DE2547886A1 - CONNECTION OF AN ELECTRONIC COMPONENT WITH CONDUCTOR TRACKS OF A CIRCUIT BOARD - Google Patents

CONNECTION OF AN ELECTRONIC COMPONENT WITH CONDUCTOR TRACKS OF A CIRCUIT BOARD

Info

Publication number
DE2547886A1
DE2547886A1 DE19752547886 DE2547886A DE2547886A1 DE 2547886 A1 DE2547886 A1 DE 2547886A1 DE 19752547886 DE19752547886 DE 19752547886 DE 2547886 A DE2547886 A DE 2547886A DE 2547886 A1 DE2547886 A1 DE 2547886A1
Authority
DE
Germany
Prior art keywords
circuit board
conductor tracks
connection
soldering
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19752547886
Other languages
German (de)
Other versions
DE2547886C2 (en
Inventor
Rolf Schneider
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE2547886A priority Critical patent/DE2547886C2/en
Priority to JP51127130A priority patent/JPS5254171A/en
Priority to GB44184/76A priority patent/GB1563414A/en
Priority to FR7632093A priority patent/FR2329135A1/en
Publication of DE2547886A1 publication Critical patent/DE2547886A1/en
Application granted granted Critical
Publication of DE2547886C2 publication Critical patent/DE2547886C2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10962—Component not directly connected to the PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)

Description

R. 2932
25.10.1975 Wo/Sm R. 2932
25.10.1975 Wo / Sm

Anlage zurAttachment to

Patent- undPatent and

GebrauchsmuGter-KilfsanmeldungUtility goods registration

ROBERT BOSCH GMBH, Stuttgart ROBERT BOSCH GMB H, Stuttgart

Verbindung eines elektronischen Baue lerne ηυ es mit Leit3rbahnen einer Leiterplatte - - Learn to connect an electronic structure with interconnects a printed circuit board - -

Die Erfindung betrifft eine Verbindung einer- Anscjhlu£elektroäe eines elektronischen Bauelementes mit Leiterbahnen au:"" einer Leiterplatte, die für einen automatischen Lötvorgaiig v-orgecelien ist - The invention relates to a connection of an electrical connection of an electronic component with conductor tracks au: "" of a circuit board which is orgecelien for an automatic soldering process -

Es ist bereits eine Verbindung bekannt, bei der die '■-!jeictr-r ~ nischen Bauelemente mit Anschlußdrähten ve::-sehen nine! und von Hand verdrahtet und mit Handlötkolben mit den ^rehcriD.euA compound is already known in which the '■ -! Jeictr-r ~ niche components with connecting wires ve :: - see nine! and from Hand wired and with hand soldering iron with the ^ rehcriD.eu

7O981S/0U77O981S / 0U7

R. 2932R. 2932

Leiterbahnen elektrisch leitend verbunden werden. Dadurch ergeben sich erhöhte Montagekosten. Außerdem sind zum Vermeiden von unterschiedlichen Wärmeausdehnungen entsprechend der verschiedenen Werkstoffe sich relativ stark erwärmende elektronische Bauelemente wie Leistungstransistoren nicht auf der Leiterplatte angeordnet, was zu verhältnismäßig großem Platzbedarf bei elektronischen Steuergeräten führt.Conductor tracks are connected in an electrically conductive manner. This results in increased assembly costs. Also are to be avoided of different thermal expansions according to the different Materials that heat up relatively strongly electronic components such as power transistors are not on the Arranged printed circuit board, which leads to a relatively large space requirement for electronic control units.

