DE2326193A1 - METHOD FOR MANUFACTURING A SOLDER MATERIAL - Google Patents

METHOD FOR MANUFACTURING A SOLDER MATERIAL

Info

Publication number
DE2326193A1
DE2326193A1 DE2326193A DE2326193A DE2326193A1 DE 2326193 A1 DE2326193 A1 DE 2326193A1 DE 2326193 A DE2326193 A DE 2326193A DE 2326193 A DE2326193 A DE 2326193A DE 2326193 A1 DE2326193 A1 DE 2326193A1
Authority
DE
Germany
Prior art keywords
solder
solder material
temperatures
production
aluminum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE2326193A
Other languages
German (de)
Other versions
DE2326193B2 (en
DE2326193C3 (en
Inventor
Guenther Dr Scharf
Heinz Schoer
Werner Dr Schultze
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vereinigte Aluminium Werke AG
Original Assignee
Vereinigte Aluminium Werke AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vereinigte Aluminium Werke AG filed Critical Vereinigte Aluminium Werke AG
Priority to DE2326193A priority Critical patent/DE2326193C3/en
Priority to AT82174A priority patent/AT324797B/en
Priority to IT67367/74A priority patent/IT1004910B/en
Priority to BE2053440A priority patent/BE811354A/en
Priority to FR7406535A priority patent/FR2230748B1/fr
Priority to NO740655A priority patent/NO740655L/en
Priority to SE7404497A priority patent/SE410156B/en
Priority to NLAANVRAGE7405762,A priority patent/NL178139C/en
Priority to GB2273674A priority patent/GB1462506A/en
Priority to LU70133A priority patent/LU70133A1/xx
Priority to JP5675474A priority patent/JPS5510357B2/ja
Priority to ZA00743320A priority patent/ZA743320B/en
Priority to CH706674A priority patent/CH599349A5/xx
Priority to SU742026251A priority patent/SU679117A3/en
Priority to DK282774A priority patent/DK139094C/en
Publication of DE2326193A1 publication Critical patent/DE2326193A1/en
Publication of DE2326193B2 publication Critical patent/DE2326193B2/en
Priority to JP8028079A priority patent/JPS558399A/en
Application granted granted Critical
Publication of DE2326193C3 publication Critical patent/DE2326193C3/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C22C21/02—Alloys based on aluminium with silicon as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/286—Al as the principal constituent

Landscapes

  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Conductive Materials (AREA)
  • Coating With Molten Metal (AREA)
  • Die Bonding (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Description

VEREINIGTE ALUMINITJM-WERKE
AKTIENGESELLSCHAFT
BONNUNITED ALUMINITJM PLANTS
SHARED COMPANY
BONN

Verfahren zur Herstellung eines LotwerkstoffesProcess for the production of a solder material

Die Erfindung "betrifft ein Verfahren zur Herstellung eines Lotwerkstoffes auf der Basis AlSi mit Gehalten an 4- - 20 % Silicium-, und aus je 0,01 - 10 %, vorzugsweise je 0,05 bis 2 %, Wismut, Strontium, Barium, Antimon und/oder Beryllium in Mengen von 0,00001 - 1,0, vorzugsweise 0,0002 - 0,1 %, Rest Aluminium und herstellungsbedingte Verunreinigungen zum flußmittellosen Löten von Aluminium-Werkstoffen unter Schutzgas bzw. sauerstoffarmer Atmosphäre.The invention "relates to a method for producing a solder material based on AlSi with contents of 4- - 20% silicon, and from 0.01 each - 10%, preferably 0.05 to 2% each, bismuth, strontium, barium, Antimony and / or beryllium in amounts of 0.00001-1.0, preferably 0.0002-0.1%, the remainder aluminum and production-related impurities for flux-free soldering of aluminum materials under protective gas or low-oxygen atmosphere.

Solche Lote sind Gegenstand der DT-AS 1 962 760 bzw. DT-OS 2 143 965· Bei deren Verarbeitung zu lotplattiertem Halbzeug bzw. Lotformteilen hat sich im Gegensatz zu derjenigen von handelsüblichen AlSi-Loten, wie beispielsweise dem L-AlSi 12, gezeigt, daß vielfach die Gefahr besteht, daß die Oberflächen der fertigen lotplattierten Bleche sowie der Folien und Drähte eine Graufärbung aufweisen, die sich beim eigentlichen Lötvorgans insofern als nachteilig erweist, als derartige Qberflächenschichten das Löten beeinträchtigen können bzw. eine aufwendigere und damit unwirtschaftlichere Vorbehandlung vor dem Löten erforderlich machen.Such solders are the subject of DT-AS 1 962 760 or DT-OS 2 143 965 In contrast to commercially available AlSi solders, such as the L-AlSi 12, preformed solder parts have shown that that there is often a risk that the surfaces of the finished solder-plated sheets as well as the foils and wires have a gray color have, which proves to be disadvantageous in the actual soldering process, as such surface layers the Can affect soldering or require a more complex and therefore less economical pretreatment before soldering do.

