DE2459906A1 - Elektrisches relais - Google Patents

Elektrisches relais

Info

Publication number
DE2459906A1
DE2459906A1 DE19742459906 DE2459906A DE2459906A1 DE 2459906 A1 DE2459906 A1 DE 2459906A1 DE 19742459906 DE19742459906 DE 19742459906 DE 2459906 A DE2459906 A DE 2459906A DE 2459906 A1 DE2459906 A1 DE 2459906A1
Authority
DE
Germany
Prior art keywords
substrate
sensor
relay according
attached
relay
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19742459906
Other languages
German (de)
English (en)
Inventor
Marcus Arts
H Keith Eastwood
Charles T Plough
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Multi State Devices Ltd
Original Assignee
Multi State Devices Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Multi State Devices Ltd filed Critical Multi State Devices Ltd
Publication of DE2459906A1 publication Critical patent/DE2459906A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H01C7/042—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient mainly consisting of inorganic non-metallic substances
    • H01C7/043—Oxides or oxidic compounds
    • H01C7/047—Vanadium oxides or oxidic compounds, e.g. VOx
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
  • Thermistors And Varistors (AREA)
  • Thermally Actuated Switches (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Control Of Resistance Heating (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
DE19742459906 1974-01-07 1974-12-18 Elektrisches relais Pending DE2459906A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US431428A US3872418A (en) 1974-01-07 1974-01-07 Electrical relay device

Publications (1)

Publication Number Publication Date
DE2459906A1 true DE2459906A1 (de) 1975-07-17

Family

ID=23711900

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19742459906 Pending DE2459906A1 (de) 1974-01-07 1974-12-18 Elektrisches relais

Country Status (10)

Country Link
US (1) US3872418A (enExample)
JP (1) JPS50116945A (enExample)
AU (1) AU7596574A (enExample)
BE (1) BE824173A (enExample)
CA (1) CA997480A (enExample)
DE (1) DE2459906A1 (enExample)
FR (1) FR2257152B3 (enExample)
GB (1) GB1469008A (enExample)
NL (1) NL7415921A (enExample)
SE (1) SE7500085L (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4237474A (en) * 1978-10-18 1980-12-02 Rca Corporation Electroluminescent diode and optical fiber assembly
US4450496A (en) * 1979-08-16 1984-05-22 Raychem Corporation Protection of certain electrical systems by use of PTC device
US4739382A (en) * 1985-05-31 1988-04-19 Tektronix, Inc. Package for a charge-coupled device with temperature dependent cooling
EP0208970B1 (de) * 1985-07-09 1990-05-23 Siemens Aktiengesellschaft MOSFET mit Temperaturschutz
US4757528A (en) * 1986-09-05 1988-07-12 Harris Corporation Thermally coupled information transmission across electrical isolation boundaries
US5008736A (en) * 1989-11-20 1991-04-16 Motorola, Inc. Thermal protection method for a power device
US5374123A (en) * 1992-05-20 1994-12-20 Goldstar Co., Ltd. Thermal comfort sensing device
US6300859B1 (en) * 1999-08-24 2001-10-09 Tyco Electronics Corporation Circuit protection devices
US9632630B2 (en) * 2011-11-17 2017-04-25 Tera Xtal Technology Corp. Touch panel structure
WO2018043346A1 (ja) * 2016-09-01 2018-03-08 パナソニックＩｐマネジメント株式会社 機能性素子及び温度センサ
EP3872876B1 (en) 2018-12-14 2023-06-14 Nuvoton Technology Corporation Japan Semiconductor device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3503030A (en) * 1966-11-11 1970-03-24 Fujitsu Ltd Indirectly-heated thermistor
US3621446A (en) * 1969-02-17 1971-11-16 Bell Telephone Labor Inc Thermal relay
US3614345A (en) * 1969-11-17 1971-10-19 Zyrotron Ind Inc Thermal sensing device

Also Published As

Publication number Publication date
JPS50116945A (enExample) 1975-09-12
US3872418A (en) 1975-03-18
BE824173A (fr) 1975-05-02
GB1469008A (en) 1977-03-30
NL7415921A (nl) 1975-07-09
FR2257152B3 (enExample) 1977-09-30
FR2257152A1 (enExample) 1975-08-01
AU7596574A (en) 1976-06-03
CA997480A (en) 1976-09-21
SE7500085L (enExample) 1975-07-08

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Legal Events

Date Code Title Description
OGA New person/name/address of the applicant
OHJ Non-payment of the annual fee