DE2831448A1 - Contacting strip for semiconductor components - is used on printed circuit board and has solder tag connected to clamp engaging terminals of elements - Google Patents

Contacting strip for semiconductor components - is used on printed circuit board and has solder tag connected to clamp engaging terminals of elements

Info

Publication number
DE2831448A1
DE2831448A1 DE19782831448 DE2831448A DE2831448A1 DE 2831448 A1 DE2831448 A1 DE 2831448A1 DE 19782831448 DE19782831448 DE 19782831448 DE 2831448 A DE2831448 A DE 2831448A DE 2831448 A1 DE2831448 A1 DE 2831448A1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
semiconductor components
elements
contact element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19782831448
Other languages
German (de)
Inventor
Gerhard Geier
Juergen Dipl Ing Gerstenmeier
Roland Ing Grad Grotz
Gert Jakob
Dieter Ing Grad Kreikenbaum
Werner Ing Grad Mollenkopf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE19782831448 priority Critical patent/DE2831448A1/en
Publication of DE2831448A1 publication Critical patent/DE2831448A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10962—Component not directly connected to the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means

Abstract

A contact element is used for connecting semiconductor components to the wiring of printed circuit boards. The printed circuit boards are made with solder tags which will increase the mechanical strength of the joing. The solder tag is connected to a clamp (5) which engages the terminal (2) of the semiconductor element (1). The clamp has a cup-shaped indentation with a dia. greater than the dia. of the terminal of the semiconductor element. There is a hole at the centre of the indentation with four slits. The solder tag tapers towards the end.

Description

Stand der TechnikState of the art

Zur elektrischen Kontaktierung von Halbleiterbauelementen, z.B. Transistoren, werden die Anschlüsse bekanntermaßen über ein Lötauge direkt mit der Leiterbahn einer Leiterplatte verlötet. Diese Kontaktierung hat aber den Nachteil, daß bei mechanischer Beanspruchung der Leiterplatte, z.B.For electrical contacting of semiconductor components, e.g. transistors, the connections are known to be connected directly to the conductor track via a soldering eye soldered to a printed circuit board. This contact has the disadvantage that at mechanical stress on the circuit board, e.g.

bei Stoß-, Druck- oder Zugbeanspruchung, der Anschluß des Halbleiterbauelementes aus seiner Lötstelle herausgerissen werden kann, was eine elektrische Unterbrechung zur Folge hat.in the case of impact, pressure or tensile stress, the connection of the semiconductor component can be torn out of its solder joint, causing an electrical interruption has the consequence.

Vorteile der Erfindung Das erfindungsgemäße Kontaktelement mit den kennzeichnenden Merkmalen des Hauptanspruchs hat demgegenüber den Vorteil, daß das Klemmteil die mechanischen Beanspruchungen, die auf die Leiterplatte und damit auch auf die Anschlüsse des Halbleiterbauelementes wirken, aufnimmt und daß die elektrische Kontaktierung über die Lötfahne gewährleistet wird.Advantages of the Invention The contact element according to the invention with the Characteristic features of the main claim has the advantage that the Clamping part the mechanical stresses on the circuit board and thus also act on the connections of the semiconductor component, and that the electrical Contact is guaranteed via the soldering lug.

Zeichnung Ein Ausführungsbeispiel der Erfindung ist in der Zeichnung dargestellt und in der nachfolgenden Beschreibung näher erläutert. Es zeigen Fig. 1 ein Kontaktelement im eingebauten Zustand und Fig. 2 die Aufsicht auf das Kontaktelement.Drawing An embodiment of the invention is shown in the drawing and explained in more detail in the following description. It shows Fig. 1 shows a contact element in the installed state and FIG. 2 shows the top view of the contact element.

