DE2814633A1 - Base laminate for mfr. of printed circuits - comprises core of mineral filler compounded with binder, sandwiched between impregnated glass-fibre plies and/or copper foil - Google Patents

Base laminate for mfr. of printed circuits - comprises core of mineral filler compounded with binder, sandwiched between impregnated glass-fibre plies and/or copper foil

Info

Publication number
DE2814633A1
DE2814633A1 DE19782814633 DE2814633A DE2814633A1 DE 2814633 A1 DE2814633 A1 DE 2814633A1 DE 19782814633 DE19782814633 DE 19782814633 DE 2814633 A DE2814633 A DE 2814633A DE 2814633 A1 DE2814633 A1 DE 2814633A1
Authority
DE
Germany
Prior art keywords
compound
laminated
printed circuits
resin
binder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19782814633
Other languages
German (de)
Inventor
Guenther Dr Ing Herrmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Herrmann Guenther Dr-Ing 8562 Hersbruck De
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE19782814633 priority Critical patent/DE2814633A1/en
Publication of DE2814633A1 publication Critical patent/DE2814633A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0284—Paper, e.g. as reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

Base material used in mfr. of printed circuits by subtractive, semi-additive, or additive process, for insulating intermediate plies, comprises ac ore of (non)conductive mineral filler(s) mixed and calendered with binder(s). The resulting core ply is sandwich-laminated between paper/glass-fibre-fleece/glass-fibre-textile plies which are impregnated with an excess of epoxy and/or phenolic resin. The resin content of the core is relatively low. A variant calls for a further ply viz. a Cu-foil, to be laminated on one or both sides of the resulting laminated whilst a second variant claims laminating the Cu-foil(s) directly onto the core, without any intermediate ply (plies).

Description

BASISMATERIALIEN ZUR HERSTELLUNG GEDRUCKTER SCHALTUNGENBASIC MATERIALS FOR MANUFACTURING PRINTED CIRCUITS

Die Erfindung bezieht sich auf ein Basismaterial zur Herstellung von Leiterplatten unter Verwendung der bekannten Ätzverfahren und der chemischen Verfahren zur Durchmetallisierung der Löcher; dabei wird Basismaterial in einem bestimmten, unten beschriebenen Mischaufbau verwendet. Es ist bekannt, daß für die Ätzverfahren und die sogenannten Additivverfahren Isolierstoffe und metallische Träger verwendet werden. Die Isolierstoffe bestehen aus Papierphenolharz-, Papierepoxidharz-, Papiermischharz-, Glasgewebe-Epoxidharz-, Glasvlies-Epoxidharz-und Glasgewebe-Papierepoxidharzkombinationen. Die Leiterplatten, die auf metallischem Träger aufgebaut werden, weisen eine Isolationsschicht aus reinen Lacken, Harzen oder Papier-, Glasgewebe-Harzkombinationen auf. Beim metallischen Träger ist von Bedeutung, daß die Löcher in den Leiterplatten zum Träger hin gut isoliert sind, da sonst ein Kurzschluß zwischen den Bauelementeanschlüssen über den Metallkern stattfinden kann.The invention relates to a base material for the production of Printed circuit boards using the known etching processes and chemical processes for through-plating the holes; base material is used in a certain, mixed structure described below is used. It is known that for the etching process and the so-called additive process uses insulating materials and metallic carriers will. The insulating materials consist of paper phenolic resin, paper epoxy resin, paper mixed resin, Glass fabric-epoxy resin, glass fabric-epoxy resin and glass fabric-paper-epoxy resin combinations. The circuit boards, which are built on a metallic carrier, have an insulating layer from pure lacquers, resins or paper, glass fabric-resin combinations. With the metallic Carrier is important that the holes in the circuit boards towards the carrier well are isolated, otherwise a short circuit between the component connections the metal core can take place.

Der Nachteil der bekannten Basismaterialien liegt darin, daß die Rohstoffe, wie Harz, Papier und Glasgewebe, durch die Verteuerung von Ö1, Harz und Papier und der vergleichsweise hohe Lohnaufwand wesentliche Kostensteigerungen jährlich aufwiesen und auch in Zukunft aufweisen werden. Beim Einsatz von metallischen Trägern sind, trotz des Kostenvorteils, als Nachteile vorhanden, daß der Verfahrensablauf entscheidend verändert werden und die einwandfreie Isolation der Löcher gegeben sein muß.The disadvantage of the known base materials is that the raw materials, like resin, paper and glass fabric, due to the increase in the price of oil, resin and paper and the comparatively high wage expenditure showed significant annual cost increases and will continue to exhibit in the future. When using metallic supports, Despite the cost advantage, the disadvantages that the process sequence is decisive must be changed and the holes must be properly insulated.

