DE202020005697U1 - glass pane - Google Patents

Abstract

Pane of glass, in particular for a vehicle, having a first glass layer (GS1), a film (F) with two conductor layers (LS1, LS2) being applied to the first glass layer (GS1), with at least one of the two conductor layers (LS1) being used to Antenna structure is provided, with a connection structure (GCPW) to the antenna structure being provided by means of the two conductor layers, the connection structure (GCPW) having a center conductor (ML) flanked by two lateral conductors (L1, L2), wherein the center conductor (ML) and the flanking two lateral conductors (L1, L2) are located in one of the two conductor layers (LS1), with a conductor (GL) facing the foil (F) being provided in the other of the two conductor layers (LS2). arranged substantially parallel to the center conductor (ML) and the flanking two side conductors (L1, L2), the flanking two side conductors (L1 , L2) and the opposite conductor (GL) have essentially the same potential, the center conductor (ML) having at least one diagnostic resistor (DR) with at least one of the lateral conductors (L1, L2) and/or the opposite conductor (GL) galvanically is connected and wherein the diagnostic resistor (DR) is arranged directly in or on the foil conductor (FC).

Description

The invention relates to a pane of glass, in particular for a vehicle.

Vehicles are increasingly being equipped with electrical components. In addition to the classic radio devices, there is an increasing number of devices in a vehicle that can receive or transmit high-frequency signals.

At this point, the reception of signals from a navigation system or also signals from communication systems is given as an example.

Navigation systems can be, for example, a satellite-supported navigation satellite system (GNSS). Systems in operation are, for example, the Global Positioning System (GPS) or the GLObal Navigation Satellite System (GLONASS). Other navigation systems are possible, e.g. based on mobile radio systems.

Communication systems can be, for example, short-range radio systems for car-to-car or car-to-infrastructure or also mobile radio communication systems, e.g. mobile communication systems of the 2nd / 3rd / 4th or 5th generation.

Since vehicles often have larger metal surfaces, this shields high-frequency signals, making reception (and transmission - if provided -) more difficult.

Appropriate antennas can be attached to the outside of the vehicle, but such additional devices pose a problem in several respects.

Exemplary arrangements are from US20140176374A1 famous.

On the one hand, the corresponding devices require breakthroughs that are susceptible to corrosion. On the other hand, such devices often disturb the visual impression. However, such devices often also provide a source of noise as well as increased wind resistance. In addition, such antennas are also the target of vandalism.

Based on this, in the past there has been a trend towards providing antennas at other locations.

For example, GNSS antennas can be placed within the vehicle interior, such as under the dashboard or under the windshield.

It is difficult to find a suitable position with a good view of the antenna on the GNSS satellites while avoiding EMC problems from electrical devices in the dashboard and from the vehicle engine.

Furthermore, electrically conductive layers such as infrared-reflecting layers or low-E layers can prevent the transmission of electromagnetic radiation through the pane and block the GNSS signal.

Typical GPS antennas are implemented as planar antennas and typically as patch antennas and are, for example, from WO 00/22695 A1 , the U.S. 2018/0037006 A1 , the DE 202006011919 U1 or the DE 202010011837 U1 famous. In this case, a planar metallic antenna structure is arranged on one side of a printed circuit board, a ceramic or other dielectric carrier. A flat base plate is arranged on the opposite side as a ground plane. Antenna structure and base plate are connected to an electrical receiving unit via electrical lines. Due to the material thickness of the printed circuit board or the ceramic carrier, the antenna has a certain thickness and is clearly visible and not very aesthetic when arranged directly on the windshield.

In the case of the applicant's products, antennas are also provided on or in a pane of glass. It turns out, however, that the connection of such antennas to systems remote from the glass pane is not unproblematic.

The antenna structure and a strip line structure are typically located on the pane in such a way that a foil F with the strip line is laid around the edge of the glass pane in the edge area of the pane. However, the fastening area for the glass pane on a vehicle body is also located in the same area. In the fastening area there is often glue (based on polyurethane). In addition to the actual antenna conductor, the previous stripline structures provided a parallel conductor for the counterweight (ground potential) in the same structural level.

In the fastening area, the signal on the stripline is impaired, particularly at high frequencies (>500 MHz, in particular 1 GHz).

This impairment can be caused by the adhesive and its electric field constant and/or the spatial proximity to another ground potential of the vehicle body.

During later installation and contacting of the antenna in complex vehicle electronics, it is desirable to be able to check whether the antenna and the respective connection structure to the antenna are correctly electrically connected. In the EP 3 174 158 A1 For this purpose, a diagnostic resistor is arranged between a connection element and an antenna element that is independent of it.

The object of the present invention is to provide an improved glass pane, in particular for a vehicle, in which an antenna, and in particular a passive antenna, and a connection structure with a diagnostic resistor can be integrated easily and inexpensively.

The object of the present invention is achieved according to the invention by a glass pane for a vehicle according to independent claim 1 . Preferred embodiments emerge from the dependent claims, the figures and the description.

As described at the outset, it is desirable to be able to check whether the antenna and the respective supply lines are correctly electrically connected during subsequent installation and contacting of the antenna in complex (vehicle) electronics. This means in particular whether there is a secure electrical connection.

The invention is based on the inventors' knowledge of integrating a diagnostic resistor into the antenna or antenna feed line. This makes it possible to use a so-called "diagnostic mode" to check whether the receiving system is correctly connected to the antenna. The diagnosis resistance is an ohmic resistance that does not impair the normal use-related reception of high-frequency antenna signals.

