DE2135831A1 - Process for the production of printed circuits for electrical engineering and electronics as well as printed circuits according to this process - Google Patents

Description

•> ATfcNTANWÄLTE F.W. HEMMERICH GERD MÜLLER D. Ü ROSSe 22 028

- bfa -

15.7.15 -El-

■ * DÜSSELDORF 10 · HOMBERGER ST RASSE 5 "^" ^ -, O 1 O C O O

7/15/1971 2 I 0 b Q Q I

Pierre, Louis »Marie DROGO,

12 rue Ploix. VERSAILLES (Yvelines). France

Process for the manufacture of printed circuits for Electrical engineering and electronics as well as printed circuits manufactured using this process

The object of this invention is essentially manufacture so-called pressed circuits after the casting process.

The production of so-called printed ones is already known Switching by rolling out insulating material, which encloses a sheet of electricity-conducting material.

The aforementioned film is then made using a photo-engraving process converted into a predetermined circuit or circuit.

Ready is also confessed that such printed Circuits by means of conductive ink or paint Insulating material can be printed, for example after Process of serigraphy or screen printing.

DLe printed circuitry obtained using one or the other method receives its external shape, its final form external shape, by punching / cutting or by machine / machining.

In a further machining process, the aforementioned printed circuits are provided with holes, which are intended either for the insertion of the circuit elements or for the connections or connections.

So far, the bores have been made mechanically, and twar essentially by drilling. Compared to the other manufacturing phases - because the circuits have more and more holes - this technique requires a considerable proportion of the processing time

109885/170 4

July 15, 1971 <ä # - B 2 -

This drilling method also has the disadvantage that expensive tools must be used to achieve an acceptable level of quality.

Because the holes to be drilled have a very small diameter, because the insulating material to be drilled has an abrasive character the aforementioned tools wear out very quickly.

Now this length influences the production price for the τ · γ-mentioned printed circuits, as well as those to be observed in the manufacture of these printed circuits Work sequence.

In addition, when using the previously known Process does not produce printed circuit boards that are flat or planar.

The aim of this invention, which aims to eliminate the above-mentioned disadvantages, is therefore to create a method for the production of printed circuits for electronic and electrical engineering. This method is characterized in that it includes the following individual steps: Production of the insulating body belonging to the printed circuit in a form which - after removing it from the form - has W projections corresponding to the holes in the printed circuit, so that all holes and the correct shape of the printed circuit can be obtained immediately, finally the application of the conductive layer or the conductor to the insulating body.

109885/1704

- bh 7/15/1971

-Gl-

The invention will now be described below with reference to the drawing Exemplary embodiment shown (the one shown in the drawing Execution examples) explained in more detail. The drawing shows int-

Fi g. 1 A cut through a fora xur making a printed circuit, the details of which are given in Figs. 19, 20 and 21.

Fig. La is a perspective view of an insulating plate or a carrier made of insulating material.

Fig. Ib A view of the finished circuit.

Fig. 2 is a greatly enlarged section, which is placed in the line A-A of Fig. La.

2a shows the same section after a metallization brought about by chemical means.

Fig. 2b The same section after applying a photosensitive synthetic resin layer

Fig. 3 The same section through Fig. La after exposure under or behind a mask.

Flg. J * One. Cut through the printed circuit of the electrolyte! see application of a metal layer.

5 shows a section through the printed circuit after the synthetic resin has been lifted off or removed.

Fig. 6 A section through a printed circuit after approaching and after dissolving the very thin Metallization.

Fiit. 7th

up to 11 ^{to 8 other} manufacturing processes for the metallization of the circuit, the circuit.

to * 13 ⁸ ^ " ¹ ^ - *** ⁰¹ * ¹¹¹ * other manufacturing process for the metallization of the street circle or the view. 109885/1704

- bra -

, July 15, 1971

U - G 2 -

Fig. Ik Bin another embodiment for the metallization of the circuit or the circuit.

Fig. 15 Jö.ne sectional view showing the metallization process in a complex circuit with various Reproduces high altitudes,

Fig. 16 The metallization of a circuit or a circuit ₉ has bores or holes.

Fig. 18 Une another view in section relating to a

yet another embodiment of a circuit or circuit that has bores and holes.

Fig. 19 A printed circuit, ie by casting or in Gießveröhrön - this process as shown in Fig. 1 i reproduces.

In accordance with this invention, but also in accordance with FIG. 1, the production of printed circuits for fi-lektrotechnik and electronics consists in that the insulating material carrier belonging to the printed circuit is cast in a form consisting, for example, of the two molds I ₁ and I ₂ exist, which are held together and connected to one another by a connection level 1 «.

