DE202010013706U1 - Device for leveling - Google Patents

Abstract

An apparatus comprising:
a support structure configured to secure an object, the object having a plurality of protrusions configured to form a pattern on a surface of a substrate upon contact of the object with the surface; and
at least one flexible connection assembly secured to the support structure and configured to allow the object to assume a parallel orientation with respect to the surface upon contact of the object with the surface.

Description

STATE OF THE ART

Miniaturized production is an important aspect of modern economics. Thus, for example, methods such as the micro-contact printing, nano imprint lithography, and printing by means of "pen-nanolithography" (in English "dip-pen nanolithography ^®" or "DPN ^®") for the production of structures and patterns in the micro- and nano range can be used. For example, compare micro-contact printing and nanoimprint lithography CM Sotomayor Torres, Alternative Lithography: Unleashing the Potentials of Nanotechnology (Nanostructure Science and Technology), 2003 , Compare for example the same US Pat. Nos. 6,380,101 ; 6,518,189 ; 6,818,959 ; 7,442,316 ; and 7,665,983 , For DPN ^® printing, compare for example the US Pat. Nos. 6,635,311 and 6,827,979 (both Mirkin et al.). A method for direct writing, including the DPN ^® -Druckens, are useful, because a pattern can be directly drawn or embedded in a substrate surface. In an embodiment of DPN ^® material is from a peak (or an array of tips) onto a substrate, for example a raster scan or nanoscopic atomic force microscope tip or plurality of such tips are used. DPN ^® can be used with a plurality of peaks, which switch use and includes two-dimensional arrays of tips which are operated in parallel on a single instrument. Compare for example the U.S. Patent Publication No. 2008/0105042 (Mirkin et al.). In all of the miniaturized fabrication methods described above, patterning may be performed to produce a variety of different structures on substrate surfaces, including soft and hard structures, organic and inorganic structures, and biological structures, and including Variety of regular or irregular patterns.

Despite significant benefits, there is a need for equipment and patterning equipment that allows for higher quality patterns and ease of use. For example, poor pattern quality can result from stamps (in microcontact printing), shapes (in nanoimprint lithography), or spikes (in DPN) not being aligned in parallel with respect to the surface of the substrate being patterned. However, leveling and aligning a large number of punch / die protrusions or tips presents an engineering challenge. Other challenges include observing the punches, dies, or tips during the leveling process, providing feedback to the user indicating leveling has been achieved and maintaining parallel alignment during patterning and / or after patterning, i. H. after contact with the surface has been broken off.

SUMMARY OF THE INVENTION

There are proposed leveling equipment, equipment for accommodating such equipment, kits, and uses for facilities.

According to one embodiment, there is proposed a device comprising: a support structure configured to secure an object, the object having a plurality of protrusions formed to impart a pattern on a surface of a substrate upon contact of the object to form the surface; and at least one flexible connection assembly secured to the support structure and configured to allow the object to assume a parallel orientation upon contact of the object with the surface with respect to the surface.

According to another embodiment, there is provided a device comprising: a support structure configured to secure an array of nanoscopic tips, the array being configured to form a pattern on a surface of a substrate upon contact of the array with the surface; and at least one magnetic flexible connection assembly secured to the support structure and having a ball and a magnetic connector, the connector having a depression shaped to receive the ball, the magnetic flexible connection assembly being configured to engage the ball Array to allow a parallel orientation with respect to the surface when the object contacts the surface.

According to another embodiment, there is provided a device comprising: a support structure configured to fix an object, the object having a plurality of protrusions formed to form a pattern on a surface of a substrate upon contact of the object to form with the surface; and a plurality of flexible interconnect assemblies attached to the support structure, the plurality of interconnect assemblies comprising: a first flexible interconnect assembly positioned along a first axis parallel to the support structure runs; a second flexible connection assembly positioned along the first axis and opposite the first flexible connection assembly; a third flexible connection assembly positioned along a second axis that is parallel to the support structure and perpendicular to the first axis; and a fourth flexible connection assembly positioned along the second axis and opposite the third flexible connection assembly; wherein the plurality of flexible connection assemblies are configured to allow the object to assume a parallel orientation with respect to the surface upon contact of the object with the surface.

According to another embodiment, there is provided a device comprising: a support structure configured to secure an array of nanoscopic tips, the array being configured to pattern on a surface of a substrate upon contact of the array with the surface form; a first magnetic flexible connection assembly attached to the support structure and positioned along a first axis that is parallel to the support structure; a second magnetic flexible connection assembly secured to the support structure and positioned along the first axis and opposite the first magnetic flexible connection assembly; a center structure positioned on the support structure and attached to the first flexible magnetic connection assembly and the second flexible magnetic connection assembly; a third magnetic flexible connection assembly secured to the center structure and positioned along a second axis parallel to the support structure and perpendicular to the first axis; a fourth magnetic flexible connection assembly mounted to the center structure and positioned along the second axis and opposite the third magnetic flexible connection assembly; and an upper structure positioned above the center structure and secured to the third flexible magnetic connection assembly and the fourth flexible flexible connection assembly, each magnetic flexible connection assembly comprising: a ball; and a connector, wherein the connector has a depression shaped to receive the ball, wherein the ball or connector is magnetic, and further wherein the magnetic bendable interconnect assemblies are configured to allow the array upon contact of the array with the surface to take a parallel orientation with respect to the surface.

According to another embodiment, there is provided a device comprising: a patterning instrument and apparatus, the apparatus being affixed to the patterning instrument, and further comprising: a support structure adapted to secure an object, wherein the object a plurality of protrusions formed to form a pattern on a surface of a substrate upon contact of the object with the surface; and at least one flexible connection assembly secured to the support structure and configured to allow the object to assume a parallel orientation with respect to the surface upon contact of the object with the surface.

A method comprises the steps of: providing a device comprising: a support structure configured to secure an object, the object having a plurality of protrusions configured to form a pattern on a surface of a substrate upon contact of the device Form object with the surface; and at least one flexible connection assembly secured to the support structure and configured to allow the object to assume parallel alignment with respect to the surface upon contact of the object with the surface; Attaching the object to the storage structure; Contacting the attached object with the substrate; and allowing the object to assume a parallel orientation with respect to the surface.

The method may include the further step of: aborting the contact of the object with the surface, wherein the parallel alignment is maintained after the contact is broken.

The method may include the further step of providing at least some of the protrusions with an ink composition.

The method may include the further step of providing at least some of the protrusions with an ink composition and transferring the ink composition from the protrusions to the surface.