The glass pane according to the invention for a vehicle has at least a first glass layer, with a film having two conductor layers being applied to the first glass layer, with at least one of the two conductor layers being used to provide an antenna structure, with the two conductor layers being used to provide a connection structure to the antenna structure for is provided, the interconnection structure having a center conductor flanked by two side conductors, the center conductor and the flanking two side conductors being in one of the two conductor layers, with a conductor being provided in the other of the two conductor layers which is im Substantially parallel to the center conductor and the flanking two side conductors, the flanking two side conductors and the conductor having substantially the same potential.

The conductor located in the other of the two conductor layers, which is opposite the central conductor and the flanking lateral conductors with regard to the film, is also referred to below as the “opposite conductor”.

Advantageously, the center conductor and the lateral conductors are formed from a first conductor layer and the opposite conductor is formed from a second conductor layer.

In a pane of glass according to the invention, the central conductor is galvanically connected to at least one of the lateral conductors and/or the opposite conductor via at least one, and preferably precisely one, diagnostic resistor. The connection can be made directly or with the interposition of further galvanically conductive structures, such as vias.

The construction of the connection structure described above makes it possible, in addition to the diagnostic function, that disturbing influences are reduced, so that less attenuation of the signal is made available.

In an advantageous embodiment of the invention, the diagnostic resistor is arranged directly in or on the foil conductor. The diagnostic resistor is preferably arranged at least in sections on the (carrier) foil and in sections on the first or second conductor layer. This enables a particularly compact and space-saving design.

In a further advantageous embodiment of the invention, the diagnostic resistor is arranged between the central conductor and at least one of the lateral conductors or between the central conductor and the opposite conductor.

In an advantageous embodiment of the invention, the diagnostic resistor is connected directly to the center conductor via a second connection area and directly to one of the lateral conductors via a first connection area.

It is understood that, in all embodiments, sections of the first or second conductor layer can be used as leads or forward leads to the diagnostic resistor or to a via. The sections can be electrically and preferably galvanically insulated from the surrounding conductor layer by layer-free insulation lines or insulation areas.

In an alternative advantageous embodiment of the invention, the diagnostic resistor is connected via a second connection area to a via and via this to the center conductor, the diagnostic resistor being electrically connected via the first connection area, preferably directly, to the opposite conductor. In this case, the diagnostic resistor is preferably arranged on the side of the film conductor with the second conductor layer (also referred to below as the underside).

In an alternative advantageous embodiment of the invention, the diagnostic resistor is connected via a second connection area, preferably directly, to the center conductor, with the diagnostic resistor being electrically connected via the first connection area to a via and via this to the opposite conductor. The diagnostic resistor is preferably on the Side of the foil conductor arranged with the first conductor layer (hereinafter also referred to as top).

In a further advantageous embodiment of the invention, the diagnostic resistor in the connection area is galvanically connected to the respective areas of the conductor layers, such as the central conductor, the lateral conductors and/or the opposite conductor, by soldering, gluing with an electrically conductive adhesive, riveting, permanent pressing.

In a further advantageous embodiment of the invention, the diagnostic resistor is an essentially ohmic resistor, preferably a purely ohmic resistor.

In a further advantageous embodiment of the invention, the diagnostic resistor has a resistance of 1 kOhm to 10 Mohms, preferably from 1 kOhm to 1 Mohm and particularly preferably from 10 kOhm to 100 kOhm.

In a further advantageous embodiment of the invention, the diagnostic resistor has a parasitic inductance of less than or equal to 0.05 nH, preferably less than or equal to 0.005 nH and/or a parasitic capacitance of less than or equal to 0.5 pF, preferably less than or equal to 0 .05 pF.

In a further advantageous embodiment of the invention, the diagnostic resistor is a surface mounted device (SMD) component, preferably a cuboid SMD component (also called a chip resistor). Such diagnostic resistors are particularly advantageous because of their low parasitic inductances and capacitances and their small dimensions.

In a further advantageous embodiment of the invention, the diagnostic resistor contains a section of the first or second conductor layer. The diagnostic resistor preferably consists of at least one, and preferably exactly one, section of the first or second conductor layer.

In a further advantageous embodiment of the invention, the diagnostic resistor consists of at least one connecting web of the first conductor layer between the center conductor and at least one of the lateral conductors. The diagnostic resistor is preferably formed in one piece with the central conductor and the at least one lateral conductor. Diagnostic resistors of this type can be produced particularly easily when producing the central conductor and the lateral conductors, do not require any further components which have to be contacted in further steps, and are particularly space-saving.

It goes without saying that connecting webs of the first or second conductive layer can also be combined with vias.

Furthermore, it is understood that sections of the first or second conductor layer can be used as feed lines or forward lines to a separate diagnostic resistor or via. The sections can be electrically and preferably galvanically insulated from the surrounding conductor layer by layer-free insulation lines or insulation areas.

In one embodiment of the invention, the film is wrapped around the first glass layer in the area of the connection structure. This makes it possible for the film with the antenna structure to be arranged on one side of the glass pane, while, for example, a connection area to the connection structure can be arranged on the inside.

In another embodiment of the invention, the film is flexible. In a further embodiment of the invention, the film has a thickness of 25 μm to 500 μm. This allows a bend to be easily provided, e.g. for wrapping around a sheet of glass, without having to preform these.

According to a further embodiment of the invention, the film is essentially transparent in the wavelength range from 400 nm to 700 nm. This does not affect the optical properties.

In yet another embodiment of the invention, the distance between each of the two lateral between the conductors and the center conductor between 50 µm min and 300 µm.

According to yet another embodiment of the invention, the center conductor has a width of 50 μm to 300 μm.

In a further embodiment of the invention, the film has a thickness of 25 μm to 300 μm.