As far as the shaping surface of the mold I ₁ is concerned, the 'projections I ^ belong to the shape, for example. These projections correspond in number to the holes in the circuit after the circuit has been removed from the mold, so that, for example, the bores and the shape of the circuit can be achieved directly. Because the insulating material carrier is produced by casting, it is possible to produce such circuits which have flat surfaces or different gradations, which considerably expands the possible uses for such circuits.

One or the other mold of the casting mold can advantageously

109885/1704

-bra. 7/15/1971 5 -03-

also have relief shapes.

As for part 1 «of the form, this one can relief farms 1-, which are intended to be in the insulating support Produce sockets or receiving bays, which then later have to receive the circuit elements. These circuit elements are then immovable in these bays and are adjusted in it.

Part 1 of the mold also includes the relief fora Igt to create indentations - and this in the insulating support -, these depressions then have to accommodate the conduction paths of the current conductors.

The methods of making the circuits or circuits will be described in detail later in this patent application.

Make the removal from the mold the conductive parts

of the printed circuits on the insulating material, such as described in the examples given below.

example 1

as can be seen from Fig. La, is immediately after casting the insulating material carrier or the insulating material plate with the irregular contours 2 and the holes 3 taken out of the mold. This insulating material body or this insulating material plate is provided with a conductor 2., namely according to the switching sequences or the conductor tracks of Fig. Ib, with which shows a finished printed circuit

Fig. 2 now shows a laid in line A-A of Fig. La Section through the circuit or through the printed circuit.

Referring to Fig. 2, the holes or bores 3 are clear ,"recognize. 109885/1704

22 028 -bh 7/15/1971 ft -0 * -

According to FIG. 2a, the insulating material carrier formed by casting is shown chemical metallization creates a very thin metal layer 5 has been applied. This metal layer 5 », the thickness of which is of the order of a few tenths of a micron, can also stretch through the holes 3 in the same way.

FLg. 2b now shows the chemically metallized insulating material carrier, its metallization layer with a layer of photosensitive synthetic resin 6 is covered

The one with Flg. 3 reproduced same section through the printed one Circuit shows that the insulating material - rather the photosensitive one located on the insulating material carrier Resin - exposed to the image of the circuit using a mask. Farther also that after developing the resin accordingly removed from the circuit pattern or the circuit pattern has been.

The method is then shown in FIG. 4 by electrolytic Application of a thicker metal layer 7 continued. .

Finally - and this can be seen from FIG. 5 - means a solvent such as aromatic ketone, the synthetic resin 6 taken away and removed so that the final circuit shown at FIG. 6 or the final circuit shown at FIG. 6 occurs after beforehand the thin metal layers in the places that voe Resin 6 have been invaded, attacked and loosened.

Example 2

FLg. 7 i »t« in a greatly enlarged section through sin * .. Insulating material carrier 1. The reader section corresponds to the Idni®

109885/1704

22 028 - bh July 15, 1971

-05-

A-A laid section according to Fig. La.

As can be seen from Fig. 8, a thick metal layer is formed by gluing 8 on the insulating material carrier or on the Ieo. plastic plate applied.

This gluing is accomplished in that at a temperature τοη 100 to 120 ° G, the metal foil 8, which was previously has been provided with a commercially available PVC adhesive, is rolled on by calendering.

According to Fig. 9, the metal layer 5 (or 8) is now old pheto-sensitive Synthetic resin 9 covered, which after exposure under a Äitwicklungswake and then following development creates the circuit and its management.

Then, as shown in Fig. 10, it becomes unprotected or not covered metal approached and disintegrated. Finally, the synthetic resin layer 9 is removed, so that the finished So posture according to Fig. 11 arises.

Example 3

Mach Fig. 12 becomes the insulating material support or the insulating material plate 1 old coated with a layer 10 of photosensitive synthetic resin and then exposed and developed under a mask.

To avoid metallization, the synthetic resin 1 and a silicone resin have been added. According to FIG. 13, a thick metal layer 11 is then applied by chemical plating to produce a current-conducting circuit or circuit. The remaining synthetic resin 10 can be removed if desired, but this is not mandatory.

example H

Fig. 14 now shows an insulating material vein an insulating material plate on which a conductive circuit or

109885/1704

22 028

-bra-

July 15, 1971

I .06-

conductive circuit using a conductive Ink by means of serigraphy or the screen printing process is printed.

Example 6

15 shows the metallization process for a circuit which is not necessarily flat or flat. The chief Circuit or the current-conducting exercise facility 13 is mediated the procedure mentioned with Examples 1 and 3 brought about, only the illustration of the circuit or the electric circuit behind the mask is different.