In the method, the object may be an array of scanning probe tips.

Another method comprises the steps of: providing a device comprising: a support structure configured to secure an array of nanoscopic tips, the array being configured to form a pattern on a surface of a substrate upon contact form the array with the surface; and at least one magnetic flexible connection assembly attached to the support structure, comprising: a ball; and a magnetic fastener, wherein the fastener has a depression shaped to receive the ball, wherein the magnetic flexible interconnect assembly is configured to allow the array to be parallel with respect to the surface upon contact of the object to occupy the surface; Attaching the array to the storage structure; Contacting the mounted array with the substrate; and allowing the array to assume a parallel orientation with respect to the surface.

Yet another method comprises the steps of: providing a device comprising: a support structure configured to secure an object, the object having a plurality of protrusions configured to pattern on a surface of a substrate upon contact of the object with the surface; and a plurality of flexible interconnect assemblies attached to the support structure, the plurality of interconnect assemblies comprising: a first flexible interconnect assembly positioned along a first axis parallel to the support structure; a second flexible connection assembly positioned along the first axis and opposite the first flexible connection assembly; a third flexible connection assembly positioned along a second axis parallel to the support structure and perpendicular to the first axis; and a fourth flexible connection assembly positioned along the second axis and opposite the third flexible connection assembly; wherein the plurality of flexible connection assemblies are configured to allow the object to assume a parallel orientation with respect to the surface upon contact of the object with the surface; Attaching the array to the storage structure; Contacting the mounted array with the substrate; and allowing the array to assume a parallel orientation with respect to the surface.

Another method includes the steps of providing a device comprising: a support structure configured to secure an array of nanoscopic tips, the array being configured to form a pattern on a surface of a substrate upon contact of the array to form with the surface; a first magnetic flexible connection assembly secured to the support structure and positioned along a first axis parallel to the support structure; a second magnetic flexible connection assembly secured to the support structure and positioned along the first axis and opposite the first magnetic flexible connection assembly; a center structure positioned on the support structure and secured to the first magnetic flexible connection assembly and the second magnetic flexible connection assembly; a third magnetic flexible connection assembly secured to the center structure and positioned along a second axis parallel to the support structure and perpendicular to the first axis; a fourth magnetic flexible connection assembly secured to the center structure and positioned along the second axis and opposite the third magnetic flexible connection assembly; and an upper structure positioned on the center structure and attached to the third magnetic flexible connection assembly and the fourth magnetic flexible connection assembly, each of the magnetic flexible connection assemblies comprising: a ball; and a connector, wherein the connector has a depression shaped to receive the ball, the ball or connector being magnetic, and further wherein the magnetic flexible connection assemblies are configured to allow the array to be parallel aligned with respect to the surface upon contact of the array with the surface; Attaching the array to the storage structure; Contacting the mounted array with the substrate; and allowing the array to assume a parallel orientation with respect to the surface.

Another method comprises the steps of: providing means having a support structure adapted to fix an object, the object having a plurality of protrusions formed to engage Forming patterns on a surface of a substrate upon contact of the object with the surface; and at least one flexible connection assembly secured to the support structure and configured to allow the object to assume parallel alignment with respect to the surface upon contact of the object with the surface; Attaching the object to the storage structure; Providing at least some of the protrusions with an ink composition; and transferring the ink composition from the protrusions to the surface. The object can be an array of scanning probe tips.

Another method includes the steps of providing a device comprising: a support structure configured to secure an array of nanoscopic tips, the array being configured to form a pattern on a surface of a substrate upon contact of the array to form with the surface; and at least one magnetic flexible connection assembly attached to the support structure, comprising: a ball; and a magnetic fastener, wherein the fastener has a depression shaped to receive the ball, wherein the magnetic flexible interconnect assembly is configured to allow the array to be parallel with respect to the surface upon contact of the object to occupy the surface; Attaching the array to the storage structure; Providing at least some of the scanning probe tips with an ink composition; and transferring the ink composition from the scanning probe tips to the surface.

Yet another method comprises the steps of: providing a device comprising: a support structure configured to secure an object, the object having a plurality of protrusions configured to pattern on a surface of a substrate upon contact of the object with the surface; and a plurality of flexible interconnect assemblies attached to the support structure, the plurality of interconnect assemblies comprising: a first flexible interconnect assembly positioned along a first axis parallel to the support structure; a second flexible connection assembly positioned along the first axis and opposite the first flexible connection assembly; a third flexible connection assembly positioned along a second axis parallel to the support structure and perpendicular to the first axis; and a fourth flexible connection assembly positioned along the second axis and opposite the third flexible connection assembly; wherein the plurality of flexible connection assemblies are configured to allow the object to assume a parallel orientation with respect to the surface upon contact of the object with the surface; Attaching the array to the storage structure; Providing at least some of the scanning probe tips with an ink composition; and transferring the ink composition from the scanning probe tips to the surface.

Another method includes the steps of providing a device comprising: a support structure configured to secure an array of nanoscopic tips, the array being configured to form a pattern on a surface of a substrate upon contact of the array to form with the surface; a first magnetic flexible connection assembly secured to the support structure and positioned along a first axis parallel to the support structure; a second magnetic flexible connection assembly secured to the support structure and positioned along the first axis and opposite the first magnetic flexible connection assembly; a center structure positioned on the support structure and secured to the first magnetic flexible connection assembly and the second magnetic flexible connection assembly; a third magnetic flexible connection assembly secured to the center structure and positioned along a second axis parallel to the support structure and perpendicular to the first axis; a fourth magnetic flexible connection assembly secured to the center structure and positioned along the second axis and opposite the third magnetic flexible connection assembly; and an upper structure positioned on the center structure and attached to the third magnetic flexible connection assembly and the fourth magnetic flexible connection assembly, each of the magnetic flexible connection assemblies comprising: a ball; and a connector, wherein the connector has a depression shaped to receive the ball, the ball or connector being magnetic, and further wherein the magnetic flexible connection assemblies are configured to allow the array to be parallel aligned with respect to the surface upon contact of the array with the surface; Attaching the array to the storage structure; Providing at least some of the scanning probe tips with an ink composition; and transferring the ink composition from the scanning probe tips to the surface.

In accordance with another embodiment, a mounting bracket is provided that is configured to assist in securing an object to a support structure, the object having a plurality of protrusions configured to form a pattern on a surface of a substrate upon contact of the object to form the surface.