According to a further embodiment of the invention, the conductor layers have a height (h _LS1 , h _LS2 ) of 1 μm to 75 μm, preferably of 10 μm to 75 μm.

That is, the invention enables fine structures that are also suitable for high frequencies.

According to a further embodiment of the invention, vias are arranged at least between one of the lateral conductors and the conductor lying opposite in relation to the film.

Improved potential equality over the extent of the arrangement is achieved by means of the vias, so that the high-frequency properties can be further improved.

According to yet another embodiment of the invention, at least one of the two conductor layers is at least partially provided with a cover layer.

In this way, a contact option to one of the conductor layers or their structures can be established at a suitable point, e.g. to provide a connection to a ground potential. On the other hand, the covering layer can prevent undesired contacting.

In a further embodiment of the invention, the antenna structure is designed to receive high-frequency signals. In particular, the antenna structure can be designed to receive mobile radio communication signals and/or signals from a (satellite-supported) positioning system.

In a further embodiment of the invention, the film has at least one material selected from the group comprising polyimide, polyurethane, polymethylene metacrylic acid, polycarbonate, polyethylene terephthalate, polyvinyl butyral, FR6, acrylonitrile-butadiene-styrene copolymer, polyethylene, polypropylene, polyvinyl chloride, polystyrene, polybutylene terephthalate, polyamide on.

In other words, a material can be used that is suitable as a carrier for conductor layers during production and is optionally optically transparent and/or optionally can be easily connected to a glass layer.

In principle, all electrically insulating substrates that are thermally and chemically stable under the conditions of manufacture and use of the glass pane according to the invention as a vehicle pane are suitable as glass panes. The glass pane preferably contains glass, particularly preferably flat glass, float glass, quartz glass, borosilicate glass, soda-lime glass or clear plastics, preferably rigid clear plastics, in particular polyethylene, polypropylene, polycarbonate, polymethyl methacrylate, polystyrene, polyamide, polyester, polyvinyl chloride and/or mixtures from that.

In yet another embodiment of the invention, the conductor layers include silver and/or copper and/or gold and/or aluminum and/or indium and/or graphene. This means that the conductor layers can also be adapted to electrical and/or thermal and/or mechanical boundary conditions.

According to yet another embodiment of the invention, the connection structure has a connection area for an electromechanical high-frequency connection element. In particular, the connection structure can have an SMA socket.

According to a further embodiment of the invention, the glass pane is a laminated glass pane, the glass pane having a second glass layer, the film being introduced between the first glass layer and the second glass layer. In other words, the film can be applied both to the outside of a pane and between layers of glass in a laminated glass pane.

• - in einem ersten Schritt, eine Elektronik an die Verbindungsstruktur angeschlossen wird;
• - in einem zweiten Schritt, von der Elektronik eine Gleichspannung, zwischen dem Mittelleiter und dem gegenüberliegenden Leiter oder zwischen dem Mittelleiter und einem der seitlichen Leiter der Verbindungsstruktur angelegt wird, und
• - in einem dritten Schritt, von der Elektronik ein elektrischer Strom gemessen wird.

An antenna connection in a glass pane according to the invention can be checked using the following method, where

• - In a first step, electronics are connected to the connection structure;
• - in a second step, a DC voltage is applied by the electronics between the central conductor and the opposite conductor or between the central conductor and one of the lateral conductors of the connection structure, and
• - in a third step, an electric current is measured by the electronics.

The ohmic resistance of the connection structure is essentially determined by the ohmic Resistance of diagnostic resistor formed. Based on the measured electrical current and taking into account the applied DC voltage value, it can be concluded that the connection and antenna structure is correctly connected to the electronics. In particular, short circuits and connection problems can be detected as deviations from the ohmic resistance value of the diagnostic resistor.

A DC voltage of 4 V to 48 V, preferably 5 V to 24 V and in particular 5 V, 6 V, 12 V, 14 V or 24 V, is advantageously applied in the second step.

As a rule, the diagnostic method (also called diagnostic mode) is only carried out rarely, preferably once, when contact is first made or when a new glass pane is installed, and is independent of the transmission and reception mode of the antenna.

According to a further embodiment of the invention, a vehicle with a glass pane according to the invention, in particular a land, sea, air or space vehicle, is provided.

According to yet another embodiment of the invention, the glass pane according to the invention is used to receive signals for satellite-based navigation, in particular to receive GNSS signals from Navstar GPS, Galileo, Glonass, Beidou, Navic, QZSS. Alternatively or additionally, the glass pane according to the invention is used to receive signals from a mobile communication system, in particular a mobile communication system of the 2nd, 3rd, 4th or 5th generation.

A diagnostic resistor in a glass pane according to the invention can be used to check that an antenna structure is correctly connected to receiving or transmitting electronics.

The invention is explained in more detail below with reference to several drawings and exemplary embodiments. The drawings are purely schematic representations and are not true to scale. In particular, the layer thicknesses of the film conductor are shown enlarged here for the sake of clarity. The drawings do not limit the invention in any way.

