DE2020587B2 - METAL-BACKED COMPRESSED LAYER FOR THE MANUFACTURE OF CIRCUIT BOARDS - Google Patents
METAL-BACKED COMPRESSED LAYER FOR THE MANUFACTURE OF CIRCUIT BOARDSInfo
- Publication number
- DE2020587B2 DE2020587B2 DE19702020587 DE2020587A DE2020587B2 DE 2020587 B2 DE2020587 B2 DE 2020587B2 DE 19702020587 DE19702020587 DE 19702020587 DE 2020587 A DE2020587 A DE 2020587A DE 2020587 B2 DE2020587 B2 DE 2020587B2
- Authority
- DE
- Germany
- Prior art keywords
- glass
- laminates
- glass fiber
- clad
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
- H01B3/084—Glass or glass wool in binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
Description
seidengewebes der Fall ist. Diese Schwierigkeit entfällt beim Aufbau aus Glasfaservlies, da das Laminat homogener wird.silk fabric is the case. This difficulty is not required if the structure is made of glass fiber fleece, as the laminate becomes more homogeneous.
3. Da die Lagenbindung des Materials besser ist als bei Verwendung von Glasseidengewebe, neigt es bei der mechanischen Bearbeitung weniger zum Delaminieren.3. Since the layer weave of the material is better than when using glass silk fabric, it is less prone to delamination during mechanical processing.
4. Da das Glasfaservlies ein Flächengewicht zwischen 50 und 100 g/m- aufweist, können dünne Laminate selbst bei Einhaltung sehr enger Toleranzen ohne zusätzliche Ausgleichslagen hergestellt weiden, was bei Glasseidengewebe im allgemeinen erforderlich ist.4. Since the glass fiber fleece has a weight per unit area between 50 and 100 g / m2, thin Laminates are manufactured without additional compensation layers, even if very tight tolerances are observed graze, which is generally required for glass silk fabrics.
5. Durch die Auswahl eines geeigneten Harzgehaltes von etwa 40 bis 50°/ο kann das Laminat so eingestellt werden, daß sein linearer thermischer Ausdehnungskoeffizient mit dem des Kupfers von 17 · 10"6 grd~' praktisch übereinstimmt. 5. By selecting a suitable resin content of around 40 to 50 ° / o, the laminate can be adjusted so that its coefficient of linear thermal expansion practically corresponds to that of copper, 17 · 10 "6 degrees.
Dadurch wird die lästige Verwölbung — vor allem der einseitig kupferkaschierten Laminate — weitgehend reduziert. Ein derartig hoher Harzgehalt ist bei für diesen Zweck gebräuchlichen Glasseidengeweben nicht anwendbar. This eliminates the annoying warpage - especially the one that is copper-clad on one side Laminates - largely reduced. Such a high resin content is essential for this purpose not applicable to conventional glass silk fabrics.
6. Glasseidengewebe kann bekanntlich mechanische Spannungen enthalten, die auf unterschiedlicher Spannung der Kettfaden sowie auf der Tatsache beruhen, daß durch das Einweben des Schußfadens eine Qv tkontraktion des Gewebes erfolgt. Bei Abweichungen von der Rechtwinkligkeit zwischen Kett- und Schußfaden, d. h. bei Verschieben des Gewebes, können weitere zusätzliche Spannungen auftreten. Diese Spannungen im Gewebe können sich beim Imprägnieren desselben verstärken und werden bei der Herstellung des glasseidenverstärkten Schichtpreßstoffes mit eingepreßt. Hierauf beruht die so überaus störende Verwindung glasseidenverstärkter Leiterplatten, die hin und wieder unvermeidbar auftritt.6. As is well known, glass silk fabrics can contain mechanical stresses which result in different Tension of the warp thread as well as based on the fact that through weaving of the weft thread a Qv t contraction of the fabric takes place. In the event of deviations from the Perpendicularity between warp and weft, d. H. when moving the fabric, further additional stresses can occur. This tension in the tissue can reinforce when impregnating the same and are reinforced in the manufacture of the glass silk Laminate pressed in with. The extremely annoying twist is based on this fiberglass-reinforced circuit boards, which occasionally occurs inevitably.
Diese Schwierigkeiten können erfindungsgemäß durch Verwendung von Glasfaservlies weitgehend vermieden werden.According to the invention, these difficulties can largely be overcome by using glass fiber fleece be avoided.
Als preßtechnisch günstig hat es sich erwiesen, tvenn man dem Laminat aus Glasfaservlies beidseitig zusätzlich eine Abdeckung aus feinem Glasseidengewebe gibt, welches zweckmäßig mit demselben härtbaren Harz wie das imprägnierte Glasfaservlies beharzt ist. Durch die beidseitige Glasseidenabdeckung wird das Schieben und Wegschwimmen des Vlieses, das bei zu früher Anwendung hohen Preßdruckes aufueten kann, verringert.It has proven to be favorable in terms of compression technology when the laminate made of glass fiber fleece is used on both sides In addition, there is a cover made of fine glass silk fabric, which is useful with the same hardenable resin like the impregnated glass fiber fleece is resinated. Due to the double-sided fiberglass cover the sliding and floating of the fleece, which is high if used too early Can aufueten pressing pressure is reduced.