One method includes the following steps: providing the mounting bracket outlined above; and securing the object to the storage structure using the mounting bracket. The method may include the further step of applying an adhesive or an adhesive to a mounting surface on the object.

A method includes the following steps: providing a device that has the following comprising: a support structure configured to secure an object, the object having a plurality of protrusions configured to form a pattern on a surface of a substrate upon contact of the object with the surface; and at least one flexible connection assembly secured to the support structure and configured to allow the object to assume parallel alignment with respect to the surface upon contact of the object with the surface; Contacting a plurality of protrusions with a substrate surface, the plurality of protrusions being provided via a plurality of cantilevers; Deflecting the plurality of outriggers; Observing an optical change indicative of surface contact between the plurality of protrusions and the substrate surface; and further leveling the plurality of protrusions using at least one flexible connection assembly secured to a support structure.

In the method, the at least one flexible connection assembly may be characterized by a coefficient of sliding friction and a coefficient of static friction, the sliding friction coefficient being sufficiently small to allow the plurality of protrusions to move and parallel alignment upon contact of the plurality of protrusions with the substrate surface and wherein the static friction coefficient is sufficiently large to allow the plurality of protrusions to maintain the parallel alignment after contact with the substrate surface is broken.

In the method, the at least one flexible connection assembly may comprise: a ball; and a connector attached to the ball, the connector having a depression shaped to receive the ball, and wherein the further leveling process comprises the step of: rotating the ball in the depression. In this case, at least the ball or the connecting element can be magnetic.

At least one advantage for at least one embodiment is the ability to level an object (including an object having a large number of patterning protrusions) for patterning a substrate surface with minimal effort and in a minimum amount of time.

At least one advantage for at least one embodiment is the ability to achieve better patterning results with a leveled object for patterning a substrate surface.

At least one advantage for at least one embodiment lies in the ability to observe an object for patterning a substrate surface during the leveling process.

At least one advantage for at least one embodiment is the ability to provide feedback that leveling has been achieved.

At least one advantage for at least one embodiment lies in the ability to maintain a leveling orientation of an object for patterning a substrate surface after contact with the surface is broken.

At least one additional advantage for at least one embodiment, because of the aspect of self-leveling the device, is that part of the process or the entire process can be automated because the need for manual measurements / interventions is reduced. Reducing the human element in its influence on errors and subjectivity can lead to increased accuracy and a more precise leveling process. Because the process can be automated, throughput, ease of use, and overall speed of work can be dramatically increased.

BRIEF DESCRIPTION OF THE DRAWINGS

The figures show exemplary embodiments.

1 FIG. 11 is an embodiment of a leveling device including: a support structure configured to secure an object to pattern a substrate surface; and a flexible connection assembly attached to the support structure.

2A Figure 10 is a side view of one embodiment of a leveling apparatus including: a support structure configured to secure an object to pattern a substrate surface; a flexible connection assembly attached to the support structure; a mounting structure attached to the flexible connection assembly and a signaling system coupled to the device. 2 B is a top view of the in the 2A shown device.

3 Fig. 12 is a view of a disassembled embodiment of a leveling apparatus including: a support structure configured to fix an object for patterning a substrate surface; a first pair of flexible connection assemblies; a Central structure attached to the first pair of flexible connection assemblies; a second pair of flexible connection assemblies; and an upper structure attached to the second pair of flexible connection assemblies.

4A is a perspective top view of the in 3 shown composite device. 4B is a perspective bottom view of the in 3 shown composite device. 4C is a picture of the assembled, fixed and in use device.

5 Figure 11 is a view of a composite embodiment of a leveling device including: a support structure configured to secure an object to pattern a substrate surface; a plurality of flexible connection assemblies attached to the support structure; a center structure and an upper structure attached to the plurality of flexible connection assemblies; and a fixing structure attached to the upper structure.

6 FIG. 10 is an embodiment of a mounting bracket configured to assist in securing an object to a support structure. FIG.

7A is a schematic representation of a multiplexed 2D DPN.

7B is an idealized schematic representation of a "rapid prototyping platform" for the multiplex protein impression.

8A is a plan view of a 2D nano-print array attached to a self-leveling mount.

8B is a bottom view of the 2D nano-print array.

8C is an optical microscope photograph of the tips and arms showing their location and spacing, and the placement and size of the observation openings.

8D is a SEM image of the tips and outriggers showing the underlying structure allowing their freedom of movement.

8E is a zoomed SEM image of the cantilever in front of a viewing port.

8F is a SEM image of the free path of the outriggers.

9A Figure 4 is a schematic representation of a 2D nano-print array just prior to contact with the minimum allowable planarity to bring all tips into contact.

9B shows that all tips are in contact, but the spacer on the right side of the device also contacts the substrate; φ must be minimized to achieve the best planarity and subsequent pattern homogeneity.

10A is an optical image of the 2D Nano-PrintArray cantilever seen through an observation port. The tips remain 1 μm above the substrate, just before contacting. The "butterfly wing" formation within the pyramidal peak appearing in red-orange refracted light has not yet undergone the change indicating substrate contact.

10B shows that the arms are fully deflected, indicating that the corner spacers are in uniform contact. The "butterfly wings" have changed shape, color and intensity accordingly.

11A Fig. 11 shows an NLP 2000 software interface showing the contact point measurements taken at the observation ports 1b, 2b and 3b immediately after coarse self-leveling. When using the "leveling execute" command, the system adjusts the φ _x -φ _y levels to compensate for the planar misalignment.

11B illustrates the contact point measurements measured again immediately after the compensation. The slope of 0.002 ° and ΔZ = 600 nm corresponds to the cantilever deflection detection limit of ± 100 nm, which means that the device is as planar as can be measured by these methods.

12A - 12D are microscopic dark field images of the homogeneous patterns in the square centimeter range, which under the pressure conditions of 11 were generated. The dots are gold structures fabricated at 3 μm intervals with a hold time of 2 seconds, with a thickness of 15 nm on a SiO ₂ substrate.

12E shows the pattern design created with the NLP 2000 software.

13A shows segmented microscopic bright field images illustrating pattern homogeneity over the entire square centimeter, with the standard deviation for feature deviations <6%.

13B shows a zoomed-in area showing the "DPN DPN" result uniformity.

13C shows the pattern according to the software design.

14 shows two data sets for the stability of self-leveling mounts. The data show that the absolute Z-positions of the observation ports remain constant and that their mutual relationship remains fixed during self-leveling operations. This confirms that the strength of the magnets maintains the planar alignment of the device after self-leveling. (A) Device # 1 has a unique angular resolution as shown by the observation aperture spread. This is due to the unique material surface between the spherical magnetic ball and its kinematic attachment. (B) A slightly different angular resolution and material surface can be seen for device # 2, but both are readily within reasonable working limits.

15A - 15C Figures are perspective views of a device and an object during the self-leveling process.

16A - 16C Figures are perspective views of a device and an object during the self-leveling process.

17A - 17C show a process for determining the first contact point by checking the "butterfly wing" light refraction behavior of the protrusions (pyramids).

DETAILED DESCRIPTION

introduction

It is generally referred to the following article: Haaheim et al., "Self-Leveling Two-Dimensional Sample Arrays for Dip Pen Nanolithography", Scanning, 32, 49-59 (2010) ,

The term "attaching" may include, for example, connecting, joining, joining, associating, inserting, hanging, holding, attaching, attaching, fixing, binding, gluing, securing, bolting, screwing, riveting, welding, brazing, pressing and such other terms. In addition, "fasten" may include objects that are fastened directly to each other and may include objects that are indirectly fastened together, for example via a separate component.

A self-leveling mount for printing devices such as the 2D nano-print array will be described and illustrated. An array of 55,000 points, for example, attached to a NLP 2000 instrument from NanoInk for nanoscale, e.g. B. achieve a planarity of less than 0.1 ° with respect to a substrate within seconds, with little or no user intervention required. Additional fine leveling routines can improve this planarity to, for example, less than 0.002 degrees with respect to the substrate - that is a Z difference of, for example, less than 600 nm over 1 cm ² surface area. A highly homogeneous etch-resistant nanostructure can be produced by means of a self-leveling array with tips, for example DPN pins.

The self-leveling process can be thought to be generally faster, easier, and more accurate than previous methods. This leads the process to automated nano manufacturing. The planar misalignment can be in representative embodiments z. B. less than 0.002 °, which seems to surpass previous results. The excellent planarity correlates with consistent patterning results, resulting in homogeneous nanostructures over 1 cm ² . It also seems that this is better than previous results, which are quantified using a standard deviation for feature dimensions of 6%. It seems that this is the best reported so far.

In the exemplary embodiments disclosed herein, the self-leveling suspension device can achieve homogeneous results on the following effects: (1) Precise Z-positioning via accurate touchdown point detection; and (2) low variance in boom deflection by very precise leveling.

A leveling device may include: a support structure and at least one flexible connection assembly secured to the support structure.

storage structure

Storage structures may be configured to secure an object having a plurality of protrusions to form a pattern on a substrate. Storage structures may be further configured to be attached to an apparatus for applying an ink composition to the plurality of protrusions. Storage structures may include one or more openings for observing an object attached to the storage structure. The shape and dimensions of the storage structures may vary. Non-limiting examples of storage structures are described below and shown in the figures. In the same way, the formation of the Storage structures used materials vary. In fact, any rigid material can be used. Suitable materials include, but are not limited to, stainless steel, aluminum, plastics and ceramics.

The storage structures and the object can be fastened together so that they function as a single piece and move in space like a piece or integrated unit. The attachment may be a rigid attachment instead of a flexible attachment.

Flexible connection assemblies

Flexible connection assemblies may be configured to allow an object attached to the support structure to achieve parallel alignment with respect to a surface upon contact of the object with the surface. By "flexible connector assembly" is meant an assembly of components that form a joint that can flex in one or more directions. By way of example only, flexible connection assemblies include rotatable connection assemblies or pivotable connection assemblies. Such flexible connection assemblies are capable of bending in multiple directions by means of a rotating movement. The flexible connection assemblies may be further configured to allow an object attached to the support structure to maintain parallel alignment with respect to a surface after contact with the surface is broken.

The ability of the flexible interconnect assemblies to allow these fastened objects to assume and maintain parallel alignment with respect to a surface is at least partially affected by the coefficient of glitter friction and the coefficient of static friction of the flexible interconnect assembly. The disclosed flexible interconnect assemblies may be characterized by a coefficient of sliding friction that is sufficiently small to allow a mounted object to move freely and to be in parallel alignment upon contact of the object with a surface. The flexible interconnect assemblies may be further characterized by a coefficient of static friction that is sufficiently large to resist movement and allow the object to maintain the parallel alignment after contact with the surface is broken. Slip and static friction coefficients may depend on the choice of material used for the components of the flexible interconnect assemblies, as well as the surface characteristics (eg, surface roughness) of these materials. As for surface roughness, it should be noted that a "rough" material has surface features that can be viewed at the micro and nano scale as the teeth of a gearbox. During the leveling process, the object attached to the support structure may assume discrete planar positions that correspond to the flexible connection assembly slipping into different "gear" positions. Any rigid material can be used for the components of the flexible connection assemblies. Suitable materials include, but are not limited to, stainless steel, aluminum, plastics and ceramics.

The flexible connection assemblies may be formed of different components. By way of example only, it is to be understood that the flexible connection assembly may include a ball and a connector attached to the ball, the connector having a depression formed to receive the ball when the ball abuts the connector. Different fasteners can be used. For example, a connector may have a pair of rods that are spaced apart from one another to receive a ball that is seated on the pair of rods. In another example, a connector may include a socket having a cavity for receiving a ball that rests within the cavity. The cavity of the pedestal may take various forms, including but not limited to a concave shape, a linearly fluted shape, and a triangular fluted shape. In yet another example, a connecting element may include a triangular arrangement of three balls that are spaced sufficiently to receive a ball that is placed on the center of the triangle. In all of these examples, the flexible link assembly provides a range of motion for an object attached to the flexible link assembly as the ball rotates within the depression of the link.

The flexible interconnect assemblies may be magnetic interconnect assemblies with at least one of the components of the assembly being magnetic. For those embodiments in which the flexible connection assemblies include a ball and a connector, the ball or connector or both may be magnetic. Different materials can be used, provided the material is a magnet. Suitable materials include ultra-strong magnets with neodymium and plated with nickel. Such magnets are commercially available. When a Component of the flexible connection assembly is a magnet, the other component may be formed of a material that is able to be attracted by a magnet, which includes steel (but is not limited thereto).

The disclosed devices may include a flexible connection assembly or a plurality of flexible connection assemblies. Flexible connection assemblies may be affixed to the support structure by various known means including, but not limited to, adhesives, adhesives, or magnets.

Examples of flexible connection assemblies are described below and shown in the figures.