• 1 eine schematische Übersicht in Bezug auf die Anordnung von Folien, Glasschicht(en) in Bezug auf eine Fahrzeugkarosserie zur Verdeutlichung von Aspekten gemäß Stand der Technik und der Erfindung,
• 2 einen Querschnitt durch einen Folienleiter in einer Ausführungsform der Erfindung zur Verdeutlichung des Schichtaufbaues,
• 3 eine schematisch perspektivische Ansicht eines Folienleiters in einer Ausführungsformen der Erfindung,
• 4 eine schematische Aufsicht auf eine Verbindungsstruktur in einer Ausführungsform der Erfindung mit einem erfindungsgemäßen Diagnosewiderstand in Form eines externen Bauelements,
• 5 eine schematische Aufsicht auf einen weiteren erfindungsgemäßen Folienleiter mit einem erfindungsgemäßen Diagnosewiderstand, der aus einem Abschnitt einer Leiterschicht gebildet ist,
• 6A eine schematische Aufsicht auf einen weiteren erfindungsgemäßen Folienleiter auf die Oberseite,
• 6B eine Querschnittsdarstellung durch den erfindungsgemäßen Folienleiter gemäß 6A entlang der Schnittlinie A-A',
• 6C eine schematische Aufsicht auf den erfindungsgemäßen Folienleiter gemäß 6A auf die Unterseite,
• 7A eine schematische Aufsicht auf einen weiteren erfindungsgemäßen Folienleiter mit einem erfindungsgemäßen elektrischen Anschlusselement in einer Ausführungsformen der Erfindung mit Blick auf die erste Leiterschicht (Oberseite),
• 7B eine schematische Aufsicht auf ein erfindungsgemäßes Anschlusselement mit einem ersten Kopplungselement in einer Ausführungsform der Erfindung und
• 7C einen schematischen Querschnitt durch ein erfindungsgemäßes Anschlusselement in einer Ausführungsform der Erfindung, und
• 7D eine schematische Aufsicht auf den erfindungsgemäßen Folienleiter gemäß 7A mit Blick auf die zweite Leiterschicht (Unterseite).

Show it:

• 1 a schematic overview in relation to the arrangement of foils, glass layer(s) in relation to a vehicle body to illustrate aspects according to the prior art and the invention,
• 2 a cross section through a foil conductor in one embodiment of the invention to illustrate the layer structure,
• 3 a schematic perspective view of a foil conductor in one embodiment of the invention,
• 4 a schematic plan view of a connection structure in an embodiment of the invention with a diagnostic resistor according to the invention in the form of an external component,
• 5 a schematic plan view of another foil conductor according to the invention with a diagnostic resistor according to the invention, which is formed from a section of a conductor layer,
• 6A a schematic plan view of another foil conductor according to the invention on the top,
• 6B a cross-sectional view through the foil conductor according to the invention 6A along the cutting line A-A',
• 6C according to a schematic plan view of the foil conductor according to the invention 6A on the bottom,
• 7A a schematic plan view of another foil conductor according to the invention with an electrical connection element according to the invention in one embodiment of the invention with a view of the first conductor layer (top side),
• 7B a schematic plan view of a connection element according to the invention with a first coupling element in an embodiment of the invention and
• 7C a schematic cross section through a connection element according to the invention in an embodiment of the invention, and
• 7D according to a schematic plan view of the foil conductor according to the invention 7A looking at the second layer of conductors (underside).

In the following the invention will be illustrated in more detail with reference to the figures. It should be noted that different aspects are described, which can be used individually or in combination. That is, each aspect can be used with different embodiments of the invention unless explicitly presented as purely alternative.

Furthermore, for the sake of simplicity, only one entity is usually referred to below referenced. Unless explicitly noted, however, the invention can also have several of the entities concerned. In this respect, the use of the words “a”, “an” and “an” is only to be understood as an indication that at least one entity is used in a simple embodiment.

Insofar as methods are described below, the individual steps of a method can be arranged and/or combined in any order, unless something different is explicitly stated in the context. Furthermore, the processes can be combined with one another, unless expressly stated otherwise.

Specifications with numerical values are generally not to be understood as exact values, but also include a tolerance of +/- 1% to +/- 10%.

Insofar as standards, specifications or the like are named in this application, at least the standards, specifications or the like applicable on the filing date are referred to. This means that if a standard/specification etc. is updated or replaced by a successor, the invention can also be applied to this.

Various embodiments are shown in the figures.

In 1 a glass pane for a vehicle is shown in the installed state. The glass pane has at least one first glass layer GS1.

A film conductor FC made from a film F with at least two conductor layers LS1, LS2 is applied to the first glass layer GS1. A cross section of such a film is in 2 shown. Application can include gluing / laminating or also the connection in an autoclave (e.g. in the case of laminated glass panes).

At least one of the conductor layers is structured as will be described below. The structuring can be created by various processes, e.g. by appropriate (screen) printing, (ablative) laser structuring, (wet chemical) etching, etc.

An antenna structure ANT is made available by means of at least one of the two conductor layers LS1, see FIG 4 . Alternatively, any antenna structure ANT can be electrically conductively connected to one or more of the conductive layers.

The antenna structure ANT in 4 itself can be suitably chosen and include, for example, a horn-type antenna, a polarized antenna, broadband antennas, etc.

Furthermore, a connection structure GCPW to the antenna structure is made available by means of the two conductor layers LS1, LS2. The connection structure GPCW has a center conductor ML on one side of the film, which is flanked by two side conductors L1, L2, with the center conductor ML and the two flanking side conductors L1, L2 being located in one of the two conductor layers, here in the conductor layer LS1. In the other conductor layer LS2 of the two conductor layers, a conductor GL is also provided, which is arranged essentially parallel to the center conductor ML and the flanking two lateral conductors L1, L2, the flanking two lateral conductors L1, L2 and the conductor GL being essentially have the same potential. Such an arrangement is in perspective in 3 shown. The width of the conductor GL in the other conductor layer LS2 is generally wider than the sum of the width b _ML of the center conductor ML and the widths of the distances a ₁ , a ₂ of each of the two side conductors L1, L2 from the center conductor ML .