Beschreibung der Erfindung In Fig. 1 ist eine Anordnung dargestellt, bei der ein Transistor 1 auf einem Kühlrahmen 3 montiert ist. Der Anschluß 2 des Transistors 1 wird durch eine Bohrung im Kühlrahmen 3 und in der Leiterplatte 4 geführt. Die mechanische Befestigung und die elektrische Kontaktierung wird durch das Kontaktelement 5, 6 gegeben. Das Kontaktelement 5, 6 besteht aus einem Klemmteil 5 und einer angesetzten Lötfahne 6. Das Klemmteil 5 hat eine kalottenförmige Vertiefung, deren Durchmesser größer als der Durchmesser des Anschlusses 2 des Transistors 1 ist. In der Mitte der Vertiefung ist eine Bohrung 7 und vier Schlitze 8 eingestanzt.Description of the invention In Fig. 1, an arrangement is shown, in which a transistor 1 is mounted on a cooling frame 3. Port 2 of the The transistor 1 is inserted through a hole in the cooling frame 3 and in the circuit board 4 guided. The mechanical fastening and the electrical contacting is by the contact element 5, 6 given. The contact element 5, 6 consists of a clamping part 5 and an attached soldering lug 6. The clamping part 5 has a dome-shaped recess, whose diameter is greater than the diameter of the connection 2 of the transistor 1 is. A hole 7 and four slots 8 are punched in the middle of the recess.

Die Bohrung 7 hat einen kleineren Durchmesser als der Durchmesser des Anschlusses 2. Das Klemmteil 5 wird über den Anschluß 2 des Transistors 1 geschoben. Dabei verkrallen sich die vier durch die Schlitze 8 seitlich begrenzten Lappen 9 mit dem Anschluß 2. Zur zusätzlichen mechanischen#Sicherung wird das Klemmteil 5 mit dem Anschluß 2 des Transistors 1 verlötet. Die von dem Klemmteil 5 ausgehende Lötfahne 6 wird dann direkt in das Lötauge der weiterführenden Leiterbahn 10 auf äsr Leiterplatte 4 gesteckt. Die Lötfahne 6 ist so geboge- daß sie nicht flach auf der Leiterplatte 4 auflieuuii kann. Die Lötfahne 6 weist ein Endstück 11 auf, das schmaler als der übrige Teil der Lötfahne 6 ist, sodaß eine Schulter 12 gebildet wird. Diese Schulter 12 verhindert ein zu weites Durchstecken der Lötfahne 6 durch die Leiterplatte 4, so daß ein Kurzschluß vermieden wird. Die Lötfahne o wird mit der Leiterbahn 10 der Leiterplatte 4 verlötet.The bore 7 has a smaller diameter than the diameter of connection 2. The clamping part 5 is pushed over connection 2 of transistor 1. The four tabs 9 laterally bounded by the slots 8 claw one another with connection 2. For additional mechanical # security, the clamping part 5 soldered to terminal 2 of transistor 1. The starting from the clamping part 5 The soldering lug 6 is then placed directly in the soldering eye of the continuing conductor track 10 äsr PCB 4 inserted. The soldering lug 6 is bent so that it is not flat the circuit board 4 auflieuuii can. The soldering lug 6 has an end piece 11 which is narrower than the remaining part of the soldering lug 6, so that a shoulder 12 is formed will. This shoulder 12 prevents the soldering lug 6 from being pushed through too far the circuit board 4, so that a short circuit is avoided. The soldering lug o is marked with the conductor track 10 of the circuit board 4 is soldered.

Claims (4)

Ansprüche @ Kontaktelement zum Anschluß von Halbleiterbauelementen an die Leiterbahn einer Leiterplatte mit Lötfahne, dadurch gekennzeichnet, daß die Lötfahne (6) mit einem den Anschluß (2) des Halbleiterbauelementes (1) aufnehmenden Klemmteil (5) verbunden ist. Claims @ contact element for connecting semiconductor components to the conductor track of a circuit board with a soldering lug, characterized in that the Soldering lug (6) with a terminal (2) of the semiconductor component (1) receiving it Clamping part (5) is connected. 2. Kontaktelement nach Anspruch 1, dadurch gekennzeichnet, daß das Klemmteil (5) eine kalottenförmige Vertiefung aufweist, deren Durchmesser größer als der Durchmesser des Anschlusses (2) des Halbleiterbauelementes (1) ist, und daß in der Mitte der Vertiefung eine Bohrung (7) und vier Schlitze (8) eingestanzt sind. 2. Contact element according to claim 1, characterized in that the Clamping part (5) has a dome-shaped recess, the diameter of which is larger than the diameter of the connection (2) of the semiconductor component (1), and that in the middle of the recess a hole (7) and four slots (8) punched are. 3. Kontaktelement nach Anspruch 1 und 2, dadurch gekennzeichnet, daß die Lötfahne (6) eine Krümmung aufweist. 3. Contact element according to claim 1 and 2, characterized in that that the soldering lug (6) has a curvature. 4. Kontaktelement nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß die Lötfahne in ein schmaleres Endstück (11) übergeht. 4. Contact element according to one of claims 1 to 3, characterized in that that the soldering lug merges into a narrower end piece (11).
DE19782831448 1978-07-18 1978-07-18 Contacting strip for semiconductor components - is used on printed circuit board and has solder tag connected to clamp engaging terminals of elements Ceased DE2831448A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19782831448 DE2831448A1 (en) 1978-07-18 1978-07-18 Contacting strip for semiconductor components - is used on printed circuit board and has solder tag connected to clamp engaging terminals of elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782831448 DE2831448A1 (en) 1978-07-18 1978-07-18 Contacting strip for semiconductor components - is used on printed circuit board and has solder tag connected to clamp engaging terminals of elements

