DE2455817A1 - Verfahren zum umsetzen von halbleiterscheiben in einer nach dem kontaktprinzip arbeitenden positionier- und belichtungsvorrichtung mit mehreren bearbeitungsstationen - Google Patents

Info

Publication number

DE2455817A1

DE2455817A1 DE19742455817 DE2455817A DE2455817A1 DE 2455817 A1 DE2455817 A1 DE 2455817A1 DE 19742455817 DE19742455817 DE 19742455817 DE 2455817 A DE2455817 A DE 2455817A DE 2455817 A1 DE2455817 A1 DE 2455817A1

Authority

DE

Germany

Prior art keywords

semiconductor wafer

positioning

fine positioning

processing stations

exposure device

Prior art date

1974-01-09

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Withdrawn

Links

• Espacenet
• Global Dossier
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• 235000012431 wafers Nutrition 0.000 claims description 31
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• 238000004519 manufacturing process Methods 0.000 description 2
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