The invention makes it possible for disruptive influences in the fastening area to be reduced, so that less signal attenuation is made available.

In one embodiment of the invention, the film F - as in 1 shown - folded around the first glass layer GS1 in the area of the connection structure GCPW.

This makes it possible for the film F with the antenna structure ANT to be arranged on one side of the glass pane GS1, while e.g. a connection element CON with a first connection area CR1 to the connection structure GPCW can be arranged on the inside of the glass pane GS1.

In a further embodiment of the invention, the foil F is flexible. In a further embodiment of the invention, the film has a thickness h _F of 25 μm to 500 μm.

This allows for easy provision of a bend, e.g. to wrap around a sheet of glass, without having to preform it.

According to a further embodiment of the invention, the film F is essentially transparent in the wavelength range from 400 nm to 700 nm. This can be provided by appropriate choice of material.

This does not affect the optical properties. It should be noted that the connection structure GPCW and/or the antenna structure ANT are not arranged in an optically visible area in all applications, but it may also be the case that these structures are arranged in an edge area that is typically optically opaque due to black printing. In such a case, the transparency of the film F and/or the conductor layers LS1, LS2 does not have to be taken into account.

In yet another embodiment of the invention, the distance a ₁ , a ₂ of each of the two lateral conductors L1, L2 from the center conductor ML is between 50 μm min and 300 μm (see FIG 3 ). It should be noted that the distances a ₁ , a ₂ do not necessarily have to be identical, but can also be different. However, the distances are preferably identical, ie a ₁ =a ₂ .

In a further embodiment of the invention, the center conductor ML has a width b _ML of 50 μm to 300 μm. The width of the center conductor ML can be dependent on the material used for the conductor layer LS1 and/or the frequency of the signals to be conducted.

According to a further embodiment of the invention, the conductor layers h _LS1 , h _LS2 have a height of 1 μm to 75 μm, preferably 10 μm to 75 μm (see 2 ). It should be noted that the heights h _LS1 , h _LS2 do not necessarily have to be identical, but can also be different. However, the heights are preferably identical, ie h _LS1 =h _LS2 .

That is, the invention enables fine structures that are also suitable for high frequencies.

According to a further embodiment of the invention, at least one of the lateral conductors L1 and the conductor GL lying opposite in relation to the film F is provided with one or more vias VIA—as in FIG 3 implied - arranged. Through-plating means here an electrical line connection and in particular a galvanic connection between the contacted areas (here L1 and GL). The vias VIA can be arranged at a predetermined distance. Furthermore, vias VIA can also be provided in an analogous manner in relation to the second lateral conductor L2 and the opposite conductor GL. The distance can be based on the wavelength of the signals to be conducted. Furthermore, the characteristic impedance of the connection structure GCPW can be adjusted by such vias VIA. In addition, improved potential equality over the extent of the arrangement is achieved by means of the plated-through holes VIA, so that the high-frequency properties can be further improved.

According to yet another embodiment of the invention, at least one of the two conductor layers LS1, LS2 is (at least) partially provided with a cover layer.

In this way, a contact option to one of the conductor layers LS1, LS2 or their structures (L1, L2, ML, GL) can be established at a suitable point, e.g. to provide a connection to a ground potential GND. On the other hand, the covering layer can prevent undesired contacting.

In a further embodiment of the invention, the antenna structure ANT is designed to receive high-frequency signals. In particular, the antenna structure ANT can be designed to receive mobile radio communication signals and/or signals from a (satellite-supported) positioning system.

In a further embodiment of the invention, the film F has at least one material selected from the group comprising polyimide, polyurethane, polymethylene metacrylic acid, polycarbonate, polyethylene terephthalate, polyvinyl butyral, FR6, acrylonitrile-butadiene-styrene copolymer, polyethylene, polypropylene, polyvinyl chloride, polystyrene, polybutylene terephthalate, polyamide on.

In other words, a material can be used that is suitable as a carrier for conductor layers during production and is optionally optically transparent and/or optionally can be easily connected to a glass layer.

In yet another embodiment of the invention, the conductor layers LS1, LS2 have silver and/or copper and/or gold and/or aluminum and/or indium and/or graphene. Thin metal foils, metal films or metal layers are preferably used. It should be noted here that the conductor layers LS1, LS2 can have different materials. However, they preferably have the same materials. This means that the conductor layers can also be adapted to electrical and/or thermal and/or mechanical boundary conditions.

According to yet another embodiment of the invention, the connection structure GCPW - as in 1 indicated - a connection area CR1 for connection element CON in the form of an electromechanical high-frequency connection element. In particular, the connection structure can have an SMA socket. the SMA socket can have an angled arrangement, for example, so that a low overall height is made available in the connection area. Typically, vehicle windows are equipped with an electromechanical high-frequency connection element as a built-in part / replacement part to enable quick installation and reliable contacting.

4 also shows a diagnostic resistor DR in the form of an external resistor component using SMD technology. The diagnostic resistor DR is arranged directly on the carrier film F, or on the lateral conductor L1 and the center conductor ML.

Such SMD resistor components are inexpensive, light and available with different resistance values and small dimensions.

The diagnostic resistor DR is an ohmic resistor with a resistance value of 10 kOhm, for example.

The diagnostic resistor DR is, for example, electrically connected to the side conductor L1 via a first connection area S1 and to the center conductor ML via a second connection area S2, and is preferably soldered. The first connection area S1 and the second connection area S2 then each form a solder connection.

It goes without saying that for all the exemplary embodiments here and below, the galvanic connection can also be made differently, for example by gluing with an electrically conductive adhesive, by riveting with an electrically conductive rivet connection or by permanent pressing, for example inside a composite pane, for example after an autoclave process.

In the area of the second connection point S2 with the diagnostic resistor DR, the middle conductor ML is expanded by an area EML. This advantageously provides enough space for soldering on the diagnostic resistor DR. At the same time, interference with the signal transmission from the antenna ANT to the connection element CON is reduced or mitigated. Furthermore, the expanded area EML is suitably shaped and, in particular, designed in a trapezoidal or rounded manner. This also results in less signal interference (lower attenuation).

In order to obtain a sufficient distance from the expanded area EML of the center conductor ML and space for the diagnostic resistor DR, the first lateral conductor L1 can have a cutout FL1.

It goes without saying that the diagnostic resistor DR here and in the following exemplary embodiments can also be arranged between the center conductor ML and the second lateral conductor L2. Furthermore, multiple diagnostic resistors DR with the same or different resistance values can be arranged between the center conductor and one or more lateral conductors L1, L2. This enables a location-resolved diagnosis of an interruption in the film conductor or the connected elements.

The diagnostic resistor DR is arranged here in the immediate vicinity of the antenna structure ANT. It goes without saying that the diagnostic resistor DR here and in the following exemplary embodiments can be arranged at any point, for example in the immediate vicinity of the connection element CON.

5 shows a further exemplary embodiment of a foil conductor FC according to the invention with a diagnostic resistor DR according to the invention. The diagnostic resistor DR is here formed in one piece by a connecting web of the conductor layer LS1 between the center conductor ML and the first lateral conductor L1. Such a diagnostic resistor DR can be produced in a particularly simple manner during the manufacture of the conductor layer LS1, for example by suitable structuring of a previously full-area conductor layer LS1. Such diagnostic resistors can be produced particularly easily and inexpensively and can be positioned flexibly and unobtrusively. In addition, they are particularly space-saving since their height does not exceed the height of the other conductor structures. Otherwise, the foil conductor FC essentially corresponds to the foil conductor FC 1 until 4 , so that only the differences are discussed here.

the 6A , 6B and 6C show an exemplary embodiment of a further foil conductor FC according to the invention with a diagnostic resistor DR according to the invention on the underside of the foil conductor FC

6A shows a schematic plan view of the top of the foil conductor FC according to the invention and 6C shows a schematic plan view of the underside of the foil conductor FC according to FIG 6A .

Here and below, top means the side with a top view of the first conductor layer LS1 and bottom means the side with a top view of the second conductor layer LS2.

6B shows a cross-sectional representation through the foil conductor FC along the cutting line AA' of FIG 6A and 6C .

The foil conductor FC essentially corresponds to the foil conductor FC 1 until 4 , so that only the differences will be discussed here.

In the example after the 6A until 6C , the diagnostic resistor DR is opposed 4 arranged on the bottom and not on the top of the foil conductor FC. Therefore, the center conductor ML in 6A no extended area EML and the first lateral conductor L1 no recess FL1.

Furthermore, the center conductor ML has a via VIA, with which a galvanic connection is formed from the center conductor ML on the top to the bottom. The via VIA ends on the underside in a region of the second conductor layer LS2, which is electrically insulated from the surrounding, opposite conductor GL by a rectangular insulating line IA. The insulation line IA preferably consists of a layer-free area that is produced, for example, by removing the coating in sections from a full-area layer (for example by etching and in particular with a suitable masking technique) or by gaps in the coating.

As a result of the galvanic connection through the plated-through hole VIA, the area of the conductor layer LS2 surrounded by the rectangular insulation line IA has the potential of the center conductor ML.

The diagnostic resistor DR is galvanically connected, for example soldered, via a second connection area S2 to the area of the conductor layer LS2 surrounded by the rectangular insulation line IA. The first connection area S1 is connected to the opposite conductor GL outside of the area of the conductor layer LS2 enclosed by the rectangular insulation line IA.

The galvanic connection between the potential of the center conductor ML and the potential of the opposite conductor GL of the foil conductor FC is therefore made in addition to the diagnostic resistor DR via a via VIA from the top to the bottom of the foil conductor FC.

The contacting of the conductive structures of the conductor layers LS1, LS2 with an electrical connection element is usually soldered on only one side of the film conductor FC and, for example, on the underside. By means of vias VIA, the diagnostic resistor DR can be arranged on the side provided for soldering the contacting of the conductor layers and soldered there. As a result, only one side of the foil conductor FC has to be soldered, which is particularly advantageous in terms of production technology, since the foil conductor FC does not have to be rotated in the soldering tool, for example.

In an advantageous embodiment, the opposite conductor GL has so-called heat traps HT in the immediate vicinity of the first connection area S1. These are formed by layer-free areas of the conductor layer (here the second conductor layer LS2), for example from four angle-shaped (L-shaped) areas. The layer-free areas can be produced, for example, by decoating a full-area layer in sections or by gaps in the coating.

Such heat traps HT are particularly advantageous if the connection areas S1, S2 of the diagnostic resistor DR are connected to the conductor layers LS1, LS2 by soldering.

The first connection area S1 is galvanically connected to the opposite conductor GL by the conductor layer remaining in the spaces between the thermal traps HT.

The removed material in the area of the HT heat traps prevents heat dissipation in the conductor layer and the soldering heat is concentrated in and around the connection area. This protects the heat-sensitive layers of the foil conductor FC and in particular any polymer layers and adhesive layers.

7A shows a top view of a further exemplary embodiment of a foil conductor FC according to the invention with an electrical connection element CON according to the invention. The connection element CON has a first connection area CR1 at one end of the foil conductor FC. In this exemplary embodiment, the first connection area CR1 is arranged at the end of the film conductor FC opposite the antenna structure ANT.

7B shows a plan view of the foil conductor FC according to the invention 7A , A first coupling element CE1 being arranged in the first connection area CR1, which is electrically conductively connected to the electrically conductive structures of the foil conductor FC, for example the central conductor ML and the lateral conductors L1, L2, for example by soldering or gluing with an electrically conductive adhesive .

7C shows a cross section through the connection element CON according to the invention in the first connection area CR1, a second coupling element CR2 being plugged onto the first coupling element CR1 and thereby being mechanically and electrically connected to it. The second coupling element CR2 is connected, for example, to one end of a round conductor RC and, for example, a coaxial cable. In this case, the first pole P1 of the first coupling element CE1 is electrically conductively connected to the center conductor ML of the foil conductor FC, for example soldered. Furthermore, the second pole P2 of the first coupling element CE1 is electrically conductively connected to the lateral conductors L1, L2 of the foil conductor FC, for example via two soldered connections in each case.

The first coupling element CE1 and the second coupling element CE2 are in the form of an electrical high-frequency connection element which is suitable, for example, for receiving high-frequency signals from the antenna ANT via the film conductor FC or for sending them to the antenna ANT. The high-frequency connection element is designed here, for example, as an electromechanical connection element that, in addition to the electrical line connection, is also mechanically firmly connected to the foil conductor FC and the round cable RC.

For example, an SMA socket as the first coupling element CE1 and an SMA plug as the second coupling element CE2 are suitable as the electromechanical high-frequency connection element. The SMA socket can have an angled arrangement, for example, so that a low overall height is made available in the connection area.

The electromechanical plug-in connection through the coupling elements CE1, CE2 allows a secure and mechanically and electrically stable connection between the foil conductor FC and the round cable RC. A particular advantage of the invention is to provide, for example, glazing with a permanently installed foil conductor FC and a first coupling element CE1. This arrangement has only small dimensions and is easy to store. The connection to the round cable RC via the second coupling element CE2 then takes place, for example, only at the place of use, for example after the pane has been installed in a vehicle body. The round cable RC can then be flexibly connected to receiving, transmitting or on-board electronics via additional line connections.

It goes without saying that the coupling elements CE1, CE2 and the electrical line connections (in particular plug-in connections) located therein can be electrically insulated, mechanically stabilized and/or protected against corrosion by a housing (not shown here), preferably by an electrically insulating housing.

7D shows a top view of the underside of the foil conductor FC, ie in a top view of the second conductor layer LS2.

The area of the second conductor layer LS2 around the pole P1 of the first coupling element CE1 is electrically isolated from the opposite conductor GL by an insulating line IA. The second connection area S2 of the diagnostic resistor DR is electrically connected to this isolated area, for example by soldering.

The first connection area S1 of the diagnostic resistor DR is electrically connected to the opposite conductor GL outside the insulated area, for example by soldering.

The galvanic line connection between the opposite conductor GL and center conductor ML is made here in addition to the diagnostic resistor DR via pole P1 of the first coupling element CE1, which serves as a through-connection from center conductor ML at the level of the first conductor layer LS1 to the level of the second conductor layer LS2.

In this case, for example, the second conductor layer LS2 with the opposite conductor GL is extended in an area perpendicular to its direction of extension and expanded, for example, by a rectangular area. Here, for example, the diagnostic resistor DR is arranged entirely in the extended area EGL. This has the particular advantage that the diagnostic resistor DR can be arranged flexibly on the foil conductor FC and, for example, at a large distance from the signal lines and in particular from the center conductor ML. As a result, the signal transmission is particularly little disturbed. In addition, the diagnostic resistor DR is soldered far away from the narrow, thin and therefore sensitive conductor structures, for example the center conductor.

It goes without saying that such an expanded area can also be formed on the upper side of the film conductor FC, for example as an expanded area (not shown here) of the first or second lateral conductor L1, L2. As a result, the diagnostic resistor DR and/or sections leading to the diagnostic resistor DR can be positioned in a particularly high-frequency compatible manner and suitable for soldering.

According to a further embodiment of the invention, the glass pane is a laminated glass pane, the glass pane having a second glass layer GS2, the film F between the first glass layer GS1 and the second glass layer GS2 is introduced. That is, the film can be placed both on the outside of a pane and between layers of glass in a laminated glass pane. The film F (with the respective conductor layers LS1, LS2) can be applied directly to one of the glass layers GS1, GS2, or an intermediate layer VF can be arranged above and/or below the film F (with the respective conductor layers LS1, LS2). be. The intermediate layer VF essentially serves to connect the glass layers GS1, GS2. In order to compensate for height differences through the film F (with the respective conductor layers LS1, LS2), the intermediate layer VF can have recesses. The intermediate layer VF contains at least one substance selected from the group comprising polybutylene terephthalate (PBT), polycarbonate (PC), polyethylene terephthalate (PET) and Polyethylene naphthalate (PEN), polyvinyl chloride (PVC), polyvinyl fluoride (PVF), polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), polyacrylate (PA), polymethyl methacrylate (PMMA), polyurethane (PUR), and/or mixtures and copolymers thereof.

According to a further embodiment of the invention, a vehicle with a glass pane according to the invention, in particular a land, sea, air or space vehicle (or combinations thereof) is provided.

According to yet another embodiment of the invention, the glass pane according to the invention is used to receive signals for satellite-based navigation, in particular to receive GNSS signals from Navstar GPS, Galileo, Glonass, Beidou, Navic, QZSS. Alternatively or additionally, the glass pane according to one of the preceding claims 1 to 18 is used to receive signals from a mobile communication system, in particular a mobile communication system of the 2nd, 3rd, 4th or 5th generation.