Der Erfinder hat sich die Aufgabe gestellt, ein Basisraterial zu entwickeln, das zusätzlich zu den bekannten Materialien eine Vereinfachung der Herstellung möglich macht und durch die Verwendung eines Compound-Kernes (Compound ist die Mischung von unten beschriebenen Füllstoffen mit einem geringen Prozentsatz an Harz) erhebliche wirtschaftliche Vorteile aufweist. Die Qualität in elektrischen, chemischen und mechanischen Eigenschaften entspricht den typischen Kennwerten der äquivalenten Basismaterialien.The inventor set himself the task of creating a basic material to develop, that in addition to the known materials, a simplification of the production is possible makes and through the use of a compound core (compound is the mixture of fillers described below with a low percentage of resin) are significant has economic advantages. The quality in electrical, chemical and mechanical properties corresponds to the typical characteristic values of the equivalent Base materials.

Erfindungsgemäß läßt sich dies dadurch erreichen, daß als Compound Füllstoff Mineralstoffe verwendet werden, die z.B. sein können: - Quarz (SiO2) - Glimmer - Feldspäte - Zirkan - Titanit - Rutil - Eustatit (Magnesiumsilikate) - Hornblenden (Anthophyllit, Tremolit) - Talk - Aluminiumsilikate (Andulusit, Chiastolit, Disthen, Sillimanit und Staniolith) - Kaolin (geschlammt und als Rohkaolin) und mit den Harzen auf Epoxid-, Phenolbasis u.ä. sowie deren Mischung verbunden sind.According to the invention, this can be achieved in that as a compound Filler minerals can be used, which can be, for example: - Quartz (SiO2) - Mica - Feldspars - Zircon - Titanite - Rutile - Eustatite (magnesium silicates) - Hornblende (anthophyllite, tremolite) - talc - aluminum silicates (andulusite, chiastolite, Disthen, sillimanite and staniolite) - kaolin (muddy and as raw kaolin) and with resins based on epoxy, phenol, etc. as well as their mixture are connected.

Die genannten Füllstoffe sind in großen Mengen vorhanden (90 % der Erdkruste besteht aus Silikaten) und können sehr wirtschaftlich gewonnen werden. Daraus ergibt sich ein wesentlicher Kostenvorteil gegenüber Harzen und Papieren.The fillers mentioned are present in large quantities (90% of the Earth's crust consists of silicates) and can be extracted very economically. This results in a significant cost advantage over resins and papers.

Mit dem Einarbeiten einer geringen Menge Harz (als Bindemittel) oder anderen Bindemitteln in den Füllstoff ist es möglich, nach dem Mischen das Compound zu Platten zu kalandrieren. Die Dimmensionen der Platten werden den Anwendungsfällen angepaßt (z.B. 1,0 mm stark). Für Leiterplatten beträgt die Stärke in der Regel 0,5 -1,5 mm. Bei Isolierstoffen kann die Stärke wesentlich darüber oder darunter liegen. Die Platten werden an den Laminierpressen an der Ober- und Unterseite mit je einem Bogen: - Phenolpapier - Epoxidpapier - Epoxid-Glasvlies Glasgewebe Polyester-Giasvlies II -Glasgewebe - Epoxid-Polyestergewebe belegt. Diese Bogen sind mit Harzüberschuß getränkt. Der Uberschuß an Harzen dient zumdefinierten Verfestigen des Compounds, da während des Preßvorganges unter Temperatureinwirkung das Harz fließt und in das Compound gepreßt wird. Die freie Harzmenge ist so bemessen, daß der Harzfluß ins Compound bei dem Belegen mit einem Bogen über 100 # Eindringtiefe aufweist, bei dem Belegen von beiden Seiten je ca. 60 % der Compoundstärke erreicht. Damit ist der Zusammenfluß und das Abbinden des Compounds erreicht. Je nach Harzwahl kann in Kurztaktpressen oder Langzeitpressen gearbeitet werden.With the incorporation of a small amount of resin (as a binder) or others Binders in the filler, it is possible after mixing the compound to form sheets to calender. The dimensions of the panels are adapted to the application (e.g. 1.0 mm thick). For printed circuit boards, the thickness is usually 0.5-1.5 mm. In the case of insulating materials, the thickness can be significantly higher or lower. The panels are attached to the lamination presses with one each on the top and bottom Sheets: - phenolic paper - epoxy paper - epoxy glass fleece glass fabric polyester glass fleece II -Glass fabric - epoxy polyester fabric covered. These arches are made with excess resin soaked. The excess of resins serves to solidify the compound in a defined manner, because during the pressing process under the influence of temperature, the resin flows and into the Compound is pressed. The free amount of resin is calculated so that the resin flow into the Compound in which an arch has a penetration depth of over 100 #, at 60% of the compound strength is achieved when both sides are covered. So is the confluence and setting of the compound is achieved. Depending on the choice of resin be worked in short-cycle presses or long-term presses.

Die Bohr- und Stanzeigenschaften des Compound-Basismaterials entsprechen denen der bekannten Werkstoffe. Die elektrischen Eigenschaften sind dem reinen Phenolharzpapierlaminat überlegen und entsprechen den hochwertigen Laminaten.The drilling and punching properties of the compound base material correspond those of the known materials. The electrical properties are of the pure phenolic resin paper laminate superior and correspond to the high quality laminates.

Von Vorteil ist das Compound aus den genannten Stoffen im lQärmedurchgang und in der ilärmeableitung. Diese Eigenschaft wird in der Leistungselektronik auf bekannten Materialien nur durch den Einsatz von zusätzlichen Kühlflächen erreicht Die Erfindung wird anschließend anhand der im Schnitt dargestellten Figur erläutert. Die Figur zeigt das Basismaterial, das aus dem Compound 1 mit den auflaminierten Bögen 2 besteht.The compound made of the substances mentioned is advantageous in the heat transfer process and in the heat dissipation. This property is well known in power electronics Materials achieved only through the use of additional cooling surfaces The invention will then be explained with reference to the figure shown in section. The figure shows the base material, which consists of the compound 1 with the sheets 2 laminated on.

Das Basismaterial wird mit gebohrten Löchern 3 oder mit gestanzten Löchern 4 versehen. Im Additivverfahren wird Kupfer 5 üblicherweise in den Löchern und auf den Oberflächen abgeschieden. Bei der Verwendung der Subtraktivtechnik wird die mit auflaminierte Kupferfolie selektiv abgeätzt, damit bleibt die Leitverbindung 6 für das Löten stehen.The base material comes with 3 drilled holes or with punched holes Holes 4 provided. In the additive process, copper 5 is usually in the holes and deposited on the surfaces. When using the subtractive technique, the laminated copper foil is selectively etched away, so that the conductive connection remains 6 stand for soldering.

LeerseiteBlank page

Claims (1)

PATENTANS PRUECHE Basismaterial zur Herstellung von gedruckten Schaltungen nach den bekannten Subtraktiv-, Semiadditiv- und Additivverfahren und für Isolationszwischenlagen dessen Anspruch 1 j Kern aus einem Compound 1 besteht. Dieses Compound 1 besteht aus Füllstoffen auf Basis von nicht leitenden oder leitenden Mincralien, die mit Bindemitteln abgebunden und kalandriert werden.PATENTANS PRUECHE Base material for the manufacture of printed circuits according to the known subtractive, semi-additive and additive processes and for insulation layers whose claim 1 j core consists of a compound 1. This compound 1 consists made of fillers based on non-conductive or conductive minerals, which with Binders are set and calendered. Anspruch 2 Auf der Ober- und Unterseite des Compounds 1 mit geringem Harzanteil wird ein Bogen 2 aus Papier/Glasvli#s/Glasgewebe, im Uberschuß getränkt mit Harzen, auf Epoxid-, Phenolharz-und Mischharzbasis auflaminiert.Claim 2 on the top and bottom of the compound 1 with low Resin content is a sheet 2 made of paper / glass fiber / glass fabric, soaked in excess Laminated with resins based on epoxy, phenolic resin and mixed resin. Anspruch 3 Das Compound 1, mit hohem Harzanteil nach Ansprucil 1, wird ohne Bogen 2 direkt mit einer oder zwei kupferfolien verpreßt.Claim 3 The compound 1, with a high resin content according to Claim 1, is pressed directly with one or two copper foils without sheet 2. Anspruch 4 Das Compound 1, nach Anspruch 1, wird mit dem Bogen 2, nach Anspruch 2, und zusätzlich einer oder zwei kupferfolien verpreßt.Claim 4 The compound 1, according to claim 1, is made with the sheet 2, according to claim 2, and additionally one or two copper foils pressed. Anspruch 5 Der Preßvorgang kann, aufgrund des Mischaufbaues, bei Einsatz von Epoxidharzen in Kurztaktpressen erfolgen. Beim Verwenden von Phenolharzen wird in Langzeitpressen verpreßt und laminiert.Claim 5 The pressing process can, due to the mixed structure, when used of epoxy resins in short-cycle presses. When using phenolic resins pressed and laminated in long-term presses.
DE19782814633 1978-04-05 1978-04-05 Base laminate for mfr. of printed circuits - comprises core of mineral filler compounded with binder, sandwiched between impregnated glass-fibre plies and/or copper foil Withdrawn DE2814633A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19782814633 DE2814633A1 (en) 1978-04-05 1978-04-05 Base laminate for mfr. of printed circuits - comprises core of mineral filler compounded with binder, sandwiched between impregnated glass-fibre plies and/or copper foil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782814633 DE2814633A1 (en) 1978-04-05 1978-04-05 Base laminate for mfr. of printed circuits - comprises core of mineral filler compounded with binder, sandwiched between impregnated glass-fibre plies and/or copper foil

Publications (1)

Publication Number Publication Date
DE2814633A1 true DE2814633A1 (en) 1979-10-11

Family

ID=6036196

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19782814633 Withdrawn DE2814633A1 (en) 1978-04-05 1978-04-05 Base laminate for mfr. of printed circuits - comprises core of mineral filler compounded with binder, sandwiched between impregnated glass-fibre plies and/or copper foil

Country Status (1)

Country Link
DE (1) DE2814633A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2493662A1 (en) * 1980-11-05 1982-05-07 Rhone Poulenc Ind METALLIZED SUBSTRATES FOR PRINTED CIRCUITS AND PROCESS FOR PREPARING THE SAME
EP0057842A2 (en) * 1981-02-09 1982-08-18 The Boeing Company Printing wiring board substrates for ceramic chip carriers
FR2525849A1 (en) * 1982-04-26 1983-10-28 Hutchinson Printed circuit substrate comprising laminate - with central part comprising synthetic foam of pref PVC or epoxy! resin
FR2554303A1 (en) * 1983-10-28 1985-05-03 Rhone Poulenc Rech METALLIZABLE SUBSTRATES FOR PRINTED CIRCUITS AND PROCESS FOR PREPARING THE SAME
EP0211979A1 (en) * 1985-08-14 1987-03-04 Toray Industries, Inc. Laminate board containing uniformly distributed filler particles and method for producing the same
EP0315852A2 (en) * 1987-11-07 1989-05-17 BASF Aktiengesellschaft Printed circuit board with improved heat conductivity

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB945274A (en) * 1961-04-06 1963-12-23 Owens Corning Fiberglass Corp Improvements in and relating to dielectric panels
US3617613A (en) * 1968-10-17 1971-11-02 Spaulding Fibre Co Punchable printed circuit board base
DE2413158B2 (en) * 1973-03-24 1975-08-21 Sansui Electric Co., Ltd. Multi-layer insulating board for electrotechnical purposes and processes for their manufacture
DD119897A1 (en) * 1975-06-27 1976-05-12

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB945274A (en) * 1961-04-06 1963-12-23 Owens Corning Fiberglass Corp Improvements in and relating to dielectric panels
US3617613A (en) * 1968-10-17 1971-11-02 Spaulding Fibre Co Punchable printed circuit board base
DE2413158B2 (en) * 1973-03-24 1975-08-21 Sansui Electric Co., Ltd. Multi-layer insulating board for electrotechnical purposes and processes for their manufacture
DD119897A1 (en) * 1975-06-27 1976-05-12