Der Erfindung liegt daher die Aufgabe zugrunde, eine Verbindung eines elektronischen Bauelementes mit Leiterbahnen einer Leiterplatte zu schaffen, bei der unabhängig von den Anschlußabmessungen und der durch Vierkstoffausdehnungen hervorrufenden Erwärmung des elektronischen Bauelementes das Bauelement auf der Leiterplatte angeordnet werden kann und die elektrisch leitende Verbindung mit den zugehörigen Leiterbahnen zusammen mit allen anderen elektrischen und elektronischen Bauelementen in einem maschinellen Lötvorgang hergestellt wird.The invention is therefore based on the object of a connection of an electronic component with conductor tracks of a To create printed circuit board, regardless of the connection dimensions and the expansion caused by square material Heating of the electronic component, the component can be arranged on the circuit board and the electrical Conductive connection with the associated conductor tracks together with all other electrical and electronic components is produced in a machine soldering process.

Erfindungsgemäß wird die Aufgabe dadurch gelöst, daß in mit Leiterbahnen verbundene Öffnungen ein Lötstützpunkt eingesetzt ist, der einen federnden Arm. hat, an dem eine trichterförmige Buchse ausgebildet ist, welche durch-ein Loch der Leiterplatte in den Lötbereich ragt und durch die sich die < Anschlußelektrode des elektronischen Bauelementes erstreckt.According to the invention the object is achieved in that in with Conductor paths connected openings a soldering post is used, which has a resilient arm. has a funnel-shaped Socket is formed which protrudes through a hole in the circuit board in the soldering area and through which the <Terminal electrode of the electronic component extends.

In weiterer vorteilhafter Ausgestaltung der Erfindung ist der Lötstützpunkt als Federkontakt ausgebildet, dessen Schenkel mit der Leiterplatte mechanisch und mit den Leiterbahnen elektrisch leitend verbunden sind und der federnde Arm mit der Anschlußelektrode elektrisch leitend verbunden ist.In a further advantageous embodiment of the invention, the soldering post is designed as a spring contact, the legs of which are mechanically connected to the printed circuit board and electrically conductively connected to the conductor tracks and the resilient arm with the connection electrode is connected in an electrically conductive manner.

709818/0447709818/0447

- J - ' R. 2932- J - 'R. 2932

Ein Ausführungsbeispiel der Verbindung nach der Erfindung ist in der Zeichnung wiedergegeben. Sie zeigt inAn embodiment of the connection according to the invention is shown in the drawing. She shows in

Fig. 1 einen Teil einer Leiterplatte, auf der ein Lötstützpunkt angeordnet ist, in räumlicher Darstellung, 1 shows a part of a circuit board on which a soldering terminal is arranged, in a three-dimensional representation.

Fig. 2 den Teil der Leiterplatte in Ansicht von der Lötseite. 2 shows the part of the printed circuit board in a view from the soldering side.

Eine Leiterplatte 1 ist mit öffnungen 2 versehen sowie mit Löchern 3 und Befestigungslöchern 4. Die öffnungen 2 (Figur 2) liegen in Anschlußstellen 5 von Leiterbahnen S3 welche auf der Leiterplatte 1 ein- oder beidseitig aufgetragen sind.A circuit board 1 is provided with openings 2 and with holes 3 and fastening holes 4. The openings 2 (FIG. 2) lie in connection points 5 of conductor tracks S 3 which are applied to one or both sides of the circuit board 1.

Ein elektronisches Bauelement in Form eines Leistungstransistors 7 ist auf der Leiterplatte 1 mechanisch befestigt durch Schrauben oder Niete, welche in den Befestigungslöchern 4 sitzen. Jede Anschlußelektrode 8 des Leistungstransistors ragt durch ein Loch 3 der Leiterplatte 1 in den Bereich eines Maschinenlötganges an der Unterseite der LeiterplatteAn electronic component in the form of a power transistor 7 is mechanically attached to the circuit board 1 by Screws or rivets that are inserted in the mounting holes 4 sit. Each connection electrode 8 of the power transistor protrudes through a hole 3 in the circuit board 1 in the area a machine soldering path on the underside of the circuit board

