DE20321021U1 - Probe station for measuring silicon wafers characteristic, has tub enclosure supporting conductive portion that include openings through which probes are placed, and conductive plates placed over unused openings - Google Patents

Probe station for measuring silicon wafers characteristic, has tub enclosure supporting conductive portion that include openings through which probes are placed, and conductive plates placed over unused openings Download PDF

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Publication number
DE20321021U1
DE20321021U1 DE20321021U DE20321021U DE20321021U1 DE 20321021 U1 DE20321021 U1 DE 20321021U1 DE 20321021 U DE20321021 U DE 20321021U DE 20321021 U DE20321021 U DE 20321021U DE 20321021 U1 DE20321021 U1 DE 20321021U1
Authority
DE
Germany
Prior art keywords
openings
probes
characteristic
conductive portion
silicon wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20321021U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Beaverton Inc
Original Assignee
Cascade Microtech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/319,287 external-priority patent/US6861856B2/en
Application filed by Cascade Microtech Inc filed Critical Cascade Microtech Inc
Publication of DE20321021U1 publication Critical patent/DE20321021U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The station has a plate assembly with a conductive portion (240) having openings (242), where the conductive portion is supported by a tub enclosure (120). Probes are placed through the openings. Conductive plates are placed over unused openings. The enclosures lower portion is opened to permit a chuck to be lowered and raised with respect to the enclosure to load a wafer.
DE20321021U 2002-12-13 2003-10-27 Probe station for measuring silicon wafers characteristic, has tub enclosure supporting conductive portion that include openings through which probes are placed, and conductive plates placed over unused openings Expired - Lifetime DE20321021U1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/319,287 US6861856B2 (en) 2002-12-13 2002-12-13 Guarded tub enclosure
EP03779339.5A EP1570279B1 (en) 2002-12-13 2003-10-27 Guarded tub enclosure

Publications (1)

Publication Number Publication Date
DE20321021U1 true DE20321021U1 (en) 2005-09-15

Family

ID=35034397

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20321021U Expired - Lifetime DE20321021U1 (en) 2002-12-13 2003-10-27 Probe station for measuring silicon wafers characteristic, has tub enclosure supporting conductive portion that include openings through which probes are placed, and conductive plates placed over unused openings

Country Status (1)

Country Link
DE (1) DE20321021U1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006018474A1 (en) * 2006-04-19 2007-10-25 Infineon Technologies Ag Test device for semiconductor elements on a semiconductor wafer and a test method using the test device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006018474A1 (en) * 2006-04-19 2007-10-25 Infineon Technologies Ag Test device for semiconductor elements on a semiconductor wafer and a test method using the test device

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20051020

R150 Term of protection extended to 6 years

Effective date: 20061116

R151 Term of protection extended to 8 years

Effective date: 20091126

R158 Lapse of ip right after 8 years

Effective date: 20120501