Der Erfindung liegt die Aufgabe zugrunde, ein Verfahren zur Herstellung der eingangs genannten Lote zu schaffen, bei dem das lotplattierte Material bzw. die Lotformteile auch bei erforderlichen Zwischen- bzw. Endglühungen blank bleiben. Dies wird · erfindungsgömäß dadurch erreicht, daß dem Lotmaterial ein Magnesium-Gehalt in Höhe von 0,05 - 0,18 %, vorzugsweise 0,05 - 0,11 %, zugesetzt wird. Dies kann in üblicher Weise durch Zulegieren von Magnesium in den genannten Mengen geschehen. Es hat sich überraschenderweise gezeigt, daß auf diese Weise ein Grauwerden derThe invention is based on the object of a method for production To create the solder mentioned at the beginning, in which the solder-plated material or the solder preforms also when required Intermediate or final anneals remain bright. This is achieved according to the invention in that the solder material has a magnesium content in the amount of 0.05 - 0.18%, preferably 0.05 - 0.11%, is added. This can be done in the usual way by adding magnesium in the amounts mentioned. It turned out surprisingly showed that in this way a graying of the

409850/0483409850/0483

erzeugten lotplattierten Bleche "bzw. Lotformteile mit Sicherheit vermieden werden kann. Setzt man dem Lotwerkstoff mehr Magnesium zu als dem erfindungsgemäßen oberen Gehalt entspricht, so "bleiben die Oberflächen zwar ebenfalls blank, jedoch ergeben sich dann beim Löten unter Schutzgas nur noch unbefriedigende Verbindungen.produced solder-plated sheets "or solder preforms with certainty can be avoided. If you put more magnesium in the brazing material to than corresponds to the upper content according to the invention, so "remain." The surfaces are also bare, but then only unsatisfactory connections result when soldering under protective gas.

Weiterhin hat es sich als vorteilhaft erwiesen, die Lotbarren TFOT der Weiterverarbeitung zu lotplattiertem Material bzw. Lotformteilen einem Homogenisierungsprozeß zu unterwerfen, um eine gleichmäßige Verteilung der Legierungsmetalle im Lotwerkstoff zu gewährleisten, ohne daß dabei die Lötbarkeit beeinträchtigt wird. Zweckmäßig erfolgt diese Wärmebehandlung bei Temperaturen zwischen 4-20 und 560 0C, vorzugsweise' zwischen 4-80 und 520 0C, wobei je nach Höhe der Temperaturen die Zeiten zwischen 6 und 24 Stunden betragen. Hierbei entsprechen in der Regel kürzere Glühzeiten höheren Homogenisierungstemperaturen.Furthermore, it has proven to be advantageous to subject the TFOT solder bars to a homogenization process for further processing into solder-plated material or solder preforms in order to ensure a uniform distribution of the alloy metals in the solder material without impairing the solderability. This heat treatment is expediently carried out at temperatures between 4-20 and 560 ° C., preferably between 4-80 and 520 ° C., the times being between 6 and 24 hours depending on the level of the temperatures. As a rule, shorter annealing times correspond to higher homogenization temperatures.

nachstehend sind einige Beispiele für die erfindungsgemäß erzeugten Lotmaterialien aufgeführt:below are some examples of those produced in accordance with the invention Solder materials listed:

1) Si1) Si - 9,8 %- 9.8% 2) Si2) Si - 7,7 %- 7.7% 3) Si3) Si - 12,5- 12.5 BiBi - 0,03 %- 0.03% SbSb - 0,5 %- 0.5% BaBa 1,011.01 .Mg.Mg - 0,07 %- 0.07% MgMg 0,13 %0.13% MgMg 0,090.09 MnMn 0,04 % 0.04 % MnMn - 0,03 % - 0.03 % MnMn o,C5o, C5 FeFe - 0,63 % - 0.63 % . Fe. Fe 0,25 % 0.25 % FeFe 0,430.43 TiTi - 0,03 % - 0.03 % TiTi 0,03 % 0.03 % TiTi 0,030.03 GuGu 0,16 %0.16% CuCu 0,01 % 0.01 % GuGu 0,130.13 -■ Zn-- ■ Zn- 0*08 % 0 * 08 % ZnZn 0,04 %0.04% ZnZn 0,150.15 . Rest. rest AluminimAluminim Restrest Aluminiumaluminum Restrest Aluminiumaluminum 4) Si4) Si - 10,7 % - 10.7 % 5) Si5) Si - 9,3 % - 9.3 % SrSr 0,53 °/° 0.53 ° / ° BeBe -. 0,0006 % -. 0.0006 % MgMg 0,15 %0.15% ' Mg'Mg - 0,15 % - 0.15% MnMn 0,10 % 0.10 % MnMn 0,10 %0.10% FeFe 0,24 % 0.24 % FeFe - 0,27 %- 0.27% TiTi 0,02 % 0.02 % TiTi - 0,03 % - 0.03 % GuGu 0,01 % 0.01 % GuGu 0,02 %0.02% ■ Zn■ Zn 0,08 %0.08% ZnZn - 0,13 %- 0.13% Restrest Aluminiumaluminum Restrest Aluminiumaluminum 409850/409850 / 04830483

Weiterliin können noch. Komb inat ionen der Elemente Wismut, Strontium, Barium, Antimon und Beryllium zusammen mit den erfindungsgemäßen Zusätzen an Magnesium verwendet werden.You can continue reading. Combinations of the elements bismuth, Strontium, barium, antimony and beryllium can be used together with the magnesium additives according to the invention.

4098 5 0/04834098 5 0/0483

Claims (3)

PatentansprücheClaims 1) Verfahren zur Herstellung eines Lotwerkstoffes auf der Basis AlSi mit Gehalten an 4 - 20 % Silicium und aus ^e 0,01 - 10 %, vorzugsweise Je 0,05 bis 2 %, Wismut, Strontium, Barium, Antimon und/oder Beryllium in Mengen von 0,00001 - 1,0, vorzugsweise 0,0002 - 0,1 %, Rest Aluminium und herstellungsbedingte Verunreinigungen zum flußmittellosen Löten von Aluminium-Werkstoffen unter Schutzgas bzw. sauerstoffarmer Atmosphäre, dadurch gekennzeichnet, daß dem Lotmaterial ein Magnesium-Gehalt in Höhe von 0,05 - 0,18 %, vorzugsweise 0,05 - 0,11 %, zugesetzt wird.1) Process for the production of a solder material based on AlSi with contents of 4 - 20 % silicon and from ^ e 0.01 - 10%, preferably 0.05 to 2% each, bismuth, strontium, barium, antimony and / or beryllium in amounts of 0.00001-1.0, preferably 0.0002-0.1%, the remainder aluminum and production-related impurities for flux-free soldering of aluminum materials in a protective gas or low-oxygen atmosphere, characterized in that the solder material has a magnesium content in the amount of 0.05-0.18%, preferably 0.05-0.11%, is added. 2) Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Lotbarren vor der Weiterverarbeitung zu lotplattiertem Material bzw. Lotformteilen einem Homogenisierungsprozeß unterworfen werden.2) Method according to claim 1, characterized in that the A homogenization process prior to further processing into solder-plated material or solder preforms be subjected. 3) Verfahren nach Anspruch 2, dadurch gekennzeichnet, daß3) Method according to claim 2, characterized in that die Wärmebehandlung bei Temperaturen zwischen 420 und 560 0G, vor*O£BUgsweise zwischen 480 und 520 0C, erfolgen, wobei je nach Höhe der Temperaturen die Zeiten zwischen 6 und 24 Stunden "betragen.the heat treatment at temperatures from 420 to 560 0 G, above * £ O BUgsweise 480-520 0 C, take place, wherein the amount time between 6 and 24 hours "depending on the height of the temperatures. 409850/0483409850/0483
DE2326193A 1973-05-23 1973-05-23 Solder for flux-free soldering of aluminum materials Expired DE2326193C3 (en)

Priority Applications (16)

Application Number Priority Date Filing Date Title
DE2326193A DE2326193C3 (en) 1973-05-23 1973-05-23 Solder for flux-free soldering of aluminum materials
AT82174A AT324797B (en) 1973-05-23 1974-02-01 METHOD FOR MANUFACTURING A SOLDER MATERIAL
IT67367/74A IT1004910B (en) 1973-05-23 1974-02-11 PROCEDURE FOR THE PRODUCTION OF A SOLDER
BE2053440A BE811354A (en) 1973-05-23 1974-02-21 PROCESS FOR MANUFACTURING A WELD
FR7406535A FR2230748B1 (en) 1973-05-23 1974-02-26
NO740655A NO740655L (en) 1973-05-23 1974-02-26 Method for producing a solder for flux-free soldering of aluminum.
SE7404497A SE410156B (en) 1973-05-23 1974-04-03 PROCEDURE FOR PREPARING SOLDERING MATERIAL
NLAANVRAGE7405762,A NL178139C (en) 1973-05-23 1974-04-29 PROCESS FOR THE PREPARATION OF A SOLDER, AND SOLDERED FORMED PRODUCT, OBTAINED USING THIS SOLDERING MATERIAL
GB2273674A GB1462506A (en) 1973-05-23 1974-05-21 Soldering material and a method of producing it
LU70133A LU70133A1 (en) 1973-05-23 1974-05-21
JP5675474A JPS5510357B2 (en) 1973-05-23 1974-05-22
ZA00743320A ZA743320B (en) 1973-05-23 1974-05-22 A process for producing solder material
CH706674A CH599349A5 (en) 1973-05-23 1974-05-22
SU742026251A SU679117A3 (en) 1973-05-23 1974-05-23 Solder for soldering aluminium alloys
DK282774A DK139094C (en) 1973-05-23 1974-05-24 PROCEDURE FOR PREPARING A SOLDERING MATERIAL
JP8028079A JPS558399A (en) 1973-05-23 1979-06-27 Brazing material and making method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2326193A DE2326193C3 (en) 1973-05-23 1973-05-23 Solder for flux-free soldering of aluminum materials

Publications (3)

Publication Number Publication Date
DE2326193A1 true DE2326193A1 (en) 1974-12-12
DE2326193B2 DE2326193B2 (en) 1977-08-25
DE2326193C3 DE2326193C3 (en) 1981-06-04

Family

ID=5881856

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2326193A Expired DE2326193C3 (en) 1973-05-23 1973-05-23 Solder for flux-free soldering of aluminum materials

Country Status (15)

Country Link
JP (2) JPS5510357B2 (en)
AT (1) AT324797B (en)
BE (1) BE811354A (en)
CH (1) CH599349A5 (en)
DE (1) DE2326193C3 (en)
DK (1) DK139094C (en)
FR (1) FR2230748B1 (en)
GB (1) GB1462506A (en)
IT (1) IT1004910B (en)
LU (1) LU70133A1 (en)
NL (1) NL178139C (en)
NO (1) NO740655L (en)
SE (1) SE410156B (en)
SU (1) SU679117A3 (en)
ZA (1) ZA743320B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11766846B2 (en) 2017-04-24 2023-09-26 Novelis Inc. Clad aluminum alloy products

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56142796A (en) * 1980-04-04 1981-11-07 Kayaba Ind Co Ltd Autopilot
EP0039153B1 (en) * 1980-04-29 1984-10-24 Marston Palmer Ltd. A sheet of foil, clad sheet of aluminium and method of brazing using a strontium containing brazing alloy
JPS58199297A (en) * 1982-05-18 1983-11-19 Tokyo Keiki Co Ltd Steering device of vessel
DE4217122A1 (en) * 1992-05-23 1993-11-25 Mahle Gmbh Coilable aluminium@ alloy wire - contains silicon or nickel and is drawn from metal-sprayed starting material
DE102004049074A1 (en) * 2004-10-08 2006-04-13 Trimet Aluminium Ag Cold curing aluminum casting alloy and method of making an aluminum casting
JP2012050995A (en) * 2010-08-31 2012-03-15 Mitsubishi Alum Co Ltd Aluminum alloy brazing material sheet for fluxless brazing and fluxless brazing method for aluminum material

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE758884A (en) * 1969-12-15 1971-04-16 Vaw Ver Aluminium Werke Ag PROCESS FOR BRAZING ALUMINUM AND ITS ALLOYS

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NICHTS ERMITTELT *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11766846B2 (en) 2017-04-24 2023-09-26 Novelis Inc. Clad aluminum alloy products

Also Published As

Publication number Publication date
DE2326193B2 (en) 1977-08-25
FR2230748B1 (en) 1978-10-20
DE2326193C3 (en) 1981-06-04
NL178139C (en) 1986-02-03
NO135856C (en) 1977-06-15
JPS5510357B2 (en) 1980-03-15
JPS5019651A (en) 1975-03-01
DK139094B (en) 1978-12-18
LU70133A1 (en) 1974-10-09
CH599349A5 (en) 1978-05-31
ZA743320B (en) 1975-10-29
JPS5539440B2 (en) 1980-10-11
AT324797B (en) 1975-09-25
NL178139B (en) 1985-09-02
JPS558399A (en) 1980-01-21
NO740655L (en) 1974-11-26
NL7405762A (en) 1974-11-26
FR2230748A1 (en) 1974-12-20
IT1004910B (en) 1976-07-20
GB1462506A (en) 1977-01-26
BE811354A (en) 1974-06-17
SE410156B (en) 1979-10-01
NO135856B (en) 1977-03-07
SU679117A3 (en) 1979-08-05
DK139094C (en) 1979-05-28

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