Publications (1)

Publication Number Publication Date
DE2831448A1 true DE2831448A1 (en) 1980-01-31

Family

ID=6044644

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19782831448 Ceased DE2831448A1 (en) 1978-07-18 1978-07-18 Contacting strip for semiconductor components - is used on printed circuit board and has solder tag connected to clamp engaging terminals of elements

Country Status (1)

Country Link
DE (1) DE2831448A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4422128A (en) * 1981-08-06 1983-12-20 General Motors Corporation Push-on terminal clip and assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4422128A (en) * 1981-08-06 1983-12-20 General Motors Corporation Push-on terminal clip and assembly

Similar Documents

Publication Publication Date Title
DE2242337C2 (en) Device for holding circuit cards
EP0268016A1 (en) Process for connecting a luminescent diode, held on a support, with a circuit board
DE2822245A1 (en) PROCESS FOR PRODUCING ELECTRICALLY CONDUCTIVE CONNECTIONS BETWEEN PRINTED BACK PANEL WIRING OF CIRCUIT BOARDS AND SPRING BARS AS WELL AS SUITABLE SPRING BARS FOR THIS PROCESS
EP0092086B1 (en) Connection assembly for a plate-like electrical device
EP0878868B1 (en) Connection terminal
DE10141400A1 (en) control unit
US3106436A (en) Electrical terminal and method of making same
DE3044888A1 (en) AUTOMATIC FIXED CONNECTING ELEMENT FOR THE PRODUCTION OF A LET-, SCREW- AND STRIP-FREE CONTACT
DE2831448A1 (en) Contacting strip for semiconductor components - is used on printed circuit board and has solder tag connected to clamp engaging terminals of elements
DE3903615A1 (en) Electrical printed circuit board
EP0210560A2 (en) Process of soldering an integrated circuit in a circuit board
DE102016209604B4 (en) Semiconductor device and power conversion device
WO1998000865A1 (en) Module for an electrical device
DE3418694A1 (en) Spacer for an electronic component
DE102004052495A1 (en) Printed circuit board (PCB) has auxiliary conductive strip arranged on front side and pivoted to conductive strip on back side rotated at an angle greater than zero degrees
DE3101931A1 (en) Device for electrical connection
DE3012650A1 (en) Circuit arrangement having circuit board and external component - has clamping terminal with three shanks, interconnected by coupler, using two for contact pin and one for circuit board bore
DE3806263A1 (en) Connection system for a telecommunications exchange
DE29919067U1 (en) Input / output connector
DE1203331B (en) Arrangement of electronic components with several connecting wires on base plates with printed wiring
DE3105672A1 (en) Construction of electrical circuits on printed-circuit boards, without any soldering process, using screws
DE10159760A1 (en) Connector for electric motor has base part for connection to substrate with coupling part for clamping connection to equipment connector, flexible connection for relative position variations
JPS6313506Y2 (en)
DE3448208C2 (en) Method for connecting light-emitting diodes, which are held in a holder, to a printed circuit board
DE3524459A1 (en) Connecting strip for at least one electrical cable

Legal Events

Date Code Title Description
OD Request for examination
8131 Rejection