DE20302732U1 - Cooling system for a CPU has a metal heat sink with a coupled contact plate for the CPU - Google Patents

Cooling system for a CPU has a metal heat sink with a coupled contact plate for the CPU

Info

Publication number
DE20302732U1
DE20302732U1 DE20302732U DE20302732U DE20302732U1 DE 20302732 U1 DE20302732 U1 DE 20302732U1 DE 20302732 U DE20302732 U DE 20302732U DE 20302732 U DE20302732 U DE 20302732U DE 20302732 U1 DE20302732 U1 DE 20302732U1
Authority
DE
Germany
Prior art keywords
cpu
heat sink
contact plate
cooling system
thermoelectric cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20302732U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHEN WILSON
Original Assignee
CHEN WILSON
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHEN WILSON filed Critical CHEN WILSON
Priority to DE20302732U priority Critical patent/DE20302732U1/en
Publication of DE20302732U1 publication Critical patent/DE20302732U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The cooling system has a finned heat sink block [2] with the cool air fan [10] inserted on the underside. A cooling plate [40] is inserted into a recess [21] and bonded to the top side is a metal contact plate [50]. The CPU is placed in contact with this.

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßtThe description text was not recorded electronically

Claims (1)

CPU-Kühlungsaufbau mit einem Kühlkörper (20) zur Absorption der Wärme von einer CPU eines Grundcomputers und einem Gebläse (10) zur Abgabe der Wärme von dem Kühlkörper, wobei der Kühlkörper eine flache Ausnehmung (21) in seiner flachen Bodenwand (23) aufweist, eine thermoelektrische Kühlungstafel (40) in die flache Ausnehmung eingesetzt ist und eine metallische Kontaktplatte an die flache Bodenwand zum Verschliessen der thermoelektrischen Kühlungstafel und zum Kontaktieren der zu kühlenden CPU angeklebt ist, eine Steuerschaltung (60) elektrisch mit dem Gebläse und der thermoelektrischen Kühlungstafel verbunden ist, um den Betrieb des Gebläses und der thermoelektrischen Kühlungstafel zu steuern, und wobei ferner die Steuerschaltung ein Stromkabel (30) für die Verbindung mit der Stromversorgungseinrichtung des Grundcomputers hat, in dem der CPU- Kühlungsaufbau installiert ist und von dem er für die Stromversorgung des Gebläses und der thermoelektrischen Kühlungstafel Strom erhält.CPU cooling structure with a heat sink ( 20 ) for absorbing the heat from a CPU of a basic computer and a fan ( 10 ) for emitting the heat from the heat sink, the heat sink having a flat recess ( 21 ) in its flat bottom wall ( 23 ), a thermoelectric cooling panel ( 40 ) is inserted into the flat recess and a metallic contact plate is glued to the flat bottom wall for closing the thermoelectric cooling panel and for contacting the CPU to be cooled, a control circuit ( 60 ) is electrically connected to the blower and the thermoelectric cooling panel to control the operation of the blower and the thermoelectric cooling panel, and wherein the control circuit further includes a power cable ( 30 ) for connection to the power supply of the basic computer in which the CPU cooling assembly is installed and from which it is used to power the blower and the thermoelectric Cooling panel receives electricity.
DE20302732U 2003-02-20 2003-02-20 Cooling system for a CPU has a metal heat sink with a coupled contact plate for the CPU Expired - Lifetime DE20302732U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE20302732U DE20302732U1 (en) 2003-02-20 2003-02-20 Cooling system for a CPU has a metal heat sink with a coupled contact plate for the CPU

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20302732U DE20302732U1 (en) 2003-02-20 2003-02-20 Cooling system for a CPU has a metal heat sink with a coupled contact plate for the CPU

Publications (1)

Publication Number Publication Date
DE20302732U1 true DE20302732U1 (en) 2003-04-24

Family

ID=7980193

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20302732U Expired - Lifetime DE20302732U1 (en) 2003-02-20 2003-02-20 Cooling system for a CPU has a metal heat sink with a coupled contact plate for the CPU

Country Status (1)

Country Link
DE (1) DE20302732U1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2416243A (en) * 2004-07-09 2006-01-18 Giga Byte Tech Co Ltd Multi stage cooling apparatus
DE102009011998A1 (en) * 2009-03-05 2010-09-16 Fujitsu Siemens Computers Gmbh Cooling body for cooling heat producing component of electronic system i.e. high-capacity server computer, has control circuit evaluating detected temperature and exchanging data with management component of electronic system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2416243A (en) * 2004-07-09 2006-01-18 Giga Byte Tech Co Ltd Multi stage cooling apparatus
GB2416243B (en) * 2004-07-09 2006-05-24 Giga Byte Tech Co Ltd Two stage radiation thermoelectric cooling apparatus
DE102009011998A1 (en) * 2009-03-05 2010-09-16 Fujitsu Siemens Computers Gmbh Cooling body for cooling heat producing component of electronic system i.e. high-capacity server computer, has control circuit evaluating detected temperature and exchanging data with management component of electronic system

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20030528

R156 Lapse of ip right after 3 years

Effective date: 20060901