DE2312015A1 - MANUFACTURING PROCESS FOR A HOUSING FOR CONNECTING OPTICAL FIBERS TO PHOTO-SENSITIVE SEMICONDUCTORS AND MICRO LAMPS OR ELECTROLUMINESCENT DIODES - Google Patents

Description

Dipl.-Ing. Waiter Jasklsbh,

2 Stuttgart-N, Menzelstrasse 40

E R F I IT D U IT G

Manufacturing process for a housing ζυΐα connecting optical fibers to photosensitive semiconductors and micro-lamps or electroluminescent Diodes.

Francois FOSO?

309838/0990

The invention "relates to the connection of optical fibers Semiconductor elements that are al & transmitters or electro-luminescent sources and serve as receivers or photosensitive elements.

In particular, the invention aims to provide a unit produce, which on the one hand consists of a housing in which the Fiber is divided into two conductors, one of which leads to LiehtE-asstrahliingi the distance serves to receive a reflected light, the other comprises a second housing in which the photo-sensitizers and Electro-luminescent semiconductor elements are included.

In the first housing are the optical Paserii, the are disassembled into two parts and are flush with the surface of the housing, those on the surface of the second containing the semiconductor elements Housing is connected.

It is known that the machining and polishing of the Housing surfaces on which the optical wires ends, lengthy and sensitive processes 3ind. D.-S manufacturing processes according to the invention should make this process easier. , -

The invention, therefore, a preparation process of a housing for connecting optical parsers are at Halbleitsreleraeiite _f characterized in DSSS the parsers are between two Ealbsehalen clamped are both tmd parallelepiped-shaped with recesses for the lasers, as well as to one side of their contact surfaces with the fiber ends encompassing hips are provided, these clans are ground flat during the polishing process and the assembled shells are overmolded in such a way that coupling and latching is made possible with that housing in which the semiconductor elements are located.

Further properties can be found in the detailed below Description. Forms of embodiment of the object according to the invention are given by way of example and without restrictive intent in the appended Drawing shown.

In this drawing:

- Fig. 1 is a perspective view of the two half-shells according to the invention with the wires stretched in between,

. - Fig. 2 a perspective view of the two joined half-shells before the polishing process of the method according to the E £ find \ m _ot

Fig. 3 is a perspective view of the coupling device

according to the invention »

309838/0990

In order to realize the coupling device of the optical fibers, the fibers are clamped between the half-Bohalen 1 and 2 according to the invention. In the example shown, the optical fibers 3 separated into two parts 3a ox & 3b are laid in recesses 4 of the parallelepiped-shaped shells, these shells being provided with a rib 5 on one side of their contact surface.

The fiber ends are clamped between these clans 5, as soon as the two half-shells 1 and 2 are joined together.

Then the ribs 5 are machined flat and those Polished surface of the interconnected half-shells on which the Ribs 5 were present.

Piping two joined Ilalbschalen form with interpolated surface 6, at the finish, the fiber ends of the optical fibers, to form a parallelepiped-shaped ^to obtain a Yor housing that is overmolded Xopplungs housing 7, with two perpendicular to the polished surface 6 Rods 8 is provided.

Biese fceiäea butene 8 serve as a ferry track for the two Elink narrow locking lamellae 9 of a housing OK, "in which, exactly opposite the fibers 3a and 3b, the Ee.lter-an.gen 11 and 12 of the semiconductor elements, for example an electro-luiainescent transmitter and a photosensitive receiver.

In this housing 10, a further housing 13 with the the electronic circuits of the semiconductor elements are attached.

To ensure mutual cohesion tlez housing 7 '-znä- 10, the ends of the lElinlcengespi & rr-Lanallen 9 ³ ^ are provided with a hook 14 which engages behind the hat 8 on the rear surface of the housing 7.

This manufacturing process means that the polishing process takes time saved »because the volume of material to be processed by polishing

only

reduced to the two ribs 5 and ^ a slight polishing of the surface 6 is necessary, while the cohesion of the connection and the final shape is achieved by the overmolding process, which allows a Y latch with that housing in which the transmitting and receiving elements the fiber ends 5 ^a and 3b of the optical fibers 3 are exactly opposite.

You invention is not limited to this only one in the description and the embodiment shown in the drawing, but covers on the contrary, also all design variants.

30983870990

Claims (3)

Manufacturing process for connecting optical fibers cn Semiconductor elements, characterized in that the fibers are between two half-shells are clamped, both of which have a parallelepiped shape and have recesses for the fibers as well as on one side of their Provide contact surfaces with a hip spanning the fiber ends are, these ribs are ground flat during the polishing process and the assembled shells are overmolded in such a way that coupling and latching with that housing is made possible in ' where the semiconductor elements are located. 2. Housing for connecting optical fibers to semiconductor elements, manufactured according to claim 1 and characterized in that it consists of two half-shells encompassing the fiber, that ..- these assembled shells are formed into a parallelepiped, in its polished surface finish the fiber ends flat and with which are attached in two other, opposite surfaces! Tuten, which run perpendicular to the polished surface and the two ratchet lamellae of the semiconductor element housing as Serve locking track. '-. 3. Housing according to claim 2, characterized in that di.e optical fibers in two parts, a transmitting and a Esipf fear part be disassembled. 309838/0990