DE2832317A1 - Flux for high temp. soldering - contains a polyglycol, ethanol and colophony, and can be easily removed when used in e.g. microelectronic integrated electrical circuits - Google Patents
Flux for high temp. soldering - contains a polyglycol, ethanol and colophony, and can be easily removed when used in e.g. microelectronic integrated electrical circuitsInfo
- Publication number
- DE2832317A1 DE2832317A1 DE19782832317 DE2832317A DE2832317A1 DE 2832317 A1 DE2832317 A1 DE 2832317A1 DE 19782832317 DE19782832317 DE 19782832317 DE 2832317 A DE2832317 A DE 2832317A DE 2832317 A1 DE2832317 A1 DE 2832317A1
- Authority
- DE
- Germany
- Prior art keywords
- flux
- polyglycol
- ethanol
- soldering
- mixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Flußmittel für hohe Löttemperaturen Flux for high soldering temperatures
Weichlötungen bei hohen Temperaturen von etwa 300 bis 4000 C erfordern eine reduzierende Umgebungsatmosphäre, beispielsweise mit Wasserstoff oder anderem Schutzgas und werden zumeist in einem Durchlaufofen durchgeführt, da gängige Flußmittel bei diesen Temperaturen einbrennen. Solche Schutzgasöfen sind teuere Einrichtungen.Require soft soldering at high temperatures of around 300 to 4000 C. a reducing ambient atmosphere, for example with hydrogen or others Protective gas and are usually carried out in a continuous furnace, as common fluxes bake at these temperatures. Such protective gas furnaces are expensive equipment.
Der Erfinder hat sich deshalb die Aufgabe gestellt, ein Flußmittel herzustellen, das bei hohen Löttemperaturen nicht einbrennt und das leicht zu entfernen ist.The inventor has therefore set himself the task of creating a flux that does not burn in at high soldering temperatures and that is easy to remove is.
Die Erfindung ist gekennzeichnet durch die in den Ansprüchen angegebenen Mittel und Verfahren.The invention is characterized by what is stated in the claims Means and procedures.
Mit Hilfe des erfindungsgemäßen kollophoniumhaltigen Flußmittels kann bei hohen Temperaturen ohne Schutzgasatmosphäre gelötet werden, wobei das Flußmittel weder #inbrennt noch schwer zu entfernen ist. Hochwertige Lötungen können somit bei Verwendung des erfindungsgemäßen vergleichsweise billigen Flußmittels hergestellt werden, ohne daß teuere Schutzgasöfen benötigt werden.With the help of the collophone-containing flux according to the invention can be soldered at high temperatures without a protective gas atmosphere, the flux neither #burns nor difficult to be removed. High quality soldering can thus when using the comparatively cheap flux according to the invention can be produced without the need for expensive protective gas furnaces.
Das erfindungsgemäße Flußmittel besteht vorteilhafterweise aus etwa 2 bis 4 Fünfteln Polyglykol, etwa 1 bis 3 Zehnteln ethanol und etwa 1 bis 3 Zehnteln Kollophonium. Zur Herstellung wird das Kollophonium bei einer Temperatur von etwa 600 C in Äthanol gelöst. Danach wird Polyglykol bis zur vollständigen Lösung zugemischt. Anschließend wird das Flußmittel abgekühlt.The flux according to the invention advantageously consists of about 2 to 4 fifths of polyglycol, about 1 to 3 tenths of ethanol and about 1 to 3 tenths Collophony. To produce the rosin is at a temperature of about 600 C dissolved in ethanol. Then polyglycol is mixed in until it is completely dissolved. The flux is then cooled.
Mit Hilfe des erfindungsgemäßen Flußmittels lassen sich hochwertige Lötungsverbindungen, wie sie bei mikroelektronischen integrierten Schaltkreisen, insbesondere bei Dünnfilmschaltungen in der Raumfahrtelektronik, erforderlich sind, herstellen.With the help of the flux according to the invention, high-quality Solder connections, as they are in microelectronic integrated circuits, are particularly necessary for thin-film circuits in space electronics, produce.
Beispielsweise wurden bei Lötungen mit Loten der Zusammensetzung 80 Au/20 Sn bei Temperaturen von 300 bis 3700 C einwandfreie Ergebnisse erzielt. Dabei wurden bei Lötzeiten von etwa 2 bis 5 Sekunden keine Einbrennungen festgestellt. Mit Hilfe des Flußmittels wird eine gute Benetzung erreicht. Überschüssige Reste können einfach entfernt werden.For example, when soldering with solders of the composition 80 Au / 20 Sn achieves perfect results at temperatures from 300 to 3700 C. Included no burn-in was found with soldering times of about 2 to 5 seconds. Good wetting is achieved with the aid of the flux. Excess leftovers can easily be removed.
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19782832317 DE2832317C2 (en) | 1978-07-22 | 1978-07-22 | Flux for high soldering temperatures and process for its production |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19782832317 DE2832317C2 (en) | 1978-07-22 | 1978-07-22 | Flux for high soldering temperatures and process for its production |
Publications (2)
Publication Number | Publication Date |
---|---|
DE2832317A1 true DE2832317A1 (en) | 1980-01-31 |
DE2832317C2 DE2832317C2 (en) | 1985-05-15 |
Family
ID=6045141
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19782832317 Expired DE2832317C2 (en) | 1978-07-22 | 1978-07-22 | Flux for high soldering temperatures and process for its production |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE2832317C2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0173167A1 (en) * | 1984-08-30 | 1986-03-05 | Texaco Development Corporation | Nonfuming solder cleansing and fusing fluids |
US4733039A (en) * | 1985-05-06 | 1988-03-22 | General Electric Company | Method of laser soldering |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1934122B2 (en) * | 1968-07-05 | 1973-02-15 | Ohn Corp , New Haven, Conn (V St A) | SOLDER COMPOUNDS AND THEIR USE |
-
1978
- 1978-07-22 DE DE19782832317 patent/DE2832317C2/en not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1934122B2 (en) * | 1968-07-05 | 1973-02-15 | Ohn Corp , New Haven, Conn (V St A) | SOLDER COMPOUNDS AND THEIR USE |
Non-Patent Citations (1)
Title |
---|
Stoeckhert: Kunststoff-Lexikon, 1973, S. 296 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0173167A1 (en) * | 1984-08-30 | 1986-03-05 | Texaco Development Corporation | Nonfuming solder cleansing and fusing fluids |
US4733039A (en) * | 1985-05-06 | 1988-03-22 | General Electric Company | Method of laser soldering |
Also Published As
Publication number | Publication date |
---|---|
DE2832317C2 (en) | 1985-05-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
8127 | New person/name/address of the applicant |
Owner name: AEG-TELEFUNKEN NACHRICHTENTECHNIK GMBH, 7150 BACKN |
|
8127 | New person/name/address of the applicant |
Owner name: ANT NACHRICHTENTECHNIK GMBH, 7150 BACKNANG, DE |
|
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |