DE202013011146U1 - heat shield - Google Patents

Abstract

Heat shield (1) for shielding an object against heat and / or sound with at least one metallic layer (2), at least one metallic layer (2) lying on the surface of the heat shield (1) having a microstructuring (29), characterized in that that a flat identification element (11) is applied and / or introduced on a surface of the at least one microstructured layer (2), the flat identification element (11) being at least shaped with the at least one microstructured layer (2) of the heat shield (1) and / or is non-positively connected.

Description

The invention relates to a heat shield for shielding an object against heat and / or sound with at least one layer. Heat shields are used for example in engine compartments of motor vehicles, especially in the area of the exhaust line, the protection near hot components located temperature-sensitive components and aggregates against inadmissible heating. Most of the heat shields also improve the sound insulation.

Typically, such heat shields are three-dimensionally deformed structural components with at least one extended layer comprising at least one microstructured layer, for example a metallic layer, and optionally further, for example non-metallic, layers. In a first embodiment it is preferred if an air cushion remains between the components to be shielded and the heat shield as well as between the at least one heat-conducting component and the heat shield over a large surface area so that the heat transfer through direct contact can be reduced to a minimum. Such heat shields are attached to at least one, but preferably at least two points, wherein the attachment is usually carried out on one of the heat-conducting components. The three-dimensional shape usually results from the shape of the heat-conducting components and their distance from adjacent components. In a second embodiment, the heat shield is located directly on the heat-emitting object and preferably encapsulates it over its entire surface from the outside. As a result, the surrounding objects are shielded from this thermal radiation. In this case, it is advantageous if the heat shield also has an insulation layer directly resting on the heat source, which is covered by at least one microstructured layer. The three-dimensional form results directly from the shape of the surrounding object. In addition to the actual thermal and structure-borne sound insulation, this structure also causes a reduction in the convection of hot air. In addition, vibrations are absorbed.

To improve the insulating and acoustical properties, at least the outer, in particular metallic, layer of the heat shield has microstructures, for example nodules and / or other embossings or microperforations. Double heat shield layers improve the stability of the heat shield and make it possible to produce comparable stable heat shields with thinner and thus lighter sheets.

Microperforated layers are preferably facing the sound source in thermally and acoustically effective heat shields, so that the sound waves can enter through the microperforations into the heat shield and are then absorbed in the interior of the heat shield.

In combination with a microperforated layer, a noppalierte layer arranged behind it can form resonance chambers. Likewise, it is possible to achieve good sound absorption if a fiber-based insulation layer is arranged behind the microperforated layer, since resonance spaces can likewise be formed in the free spaces of the insulation layer.

In the past, when markings were applied to vehicle parts by means of logos, these markings, such as manufacturer or date of manufacture and part number, are codified with increasing frequency. The so-called data matrix code, a two-dimensional, generally square arrangement of points or squares, has meanwhile largely prevailed for this marking, including heat shields.

For heat shields with smooth surfaces, it does not pose any difficulty to print, einzulasern or formulate this data matrix code. In the case of heat shields with a microstructured surface, however, it is not possible to apply a data matrix code in a legible manner, since its structures and the microstructure of the relevant layer of the heat shield overlap and interfere with one another.

In the prior art, it was attempted to attach identification fields by means of cohesive methods to microstructured outer layers of heat shields. In particular, attempts have been made to weld corresponding identification fields. For this purpose, on the one hand, additional production facilities are required, since the production of heat shields traditionally requires no welding operations. The result is considerable price increases. On the other hand there is the problem that the identification fields in the operation of the heat shield do not remain permanently stable attached to the heat shield position, but solve in the face of the prevailing vibrations in the engine compartment again. The welding of microstructured layers, in particular thin microstructured layers also proves to be difficult, since only small contiguous areas are available in which the layers lie on each other. In the case of heat shields with at least one fiber-based insulation layer, there is also the risk that the high energy input locally leads to damage to the insulation layer (s).

Attempts have also been made to apply identification fields by means of separate fastening means. In this way, although a better, but also not on the life of a Vehicle designed durability of the marking field on the surface of the heat shield can be achieved. But this attachment method requires additional equipment that are not common in the heat shield production and increases the production time and thus the cost of manufacturing the heat shield. The provision and mounting of the additional attachment means, such as rivets, further complicates and increases the cost of manufacturing the heat shield.

The object of the invention is thus to provide a heat shield having at least one microstructured layer, yet an easily readable label on the microstructured layer of the heat shield is attached. The microstructured layer should be produced from conventional starting material and the production should be as simple and inexpensive as possible.

The solution of this problem is achieved with the heat shield according to claim 1. Preferred developments emerge from the dependent claims.

The invention thus relates to a heat shield for shielding an object against heat and / or sound with at least one metallic layer. At least one lying on the surface of the heat shield metallic layer has a microstructuring. On at least one surface of the at least one microstructured layer, at least one planar identification element is placed on and / or connected in a positive and / or non-positive manner to the at least one microstructured layer of the heat shield. The positive and / or non-positive connection does not have to be formed directly by the microstructured layer and the marking element. Rather, other components or elements of the heat shield can be involved in the connection.

The fact that the planar marking element is formed as an additional element, the at least one microstructured layer of the heat shield from conventional starting material, d. H. coil-structured material. The introduction or introduction of the marking element makes it possible to apply the label on an unstructured surface, so that it is easy to read. The positive and / or non-positive connection of the marking element with the heat shield or at least its at least one microstructured layer makes it possible to dispense with elaborate attachment methods between the first metallic layer and the marking element, such as welding or riveting. The positive and / or non-positive connection can be introduced, for example, during the required anyway three-dimensional shaping of the heat shield and therefore usually requires no additional manufacturing equipment or extended cycle times in the production. In the case of multilayer heat shields, the identification element can, for example, also be positively and / or non-positively connected to at least one of these layers when fastening the layers of the heat shield.

In multilayer heat shields, the at least one microstructured layer is preferably disposed on the outer surface of the heat shield, while the at least one further layer is located farther from the outer surface of the heat shield, preferably on the inner surface of the heat shield. In the case of this layer arrangement, the two-dimensional marking element is arranged at least in sections on the surface of the at least one microstructured layer facing away from the outer surface of the heat shield, namely between the at least one microstructured layer and the at least one further layer. If no further layer is present, the marking element can also rest directly on the object surrounded by the heat shield.

For receiving the identification element, the at least one microstructured layer preferably has at least one receiving region, wherein the microstructured layer in this receiving region has at least one recess which, like a window, reveals the identification field of the underlying identification element. The edge regions of the marking element are covered like a frame. Adjacent to the at least one recess, the receiving region of the microstructured layer in a first embodiment has one, but preferably a plurality of through openings, which are in particular slotted or slot-shaped. In a second embodiment, adjacent to the recess of the receiving region at least partially projections are formed, which preferably have from the outer surface of the heat shield to the inner surface of the heat shield.

The planar marking element in turn has, preferably at its outer edge, at least in sections, at least one projection, which points after installation of the marking element in the heat shield in the direction of the outer surface of the heat shield. The projection is advantageously bent by an angle of at least 60 °, but preferably at least 80 ° out of the plane of the planar marking element, wherein the bend does not have to take place on a single bending line but can also extend over a bending region. A projection can have further bending lines or regions in its further course starting from the first bending region; it can also be parallel to the plane of the marking element with its free end be directed. It may be in the projection to a short tab, but also an entire outer edge of the flat marking element may be bent out of the plane accordingly.

If the first microstructured layer of the heat shield has one or more passage openings, as described above, it is preferred if the at least one projection extends through the at least one passage opening and is deformed, folded over and / or compressed for attachment to the outer surface of the heat shield. The number of protrusions of the marking element preferably corresponds to the number of through openings. Alternatively, a plurality of projections, in particular spaced from one another, can be guided through a single, in particular elongate, through-opening. The reshaping is preferably carried out in such a way that the part of the projection which projects beyond the passage opening is folded over or pressed in such a way that it protrudes laterally beyond the passage opening and thus enables a form-locking connection.

In an advantageous variant, the part of the projection which projects beyond the passage opening is bent or folded over onto the surface of the microstructured layer, wherein, when the protruding part of the projection extends into the recess, the free end is on the surface recognizable by the recess The flat marking element can come to rest or even pressed onto this. In the latter case, especially if the material thickness of the marking element is equal to or less than the material thickness of the microstructured layer, a protrusion of the free end of the projection is avoided, so that the risk of injury is minimized. The same results for a short free end, which is folded down along the side edge of the microstructured layer in the direction of the marking element.

In another advantageous variant, the part of the projection which projects beyond the passage opening is pushed back onto the surface of the microstructured layer, so that a button-shaped area is formed which covers the passage opening on at least two sides, but preferably peripherally. It is also possible to provide the projection in the interior of the part, which protrudes beyond the passage opening, with a slot and knockouts at the ends and half the extension length of the slot. As a result, when upsetting the supernatant, a folding can be achieved, the two back-ups also provide a positive connection between the labeling element and microstructured position.

If, on the other hand, the first microstructured layer of the heat shield has at least one projection, as is also described above, it is preferred if the at least one projection lies between the at least one projection of the receiving region of the microstructured layer and the at least one further layer and thereby of the projection is held on the further situation. Preferably, both the at least one projection in the direction of the marking element and the at least one projection in the direction of the outer surface of the heat shield are pre-formed, in particular bent over. When joining the deformation can then be further adapted, for example, be pressed. In this variant, it is advantageous if the microstructured layer has a plurality of such projections or an elongate projection not only on one edge of the recess but on two, in particular opposite, edges of the recess. The protrusions can also consist of short sections or be formed as an elongated projection along at least one, but preferably along two mutually opposite edges of the sheet-like marking element.

The fastening is improved if the planar marking element as a whole or at least the at least one projection of the marking element at least in sections has a wavy and / or serrated edge. This wave and / or jagged edge can intervene with coordination of the wave or spike size and spacing on the microstructure form fit in the microstructuring of at least one microstructured layer and thus prevent a release of the compound.

Alternatively or additionally, the attachment can be improved by a suitable support of the projection (s) or the identification element on the side facing away from the marking field side. In a first variant, in the at least one microstructured layer adjacent to at least one projection at least in sections, a crank is formed on the side of the projection facing away from the recess. Together bend and projection thus form a more or less long groove in which the projection is added.

In a second variant, the support is provided by a further layer of the heat shield. In the region of the receiving region of the microstructured layer, this further layer has at least one return at least in sections. The at least one protrusion of the planar identification element is here now preferably between at least one projection of the Recorded receiving area of the microstructured layer and at least one edge of the at least one return. The supporting effect can be done by the side edge and / or the bottom of the recess when the return is predominantly rectangular. Oblique edges are also possible as a support.

A further embodiment of the invention provides that the marking element has at least one protrusion which, as in the previously described embodiments, does not point in the direction of the outer surface of the heat shield, but points away from the microstructured layer. In this case, it is advantageous if appendages adjoin the projection (s) and point away from the identification field of the marking element. It is advantageous if both between the surface of the marking element and the projections on the one hand and between the projections and the projections on the other hand, an angle of approximately 80 to 100 ° is clamped. Preferably, at least one return is also present here, in which the marking element is supported. The solution is particularly preferred in heat shields which have a microstructured outer layer and a fiber-based insulating layer as the inner layer. In this case, the fastening elements which are generally required for fixing the heat shield layers to each other in any case can also be used to reinforce the positive connection between the heat shield layers and the marking element. The fastening means may be, for example, staples or clips.

The at least one further layer may be a structured or unstructured metallic layer. The layer thickness of this at least one further layer in the region of the at least one recess is substantially identical to its layer thickness outside the at least one recess. The return is thus formed by a local deflection of the metallic layer, for example a cup-like depression.

However, the at least one further layer may also be an insulation layer. As already mentioned, the insulation layer can also have a constant layer thickness in the area of the recess of the microstructured layer. Alternatively, the layer thickness in the region of the at least one return is advantageously reduced in comparison to the layer thickness outside the at least one return. If the insulation layer is made up of a plurality of individual layers, at least one such individual layer can be recessed in the region of the recess. In the case of a single-layer insulation layer, however, this has a thickness reduction in the region of the return, which has been realized, for example, by local compression.

With regard to the design of the marking element, there are various process and design options. On the one hand, it is possible for the heat shield to be initially produced and delivered in such a way that the flat marking element has a smooth surface, that is, no labeling has yet been applied or inserted. The final marking of the marking element in this case takes place at the engine or vehicle manufacturer.

It is also possible that the sheet-like marking element is labeled directly in the production of the heat shield and thus the heat shield has a label immediately after its production. The marking element can already be labeled before its attachment or be labeled only after its attachment. A partial inscription in the heat shield production and supplementing the lettering at the engine or vehicle manufacturer is possible.

There are various methods available for applying or applying the inscription. On the one hand, a printing process, whereby it must be ensured that the ink or other ink used has a temperature and possibly also oil stability sufficient for the intended use of the heat shield. On the other hand, the inscription can be introduced into the surface of the marking element so that a structuring of the surface takes place. Here, in particular the labeling by laser, but also an embossing or even the punching of the label offers. Engraving or etching are basically possible.

With regard to the temperature stability of the entire heat shield, it is advantageous if the marking element consists of metal, in particular of steel or an aluminum alloy, or contains metal, in particular steel or an aluminum alloy. If the marking element is mounted on the surface of the heat shield facing away from the heat source, as is the case in particular with heat shields resting directly on the heat-emitting article, it is also possible that the marking element consists of a thermoplastic or duroplastic material or a thermoplastic and / or contains thermosetting material.

There are also labeling elements used, which consist of a metal-plastic composite, such as a plastic disc, which is surrounded by a metal frame. As a result, the mechanical strength in the attachment area of Labeling element improves and at the same time all labeling options for plastic surfaces are available.

The microstructuring of the heat shield may be a nodalization. By means of Noppalierung the heat shield can be awarded a particularly bending resistant surface and / or overall shape. The Noppalierung thereby has substantially a regular grid, which, however, may have irregularities in stretched or compressed areas due to the three-dimensional deformation of the entire heat shield.

• – Noppenhöhen zwischen 1 und 15 mm, vorzugsweise zwischen 3 und 10 mm,
• – Noppendurchmesser oder Noppenbreite in der größten Erstreckungsrichtung zwischen 1 und 20 mm, vorzugsweise zwischen 3 und 10 mm,
• – Flächenausdehnungen der Noppen zwischen 3 und 500 mm², vorzugsweise zwischen 10 und 70 mm²,
• – Flankenwinkel der Noppen zwischen 20 und 90°, vorzugsweise zwischen 30 und 60°,
• – Abstände der Noppenscheitelpunkte zwischen 2,5 und 30 mm, vorzugsweise zwischen 6 und 15 mm und/oder
• – Dichte der Noppen zwischen 1 und 10, vorzugsweise zwischen 1 und 6 Noppen pro Quadratzentimeter.

The dualization can be optimized by choosing a number of parameters for the particular application. In addition to the preferred, substantially circular knobbed shape, other, for example, oval knobbed shapes are also possible here. In addition, approximately rectangular, in checkerboard pattern against each other deformed embossing pattern in the term Noppalierung within the meaning of this invention are included. Particularly suitable studded geometries result when using one of the following parameters or combination of several of the following parameters:

• - stud heights between 1 and 15 mm, preferably between 3 and 10 mm,
• - Noppendurchmesser or Noppenbreite in the largest extension direction between 1 and 20 mm, preferably between 3 and 10 mm,
• Area expansions of the dimples between 3 and 500 mm ² , preferably between 10 and 70 mm ² ,
• Flank angle of the pimples between 20 and 90 °, preferably between 30 and 60 °,
• - Distances of Noppenscheitelpunkte between 2.5 and 30 mm, preferably between 6 and 15 mm and / or
• - Density of the nubs between 1 and 10, preferably between 1 and 6 nubs per square centimeter.

• – ein Durchmesser der Mikroperforierungen zwischen 0,05 mm und 3 mm, bevorzugt zwischen 0,08 mm und 1 mm,
• – eine Dichte der Mikroperforierungen zwischen 1 und 200, bevorzugt zwischen 3 und 100 Löcher pro Quadratzentimeter, und/oder
• – ein Anteil der von den Löchern eingenommene Fläche zwischen 0,1% und 20%.

Alternatively or additionally, the microstructuring may be a microperforation. This is particularly advantageous in multi-layer heat shields. The microperforation allows sound waves to penetrate and be absorbed between the layers of the heat shield. Microperforation can be optimized by choosing a number of parameters for the particular application. Preferred absorption characteristics of the heat shield are obtained using one of the following parameters or a combination of several of the following parameters:

• A diameter of the microperforations between 0.05 mm and 3 mm, preferably between 0.08 mm and 1 mm,
• A density of microperforations between 1 and 200, preferably between 3 and 100 holes per square centimeter, and / or
• - A proportion of the area occupied by the holes between 0.1% and 20%.

The material of the at least one microstructured layer is advantageously an aluminum alloy or steel, in particular coated steel, more preferably hot-dip aluminized or alu-plated steel. Stainless steel is the preferred material for many applications. The layer thickness of the microstructured layer is advantageously between 0.1 and 0.5 mm.

The heat shield can be designed in one layer, so then consists of a single microstructured layer. Advantageously, however, the heat shield consists of at least two layers. In one embodiment, the heat shield comprises at least two metallic layers, of which at least one is microstructured. Particularly advantageous absorption properties of the heat shield result from the combination of a microperforated cover layer with a noppalierten layer, because this form Helmholtz resonators whose interiors offer both an excellent sound-absorbing effect and a good thermal insulation.

In another embodiment, the heat shield consists of at least one metallic layer, of which at least one is microstructured and at least one layer of an insulating material, in particular of a fiber material. This may be a woven, knitted, crocheted, knitted, laid or nonwoven fabric. The insulating material preferably consists of mineral fibers, glass fibers, carbon fibers and / or mixed fibers, these may additionally be impregnated and / or chemically modified. The insulation material may include further functions, for example, have sections of different thickness and / or channels for the passage of air streams. The total layer thickness of the insulation layer outside the recesses is advantageously between 1 and 100 mm, preferably between 1 and 40 mm. Especially the large layer thicknesses, these will rarely be present over the entire area, but fill only a portion of a larger contiguous area. Also, the density of the insulation material often varies over the area. The density of unimpregnated or chemically modified fiber-based layers when installed is 100-400 kg / m ³ , in particular 120-300 kg / m ³ . For chemically modified or impregnated, in particular with a binder impregnated fiber-based insulation layers, the density in the installed state is 110-500 kg / m ³ , advantageously 150-400 kg / m ³ .

The heat shield can be designed so that after its installation remains an air cushion between it and the object to be shielded. However, in the case of heat shields comprising at least one microstructured metallic layer and an insulating layer of fiber material, an adjacent shielding is advantageous because the object to be shielded, in particular a heat source, can be encapsulated at least in sections, but advantageously peripherally. It is advantageous if the insulating layer of fiber material rests directly on the object to be shielded and is surrounded on its outside by the microstructured metallic layer. Here it is possible that the heat shield consists of several separate sections that are assembled in the shoring. Individual sections can also be flexibly connected to one another via hinges or bending lines. It is likewise possible for the heat shield to consist of only one section-in each case individually for the at least one insulating fiber material layer and for the at least one microstructured metallic layer or already prefixed or preassembled-whereby the free edges are connected to one another at least in sections when the heat shield is closed , In addition to the connection methods and means known from the prior art, it is also possible to connect via the identification element, namely if the receiving region of the at least one microstructured layer is distributed over two edge sections of the microstructured layer to be joined together. If the identification element is positively and / or non-positively connected to both edge sections, these two edge sections are connected to one another via the identification element, so that the underlying fiber-based insulation layer is covered and enclosed.

Instead of a data matrix code or in addition to a data matrix code, the identification field of the identification element can also be provided with number and / or letter sequences and / or one or more logo (s). The data matrix code is preferably designed as a two-dimensional code, but it can also be a one-dimensional barcode or introduced. The following is also simplifying the caption.

The marking field need not have a rectangular or square base area. Rather, it may be advantageous if it - in addition to the projections - in the plane projections or recesses, which are adapted to a corresponding geometry in the microstructured position. This makes it possible that the marking element can be installed only in an insertion position. Alternatively or additionally, the projections can also be aligned relative to the projections or passage openings in such a way that no incorrect installation is possible. For this purpose, an asymmetrical arrangement of the projections is advantageous.

The identification element can also have a web-shaped section, which in turn can be deformed downwards into the at least one further layer and, for example, if it has lateral protrusions or hooks, is additionally connected to the fiber-based material of the insulation layer in this way.

Heat shields according to the invention are used, for example, for shielding hot areas of internal combustion engines, in particular catalysts, exhaust manifolds, turbochargers, sections of the exhaust pipes and the like, but also in battery conditioning.

In the following the invention will be explained in more detail with reference to drawings. These drawings are merely illustrative of preferred embodiments of the invention without the invention being limited to them. Like parts are designated in the drawings with the same reference numerals and may not be described again in case of repetition. The following examples illustrate a multiplicity of individual features which can also serve isolated from the context of the respective example for the development of the heat shield according to the invention. The drawings are of a purely schematic nature, in the sectional views is almost completely dispensed with the illustration of the microstructuring and the labeling of the label element. Scalability applies only where it is explicitly mentioned in the description.

The figures show schematically:

1 in two partial representations basic structures of heat shields with microstructured outer layer;

2 two plan views of heat shields according to the invention in the region of the receiving area and an associated cross-sectional view;

3 a cross section through a further embodiment of a heat shield according to the invention in the receiving area and its surroundings;

4 a plan view of a heat shield according to the invention in the region of the receiving area and two associated cross-sectional views;

5 a cross section through two further embodiments of inventive heat shields;

6 two oblique views and two cross-sectional views through a further embodiment of a heat shield according to the invention in the installed state;

7 a plan view of another embodiment of a heat shield according to the invention in the region of the receiving area;

8th Cross-sectional views of the receiving areas of two inventive heat shields; and

9 two mutually perpendicular cross-sectional views of the receiving area of another embodiment of a heat shield according to the invention.

1-a shows a detail of a plan view of a heat shield according to the invention 1 with a microstructured location 2 , where the microstructuring of the location 2 A microperforation with a regular grid is over the entire heat shield 1 draws. As a second location 3 is arranged a noppalierte layer. In the section shown are still two passage openings 5 to see for fasteners. The marking element according to the invention can not be seen in the detail shown.

In 1-b is a heat shield 1 shown, which consists of two half-shells, which in turn each consist of a fiber-based layer 4a . 4b and a microstructured metal layer 2a . 2 B are constructed. 1-b shows the items in exploded view together with the object to be shielded 50 , a catalyst. The metal layer 2a . 2 B with their regular microstructuring 29 , more precisely a microperforation, forms the outside of the heat shield, the fiber-based layer 4a . 4b the inside; she comes right on the catalyst 50 to lie. Only the inlet and outlet sides of the catalyst are not covered by the fiber-based layer, but only by the microperforated metal layer. Here is the marking element according to the invention 11 as described below on the first microstructured metal layer 2a appropriate.

Out 1-a and 1-b In view of the full-surface microstructuring, it becomes clear that a legible inscription directly on the microstructured surface of such heat shields is not possible, but must take place via a separate marking element, which is also durably fastened to the heat shield or integrally incorporated therein.

2-a represents a cross section through a receiving area 70 a two-ply heat shield 1 dar. The outer surface 61 of the heat shield 1 is formed by a nickel-plated steel layer, which makes it possible to use a thinner sheet steel than would be the case with an unstructured sheet metal. Below the leveled steel layer 2 is a fiberglass-based insulation layer 4 arranged at the same time the inner surface 62 of the heat shield forms, with this directly on the surface of the object to be shielded 50 , an exhaust pipe, rests. In the recording area 70 there is an identification element 11 between the noppalierten situation 2 and the insulation situation 4 , The isolation situation 4 indicates a return 41 in which the label element 11 at least partially recorded. In the recording area 70 is the steel layer 2 with a recess 71 provided by a region of the steel layer is cut out. The label field 80 of the label element 11 lies in the region of the recess 71 , The edges around the recess are sections as projections 72 down, towards the insulating layer 4 deformed, in the steepest section of the flank area, the angle to the plane of the situation 2 im directly to the reception area 70 subsequent area between 85 and 90 °, in the further course in the direction of the recess, the angle decreases again and goes to 0 °. The edges of the marking element form projections at least in sections 81 leading to the outer surface 61 of the heat shield 1 bent upwards, here is towards the outer edge of the marking element 11 a continuous increase of the angle to the plane of the marking field 80 to see at almost 90 °. The projections 72 and overhangs 81 are in their size and reshaping coordinated so that the projections 72 the projections 81 at least partially cover and down against the edge 42 of the return 41 press, even if the exploded view of the 2-a does not reflect the immediate concern of the elements.

2 B and 2-c illustrate design options for the projections 72 , These can, for example, as in 2 B on all outer edges of the recess 71 be formed in sections, or as in 2-c along two outer edges over the entire length of the outer edge. It is essential that the projections 72 are arranged so that they are the projections 81 at least in sections cover and form a positive fit. For this purpose, it is preferred if the projections 72 are arranged so that they prevent slippage of the microstructured layers relative to the marking element. A release of the layers 2 . 4 and thus also of the labeling element 11 is here by the not shown, but anyway necessary attachment of the layers 2 . 4 with each other or on the component 50 avoided. The projections 81 can like the tabs 72 in 2 B be designed as short tabs, or as in 2-c via at least one, preferably at least two outer edges of the marking element 11 , Even a complete circulation is possible, but then the corner areas must be reshaped or recessed accordingly, so disturbing accumulation of material can be avoided.

In 2 B are both the recess 71 as well as the label element 11 - except for the projections 72 and overhangs 81 - essentially rectangular. In 2-c are also hexagonal imprints 75 in projecting portions of the receiving area 70 the microstructured situation 2 provided, the identification element 11 is cut out accordingly in this area. This will ensure that the label element 11 only in this installation position on the heat shield 1 can be fixed and the in 2-c already lasered label 19 of the label element 11 thus always having the desired orientation. The label field 80 of the label element 11 in 2 B is still without caption, as this is to be applied only when installing.

3 is a section through another embodiment of the receiving area 70 a heat shield according to the invention 1 again. Here is the isolation situation 4 guided without jumping through the receiving area. The receiving area of the microstructured layer 2 points in addition to the projections 72 still craning 73 on, each on top of the recess 71 distant side of the projections are provided. projections 72 and craning 73 thus form groove-like receiving spaces for the projections 81 of the label element. By providing the combination of overhangs 81 and groove-like receiving spaces on both sides of the cross-section and thus on two opposite sides of the receiving area 70 as well as the location of the marking element 11 between the microstructured layer 2 and the insulation situation 4 , which are connected to each other outside the section shown, is a positive connection of the marking element 11 with the microstructured layer 2 given.

4 illustrates another embodiment of a heat shield according to the invention 1 in which the positive connection is directly between the microstructured layer 2 and the underlying identification element 11 is made. These are in the microstructured position 2 at the two in 4-a lateral edges of the receiving area 70 two through holes each 74 provided by which the projections 81 of the label element from bottom to top. The free ends of the projections 81 passing over the top of the passages 74 protrude, are folded over in the direction of the recess and thus lie between the passage opening 74 and the recess 71 on the edge portion of the microstructured layer 2 , The projections 81 , in the 4-a through the passage openings further up 74 rich, in this case have a shorter length than those of the two lower through holes 74 ,

This is also true when comparing the sectional views of the 4-b and 4-c along the AA or BB lines of the 4-a run, clearly. In 4-b range the folded sections 82 of the projections 81 not to the edge of the recess 71 while in 4-c go beyond this. With such long projections 81 it is possible to further bend the free end, so that this is not freely accessible on the surface, but along the edge of the recess 71 to this rejects. This not least improves the connection between the marking element 11 and the microstructured layer 2 , As in the embodiment of 2-a is also a return here 41 in the isolation situation 4 formed, for example embossed, in which the undeformed portion of the marking element 11 is included. The thickness of the insulation layer 4 is in the region of the recess D4 ', in the area outside the recess in the region adjacent to the recess D4. As a result, an additional thickness application by the marking element 11 minimized.

The embodiment of 5-a differs from the previous one by the design of the return of the insulation layer 4 and the deformation of the free end of the projections 81 , The isolation situation 4 is here from two layers 4a . 4b built, the return 41 for the inclusion of the marking element 11 created by a recess of the layer 4a , As in 4 are projections 81 of the label element 11 through through holes 74 led upwards. Here, however, the free ends are not folded, but embossed like a button, so that over at least one edge, but here both edges of the passage opening 74 laterally projecting extensions 84 form. Are the passage openings 74 in their extension transversely to the plane of the drawing only slightly larger than the projections 81 , so the spacers can also survive on all sides of the through hole and completely close this upwards.

5-b based on a single layer insulation layer 4 with in the reception area 70 the microstructured situation 2 continuous layer thickness. As in 4 and 5a are projections 81 of the label element 11 through through holes 74 led upwards. Here, however, the protruding portion of the projections has an internal, virtually buttonhole-shaped slot 84c up in the left half of the 5-b in the half-compressed state of the overhang 81 is shown. Upon further compression of the free end of the projection, the two through the slot 84c separate sections 84a . 84b of the free end so pressed that they move in different directions through the passage opening 74 put, ultimately results in the fully compressed state, a staggered supernatant 84 which in plan view resembles a filled first and third or second and third field of a Cartesian coordinate system. Again, a positive connection is achieved.

6 illustrates the shielding of one side of a component in four partial images 50 by means of a heat shield according to the invention 1 . 6-c corresponds to a section along the line CC of 6-b , 6-d represents another embodiment of the invention on a similar cutting line. This heat shield is plugged on the page in question and shields adjacent components of the component 50 arising heat. Out 6-a It becomes clear that inscriptions on microstructured surfaces, here a noppalierten surface, are not legible, it already disappears the connecting lines of the reference numerals. Instead, the label is made 19 - not with a Data Matrix code, but with letters and numbers - on a separate label element 11 in the reception area 70 of the heat shield 1 between the noppalierten situation 2 and the insulation situation 4 is included. As in the previous embodiments, in the noppalierten location 2 a recess 71 punched out the marking field 80 leaves free. The label element 11 indicates next to the actual label field 80 two in the direction of the insulation layer 4 pointing overhangs 81 on, in lateral extensions 85 pass. These extensions 85 be from the recess 71 surrounding edge portions of the receiving area 70 covered and against the return 41 pressed the insulation layer. In addition, as with heat shields that directly and comprehensively surround a heat-emitting article, the layers are not uncommonly provided by clip-type fasteners 88 fastened together. Here, these clip-like fasteners also extend through the extensions 85 of the label element 11 through and fix the label element 11 in addition to the two layers 2 . 4 , Here arise in the noppalierten location 2 and in the labeling element 11 Through openings 87 . 89 if the clip-type fasteners 88 are inserted in the insulation layer when inserting the clip-like fasteners 88 blind holes 47 educated. Similar clip-type fasteners 88 are in 6-b also in the labeling element 11 remote areas of the heat shield 1 recognizable.

A variant of in 6-c illustrated embodiment results when the between the straight portion of the marking element 11 with the identification field 80 , the two overhangs 81 and the top of the insulation layer 4 existing clearance from the isolation situation 4 is replenished. This is then for each extension 85 of the projections 81 a separate return 41 the isolation situation 4 maintained.

6-d varies the embodiment in that instead of only inserted brackets such brackets 88 can be used, which are bent on their free end u. thus barbs 86 form. To realize this bending, the insulation layer is 4 in the area of the brackets with bulges 48 provided on which also the layer thickness of the insulation layer 4 is reduced. This creates a free space between the insulation layer 4 and the underlying component 50 , The label element 11 is not directly penetrated by the brackets, but the bulges 48 the isolation situation 4 grab through recesses 99 in the extensions 85 of the label element 11 and thus effect an indirect positive connection.

Out 7 it becomes clear that the labeling element 11 also can be used two sections of a heat shield 1 , in particular two sections 2a . 2 B the on the outside surface 61 of the heat shield 1 lying microstructured, here microperforated, sheet metal layer 2 connect to. There are two exception sections for this purpose 71a . 71b each of the mutually facing section edges 91a . 91b starting in the sections cleared and form together with the adjacent areas of the receiving area 70 , The actual connection can be as in the embodiment of 4-a done so that each two projections 81 at two opposite edges of the marking element 11 the outer edge of the receiving area 70 spread. Due to the plastic deformation of the projections 81 as well as the support by the return 41 the isolation situation 4 so become the two layer sections 2a . 2 B along the connecting line 90 held together.

In 8th are two variants of the heat shield according to the invention 1 each showing a microperforated outer layer 2 and a noppalierte inner layer 3 exhibit. Through the openings of the microperforation 29 can sound waves into the interior of the heat shield 1 , in particular in the chambers between the nubs 39 penetrate and run dead in this interior. The return of the further position of the heat shield, here the noppalierten location 3 , can be embossed so that the Noppalierung on the underside of the label element 11 is continued, as in 8-a shown. However, it is industrially advantageous to use the entire receiving area 70 in the noppalierten location 3 to shape so that he on the one hand the return 41 forms and on the other hand, a smooth support for the marking element 11 , as in 8-b shown. The attachment of the marking element 11 is in 8-a similar to in 4-c realized, the free end 83 the cantilever 81 but not just along the edge of the recess 71 in the direction of the marking field 80 bent but pressed so that its free end extends on the surface of the label field parallel to its plane. In 8-b the crimping takes place via the passage opening 74 projecting portions of the projections 81 however, to the outside, ie in from the recess 71 opposite direction. The folded sections 82 come on the surface of the microperforated layer 2 to lie. Compared to the microperforations are the through holes 74 significantly larger, in particular larger than this from the size ratios in 8th could be derived. The passage openings in particular have a width that is slightly greater than the material thickness of the marking element 11 or its projections 81

The embodiment of 9 is that the 2-a very similar in the cross-sectional view shown, here is the microstructured layer 2 however microperforated, the projections 72 are significantly longer than in 2-a , and the free ends of the cantilever 81 rejuvenate in the cross-sectional view. 9-b clarifies the function of this taper in a further cross section through the label element 11 and microperforated location 2 perpendicular to that of the 9-a passes through the section Y. Here it becomes clear that the elongated cantilever 81 has on its upper side a wavy edge, the wave crests 13 into the microperforations 29 plunge. For this purpose, the period length of the wavy edge on the distances of the microperforations 29 Voted. Of course, it is possible to provide a smaller number of wave periods, in which then every wave mountain, for example 13 in a microperforation 29 dips. Also, a smaller number of wave crests may be provided as microperforations.

Also possible, but not explicitly shown, is a comparable immersion of wave or jagged peaks of the projection 81 in the wells of a noppalierten sheet. In the case of thermoplastic edges of the marking element, it would also be possible to melt and infiltrate edge sections into the microstructuring.

Claims (19)

Heat shield ( 1 ) for shielding an object against heat and / or sound with at least one metallic layer ( 2 ), at least one on the surface of the heat shield ( 1 ) lying metallic layer ( 2 ) a microstructuring ( 29 ), characterized in that a planar identification element ( 11 ) on a surface of the at least one microstructured layer ( 2 ) is introduced and / or incorporated, wherein the two-dimensional marking element ( 11 ) at least with the at least one microstructured layer ( 2 ) of the heat shield ( 1 ) is positively and / or non-positively connected. Heat shield according to the preceding claim, characterized in that the heat shield ( 1 ) at least one further layer ( 3 . 4 ), wherein the at least one microstructured layer ( 2 ) on the outer surface ( 61 ) of the heat shield ( 1 ) and the at least one further layer ( 3 . 4 ) preferably on the inner surface ( 62 ) of the heat shield is arranged. Heat shield according to one of the preceding claims, characterized in that the flat identification element ( 11 ) at least in sections on the outer surface ( 61 ) of the heat shield ( 1 ) facing away from the surface of the at least one microstructured layer ( 2 ) between the at least one microstructured layer ( 2 ) and the at least one further layer ( 3 . 4 ) is arranged. Heat shield according to one of the preceding claims, characterized in that the at least one microstructured layer ( 2 ) a receiving area ( 70 ), in which the microstructured layer ( 2 ) at least one recess ( 71 ), wherein the receiving area ( 70 ) adjacent to the at least one recess ( 71 ) one or more passage openings ( 74 ) or at least partially protrusions ( 72 ), wherein the projections ( 72 ) from the outer surface ( 61 ) of Heat shields ( 1 ) to the inner surface of the heat shield ( 1 ) point. Heat shield according to one of the preceding claims, characterized in that the flat identification element ( 11 ), preferably at its outer edge, at least in sections at least one projection ( 81 ), wherein the at least one protrusion ( 81 ), when the flat identification element ( 11 ) between the at least one microstructured layer ( 2 ) and the at least one further layer ( 3 . 4 ), towards the outer surface ( 61 ) of the heat shield ( 1 ), wherein the at least one protrusion ( 81 ) is preferably arranged such that - between at least one projection ( 72 ) of the receiving area of the microstructured layer ( 2 ) and the at least one further layer ( 3 . 4 ) and / or - through the at least one passage opening ( 74 ) and preferably on the outer surface ( 61 ) of the heat shield ( 1 ) is formed and / or pressed. Heat shield according to one of the preceding claims, characterized in that the flat identification element ( 11 ) at least in sections a wave and / or jagged edge ( 13 ), wherein in particular the edge of the at least one protrusion ( 81 ) is at least partially wave-shaped and / or serrated, and wherein preferably the wave and / or jagged edge is at least partially positive fit with the microstructuring ( 29 ) of the at least one microstructured layer ( 2 ). Heat shield according to one of the preceding claims, characterized in that the at least one microstructured layer ( 2 ) adjacent to at least one projection ( 72 ) of the receiving area at least partially a crank ( 73 ), wherein the offset on the of the recess ( 71 ) facing away from the projection ( 72 ) and preferably at least one protrusion ( 81 ) of the identification element ( 11 ) between the projection ( 72 ) and the bend ( 73 ) is arranged. Heat shield according to one of the preceding claims, characterized in that the at least one further layer ( 3 . 4 ) in the area of the reception area ( 70 ) of the microstructured layer ( 2 ) at least in sections at least one return ( 41 ), wherein the at least one protrusion ( 81 ) of the planar identification element ( 11 ) preferably between at least one projection ( 72 ) of the recording area ( 70 ) of the microstructured layer ( 2 ) and at least one edge ( 42 ) of the at least one return ( 41 ) the at least one further layer ( 3 . 4 ) is arranged. Heat shield according to one of the preceding claims, characterized in that the at least one further layer ( 3 . 4 ) a structured or unstructured metallic layer ( 3 ), wherein the layer thickness (D3 ') of the at least one further layer in the region of the at least one return ( 41 ) is substantially identical to the layer thickness (D3) of the at least one further layer outside the at least one return ( 41 ). Heat shield according to one of claims 1 to 8, characterized in that the at least one further layer ( 3 . 4 ) an insulation layer ( 4 ), wherein the layer thickness (D4 ') of the insulating layer ( 4 ) in the region of the at least one return ( 41 ) is reduced compared to the layer thickness (D4) of the insulation view ( 4 ) outside of the at least one return ( 41 ). Heat shield according to one of the preceding claims, characterized in that the flat identification element ( 11 ) has a smooth surface. Heat shield according to one of claims 1 to 10, characterized in that the flat identification element ( 11 ) a label ( 19 ), the label ( 19 ) preferably by means of - laser and / or - a printing process, in particular by means of ink jet printing and / or - an embossing process - a punching process and / or introduced. Heat shield according to one of the preceding claims, characterized in that the identification element ( 11 ) made of metal, in particular steel or an aluminum alloy, or metal, in particular steel or an aluminum alloy contains. Heat shield according to one of the preceding claims, characterized in that the identification element ( 11 ) consists of a thermoplastic or thermosetting material or contains a thermoplastic and / or thermosetting material. Heat shield according to one of the preceding claims, characterized in that the microstructuring ( 29 ) is a Noppalierung, in particular - the stud heights between 1 and 15 mm, preferably between 3 and 10 mm and / or - The diameter of a knob between 1 and 20 mm, preferably between 3 and 10 mm and / or - the surface extent of a knob between 3 and 500 mm ² , preferably between 10 and 70 mm ² and / or - the flank angle of a knob between 20 and 90 °, preferably between 30 and 60 ° and / or - the distances between the pimple vertices between 2.5 and 30 mm, preferably between 6 and 15 mm and / or - the density of the pimples between 1 and 10, preferably between 1 and 6 pimples per square centimeter. Heat shield according to one of the preceding claims, characterized in that the microstructuring ( 29 ) is a microperforation, wherein in particular - the diameter of the microperforations between 0.05 mm and 3 mm, preferably between 0.08 mm and 1 mm and / or - the density of microperforations between 1 and 200, preferably between 3 and 100 holes per Square centimeter and / or the area occupied by the holes is between 0.1% and 20%, in particular between 0.2 and 10% of the total area of the microstructured layer. Heat shield according to one of the preceding claims, characterized in that the heat shield ( 1 ) a closed mold with at least one connecting line ( 90 ), at which two edge sections ( 91a . 91b ) of two sections ( 2a . 2 B ) of the at least one microstructured layer ( 2 ) touch at least in sections, wherein the receiving area ( 70 ) in the region of the at least one connecting line ( 90 ), the label element ( 11 ) preferably the two edge sections ( 91a . 91b ) of the at least one microstructured layer ( 2 ) connects positively and / or non-positively. Heat shield according to one of the preceding claims, characterized in that the material of the at least one microstructured layer ( 2 ) is selected from an aluminum alloy or steel, in particular coated steel, more preferably from hot-dip or alu-plated steel, or from a stainless steel. Heat shield according to one of the preceding claims, characterized in that the material of the at least one insulating layer ( 3 ) is selected from a fiber material, in particular from a woven, knitted fabric, crochet, knitted fabric, scrim or nonwoven, preferably from mineral fibers, glass fibers, carbon fibers and / or mixed fibers with or without impregnation and / or chemical modification.

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