DE29921553U1 - Apparatur zur Aufbringung von Kunststoffstrukturen auf Halbleiterscheiben - Google Patents

Apparatur zur Aufbringung von Kunststoffstrukturen auf Halbleiterscheiben

Info

Publication number
DE29921553U1
DE29921553U1 DE29921553U DE29921553U DE29921553U1 DE 29921553 U1 DE29921553 U1 DE 29921553U1 DE 29921553 U DE29921553 U DE 29921553U DE 29921553 U DE29921553 U DE 29921553U DE 29921553 U1 DE29921553 U1 DE 29921553U1
Authority
DE
Germany
Prior art keywords
semiconductor wafer
translucent plate
plate
plastic structures
gap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29921553U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KRASSOW HEIKO
Original Assignee
KRASSOW HEIKO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KRASSOW HEIKO filed Critical KRASSOW HEIKO
Priority to DE29921553U priority Critical patent/DE29921553U1/de
Publication of DE29921553U1 publication Critical patent/DE29921553U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
    • B29C35/0894—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds provided with masks or diaphragms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
    • H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
    • H01L21/02214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
    • H01L21/02216—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02345—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to radiation, e.g. visible light
    • H01L21/02348—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to radiation, e.g. visible light treatment by exposure to UV light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5875—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses
    • B29C2043/5883—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses ensuring cavity filling, e.g. providing overflow means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt

Claims (3)

1. Apparatur zur Aufbringung von Kunststoffstrukturen auf Halbleiterscheiben, bestehend aus einer Aufnahmevorrichtung (2), einer mindestens teilweise lichtdurchlässigen Platte (3) und einer geeigneten Lichtquelle (4), dadurch gekennzeichnet, dass die Halbleiterscheibe (1) in einer Aufnahme (2) liegt, welche mittels der lichtdurchlässigen Platte (3) und geeigneten Mittelmund Vorrichtungen (11, 12, 14) dicht verschlossen wird, so dass zwischen Halbleiterscheibe und Platte ein gleichförmig hoher Spalt (8) entsteht, welcher über mindestens einen Einlass (7) mit einem Polymer (5) aus einem Vorratsbehälter (10) gefüllt wird, wobei die sich im Spalt befindliche Luft über einen oder mehrere Auslässe(9) entweichen kann oder vorher entfernt worden ist, und das Polymer darin mithilfe der Lichtquelle (4) geeigneter Wellenlänge durch genannte Platte (3) hindurch in einer Art Fotolithographieverfahren zu auf der Halbleiterscheibe haftenden Kunststoffstrukturen vernetzt wird.
2. Apparatur nach Anspruch 1 dadurch gekennzeichnet, dass die lichtdurchlässige Platte (3) eine für fotolithographische Zwecke geeignete Maske, wie die in der Mikrotechnologie üblichen Glas-Chrom-Masken, ist, welche, in bezug auf die zur Vernetzung des Kunststoffes notwendigen Wellenlängen, durchlässige und undurchlässige Bereiche aufweist.
3. Apparatur nach Anspruch 1 dadurch gekennzeichnet, dass die Höhe des Spaltes (8) und damit der Abstand zwischen der Halbleiterscheibe (1) und der lichtdurchlässigen Platte (3) durch eine entsprechende Konstruktionsausführung der Apparatur einstellbar ist.
DE29921553U 1999-12-07 1999-12-07 Apparatur zur Aufbringung von Kunststoffstrukturen auf Halbleiterscheiben Expired - Lifetime DE29921553U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29921553U DE29921553U1 (de) 1999-12-07 1999-12-07 Apparatur zur Aufbringung von Kunststoffstrukturen auf Halbleiterscheiben

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29921553U DE29921553U1 (de) 1999-12-07 1999-12-07 Apparatur zur Aufbringung von Kunststoffstrukturen auf Halbleiterscheiben

Publications (1)

Publication Number Publication Date
DE29921553U1 true DE29921553U1 (de) 2000-03-30

Family

ID=8082657

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29921553U Expired - Lifetime DE29921553U1 (de) 1999-12-07 1999-12-07 Apparatur zur Aufbringung von Kunststoffstrukturen auf Halbleiterscheiben

