DE2832317A1 - Flux for high temp. soldering - contains a polyglycol, ethanol and colophony, and can be easily removed when used in e.g. microelectronic integrated electrical circuits - Google Patents

Flux for high temp. soldering - contains a polyglycol, ethanol and colophony, and can be easily removed when used in e.g. microelectronic integrated electrical circuits

Info

Publication number
DE2832317A1
DE2832317A1 DE19782832317 DE2832317A DE2832317A1 DE 2832317 A1 DE2832317 A1 DE 2832317A1 DE 19782832317 DE19782832317 DE 19782832317 DE 2832317 A DE2832317 A DE 2832317A DE 2832317 A1 DE2832317 A1 DE 2832317A1
Authority
DE
Germany
Prior art keywords
flux
polyglycol
ethanol
soldering
mixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19782832317
Other languages
German (de)
Other versions
DE2832317C2 (en
Inventor
Heiner Dipl Ing Hauer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bosch Telecom GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE19782832317 priority Critical patent/DE2832317C2/en
Publication of DE2832317A1 publication Critical patent/DE2832317A1/en
Application granted granted Critical
Publication of DE2832317C2 publication Critical patent/DE2832317C2/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The flux comprises (a) 2/5-4/5 polyglycol, pref. of average mol. wt. of 1-10 kg/mol, (b) 1/10-3/10 EtOH and (c) 1/10-3/10 colophonyl. The flux is not stoved at high temps, aq. 300-400 degrees C. The flux is prepd. by dissolving (c) in (b) at 60 degrees C, and adding (a) to obtain complete dissolution. The flex is then cooled.

Description

Flußmittel für hohe Löttemperaturen Flux for high soldering temperatures

Weichlötungen bei hohen Temperaturen von etwa 300 bis 4000 C erfordern eine reduzierende Umgebungsatmosphäre, beispielsweise mit Wasserstoff oder anderem Schutzgas und werden zumeist in einem Durchlaufofen durchgeführt, da gängige Flußmittel bei diesen Temperaturen einbrennen. Solche Schutzgasöfen sind teuere Einrichtungen.Require soft soldering at high temperatures of around 300 to 4000 C. a reducing ambient atmosphere, for example with hydrogen or others Protective gas and are usually carried out in a continuous furnace, as common fluxes bake at these temperatures. Such protective gas furnaces are expensive equipment.

Der Erfinder hat sich deshalb die Aufgabe gestellt, ein Flußmittel herzustellen, das bei hohen Löttemperaturen nicht einbrennt und das leicht zu entfernen ist.The inventor has therefore set himself the task of creating a flux that does not burn in at high soldering temperatures and that is easy to remove is.

Die Erfindung ist gekennzeichnet durch die in den Ansprüchen angegebenen Mittel und Verfahren.The invention is characterized by what is stated in the claims Means and procedures.

Mit Hilfe des erfindungsgemäßen kollophoniumhaltigen Flußmittels kann bei hohen Temperaturen ohne Schutzgasatmosphäre gelötet werden, wobei das Flußmittel weder #inbrennt noch schwer zu entfernen ist. Hochwertige Lötungen können somit bei Verwendung des erfindungsgemäßen vergleichsweise billigen Flußmittels hergestellt werden, ohne daß teuere Schutzgasöfen benötigt werden.With the help of the collophone-containing flux according to the invention can be soldered at high temperatures without a protective gas atmosphere, the flux neither #burns nor difficult to be removed. High quality soldering can thus when using the comparatively cheap flux according to the invention can be produced without the need for expensive protective gas furnaces.

Das erfindungsgemäße Flußmittel besteht vorteilhafterweise aus etwa 2 bis 4 Fünfteln Polyglykol, etwa 1 bis 3 Zehnteln ethanol und etwa 1 bis 3 Zehnteln Kollophonium. Zur Herstellung wird das Kollophonium bei einer Temperatur von etwa 600 C in Äthanol gelöst. Danach wird Polyglykol bis zur vollständigen Lösung zugemischt. Anschließend wird das Flußmittel abgekühlt.The flux according to the invention advantageously consists of about 2 to 4 fifths of polyglycol, about 1 to 3 tenths of ethanol and about 1 to 3 tenths Collophony. To produce the rosin is at a temperature of about 600 C dissolved in ethanol. Then polyglycol is mixed in until it is completely dissolved. The flux is then cooled.

Mit Hilfe des erfindungsgemäßen Flußmittels lassen sich hochwertige Lötungsverbindungen, wie sie bei mikroelektronischen integrierten Schaltkreisen, insbesondere bei Dünnfilmschaltungen in der Raumfahrtelektronik, erforderlich sind, herstellen.With the help of the flux according to the invention, high-quality Solder connections, as they are in microelectronic integrated circuits, are particularly necessary for thin-film circuits in space electronics, produce.