The shape of the insulating material does indeed allow a contact copy not au. For this reason, a projector is used whose light source is selective and rich in ultraviolet Light is, (mercury arc lamp). By the Punktuel-Ie Light source of the arc, the errors with regard to the depth of the field are made negligibly small.

In some cases, the use of a flat or plan Mask and a point light source (without lens) possible.

Example 6

In this W with Fig. 16 shown example, the shape or design, the conductive layer or the strbmleitenden circuit 14 are manufactured in molding by casting, the result of which is shown with Fig. 1,.

The insulating material carrier, which (according to Fig. 17) with a photosensitive Synthetic resin layer 15 is coated, is exposed and developed. The chemical metallization is possibly through an electrolytically applied metal layer - and this after Example 1 and 3 - reinforced. The circuits or circuits obtained in this way are particularly robust.

109885 / 170A

22 028

- bh 7/15/1971

- α 7 -

Example 7

The circuit shown in FIG. 18 is a circuit that is produced during molding by casting directly into a cavity, the electrical conductivity being achieved by means of a paste which for example, “is applied with a scraper.

In this way of production, circuits or circuits for currents with very high currents can be realized will.

With FLg. 19t, FIGS. 20 and 21 is a circuit or a circuit Circuit shown, which according to the method of FIG has been made. The surface 18 of this circuit or this circuit is provided with the depressions or indentations 20. These depressions or indentations that have been produced during the Gieflformvorganges, take the circuit elements, which there by their Fora, by Soldering, possibly also held by the elasticity of the insulating material carrier, whereby this construction all errors in the construction of the circuit elements are avoided directly during casting an edge 21 on one level, but also a shortening in a corresponding form the other side, so that a possible stacking or plugging of the circuits is possible.

In the course of casting or shaping, the method allows the attachment of metal parts, for example of Connection lugs 23, which are automatically in the right places during the metallization process. DLe area 19 consists of a circuit or a conductor that has been implemented with the aid of the above-mentioned methods.

109885/1704

22 028

- bh 15.7.1971

-08-

I oxygen carrier or issuer st off plates for the printed views are advantageously made of hard plastic throwing material or soft plastic material, and can be made by injecting the powder that needs to be supplied or by Qieäsn vsn poljaerisable Kanstharsen by Sakundäraktion.

The shaped pieces for the circuits provided with depressions according to Examples 6 and 7 are advantageously produced by a photochead assembly. OL @ gleiehs mask Jiiid sur Abfcildiane ^de e Biromkreims and sur Ftbrikfttien der Fora used, a clear marking is guaranteed.

But let me add to this addendum. me, pointed out that this invention is not limited to those described here Au & iüftrung examples that can be rea-Iieiert in other ways without being DSSS departing from the spirit of the invention need "

1OS885 / 1704

Claims (4)

22 026 -Dh- July 15, 1971 -Al- Pierre, Louis, Marie KOOO. Patent claims: Process for the production of printed circuits for electrical engineering and electronics. This method thereby known without that the insulating material carrier or the insulating stiffener plate for The printed circuit is made in a fora corresponding to the holes that the circuit is after de «Herawsnehaen aus der Fen * should show, Hit Vojv spring is provided} finally the insulating material carrier or the insulating plate is a · conductor or coated with a conductive layer 109885/1704 22 028 - bh 7/15/1971 H -A 2- 2. The method of claim 1.
This method
characterized by »that the shaping surfaces of the molds belonging to the casting mold have relief molds, around the insulating material body or currents embedded in the insulating material to be able to bring about conductor tracks, but also cavities or bays to accommodate the circuit elements, 3 · Method according to claims 1 and 2. || This method characterized by _t daS the insulating material on one or the other surface plate - or on both sides of the insulating plate or the insulating material carrier - a current conductor layer is applied. 4. The method of claim 1.
This method
characterized in that on all surfaces of the insulating material carrier or the insulating material plate an electrically conductive layer is achieved by applying a thin layer of conductor material; W. this thin etrome-conducting layer then with a layer is covered from photosensitive synthetic resin, which creates space for the electrolytic after the exposure process Applying a thick Metallschichtι then the superfluous Synthetic resin is removed again in order to make the circuit or the circuit visible, that the thin metal layers by chemical Influence at the points of the superfluous synthetic resin can be taken away. 109885 / 170A - bh 7/15/1971 - A 3 - A method of manufacturing printed circuit boards according to claim 1 and any one of claims 2 to 4. - Shde - 10988S / 17Q4