Objects to be attached to the storage structure

The objects to be attached to the support structure include a plurality of protrusions, the protrusions being configured to form a pattern on a surface of a substrate upon contact of the object with the surface. The pattern can be a micro or nano-scale pattern. By "micro range" is meant that the pattern z. B. includes a feature with a dimension on the order of microns, z. B. 1, 10, 100 microns, etc. "Nanoscale" is understood that the pattern z. B. includes a feature with a dimension on the order of nanometers, z. 1, 10, 100 nm, etc. The pattern may include points, lines and circles arranged in different irregular or regular orientations. Exemplary objects include stamps (including polymer stamps) used in micro-contact printing and molds used in nanoimprint lithography. Such punches and molds are known. The object may be an elastomeric tip array, such as the one shown in FIG Hong et al. "Micromachined elastomeric tip array for variable dot size and density printing", J. Micromech. Microeng. 18 (2008) ,

Another non-limiting exemplary example is an array of nanoscopic and / or scanning probe tips. The array may be a one-dimensional or a two-dimensional tip array, including high density tip arrays. Comparisons z. B. the US Pat. Nos. 6,635,311 and 6,827,979 (Mirkin et al.); U.S. Patent Application No. 2008/0105042 (Mirkin et al.); and U.S. Patent Application No. 2008/0309688 (Haaheim et al.). See also DPN 5000, NLP 2000, NSCRIPTOR ^™ and other nanolithographic equipment sold by NanoInk (Skokie, IL, USA). The peaks may be solid or hollow, and may have a peak radius of, for example, less than 100 nm. The tips may (but need not) be formed at the end of a cantilever structure. The boom can be attached to a holder. The holder may include one or more viewing apertures formed for viewing the tips. The observation openings may have different shapes, sizes and configurations, such. B. in the U.S. Patent No. 2008/0309688 (Haaheim et al.). This reference also describes methods of making the observation ports. The holders may also include one or more spacers which serve to prevent tips from being pressed against the underside of the holders. Reference may be made again to US Patent Application No. 2008/0309688 (Haaheim et al.).

Polymeric pin tip arrays are used in the WO 2009 / 132,321 ( PCT / US 2009/041738 ) (Mirkin et al.).

Objects, support structures, and other devices attached to the object, as well as substrates, may be configured to move with nanopositioners, such as piezoresistive nanopositioners. Movements can take place in x-, y- and z-direction; they can also be rotating movements. See US Patent Application No. 2009/0023607, and US Pat "The Nanopositioning Book. Moving and Measuring to Savior than a Nanometer ", TR Hicks et al., 2000 ,

The objects may be attached to the support structure by means of various known attachment means. By way of example only, adhesives, adhesives or magnets may be used to secure the object to the support structure.

mounting bracket

Also, a separate connection bracket may be used which is configured to assist in securing the object to the support structure. The mounting bracket may be helpful when using adhesives, adhesives, or similar fasteners to secure the object to the support structure. The mounting bracket may include a cavity configured to hold the object in a fixed position leaving a mounting surface of the object free during the mounting process. The mounting bracket may further include a channel configured to receive a support structure mounted on the Mounting surface of the object is placed. The mounting bracket may further include a clamping member configured to hold the mounting structure in a fixed position on the mounting surface of the object during the mounting process. The general shape and dimensions of the mounting bracket are not limited; they may vary depending on the shapes and dimensions of the object and the storage structure which are to be fastened together using the mounting bracket. Similarly, the materials used to form the mounting bracket may also differ. All of the metals and plastics described herein may be used, although the use of other, similar materials is possible. Non-limiting examples of mounting brackets are described below and shown in the figures.

Other components

The devices may include various other components. By way of example only, the devices may include a mounting structure secured to the at least one flexible connector assembly. The attachment structure may be configured to be attached to a patterning instrument. The shapes and dimensions of the attachment structure may vary. Non-limiting examples of mounting structures will be described below and shown in the figures. Similarly, the materials used to form the support structures may vary. Suitable materials include, but are not limited to, copper and the like. The attachment structure may be attached to the flexible connector assembly and the patterning instrument in a variety of ways, including the use of adhesives, adhesives, and screws (this list is not meant to be limiting).

The devices may further include a signaling system for signaling the orientation of the attached object with respect to a surface. For example, the signaling system may be configured to signal when a parallel alignment of the attached object to a surface has been achieved. Non-limiting examples of signaling systems are described below and shown in the figures.

Additional embodiments

An embodiment of a device for leveling is in 1 shown. As in 1 shown, includes the device 100 a storage structure 102 that is trained to be an object 104 and a flexible connection assembly attached to the support structure 106 to fix. In the 1 shown storage structure 102 is a block, but other shapes can be used as well. All objects described above can be attached to the storage structure, including a tip array with e.g. As scanning probe tips, tips that are provided on a boom, tips that are not provided on a boom, and / or elastomeric tips. While the disclosed devices are configured to secure such objects, the devices need not include the objects themselves. As in 1 shown, the flexible connection assembly 106 a ball 108 and a connecting element 110 include, which is attached to the ball. Other flexible connection assemblies are also possible. The connecting element 110 includes depression at one end, wherein the depression is shaped to receive the ball abutting against the connector. In 1 For example, the flexible connection assembly is a magnetic connection assembly. In general, either the ball or the connector can be magnetic; in 1 is however the connecting element 110 a magnet and the ball 108 is a steel ball. Thus, the connecting element and the ball are attached to each other by means of magnetic forces and the flexible connecting assembly can bend in different directions when the ball 108 within the depression of the fastener 110 rotates. The ball 108 is at the storage structure 102 attached by means of an adhesive (other fasteners are also possible). Thus, any bending of the flexible connection assembly results in movement of the support structure attached to the ball and the object attached to the support structure.

The 2A and 2 B show another embodiment of a leveling device. As in 2A shown, includes the device 200 a storage structure 202 that is trained to be an object 204 and a flexible connection assembly attached to the support structure 206 to fix. The device further includes a mounting structure 212 attached to the connecting element of the flexible connection assembly 206 is attached. The attachment structure is adapted to attach to a platform 214 a sampling instrument (not shown) by means of a hinge element 216 to be attached to one end of the attachment structure. 2 B shows a plan view of the device including the storage structure 202 , the object 204 , the flexible connection assembly 206 and the attachment structure 212 , 2 B shows more clearly that in this Embodiment, the attachment structure has the shape of a beam; other forms are also possible. Similarly, the mounting structure may be attached to the patterning instrument adjacent to a hinge element 216 also be fastened by other means.