As a result, a new approach is being pursued instead of the previous technology of a transmission line or a coplanar waveguide, as was used in the prior art. By using an opposite conductor GL, the influence of interfering elements, especially in the fastening area, can be reduced.

Nevertheless, the requirements for a thin structure that can be integrated can be met.

By means of the invention it is possible to provide good transmission with good adaptation to the waveguide resistance even when bending around the glass layer GS1.

Reference List

FC

foil conductor

CON

Connection element, electrical connection element

DR

diagnostic resistor

S1, S2

Connection area (solder connection) of diagnostic resistor DR

i.a

isolation line, isolation area

HT

Heat Trap

FL1

Recess in lateral conductor L1

EML

extended area of the center conductor ML

EGL

extended area of opposite conductor GL

CE1, CE2

Coupling element, electrical coupling element

P1, P2

pole

CR1

connection area

GS1, GS2

glass layer

LS1, LS2

conductor layer

ANT

antenna structure

GCPW

connection structure

ML

center conductor

L1, L2

side ladder

GL

opposite ladder

f

film, carrier film

a1, a2

distance

bML

broad

hF

thickness

hLS1, hLS2

height

VIA

via

A

vehicle body

vf

intermediate layer

GND

ground potential

cl

Glue

QUOTES INCLUDED IN DESCRIPTION

This list of the documents cited by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent Literature Cited

• US20140176374A1 [0008]
• WO 0022695 A1 [0014]
• US 2018/0037006 A1 [0014]
• DE 202006011919 U1 [0014]
• DE 202010011837 U1 [0014]
• EP 3174158 A1 [0019]

Claims (13)

Pane of glass, in particular for a vehicle, having a first glass layer (GS1), a film (F) with two conductor layers (LS1, LS2) being applied to the first glass layer (GS1), with at least one of the two conductor layers (LS1) being used to Antenna structure is provided, with a connection structure (GCPW) to the antenna structure being provided by means of the two conductor layers, the connection structure (GCPW) having a center conductor (ML) flanked by two lateral conductors (L1, L2), wherein the center conductor (ML) and the flanking two lateral conductors (L1, L2) are located in one of the two conductor layers (LS1), with a conductor (GL) facing the foil (F) being provided in the other of the two conductor layers (LS2). arranged substantially parallel to the center conductor (ML) and the flanking two side conductors (L1, L2), the flanking two side conductors (L1 , L2) and the opposite conductor (GL) have essentially the same potential, the center conductor (ML) having at least one diagnostic resistor (DR) with at least one of the lateral conductors (L1, L2) and/or the opposite conductor (GL) galvanically is connected and wherein the diagnostic resistor (DR) is arranged directly in or on the foil conductor (FC). glass pane after claim 1 , wherein the diagnostic resistor (DR) is arranged at least in sections on the film (F) and in sections on the first or second conductor layer (LS1, LS2). pane of glass, after claim 1 or 2 , wherein the diagnostic resistor (DR) - is connected directly to the center conductor (ML) via a second connection area (S2) and directly to one of the lateral conductors (L1, L2) via a first connection area (S1), or - via a second connection area (S2) is electrically connected to a via (VIA, P1) and above it to the center conductor (ML), the diagnostic resistor (DR) being electrically connected to the opposite conductor (GL) via the first connection area (S1), or - via a second connection area (S2) is electrically connected to the center conductor (ML), the diagnostic resistor (DR) being electrically connected via the first connection area (S1) to a via (VIA) and thereto to the opposite conductor (GL). Glass pane after one of Claims 1 until 3 , wherein the diagnostic resistor (DR) in the connection area (S1, S2) is galvanically connected by soldering, gluing, preferably with an electrically conductive adhesive, riveting or permanent pressing. Glass pane after one of Claims 1 until 4 , wherein the diagnostic resistor (DR) is a surface mounted device component, preferably a cuboid surface mounted device component. Glass pane after one of Claims 1 and 2 , wherein the diagnosis resistance (DR) consists of a section of the first conductor layer (LS1). glass pane after claim 6 , wherein the diagnostic resistor (DR) consists of at least one connecting web of the first conductor layer (LS1) between the center conductor (ML) and at least one of the side conductors (L1, L2) and preferably in one piece with the center conductor (ML) and the at least one side conductor (L1, L2) is formed. Glass pane after one of Claims 1 until 7 , wherein the diagnostic resistor (DR) is an essentially ohmic resistor with a resistance value of 1 kOhm to 10 MOhm, preferably 1 kOhm to 1 MOhm and particularly preferably 10 kOhm to 100 kOhm. Glass pane after one of Claims 1 until 8th , wherein the central conductor (ML) has a width (b _ML ) of 50 μm to 300 μm and/or the distance (a ₁ , a ₂ ) of each of the two lateral conductors (L1, L2) from the central conductor (ML) is between 50 μm min and is 300 µm. Glazing according to one of the preceding claims, in which vias (VIA) are arranged between one of the lateral conductors (L1) and the opposite conductor (GL) with respect to the film (F). Glass pane according to one of the preceding claims, wherein at least one of the two conductor layers (LS1, LS2) is at least partially provided with a cover layer. Glass pane according to one of the preceding claims, wherein the connection structure (GCPW) has a connection area (CR1) for a connection element (CON), preferably for an electromechanical high-frequency connection element. Glass pane according to one of the preceding claims, wherein the glass pane is a laminated glass pane, the glass pane having a second glass layer (GS2), the film (F) is arranged between the first glass layer (GS1) and the second glass layer (GS2).

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