Anwendungsbeispiel 1. Aufbau:Application example 1. Structure:
551Vo Glasfaservlies, bestehend aus etwa 90" η Ε-Glas mii 9 inn Filamenten und einem Flächengewicht von 50 bis 60 g/m-, 45°/o Bindemittel aus härtbarem Harz, beste-•5 hend aus55 1 Vo glass fiber fleece, consisting of about 90 "η Ε -glass with 9 inn filaments and a weight per unit area of 50 to 60 g / m2, 45% binder made of hardenable resin, consisting of
100 Gewichtsteilen unmodifiziertes Epoxydharz vom Epoxydäquivalentgewicht 180 bis 200, 44 Gewichtsteilen aromatisches Dia-100 parts by weight of unmodified epoxy resin of epoxy equivalent weight 180 to 200, 44 parts by weight of aromatic di-
min als Härter.min as a hardener.
0,5 Gewichtsteilen BF_,-Addukt als Beschleuniger.0.5 part by weight of BF _, - adduct as accelerator.
2. Imprägnierung:2. Impregnation:
Die Imprägnierung des Glasfaservlieses wird im Tauch- oder Walzenabquetschverfahren auf einer horizontalen Imprägniermaschine durchgeführt, wobei das oben angegebene Bindemittel in einem geeigneten Lösungsmittel gelöst ist.The impregnation of the glass fiber fleece is done in a dip or roller squeeze process carried out a horizontal impregnation machine, using the binder specified above is dissolved in a suitable solvent.
3. Verpressen:3. Pressing:
Die auf Format geschnittenen Bogen des imprägnierten Glasfaservlieses werden eventuell unter Mitverwendung von zwei Abdecklagen imprägnierten Glasseidengewebes, wie vorstehend beschrieben, mit Kupferfolie zusammengeschichtet und unter Druck und Temperatur verfestigt. Die Preßtemperatur beträgt 170" C. der Preß- *° druck 80 kp/cms, die Preßzeit 2 Stunden.The sheets of impregnated glass fiber fleece, cut to size, are optionally layered together with copper foil using two cover layers of impregnated glass fiber fabric, as described above, and solidified under pressure and temperature. The pressing temperature is 170 "C. the pressing * ° pressure 80 kp / cm s , the pressing time 2 hours.
Als härtbares Harz können z. B. auch Phenol-, Silikon-, Bisdien- oder ungesättigte Polyesterharze verwendet werden.As the curable resin, for. B. also phenolic, silicone, bisdiene or unsaturated polyester resins be used.
Die Metallkaschierung kann auch nachträglich auf die an sich nicht metallkaschierten SchichtpreßstoiT platte unter Anwendung eines Additivverfahrens aufgebracht werden.The metal lamination can also be applied subsequently to the pressed laminate, which is not actually metal-lined plate can be applied using an additive process.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19702020587 DE2020587B2 (en) | 1970-04-28 | 1970-04-28 | METAL-BACKED COMPRESSED LAYER FOR THE MANUFACTURE OF CIRCUIT BOARDS |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19702020587 DE2020587B2 (en) | 1970-04-28 | 1970-04-28 | METAL-BACKED COMPRESSED LAYER FOR THE MANUFACTURE OF CIRCUIT BOARDS |
Publications (2)
Publication Number | Publication Date |
---|---|
DE2020587A1 DE2020587A1 (en) | 1971-11-18 |
DE2020587B2 true DE2020587B2 (en) | 1972-03-02 |
Family
ID=5769548
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19702020587 Pending DE2020587B2 (en) | 1970-04-28 | 1970-04-28 | METAL-BACKED COMPRESSED LAYER FOR THE MANUFACTURE OF CIRCUIT BOARDS |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE2020587B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3316362A1 (en) * | 1983-05-05 | 1984-11-08 | Dynamit Nobel Ag, 5210 Troisdorf | EPOXY RESIN BASED COMPRESSION MATERIAL FOR PRINTED CIRCUITS |
-
1970
- 1970-04-28 DE DE19702020587 patent/DE2020587B2/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3316362A1 (en) * | 1983-05-05 | 1984-11-08 | Dynamit Nobel Ag, 5210 Troisdorf | EPOXY RESIN BASED COMPRESSION MATERIAL FOR PRINTED CIRCUITS |
Also Published As
Publication number | Publication date |
---|---|
DE2020587A1 (en) | 1971-11-18 |
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