Ein Lötstützpunkt ist als im wesentlichen U-förmige Kontaktfeder 9 mit zwei Schenkeln 10 ausgebildet. Die Schenkel 10 laufen in Zapfen 11 aus, welche in die öffnungen 2 gesteckt sind und mit ihren Enden ebenfalls an der Unterseite der Leiterplatte 1 in den Lötbereich ragen. Ein federnder Kontaktarm 12 ist an der Kontaktfeder 9* derart angebogen, daß er mit einem Verbindungsabschnitt 13 zwischen den Schenkeln 10 ebenfalls U-förmig verbunden ist. Der Kontaktarm 12 ist an seinem freien Ende zu einer trichterförmigen Buchse 14 geformt. Die trichterförmige Buchse 14 ragt durch das Loch der Leiterplatte 1 auch in den Lötbereich. Die Anschlußelektrode 8 des Leistungstrahsistors J erstreckt sich durch die Buchse 14 bis über die Unterseite.der Leiterplatte 1 hinaus. Jeder Anschlußelektrode 8 ist eine .Kontaktfeder 9 zugeordnet.A soldering post is designed as a substantially U-shaped contact spring 9 with two legs 10. The legs 10 terminate in pegs 11 which are inserted into the openings 2 and with their ends also protrude into the soldering area on the underside of the circuit board 1. A resilient contact arm 12 is bent on the contact spring 9 * in such a way that it is also connected in a U-shape to a connecting section 13 between the legs 10. The contact arm 12 is shaped at its free end to form a funnel-shaped socket 14. The funnel-shaped socket 14 also protrudes through the hole in the circuit board 1 into the soldering area. The connection electrode 8 of the power transistor J extends through the socket 14 to over the lower side of the circuit board 1 addition. Each connection electrode 8 is assigned a contact spring 9.

7098-18/04477098-18 / 0447

- Jf - R. 2932- Jf - R. 2932

Die Bauelemente einer Steuerelektronik, die Leistungstransistoren 7 der Leistungsstufe und sonstige elektrischen Bauelemente sind auf der Leiterplatte 1 angeordnet und mit den Leiterbahnen δ durch einen einzigen Masehinenlötgang elektrisch leitend verbunden. Dabei steigt Lötmittel 15 in die Buchse 14 und bildet dort wie unterhalb des Bereichs um die kleinere Öffnung der Buchse Ik eine gute elektrisch leitende Verbindung zwischen der Anschlußelektrode 8 und dem Kontaktarm 12 der Kontaktfeder 9- Die elektrisch leitende Verbindung zwischen der Kontaktfeder 9 und der zugehörigen Leiterbahn 6 erfolgt über die Schenkel 10 und Zapfen 11, welche durch Lötmittel mit den Anschlußstellen 5 der Leiterbahnen 6 verbunden sind.The components of an electronic control system, the power transistors 7 of the power stage and other electrical components are arranged on the circuit board 1 and are electrically conductively connected to the conductor tracks δ by a single mass-soldering path. In this case solder 15 rises into the socket 14 and forms there, as below the area around the smaller opening of the bushing Ik a good electrically conductive connection between the terminal electrode 8 and the contact arm 12 of the contact spring 9, the electrically conductive connection between the contact spring 9 and the associated The conductor track 6 takes place via the legs 10 and pins 11, which are connected to the connection points 5 of the conductor tracks 6 by solder.

