DE29513315U1 - Device for holding components when applying electrodes - Google Patents

Device for holding components when applying electrodes

Info

Publication number
DE29513315U1
DE29513315U1 DE29513315U DE29513315U DE29513315U1 DE 29513315 U1 DE29513315 U1 DE 29513315U1 DE 29513315 U DE29513315 U DE 29513315U DE 29513315 U DE29513315 U DE 29513315U DE 29513315 U1 DE29513315 U1 DE 29513315U1
Authority
DE
Germany
Prior art keywords
holding components
applying electrodes
electrodes
applying
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29513315U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Siemens Matsushita Components GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Matsushita Components GmbH and Co KG filed Critical Siemens Matsushita Components GmbH and Co KG
Priority to DE29513315U priority Critical patent/DE29513315U1/en
Publication of DE29513315U1 publication Critical patent/DE29513315U1/en
Priority to JP1996008887U priority patent/JP3034740U/en
Priority to BE9600699A priority patent/BE1010034A3/en
Priority to US08/699,633 priority patent/US5736018A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
DE29513315U 1995-08-18 1995-08-18 Device for holding components when applying electrodes Expired - Lifetime DE29513315U1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE29513315U DE29513315U1 (en) 1995-08-18 1995-08-18 Device for holding components when applying electrodes
JP1996008887U JP3034740U (en) 1995-08-18 1996-08-14 Holding device for attaching electrodes to the device
BE9600699A BE1010034A3 (en) 1995-08-18 1996-08-14 Fixing device components when applying electrode.
US08/699,633 US5736018A (en) 1995-08-18 1996-08-19 Device for holding components during electrode application

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29513315U DE29513315U1 (en) 1995-08-18 1995-08-18 Device for holding components when applying electrodes

Publications (1)

Publication Number Publication Date
DE29513315U1 true DE29513315U1 (en) 1995-10-19

Family

ID=8011959

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29513315U Expired - Lifetime DE29513315U1 (en) 1995-08-18 1995-08-18 Device for holding components when applying electrodes

Country Status (4)

Country Link
US (1) US5736018A (en)
JP (1) JP3034740U (en)
BE (1) BE1010034A3 (en)
DE (1) DE29513315U1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5849644A (en) * 1996-08-13 1998-12-15 Micron Technology, Inc. Semiconductor processing methods of chemical vapor depositing SiO2 on a substrate
US6982154B2 (en) * 2002-02-21 2006-01-03 Surromed, Inc. Modified annexin proteins and methods for treating vaso-occlusive sickle-cell disease
DE10393077T5 (en) * 2002-08-16 2005-07-21 Electro Scientific Industries, Inc., Portland Modular belt carrier for electronic components
US20060213806A1 (en) * 2005-03-25 2006-09-28 Saunders William J Configurations of electronic component-carrying apertures in a termination belt

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4395184A (en) * 1980-02-21 1983-07-26 Palomar Systems & Machines, Inc. Means and method for processing miniature electronic components such as capacitors or resistors
JPS60109204A (en) * 1983-11-17 1985-06-14 株式会社村田製作所 Method of forming external electrode of chip part
JPH0283913A (en) * 1988-09-21 1990-03-26 Taiyo Yuden Co Ltd Conductive paste application to edge face of chip-shaped electronic component
JPH0214510A (en) * 1989-05-01 1990-01-18 Murata Mfg Co Ltd Holding plate for chip component

Also Published As

Publication number Publication date
BE1010034A3 (en) 1997-11-04
JP3034740U (en) 1997-03-07
US5736018A (en) 1998-04-07

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19951130

R150 Utility model maintained after payment of first maintenance fee after three years

Effective date: 19981208

R157 Lapse of ip right after 6 years

Effective date: 20020501