DE2538119A1 - - Google Patents
Info
- Publication number
- DE2538119A1 DE2538119A1 DE19752538119 DE2538119A DE2538119A1 DE 2538119 A1 DE2538119 A1 DE 2538119A1 DE 19752538119 DE19752538119 DE 19752538119 DE 2538119 A DE2538119 A DE 2538119A DE 2538119 A1 DE2538119 A1 DE 2538119A1
- Authority
- DE
- Germany
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C29/00—Joining metals with the aid of glass
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/02—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing by fusing glass directly to metal
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19752538119 DE2538119C2 (en) | 1975-08-27 | Encapsulation or soldered connection made of glass solder with a chemically passivated surface and a method for producing the layer to be applied |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19752538119 DE2538119C2 (en) | 1975-08-27 | Encapsulation or soldered connection made of glass solder with a chemically passivated surface and a method for producing the layer to be applied |
Publications (3)
Publication Number | Publication Date |
---|---|
DE2538119A1 true DE2538119A1 (en) | 1976-11-25 |
DE2538119B1 DE2538119B1 (en) | 1976-11-25 |
DE2538119C2 DE2538119C2 (en) | 1977-07-21 |
Family
ID=
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4784872A (en) * | 1984-11-17 | 1988-11-15 | Messerschmitt-Boelkow-Blohm Gmbh | Process for encapsulating microelectronic semi-conductor and layer type circuits |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4784872A (en) * | 1984-11-17 | 1988-11-15 | Messerschmitt-Boelkow-Blohm Gmbh | Process for encapsulating microelectronic semi-conductor and layer type circuits |
Also Published As
Publication number | Publication date |
---|---|
DE2538119B1 (en) | 1976-11-25 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
E77 | Valid patent as to the heymanns-index 1977 | ||
8339 | Ceased/non-payment of the annual fee |