Leistungstransistoren 7 gehören zu.den sich relativ stark erwärmenden elektronischen Bauelementen. Sie verursachen bei Temperaturwechsel unterschiedliche Wärmeausdehnung der sie unmittelbar umgehenden verschiedenen Werkstoffe wie der Kontaktfeder 9 und der Leiterplatte 1. Durch die Federwirkung des Kontaktarmes 12 in Richtung der Längsachse der Anschlußelektrode 8 werden durch die unterschiedliche Ausdehnung bei Temperaturwechsel hervorgerufene Spannungen kompensiert. Dadurch ist es möglich, sich relativ stark erwärmende elektronische Bauelemente 7 direkt auf der Leiterplatte 1 anzuordnen. Zum Herstellen der elektrisch leitenden Verbindungen zwischen den Leistungstransistoren 7 und den Leiterbahnen 6 entfällt sowohl das lohnintensive Verdrahten von Hand als auch das Löten mit Handkolbe"n. Die Zapfen 11 zum Kontaktieren an den Leiterbahnen 6 können außerdem unabhängig von den Abmessungen der Anschlußelektroden 8 den Anschlußstellen 5 und Leiterbahnen angepaßt werden.Power transistors 7 belong zu.den are relatively strong heating electronic components. When the temperature changes, they cause different thermal expansion of them directly immediate different materials such as the contact spring 9 and the circuit board 1. By the spring action of the contact arm 12 in the direction of the longitudinal axis of the connection electrode 8 due to the different expansion with temperature changes caused stresses compensated. This is it is possible to arrange electronic components 7 which heat up relatively strongly directly on the circuit board 1. To manufacture the electrically conductive connections between the power transistors 7 and the conductor tracks 6 are omitted the wage-intensive wiring by hand and soldering with hand-held pistons. The pins 11 for contacting the conductor tracks 6 can also independently of the dimensions of the connection electrodes 8, the connection points 5 and conductor tracks be adjusted.

709818/0447709818/0447

LeerseiteBlank page

Claims (3)

AnsprücheExpectations 1\ Verbindung einer Anschlußelektrode eines elektronischen Bauelementes mit einer Leiterbahn auf einer Leiterplatte, die für einen automatischen Lötvorgang vorgesehen ist, dadurch gekennzeichnet, daß in mit Leiterbahnen (6) verbundene Öffnungen (2) der Leiterplatte (1) ein Lötstützpunkt (9) eingesetzt ist, der einen federnden Kontaktarm (12) hat, an dem eine trichterförmige Buchse (Ik) ausgebildet ist, welche
durch ein Loch (3) der Leiterplatte (1) in den Lötbereich
ragt und durch die sich die Ansehlußelektrode (8) des elektrischen Bauelementes (7) erstreckt.1 \ Connection of a connection electrode of an electronic component to a conductor track on a circuit board which is intended for an automatic soldering process, characterized in that a soldering support point (9) is inserted into openings (2) of the circuit board (1) connected to conductor tracks (6) , which has a resilient contact arm (12) on which a funnel-shaped socket (Ik) is formed, which
through a hole (3) in the circuit board (1) into the soldering area
protrudes and through which the connection electrode (8) of the electrical component (7) extends. 2. Verbindung nach Anspruch 1, dadurch gekennzeichnet, daß der Lötstützpunkt als Federkontakt (9) ausgebildet ist, dessen Schenkel (10; 11) mit der Leiterplatte (1) mechanisch und mit •den Leiterbahnen (6) elektrisch leitend verbunden sind und der federnde Kontaktarm (12) mit der Ansehlußelektrode (8) elektrisch leitend verbunden ist.2. A compound according to claim 1, characterized in that the soldering point is designed as a spring contact (9) whose Legs (10; 11) are mechanically connected to the printed circuit board (1) and to the conductor tracks (6) in an electrically conductive manner and the resilient contact arm (12) is electrically conductively connected to the connection electrode (8). 3. Verbindung nach Anspruch 1 oder. 2, dadurch gekennzeichnet, daß das mit Leiterbahnen (6) zu verbindende elektronische Bauelement (7) auf der Leiterplatte (1) angeordnet ist.3. A compound according to claim 1 or. 2, characterized in that the electronic component (7) to be connected to conductor tracks (6) is arranged on the circuit board (1). 709818/0447709818/0447
DE2547886A 1975-10-25 1975-10-25 Solder post for components on circuit boards Expired DE2547886C2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE2547886A DE2547886C2 (en) 1975-10-25 1975-10-25 Solder post for components on circuit boards
JP51127130A JPS5254171A (en) 1975-10-25 1976-10-22 Connector member of conductive path of conductive plate to connection electrode of electronic part
GB44184/76A GB1563414A (en) 1975-10-25 1976-10-25 Connection of an electronic component to the conductive paths of a printed circuit board
FR7632093A FR2329135A1 (en) 1975-10-25 1976-10-25 DEVICE FOR CONNECTING AN ELECTRODE CONNECTING AN ELECTRONIC COMPONENT WITH THE CONDUCTIVE TRACKS OF A PRINTED CIRCUIT