The 2A and 2 B also show that the leveling device is integrated with a signaling system, the signaling system serving to signal when a parallel alignment of an object attached to the device has been achieved. The signaling system includes an electrical circuit. The electrical circuit is formed by the following elements: a power source that is connected by a positive terminal 217 and a negative connection 218 is represented; a light source (not shown) electrically coupled to the power source; the attachment structure 212 electrically coupled to the power source; and a storage element 220 electrically coupled to the power source and configured to support the other end of the mounting structure. Various known power sources and light sources can be used. For example only, it is mentioned that an LED can be used as a light source. The shape and dimensions of the bearing element may vary provided that the bearing element can support the end of the mounting structure. The composition of the bearing member and the mounting structure may also vary, although conductive materials are desirable to form the electrical circuit of the signaling system.

Other signaling systems are also conceivable to signal when a parallel alignment has been achieved and to provide quantitative information accordingly. Such signaling systems may be incorporated into any of the devices disclosed herein. For example, a signaling system may include means for a displacement measurement. An integrated device implemented with such a signaling system may include a rigid arm coupled to the device. The arm may be configured to extend outwardly from the device. The arm may be further configured to measure movement of the device when the device is under load. For example, the arm may be coupled to a displacement measuring device, such as a digital encoder or a capacitive motion sensor. When the device comes into contact with the surface of the substrate and the protrusions on an object attached to the device begin to deflect and exert an upward force on the arm, very small deflections of the arm can be measured.

As another example, mention may be made of a signaling system that may include means for bending strain measurement. A device integrated with such a signaling system may include a strain gauge coupled to the device, wherein the strain gauge is configured to measure the applied force and to quantify the touchdown point when the device and the substrate come into contact. Alternatively, the device may include pressure sensors coupled to a substrate to be contacted by the device. The pressure sensors may be configured to provide information about when and where projections on an object attached to the device begin to apply force to the substrate.

The leveling process will now be described with reference to FIGS 2A and 2 B described. The fortified object 204 can be brought into contact with a substrate (not shown) which is below the object. Contact between the object and the surface of the substrate can be brought about in different ways, for example by lowering the device (and thus the attached object) in the direction of the substrate, or by raising the substrate in the direction of the device. By way of example only, it will be understood that a substrate may be mounted on a moveable stage or platform of a patterning instrument. When the substrate and the attached object come in contact, the ball of the flexible connection assembly may 206 rotate within the depression of the fastener, allowing the fastened object to assume a parallel orientation with respect to the substrate. Thus, the device is capable of "self-leveling", meaning that leveling is achieved by the freedom of movement afforded by the flexible connection assembly and by the force exerted by the attached object and the substrate on each other during contact.

Also with reference to the 2A and 2 B the signaling process will now be described. Before the attached object reaches a parallel orientation, the attachment structure rests 212 on, and is in contact with, the storage element 220 , In this configuration, a closed electrical circuit is formed between the power sources 217 . 218 , the fastening structure 212 , the storage element 220 , and the light source causing the light source to "come on". After the fastened object assumes a parallel orientation with respect to the substrate, any further vertical movement of the substrate and the object relative to one another will cause the attachment structure to be displaced from the substrate Storage element lifts. This "lift off" opens the electrical circuit, causing the light source to "go out". Thus, a signal emanates from the light source that the parallel alignment of the object with respect to the substrate has been achieved.

Another embodiment of a leveling device is in 3 shown. The device 300 includes a storage structure 302 used for fixing an object 304 is formed, and a plurality of flexible connection assemblies 306 . 308 . 310 and 312 which are attached to the storage structure. A central axis can be defined around which the flexible connection assemblies are provided. Two axes can be defined which are perpendicular to the central axis. These two axes are perpendicular to each other and can be used to define the position of the flexible connection assemblies. Additionally, two vertical planes may intersect the central axis, with the flexible interconnect assemblies being located on those planes. The first flexible connection assembly 306 is along a first axis parallel to the storage structure 302 positioned. The second flexible connection assembly 308 is along the first axis and opposite to the first flexible connection assembly 306 positioned. The third flexible connection assembly 310 is along a second axis parallel to the storage structure 302 and positioned perpendicular to the first axis. The fourth flexible connection assembly 312 is along this second axis and opposite to the third flexible connection assembly 310 positioned. As in 2 includes each of the flexible connection assemblies of 3 a ball and a connector, the connector having a depression shaped to receive the ball within the depression. However, other flexible connection assemblies are also conceivable. 3 shows that in this embodiment, the connecting elements are pedestals. The pedestals of the second 308 and fourth 312 Flexible connecting assemblies have two opposite long sides and two opposite short sides. However, other types of fasteners are conceivable. The shape of the connecting element of the second flexible connecting assembly 308 as they are in 3 can be shown, the rotation of a fastened object 304 to facilitate the second axis, but limit the rotation of the attached object about the first axis. Similarly, the shape of the connecting element of the fourth flexible connecting assembly 312 as they are in 3 is shown to facilitate rotation of the mounted object about the first axis, but limit rotation of the object about the second axis.

The flexible connection assemblies in 3 can be magnetic connection assemblies. Although both the ball and the connecting element can be magnetic; however, are in 3 the balls magnetic and the connecting elements are formed of a material, for. As steel, which is able to be attracted by a magnet. Thus, as described above, the connecting member and the ball are fixed by means of magnetic forces and the movable connecting assemblies are capable of bending in different directions as the balls rotate within the depressions of their respective connecting members. The balls of the first 306 and the second 308 Flexible connection assemblies may be attached to the storage structure 302 be attached by means of an adhesive, but other fastening means are also possible.

As in 3 As shown, the device may still have a center structure 314 which are above the storage structure 302 positioned and at the first 306 and second 308 flexible assembly is attached. The device may further have an upper structure 316 include that above the center structure 314 positioned and at the third 310 and fourth 312 flexible connecting assembly is attached. The shapes and dimensions of the storage structure 302 , the middle structure 314 and the upper structure 316 can vary. As in the 3 and 4A As shown, these structures can have complementary shapes. In particular, the middle structure 314 be shaped to fit around at least part of the storage structure 302 and the upper structure 316 to grab around and pick up this part so that the structures are "nested" when fully assembled. The exact shape of the storage structure 302 and the middle structure 314 as they are in 3 can also facilitate the rotation of the object about the second axis (as described above) while limiting the rotation of the object about the first axis. Similarly, as in the 3 and 4A shown the upper structure 316 be shaped to fit into at least part of the center structure 314 so that the top structure and middle structure are "nested" when fully assembled. The exact shape of the middle structure 314 and the upper structure 316 as they are in 3 can also facilitate rotation of the mounted object about the first axis while limiting rotation of the object about the second axis. The balls of the third 310 and fourth 312 Flexible connecting assemblies may be attached to the center structure 314 be attached by means of an adhesive, but other fastening means are also possible.

3 further shows that the device has additional mechanisms, Embodiments or means for fixing the center structure 314 at the first 306 and second 308 flexible connecting assembly and for securing the upper structure 316 at the third 310 and fourth 312 can include flexible connection assembly. These attachment embodiments may be magnets 318 - 324 be ( 318 . 320 . 322 . 324 ), other attachment embodiments are also possible. As in 3 shown, the first 318 and the second 320 Magnet between the storage structure 302 and the middle structure 314 be positioned. The first 318 and the second 320 Magnet can be attached to the center structure 314 using different means, including adhesives. The first 318 and the second 320 Magnet can then use magnetic forces on the connecting elements of the first 306 or second 308 be attached flexible connecting assembly. Similarly, the third 310 and fourth 324 Magnet between the center structure 314 and the upper structure 316 be positioned. The third 322 and the fourth 324 Magnets can be attached to the top structure via different means, including adhesives 316 be attached. The third 322 and the fourth 324 Magnet can then by magnetic forces on the connecting elements of the third 310 or fourth 312 be attached flexible connecting assembly.

3 shows that the magnets 318 - 324 ( 318 . 320 . 322 . 324 ) and the flexible connection assemblies 306 - 312 ( 306 . 308 . 310 . 312 ) form a "sandwich" -like structure that includes a magnet, a connector, and a ball. In the figure, the ball is also magnetic. An alternative sandwich structure is a magnet, a ball and a connector. In such a structure, the connecting element may be magnetic. Thus, the ball can come from a conventional steel ball bearing, wherein the ball has been machined so that it is smoother than a magnetic ball. As described above, the smoothness of structures of the flexible interconnect assembly can affect at least the static coefficient of friction of the assembly, with a smoother sphere meaning a "gear" with smaller "teeth" and a smaller coefficient of static friction.

As in 3 shown, the storage structure 302 , the middle structure 314 and the upper structure 316 one central opening each 326 include, which is designed to be the view of an object 304 to allow, which is attached to the storage structure. As will be further described below, this feature may be useful as part of a signaling system to signal when a parallel alignment of the object with respect to a substrate has been achieved.

As described above, the storage structure 302 further configured to be attached to a device for applying an ink composition to the plurality of protrusions. As in 3 shown, the storage structure 302 a pair of magnets 328 . 330 include. These magnets can be used to support the storage structure (eg, when used by the facility 300 ) is attached to different structures, including an apparatus provided for applying an ink composition to the plurality of protrusions of the object to be leveled against a substrate. If the object is an array of peaks (such as scanning probe tips), the storage structure may be over the magnets 328 . 330 attached to a device for sputtering the tips. The tips may also be coated with a liquid coating using e.g. B. phospholipids are coated.

The 4A - 4C show different perspective views in the 3 shown device in the assembled state. 4A shows a perspective top view of the device 400 including the storage structure 402 that is trained to be an object 404 to fasten, a middle structure 414 , and an upper structure 416 , The middle structure 414 is shown partially transparent to the second flexible connector assembly 408 to show. Only parts of the first, third and fourth flexible connection assemblies are shown (not labeled). 4B shows a perspective bottom view of the device 400 including the storage structure 402 that is trained to be an object 404 , a middle structure 414 and an upper structure 416 to fix. 4B also shows that the object 404 a plurality of observation openings 434 which are adapted to allow the view of a projection or a plurality of projections (not shown) on the object. As will be described below, this feature may be helpful as part of a signaling system to signal when a parallel alignment of the object with respect to a substrate has been achieved.

As described above, the leveling devices may include a mounting structure configured to secure a patterning instrument. Such a device 500 is in 5 shown. The attachment structure 536 has a cantilever or beam structure 538 with an opening 540 but other forms are possible. 5 also shows the storage structure 502 , the middle structure 514 and the upper structure 516 the device 500 ,

In some example embodiments, the suspension design may only be the outer one Cover the perimeter of the object, the object is about a top array, z. For example, a 2D Nano-PrintArray, leaving the internal viewing area free for observation. Advantageously, this allows deflection measurements by means of an observation aperture in order to provide helpful confirmation of the planarity. This design is different from the 2-axis design or single-sphere designs.

leveling process

Now, the leveling process will be described with reference to FIG 3 , The fortified object 304 can be brought into contact with a substrate (not shown) which is below the object. The contact between the object and the surface of the substrate can be achieved in different ways, as described above with reference to FIG 2 described. By way of example only, it will be appreciated that a substrate may be mounted on a movable platform or stage of a patterning instrument and on the attached object 304 the device 300 can be lifted up. When the substrate and the fixed object come into contact, the balls of the flexible connection assemblies rotate within the depressions of the respective connectors. As described above, the specific shapes allow the storage structure 302 , the middle structure 314 , the upper structure 316 and the connecting elements of the second 308 and the fourth 312 flexible connecting assembly the rotation of the attached object 304 about a first axis parallel to the support structure and about a second axis parallel to the support structure and perpendicular to the first axis. This freedom of movement allows the attached object 304 to assume a parallel orientation with respect to the substrate upon contact.

The leveling devices may also be integrated with a signaling system, the signaling system serving to signal when a parallel alignment of an object attached to the device has been achieved. As described above, the device may include one or more apertures, and an object attached to the device may include one or more viewing ports, wherein the apertures and viewing ports are configured to facilitate the observation of a projection or projections on the object. 3 shows a device 300 with an opening 326 in both the storage structure 302 , the middle structure 314 , as well as the upper structure 316 , 4B shows a device 400 with a fortified object 404 which has a plurality of observation openings 434 Has. A signaling system for such a device may further include an optical device, such as a microscope, to facilitate viewing through the apertures and viewing ports. The system may also include cameras for further zooming capabilities and computers and imaging software for rendering capabilities. See, for example, U.S. Patent Application No. 2008/0309688 to Haaheim et al.