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2493662A1 (en) * 1980-11-05 1982-05-07 Rhone Poulenc Ind METALLIZED SUBSTRATES FOR PRINTED CIRCUITS AND PROCESS FOR PREPARING THE SAME
EP0052061A1 (en) * 1980-11-05 1982-05-19 Rhone-Poulenc Specialites Chimiques Method of making metallized substrates for printed circuits
EP0057842A2 (en) * 1981-02-09 1982-08-18 The Boeing Company Printing wiring board substrates for ceramic chip carriers
EP0057842A3 (en) * 1981-02-09 1984-03-21 The Boeing Company Printing wiring board substrates for ceramic chip carriers
FR2525849A1 (en) * 1982-04-26 1983-10-28 Hutchinson Printed circuit substrate comprising laminate - with central part comprising synthetic foam of pref PVC or epoxy! resin
FR2554303A1 (en) * 1983-10-28 1985-05-03 Rhone Poulenc Rech METALLIZABLE SUBSTRATES FOR PRINTED CIRCUITS AND PROCESS FOR PREPARING THE SAME
EP0145613A1 (en) * 1983-10-28 1985-06-19 Ciba-Geigy Ag Platable substrates for printed circuits, and method of making them
EP0211979A1 (en) * 1985-08-14 1987-03-04 Toray Industries, Inc. Laminate board containing uniformly distributed filler particles and method for producing the same
EP0315852A2 (en) * 1987-11-07 1989-05-17 BASF Aktiengesellschaft Printed circuit board with improved heat conductivity
EP0315852A3 (en) * 1987-11-07 1989-12-27 BASF Aktiengesellschaft Printed circuit board with improved heat conductivity

Similar Documents

Publication Publication Date Title
EP0129697B1 (en) Method of making printed circuit boards
DE2439152A1 (en) HIGH PRESSURE LAMINATE
DE3020196A1 (en) MULTI-LAYER PCB AND METHOD FOR THE PRODUCTION THEREOF
DE69921893T2 (en) Conductive paste composition for filling
DE2814633A1 (en) Base laminate for mfr. of printed circuits - comprises core of mineral filler compounded with binder, sandwiched between impregnated glass-fibre plies and/or copper foil
EP0324352A2 (en) Process for making a metal core circuit board
DE3313579C2 (en)
DE4206746C1 (en) Manufacture of circuit board with rigid and flexible sections - has flexible sections created by having non-bonding insert of insulation broken away
EP0126856B1 (en) Method of making a circuit board having rigid and flexible areas
DE60031943T2 (en) METHOD FOR PRODUCING ELECTRONIC COMPONENTS
DE1665374B1 (en) BASE MATERIAL MADE OF INSULATING MATERIAL FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARDS
DE3302857A1 (en) Method of producing prelaminates for rigid-flexible printed circuit boards
DE2040035A1 (en) Process for the production of metal clad laminates
DE2047204A1 (en) Multi-layer printed circuit board
WO2003004717A2 (en) Partition plate and method for producing a partition plate for a multi-layer pressed stack
DE3624719C2 (en)
DE2311919A1 (en) GLASS FIBER REINFORCED EPOXY LAMINATE WITH A RELATIVELY THICK EPOXY-BASED PLASTIC OVERLAY, AND PROCESS FOR THE PRODUCTION OF THIS
DE10038429A1 (en) Composite laminate and method of making the same
EP2467003A2 (en) Circuit board and method for producing circuit boards
DE2166448C3 (en) Printed circuit board base material and process for its manufacture
DE2659625C3 (en) Process for the production of base material for the production of printed circuits
DE3609239C2 (en)
DE2136212B1 (en) Process for the production of a base material for printed circuits
AT399250B (en) MULTILAYER CIRCUIT BOARD AND METHOD FOR THEIR PRODUCTION
DE1938421A1 (en) Process for the production of carrier bodies with strip conductors embedded between insulating material

Legal Events

Date Code Title Description
OGA New person/name/address of the applicant
8110 Request for examination paragraph 44
8127 New person/name/address of the applicant

Owner name: HERRMANN, GUENTHER, DR.-ING., 8562 HERSBRUCK, DE

8125 Change of the main classification

Ipc: H05K 1/03

8139 Disposal/non-payment of the annual fee