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2547886A DE2547886C2 (en) 1975-10-25 1975-10-25 Solder post for components on circuit boards

Publications (2)

Publication Number Publication Date
DE2547886A1 true DE2547886A1 (en) 1977-05-05
DE2547886C2 DE2547886C2 (en) 1984-06-14

Family

ID=5960117

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2547886A Expired DE2547886C2 (en) 1975-10-25 1975-10-25 Solder post for components on circuit boards

Country Status (4)

Country Link
JP (1) JPS5254171A (en)
DE (1) DE2547886C2 (en)
FR (1) FR2329135A1 (en)
GB (1) GB1563414A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9634411B2 (en) 2014-12-09 2017-04-25 HKR Seuffer Automotive GmbH & Co. KG Contact device mechanically mountable and electrically connectable on a printed circuit board by a fastening portion for receipt of an external plug element

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2585887B1 (en) * 1985-07-31 1988-03-11 Dav IMPROVED CLIP FOR CONNECTING FLAT TONGS TO A PRINTED CIRCUIT
GB2192100B (en) * 1986-06-30 1990-07-11 Black & Decker Inc Improvements in or relating to mounting a component on a surface and to methods of mounting such components
DE3922237A1 (en) * 1989-07-06 1991-01-10 Hirschmann Richard Gmbh Co Circuit board connection socket - has bush coupled by flexible link to integral housing soldered onto board
DE4419815C1 (en) * 1994-06-07 1995-09-28 Vdo Schindling Contact spring for circuit board
DE19600189A1 (en) * 1996-01-04 1997-07-10 Grote & Hartmann Slotted spring contact element for flat pluggable connector
DE10121430C1 (en) * 2001-05-02 2002-08-14 Webasto Vehicle Sys Int Gmbh Connectors
DE102009053426B4 (en) * 2009-11-19 2020-03-19 Pierburg Gmbh Electrical contact element
DE102011075031A1 (en) * 2011-04-29 2012-10-31 Endress + Hauser Gmbh + Co. Kg Printed circuit board for use in measuring device that is utilized for measuring e.g. parameter of total organic carbon, has contact spring deformable in axial direction of hole, and terminal provided in electric contact with conductor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2730690A (en) * 1952-03-29 1956-01-10 Motorola Inc Printed circuit chassis and tube clip

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1933663C3 (en) * 1969-07-02 1978-04-06 Siemens Ag, 1000 Berlin Und 8000 Muenchen Device for holding and contacting a ceramic capacitor in a slot in a printed circuit board
US3654583A (en) * 1970-06-22 1972-04-04 Berg Electronics Inc Circuit board eyelet

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2730690A (en) * 1952-03-29 1956-01-10 Motorola Inc Printed circuit chassis and tube clip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9634411B2 (en) 2014-12-09 2017-04-25 HKR Seuffer Automotive GmbH & Co. KG Contact device mechanically mountable and electrically connectable on a printed circuit board by a fastening portion for receipt of an external plug element

Also Published As

Publication number Publication date
JPS5254171A (en) 1977-05-02
DE2547886C2 (en) 1984-06-14
FR2329135A1 (en) 1977-05-20
GB1563414A (en) 1980-03-26
FR2329135B1 (en) 1982-05-21

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