DE2132254A1 - Verfahren zum Montieren elektronischer Vorrichtungen - Google Patents

Verfahren zum Montieren elektronischer Vorrichtungen

Info

Publication number
DE2132254A1
DE2132254A1 DE19712132254 DE2132254A DE2132254A1 DE 2132254 A1 DE2132254 A1 DE 2132254A1 DE 19712132254 DE19712132254 DE 19712132254 DE 2132254 A DE2132254 A DE 2132254A DE 2132254 A1 DE2132254 A1 DE 2132254A1
Authority
DE
Germany
Prior art keywords
aluminum
alloy
layer
germanium
eutectic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19712132254
Other languages
German (de)
English (en)
Inventor
Hoffmann Joe Gordon
Manus Donald Jackson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of DE2132254A1 publication Critical patent/DE2132254A1/de
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950°C
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Products (AREA)
DE19712132254 1970-06-30 1971-06-29 Verfahren zum Montieren elektronischer Vorrichtungen Ceased DE2132254A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US5125370A 1970-06-30 1970-06-30
US5125570A 1970-06-30 1970-06-30

Publications (1)

Publication Number Publication Date
DE2132254A1 true DE2132254A1 (de) 1972-01-05

Family

ID=26729217

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19712132254 Ceased DE2132254A1 (de) 1970-06-30 1971-06-29 Verfahren zum Montieren elektronischer Vorrichtungen

Country Status (3)

Country Link
JP (1) JPS5750053B1 (https=)
DE (1) DE2132254A1 (https=)
FR (1) FR2096801A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11271132B2 (en) * 2015-07-24 2022-03-08 Artilux, Inc. Multi-wafer based light absorption apparatus and applications thereof
US11316065B2 (en) 2015-07-24 2022-04-26 Artilux, Inc. Multi-wafer based light absorption apparatus and applications thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59146768U (ja) * 1983-03-23 1984-10-01 株式会社東芝 水質計器

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL252974A (https=) * 1959-07-24

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11271132B2 (en) * 2015-07-24 2022-03-08 Artilux, Inc. Multi-wafer based light absorption apparatus and applications thereof
US11316065B2 (en) 2015-07-24 2022-04-26 Artilux, Inc. Multi-wafer based light absorption apparatus and applications thereof

Also Published As

Publication number Publication date
FR2096801B1 (https=) 1976-09-17
JPS5750053B1 (https=) 1982-10-25
FR2096801A1 (en) 1972-02-25

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Legal Events

Date Code Title Description
OD Request for examination
8131 Rejection