Beispielsweise wurden bei Lötungen mit Loten der Zusammensetzung 80 Au/20 Sn bei Temperaturen von 300 bis 3700 C einwandfreie Ergebnisse erzielt. Dabei wurden bei Lötzeiten von etwa 2 bis 5 Sekunden keine Einbrennungen festgestellt. Mit Hilfe des Flußmittels wird eine gute Benetzung erreicht. Überschüssige Reste können einfach entfernt werden.For example, when soldering with solders of the composition 80 Au / 20 Sn achieves perfect results at temperatures from 300 to 3700 C. Included no burn-in was found with soldering times of about 2 to 5 seconds. Good wetting is achieved with the aid of the flux. Excess leftovers can easily be removed.

Claims (6)

Flußmittel für hohe Löttemperaturen Patentansprüche 1. Fußmittel für hohe Löttemperaturen, bestehend aus folgenden Masseanteilen: etwa 2 bis 4 Fünftel Polyglykol etwa 1 bis 3 Zehntel ethanol und etwa 1 bis 3 Zehntel Kollophonium. Flux for high soldering temperatures Patent claims 1. Foot medium for high soldering temperatures, consisting of the following proportions by mass: approx. 2 to 4 fifths Polyglycol about 1 to 3 tenths of ethanol and about 1 to 3 tenths of rosin. 2. Flußmittel nach Anspruch 1, dadurch gekennzeichnet, daß das Polyglykol eine mittlere molare Masse von etwa 1 bi 10 kg/mol aufweist.2. Flux according to claim 1, characterized in that the polyglycol has an average molar mass of about 1 to 10 kg / mol. 3. Verfahren zur Herstellung des Flußmittels nach den vorhergehenden Ansprüchen, gekennzeichnet durch Vermischen von Ethanol und Kollophonium und durch anschließendes Vermengen mit Polyglykol.3. Process for the preparation of the flux according to the preceding Claims, characterized by mixing ethanol and rosin and through subsequent mixing with polyglycol. Verfahren nach Anspruch 3, dadurch gekennzeichnet, daß Vermischen und/oder Vermengen bei einer Temperatur von etwa 600 C durchgeführt und daß danach das Flußmittel abgekühlt wird.Method according to claim 3, characterized in that Mix and / or mixing carried out at a temperature of about 600 C and that afterwards the flux is cooled. 5. Verfahren nach Anspruch 3 oder 4, dadurch gekennzeichnet, daß das Vermengen bis zur vollständigen Lösung des Polyglykols erfolgt.5. The method according to claim 3 or 4, characterized in that the Mixing takes place until the polyglycol has completely dissolved. 6. Verfahren nach Anspruch 3, 4 oder 5, dadurch gekennzeichnet, daß Vermischen bzw. Vermengen durch Rühren erfolgt.6. The method according to claim 3, 4 or 5, characterized in that Mixing or blending takes place by stirring.
DE19782832317 1978-07-22 1978-07-22 Flux for high soldering temperatures and process for its production Expired DE2832317C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19782832317 DE2832317C2 (en) 1978-07-22 1978-07-22 Flux for high soldering temperatures and process for its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782832317 DE2832317C2 (en) 1978-07-22 1978-07-22 Flux for high soldering temperatures and process for its production

Publications (2)

Publication Number Publication Date
DE2832317A1 true DE2832317A1 (en) 1980-01-31
DE2832317C2 DE2832317C2 (en) 1985-05-15

Family

ID=6045141

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19782832317 Expired DE2832317C2 (en) 1978-07-22 1978-07-22 Flux for high soldering temperatures and process for its production

Country Status (1)

Country Link
DE (1) DE2832317C2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0173167A1 (en) * 1984-08-30 1986-03-05 Texaco Development Corporation Nonfuming solder cleansing and fusing fluids
US4733039A (en) * 1985-05-06 1988-03-22 General Electric Company Method of laser soldering

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1934122B2 (en) * 1968-07-05 1973-02-15 Ohn Corp , New Haven, Conn (V St A) SOLDER COMPOUNDS AND THEIR USE

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1934122B2 (en) * 1968-07-05 1973-02-15 Ohn Corp , New Haven, Conn (V St A) SOLDER COMPOUNDS AND THEIR USE

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Stoeckhert: Kunststoff-Lexikon, 1973, S. 296 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0173167A1 (en) * 1984-08-30 1986-03-05 Texaco Development Corporation Nonfuming solder cleansing and fusing fluids
US4733039A (en) * 1985-05-06 1988-03-22 General Electric Company Method of laser soldering

Also Published As

Publication number Publication date
DE2832317C2 (en) 1985-05-15

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8127 New person/name/address of the applicant

Owner name: AEG-TELEFUNKEN NACHRICHTENTECHNIK GMBH, 7150 BACKN

8127 New person/name/address of the applicant

Owner name: ANT NACHRICHTENTECHNIK GMBH, 7150 BACKNANG, DE

D2 Grant after examination
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee