DE202011105468U1 - PCB separator - Google Patents

Abstract

Printed circuit board separating device (10) for separating in particular assembled printed circuit boards (52) from a printed circuit board substrate (30), the printed circuit board substrate (30) and the printed circuit boards (52) separated therefrom in the course of a separation process being held on a workpiece carrier (12) during the separation process, wherein the workpiece carrier (12) comprises a base (14) and magnetically interacting with the base (14) holding elements (20) and / or support elements (22) for holding and / or supporting the printed circuit board substrate (30), the holding elements (20) and / or support elements (22) have an installation surface (78) for installation on the base base (14) and an active surface (38) for holding and / or supporting the printed circuit board substrate (30), characterized in that an in particular plate-shaped fixing device (86) is provided which has a plurality of openings (94), the arrangement of the openings (94) in the fixing device g (86) is matched to a predetermined arrangement of a plurality of holding elements (20) and / or supporting elements (22) and the size and shape of the openings (94) is designed such that in each opening ...

Description

The invention relates to a printed circuit board separation device for separating in particular printed circuit boards from a printed circuit board substrate, wherein the printed circuit board substrate and the separated therefrom in the course of a separation processing pigtails are held during separation on a workpiece carrier, the workpiece carrier a base and magnetically cooperating with the base support elements and / / or support elements for holding and / or supporting the printed circuit board substrate, wherein the holding elements and / or support elements have a footprint for placement on the base base and an active surface for holding and / or supporting the printed circuit substrate.

Such a printed circuit board separation device is known from DE 20 2009 015 945 known. It allows a particularly simple, flexible and cost-effective separation of printed circuit board substrates, especially for printed circuit boards to be produced in small series.

On this basis, the present invention has the object to optimize the known printed circuit board separation device.

This object is achieved in a printed circuit board separation device of the type mentioned above in that a particular plate-shaped fixing device is provided, which has a plurality of apertures, wherein the arrangement of the apertures in the fixing device is tuned to a predetermined arrangement of a plurality of holding elements and / or Support elements and wherein the size and shape of the apertures is designed so that in each case an opening a holding element and / or a support element guided at the height of a guide portion and fixed in a plane parallel to the base plane.

The fixing device according to the invention makes it possible in each case to fix a holding element and / or supporting element in a plane parallel to the base plane relative to the fixing device. This makes it possible to prevent a relative movement of a plurality of holding elements and / or supporting elements. This has the advantage that a displacement of a holding element and / or support element is avoided as a result of the processing forces associated with a cutting processing of a printed circuit board substrate. In this way, the holding elements and / or support elements can be reliably and permanently held on the base, so that the circuit board separation device according to the invention is particularly well suited for mass-produced printed circuit boards.

It is possible that the guide section adjoins the installation surface. For a particularly reliable fixation of the holding elements and / or support elements, however, it is preferred that the guide portion is spaced from the footprint. This distance allows a particularly good absorption of tilting moments, which arise in a tilting of the holding elements and / or support elements relative to the base.

Preferably, the holding elements and / or support elements on a support surface for supporting a bottom of the fixing device. This has the advantage that an external holder for holding the fixing device relative to the base can be dispensed with. Rather, the holding elements and / or supporting elements can be used to form together with the fixing a composite, which is not relatively movable in a plane parallel to the base base plane to each other.

It is particularly preferred that the bearing surface between the footprint and the active surface is arranged. As a result, tilting moments acting around the footprint of the retaining elements and / or support elements can be easily absorbed. In addition, a spacing of the support surface is achieved to the active surface, so that a separating tool which separates a printed circuit board substrate, can pass through the printed circuit board substrate, but does not come into contact with the fixing device.

Furthermore, it is preferred if the support surface is formed by the upper side of a foot section of a holding element and / or support element. This makes it possible to use a foot portion not only for the arrangement of a magnet, but also as a support surface for the underside of the fixing device.

Furthermore, it is preferred if a guide surface of a holding element and / or support element is formed by a guide section tapered relative to the foot section. This has the advantage that the apertures of the fixing device can be joined in a simple manner to the guide sections of the retaining elements and / or supporting elements and positioning of the fixing device relative to the retaining elements and / or supporting elements seen in the joining direction by simple support on the top of the foot section of a Holding element and / or support element takes place.

Finally, it is preferred if the guide surfaces of the holding elements and / or support elements are cylindrical and if the openings are hollow cylindrical. As a result, it is not necessary, the holding elements and / or support elements in align their respective rotational position relative to the fixing device.

Further features and advantages of the invention are the subject of the following description and the diagrammatic representation of a preferred embodiment.

In the drawings show:

1 a perspective view of an embodiment of a printed circuit board separation device with a base and a plurality of holding elements and support elements;

2 a perspective view of the circuit board separator according to 1 wherein the holding elements and support elements are fixed by means of a fixing device; and

3 an exploded view of the circuit board separator according to 2 , wherein in addition to a printed circuit board to be separated into a printed circuit board substrate and a covering device are shown.

An embodiment of a printed circuit board separation device is indicated in the drawing as a whole by the reference numeral 10 designated. The circuit board separator 10 includes a total with the reference numeral 12 designated workpiece carrier. The workpiece carrier 12 includes a foundation 14 , which in particular in the form of a magnetic base plate 16 is trained. The base plate 16 extends over a work area, which is for example rectangular.

The workpiece carrier 12 further preferably comprises at least one magazine-like receptacle 18 which are preferably in close proximity to the base 14 is arranged, in particular in marginal areas of the base 14 are arranged and fixed.

The magazine-like shots 18 serve for the storage of holding elements 20 and support elements 22 , Furthermore, the recordings serve 18 also for storing optional additional holding elements 24 and additional support elements 26 , The Elements 20 to 26 each have a magnetically active foot section 28 on, which by arrangement of the element on the base plate 16 interacts magnetically with this.

The holding elements 20 serve to fix a printed circuit board substrate 30 (compare 3 ) on the base plate 16 of the workpiece carrier 12 , For this purpose, the holding elements 20 holding portions 32 on (compare 1 and 3 ), which for engagement of retaining recesses 34 of the printed circuit board substrate 30 or to rest against a boundary 36 of the printed circuit board substrate 30 are formed.

The holding elements 20 and the support elements 22 each have an effective area 38 which is for abutment against a bottom surface of the printed circuit board substrate 30 serves. The effective area 38 a holding element 20 is annular and extends around a holding section 32 , The effective area of a support element 22 is closed and preferably circular.

The optional additional holding elements 24 have additional holding sections 40 on which the holding sections 32 the holding elements 20 correspond and which for engagement in additional recesses 42 a covering device 44 (compare 3 ) serve.

The cover 44 is in particular in the form of a cover plate 46 formed, which preferably parallel to the printed circuit board substrate 30 and the foundation 14 can be arranged. The additional holding sections 40 the additional holding elements 24 Optionally serve as an attachment to a boundary 48 the covering device 44 ,

The additional holding elements 24 preferably adjacent to the additional holding sections 40 an example annular contact surface 50 on which for planting a bottom of the cover 44 serves. The effective height of the additional holding element 24 is equal to the distance between the bottom of the foot section 28 and the contact surface 50 ,

The printed circuit board substrate 30 has at least one printed circuit board 52 , preferably a plurality of printed circuit boards 52 on. In the embodiment shown in the drawing (see 3 ) has the printed circuit board substrate 30 six printed circuit boards 52 on.

The printed circuit board substrate 30 is made starting from a closed substrate surface by first contours 54 the circuit boards 52 are introduced in sections in the closed substrate surface. This operation is usually before an assembly of the printed circuit board substrate 30 with components 56 . 58 performed, so that these components not by the production of the sectional contours 54 can be contaminated conditionally.

Following the production of the section-wise contours 54 remain separation areas 60 , which is for a separation of the printed circuit boards 52 from the printed circuit substrate 30 still have to be severed.

Usually, the assembly of the printed circuit board substrate takes place after the production of the sectional contours 30 with (in particular electronic) components 56 . 58 ,

This is then done with sectioned contours 54 provided and populated PCB substrate 30 at the base 14 determined, in particular by attaching the printed circuit board substrate 30 on the holding sections 32 the holding elements 20 , Here, a numerically controlled removal of the holding elements 20 from the magazine-like shots 18 done as in the DE 20 2009 015 945 U1 described and therefore not further explained at this point. If required, support elements can also be used 22 for supporting the printed circuit board substrate 30 be positioned in a corresponding manner.

Before the separation of the separation areas 60 becomes the cover device 44 on the workpiece carrier 12 set, preferably using the additional holding elements 24 and, if necessary, using additional support elements 26 ,

The cover plate 46 has at least one recess 62 , preferably a plurality of recesses 62 on. The recesses 62 are, for example, slot-shaped. The recesses 62 are slightly larger than the separation areas 60 of the printed circuit board substrate 30 ,

The location, shape, orientation and size of the recesses 62 is based on the location, shape, orientation and size of the separation areas 60 of the printed circuit board substrate 30 Voted. The recesses 62 limit free space 64 which has an access passage for an in 3 schematically illustrated separating device 68 form. The cross section of an access passage is preferably only slightly larger than a separation area assigned to this access passage 60 ,

The separator 68 has a drive 70 for a cutting tool 72 on. The separator 68 is preferably positioned numerically controlled, in a plane parallel to the base plate 16 and in a direction perpendicular to the base 14 ,

With the cutting tool 72 it is in particular a milling tool. Preferably, the separating tool 72 a diameter which is only slightly smaller than the smallest distance between opposite boundaries of the recesses 62 ,

The material of the cover plate 46 outside the recesses 62 forms cover sections 74 , which preferably merge into each other, so that a one-piece cover plate 46 is created.

For separating processing of the separation areas 60 by means of the separating tool 72 becomes the separator 68 positioned so that the cutting tool 72 a recess 62 penetrated and engaged with the recess associated with this separation area 60 arrives. In this case, the printed circuit board substrate 30 in the area outside the recesses 62 by means of the cover sections 74 from the cover 46 covered. This prevents that in the course of separation resulting printed circuit boards 52 from the holding elements 20 (and optionally of the support elements 22 ) from a suction device 76 be sucked off (in 3 shown schematically). The suction device 76 serves to suck off the impurities (particles, chips) created during the separation process. The suction device 76 but should not just the isolated circuit boards 52 with suction; these should rather on the holding elements 20 or supporting elements 22 remain.

The foot sections 28 a holding element 20 or a support element 22 each have a footprint on their underside 78 on. At the top of the foot sections 28 is an annular bearing surface 80 intended.

From the foot section 28 protrude tapered guide sections 82 from which preferably cylindrical guide surfaces 84 exhibit.

The guide sections 82 extend between the foot section 28 and the active surfaces 38 ,

The holding elements 20 and / or the support elements 22 are by magnetic action at the base 14 fixable. To a relative movement of the holding elements 20 and / or the support elements 22 in one to the foundation 14 to prevent parallel plane is a fixing device 86 (compare 3 ), which in particular in the form of a fixing plate 88 is trained.

The fixing device 86 has one of the basic principles 14 facing underside 90 and a the printed circuit board substrate 30 facing top 92 on.

Furthermore, the fixing device 86 breakthroughs 94 on which is between the bottom 90 and the top 92 extend.

The breakthroughs 94 are each in the form of a guide section 82 customized. The breakthroughs 94 are only slightly larger than the guide sections 82 so the guide surface 84 the guide sections 82 at least largely immovable relative to the fixing device 86 is when the guide sections 82 in the breakthroughs 94 are included.

This is the bottom 90 the fixing device 86 on the respective contact surfaces 80 the holding elements 20 and / or the support elements 22 on.

The arrangement of the breakthroughs 94 , ie the distribution, pattern or "raster" of breakthroughs 94 is on the arrangement of the holding elements 20 and / or support elements 22 matched so that a predetermined arrangement (pattern, grid) of a plurality of holding elements 20 by means of the fixing device 86 is fixable relative to each other.

If the circuit board separator 10 a covering device 44 has and additional holding elements 24 and / or additional support elements 26 are provided, it is preferred if the fixing device 86 Additional breakthroughs 96 which are matched in terms of their arrangement, size and shape on a peripheral surface 98 the foot sections 28 an additional holding element 24 and / or an additional support element 26 , In this way, the additional holding elements 24 and / or the additional support elements 26 be fixed relative to each other.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 202009015945 [0002]
• DE 202009015945 U1 [0029]

Claims (7)

PCB separation device ( 10 ) for separating in particular populated printed circuit boards ( 52 ) from a printed circuit board substrate ( 30 ), wherein the printed circuit board substrate ( 30 ) and the circuit boards isolated therefrom in the course of a separation process ( 52 ) during parting on a workpiece carrier ( 12 ), wherein the workpiece carrier ( 12 ) a basic basis ( 14 ) and magnetic with the base ( 14 ) cooperating holding elements ( 20 ) and / or supporting elements ( 22 ) for holding and / or supporting the printed circuit substrate ( 30 ), wherein the retaining elements ( 20 ) and / or supporting elements ( 22 ) a footprint ( 78 ) to set up on the basis ( 14 ) and an effective area ( 38 ) for holding and / or supporting the printed circuit substrate ( 30 ), characterized in that a particular plate-shaped fixing device ( 86 ) is provided, which a plurality of breakthroughs ( 94 ), wherein the arrangement of the breakthroughs ( 94 ) in the fixing device ( 86 ) is tuned to a predetermined arrangement of a plurality of holding elements ( 20 ) and / or supporting elements ( 22 ) and the size and shape of the breakthroughs ( 94 ) is designed so that in each case a breakthrough ( 94 ) a holding element ( 20 ) and / or a support element ( 22 ) at the height of a guide section ( 82 ) and in one to the basic ( 14 ) parallel plane is fixed. PCB separation device ( 10 ) according to claim 1, characterized in that the guide section ( 82 ) to the footprint ( 78 ) is spaced. PCB separation device ( 10 ) according to one of the preceding claims, characterized in that the holding elements ( 20 ) and / or supporting elements ( 22 ) a support surface ( 80 ) for supporting a lower side ( 90 ) of the fixing device ( 86 ) exhibit. PCB separation device ( 10 ) according to claim 3, characterized in that the bearing surface ( 80 ) between the footprint ( 78 ) and the effective area ( 38 ) is arranged. PCB separation device ( 10 ) according to claim 3 or 4, characterized in that the bearing surface ( 80 ) from the top of a foot section ( 28 ) of a holding element ( 20 ) and / or support element ( 22 ) is formed. PCB separation device ( 10 ) according to claim 5, characterized in that a guide surface ( 84 ) of a holding element ( 20 ) and / or support element ( 22 ) of a relative to the foot section ( 28 ) tapered guide section ( 82 ) is formed. PCB separation device ( 10 ) according to one of the preceding claims, characterized in that the guide surfaces ( 84 ) of the retaining elements ( 20 ) and / or supporting elements ( 22 ) are cylindrical and that the openings ( 94 ) are hollow cylindrical.

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