JPS50116945A - - Google Patents
Info
- Publication number
- JPS50116945A JPS50116945A JP49146652A JP14665274A JPS50116945A JP S50116945 A JPS50116945 A JP S50116945A JP 49146652 A JP49146652 A JP 49146652A JP 14665274 A JP14665274 A JP 14665274A JP S50116945 A JPS50116945 A JP S50116945A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
- H01C7/042—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient mainly consisting of inorganic non-metallic substances
- H01C7/043—Oxides or oxidic compounds
- H01C7/047—Vanadium oxides or oxidic compounds, e.g. VOx
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Thermistors And Varistors (AREA)
- Thermally Actuated Switches (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Control Of Resistance Heating (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US431428A US3872418A (en) | 1974-01-07 | 1974-01-07 | Electrical relay device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS50116945A true JPS50116945A (enExample) | 1975-09-12 |
Family
ID=23711900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49146652A Pending JPS50116945A (enExample) | 1974-01-07 | 1974-12-20 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US3872418A (enExample) |
| JP (1) | JPS50116945A (enExample) |
| AU (1) | AU7596574A (enExample) |
| BE (1) | BE824173A (enExample) |
| CA (1) | CA997480A (enExample) |
| DE (1) | DE2459906A1 (enExample) |
| FR (1) | FR2257152B3 (enExample) |
| GB (1) | GB1469008A (enExample) |
| NL (1) | NL7415921A (enExample) |
| SE (1) | SE7500085L (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4237474A (en) * | 1978-10-18 | 1980-12-02 | Rca Corporation | Electroluminescent diode and optical fiber assembly |
| US4450496A (en) * | 1979-08-16 | 1984-05-22 | Raychem Corporation | Protection of certain electrical systems by use of PTC device |
| US4739382A (en) * | 1985-05-31 | 1988-04-19 | Tektronix, Inc. | Package for a charge-coupled device with temperature dependent cooling |
| EP0208970B1 (de) * | 1985-07-09 | 1990-05-23 | Siemens Aktiengesellschaft | MOSFET mit Temperaturschutz |
| US4757528A (en) * | 1986-09-05 | 1988-07-12 | Harris Corporation | Thermally coupled information transmission across electrical isolation boundaries |
| US5008736A (en) * | 1989-11-20 | 1991-04-16 | Motorola, Inc. | Thermal protection method for a power device |
| US5374123A (en) * | 1992-05-20 | 1994-12-20 | Goldstar Co., Ltd. | Thermal comfort sensing device |
| US6300859B1 (en) * | 1999-08-24 | 2001-10-09 | Tyco Electronics Corporation | Circuit protection devices |
| US9632630B2 (en) * | 2011-11-17 | 2017-04-25 | Tera Xtal Technology Corp. | Touch panel structure |
| WO2018043346A1 (ja) * | 2016-09-01 | 2018-03-08 | パナソニックＩｐマネジメント株式会社 | 機能性素子及び温度センサ |
| EP3872876B1 (en) | 2018-12-14 | 2023-06-14 | Nuvoton Technology Corporation Japan | Semiconductor device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3503030A (en) * | 1966-11-11 | 1970-03-24 | Fujitsu Ltd | Indirectly-heated thermistor |
| US3621446A (en) * | 1969-02-17 | 1971-11-16 | Bell Telephone Labor Inc | Thermal relay |
| US3614345A (en) * | 1969-11-17 | 1971-10-19 | Zyrotron Ind Inc | Thermal sensing device |
-
1974
- 1974-01-07 US US431428A patent/US3872418A/en not_active Expired - Lifetime
- 1974-12-02 AU AU75965/74A patent/AU7596574A/en not_active Expired
- 1974-12-06 NL NL7415921A patent/NL7415921A/xx not_active Application Discontinuation
- 1974-12-13 CA CA215,958A patent/CA997480A/en not_active Expired
- 1974-12-18 DE DE19742459906 patent/DE2459906A1/de active Pending
- 1974-12-20 JP JP49146652A patent/JPS50116945A/ja active Pending
- 1974-12-23 GB GB5557774A patent/GB1469008A/en not_active Expired
-
1975
- 1975-01-03 FR FR7500151A patent/FR2257152B3/fr not_active Expired
- 1975-01-03 SE SE7500085A patent/SE7500085L/xx unknown
- 1975-01-07 BE BE152205A patent/BE824173A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US3872418A (en) | 1975-03-18 |
| DE2459906A1 (de) | 1975-07-17 |
| BE824173A (fr) | 1975-05-02 |
| GB1469008A (en) | 1977-03-30 |
| NL7415921A (nl) | 1975-07-09 |
| FR2257152B3 (enExample) | 1977-09-30 |
| FR2257152A1 (enExample) | 1975-08-01 |
| AU7596574A (en) | 1976-06-03 |
| CA997480A (en) | 1976-09-21 |
| SE7500085L (enExample) | 1975-07-08 |