Country Status (1)

Country Link
DE (1) DE29921553U1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7759135B2 (en) 2008-09-30 2010-07-20 Infineon Technologies Ag Method of forming a sensor node module
WO2013102351A1 (zh) * 2012-01-05 2013-07-11 沈阳新松机器人自动化股份有限公司 透光夹持式预对准机

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7759135B2 (en) 2008-09-30 2010-07-20 Infineon Technologies Ag Method of forming a sensor node module
WO2013102351A1 (zh) * 2012-01-05 2013-07-11 沈阳新松机器人自动化股份有限公司 透光夹持式预对准机

Similar Documents

Publication Publication Date Title
DE2915899C2 (de) Verfahren und Vorrichtung zum Auffinden von Fehlern, insbesondere von Rissen, in Körpern, die eine Vielzahl von diese Körper durchsetzenden, zueinander parallel verlaufenden Kanälen aufweisen
DE3410267C2 (de)
DE3217891A1 (de) Verfahren und vorrichtung zum reinigen von halbleiterplaettchen
EP0050312A3 (de) Vorrichtung und Verfahren zum Dispergieren und Lösen von Polymerpulvern
DE10130999A1 (de) Multifunktions-Reinigungsmodul einer Herstellungseinrichtung für Flachbildschirme und Reinigungsgerät mit Verwendung desselben
DE2624156A1 (de) Vorrichtung zur behandlung von flachen werkstuecken mit fluessigkeiten und/oder gasen
EP0073415A3 (de) Vorrichtung zum Dispergieren einer zweiten Phase in einer ersten Phase
DE102016122075B3 (de) Arbeitsverfahren und Vorrichtung zur Überwachung einer UV-Desinfektionsanlage
DE2736000C2 (de) Verfahren und Vorrichtung zur chemischen Behandlung einer Oberfläche auf einer Seite eines Werkstückes
DE29921553U1 (de) Apparatur zur Aufbringung von Kunststoffstrukturen auf Halbleiterscheiben
DE69201998T2 (de) Filter für die schnelle Extraktion von aromatischen Substanzen eines Produkts mit einer Flüssigkeit unter Druck sowie Vorrichtung mit einem solchen Filter.
EP0402798A3 (de) Beschichtungsvorrichtung
DE3202064A1 (de) Vorrichtung zur nassen siebanalyse
EP0201107A2 (de) Vorrichtung zum Aushärten von lichthärtendem Fingernagel- und Fussnagelersatz
EP1474357A2 (de) Verfahren zur herstellung einer sensor-oder aktuatoranordnung sowie sensor - oder aktuatoranordnung
AT391056B (de) Vorrichtung zur intensivierung der durchdringung von fleisch oder fleischwaren mit behandlungsfluessigkeit
DE60032521T2 (de) Verfahren zur herstellung von mikroelektromechanische vorrichtungen enthaltenden bauelementen durch verwendung von wenigstens einem uv-härtbaren band
DE3102753A1 (de) Reinigungsvorrichtung fuer reaktionsgefaesse
DE3942435A1 (de) Verfahren zur trocknung von benetzten, drahtfoermigen, laenglichen materialien
DE20119157U1 (de) Vorrichtung zum Prüfen von Halbleiterscheiben
DE60313980T2 (de) Verfahren und vorrichtung zum verbinden zweier plattenförmiger gegenstände
DE2317649B2 (de) Verfahren und Vorrichtung zum geordneten Ablösen von auf einem Substrat aufgeklebten Halbleiterelementen
DE69317555D1 (de) Vorrichtung zur Angabe, dass eine Flüssigkeit in einem Behälter ein bestimmtes Niveau erreicht, insbesondere für elektrisch betriebene Geräte
EP0396038A3 (de) Kalkdosiervorrichtung sowie Verfahren zu deren Betrieb
EP0096287A2 (de) Vorrichtung zum Behandeln von nach photochemischen Verfahren hergestellten Druckplatten

Legal Events

Date Code Title Description
R086 Non-binding declaration of licensing interest
R207 Utility model specification

Effective date: 20000504

R156 Lapse of ip right after 3 years

Effective date: 20030701