An exemplary signaling process will now be described for a fixed array of scanning probe tips that are on cantilevers using the signaling system described above. However, it is noted that the following description is not limited to an array of scanning probe tips that are on cantilevers. The description applies equally to each of the objects described here, to be attached to a storage structure, and to similar objects. Before the attached array occupies a parallel orientation, the array of cantilevers and scanning probe tips - viewed through the observation aperture - appears defocused. In addition, light reaching the cantilevers through the observation port (s) may be reflected by the cantilevers. The reflected light may have a certain color and intensity, giving an indication of the deflection state of the cantilevers. When the attached array comes in contact with the substrate and the array moves in a parallel orientation with respect to the substrate, the tips come into contact with the substrate and the cantilevers are deflected upwardly. When the tips come in contact with the substrate and deflect the cantilevers, the tips are brought into focus and the reflection of the light from the cantilever beams changes, resulting in a corresponding change in color and / or intensity. Any further vertical movement of the substrate and the object against each other may cause further changes in the light reflection and may cause the tips to move out of focus. Thus, the image of the peaks and / or cantilevers (at three different XY locations) may give a signal that the parallel alignment of the object with respect to the substrate has been achieved.

The objects, devices, and assemblies described herein may be considered a gimbal.

Any of the above-described devices can be added to devices and kits. The use of the facilities can be controlled via instruments, software, computers and external hardware.

mounting brackets

As described above, separate mounting brackets are also proposed are configured to assist the attachment of any of the disclosed objects to any of the disclosed storage structures. An exemplary embodiment of a mounting bracket 600 is in 6 shown. The mounting bracket 600 is designed to attach an object 604 at a storage structure 606 to support. The mounting bracket 600 includes a cavity 608 that is trained to the object 604 to hold in a fixed position while a mounting surface 610 remains free on the object during the attachment process. The cavity 608 includes an approach 612 which is designed to be around the object 604 to store along at least a portion of the edge of the object. The plurality of protrusions (not shown) on the surface of the object opposite to the mounting surface 610 lie, extend during the attachment process in the cavity 608 , This may be helpful to avoid contact of the projections and damage to the projections during the attachment process. The mounting bracket 600 also includes a channel 614 which is shaped around a surface of a storage structure 606 pick up on the mounting surface 610 of the object 604 is placed. The mounting bracket 600 can continue a clamping element 616 include that is formed to the storage structure 606 during the fastening process in a fixed position on the mounting surface 610 of the object 604 to keep. The shape and dimensions of the clamping element 616 are not limited, provided the clamping element is capable of the storage structure 606 on the object 604 to contact and keep the storage structure in place. The clamping element may have a spring effect.

An exemplary attachment process will now be described, with reference to FIG 6 , An object 604 can on the approach 612 the cavity 608 to be placed. An adhesive, adhesive, or other fastener may be applied to the mounting surface 610 of the object 604 be applied. Next is a storage structure 606 on the mounting surface 610 placed. If adhesives or adhesives or a similar fastener has been used, the clamp may 616 on the storage structure 606 lowered to the storage structure against the mounting surface 610 of the object 604 while the adhesive or adhesive cures or dries.

As noted several times, the dimensions of the devices and components proposed herein may vary. In some cases, the dimensions of the devices (eg, leveling devices, mounting brackets, etc.) and components of such devices (eg, the object, the support structure, the center structure, the upper structure, the flexible interconnect assembly, Connecting element, the attachment structure, etc.) be very small, on the order of centimeters, millimeters or even smaller. Miniaturized manufacturing of equipment and components that can flex and move can be a big challenge. By way of example only, it will be understood that the largest dimensions of any of the devices described herein may be about 10 cm or less. This includes embodiments in which the largest dimension is about 5 cm, 2 cm, 1 cm, or 0.5 cm. However, larger and smaller dimensions are also possible. As a further non-limiting example, it is to be understood that the largest dimension of each of the components described herein may be about 5 cm or less. This includes embodiments in which the size dimensions are about 5 cm, 2 cm, 1 cm, 0.5 cm or 1 mm. However, larger or smaller dimensions are also possible.

equipment

According to another aspect, devices are proposed which comprise the disclosed devices. In some embodiments, the device may include a patterning instrument, as well as any of the devices described above, the device being attached to the patterning instrument. Various patterning instruments may be used, including but not limited to commercially available instruments for micro-contact printing and nanoimprint lithography. Sampling instruments may also include raster probe instruments designed for patterning. Such scanning probe instruments include, but are not limited to, scanning tunneling microscopes, atomic force microscopes, and near-field scanning optical microscopes, all of which are commercially available. Other scanning probe instruments include the DPN 5000, NLP 2000, and the NSCRIPTOR systems commercially available from NanoInk, Inc. (Skokie, IL, USA).

Another possible patterning instrument is described in U.S. Patent Application No. 2009/0023607 (Rozhok et al.). Such an instrument may include: at least one multi-axis assembly having at least 5 nanopositioning platforms; at least one raster probe tip assembly, wherein the raster probe tip assembly and the multi-axis assembly are configured to transfer a material from the raster probe tip assembly to the substrate, wherein the substrate through the Multiple axis assembly is positioned; at least one observation assembly; and at least one controller. The nanopositioning platforms, multi-axis assemblies, scanning probe tip assemblies, observation assemblies, and controllers are described in U.S. Patent Application No. 2009/0023607 (Rozhok et al.).

In each of the sampling instruments described above, climate chambers for controlling z. As temperature, humidity and gas content may be present.

kits

One or more of the components and devices described herein may be combined in convenient kits. The kits may further include one or more instructions for use of how to use the kit. For example, the kit may be configured to interact with a patterning instrument, such as an existing commercial patterning instrument.

method

Methods of using any of the disclosed devices and devices include leveling methods and patterning methods. A leveling method may include the following steps: providing any of the devices disclosed herein; Attaching any of the objects disclosed herein to the storage structure of the device; Contacting the attached object with a substrate; and allowing the object to assume a parallel orientation with respect to the substrate surface. The step of contacting the fastened object may be implemented as described above, e.g. By moving the device and the attached object toward the substrate or by moving the substrate toward the device and the attached object. The step of allowing the object to assume parallel alignment is accomplished by bending the flexible link assemblies and thus moving the attached object in response to the force exerted by the attached object and the substrate against each other.

The leveling process may involve additional steps. By way of example only, the method may include the step of: affirming that the parallel alignment has been achieved using any of the signaling systems described above. As another example, it should be noted that the method may include breaking the contact of the attached object with the substrate surface, maintaining the parallel orientation of the attached object after the contact is broken.

A sampling method may include the steps of: providing any of the devices disclosed herein; Attaching any of the disclosed objects to the storage structure of the device; Providing at least some of the protrusions of the object with an ink composition; and transferring the ink composition from the protrusions to the surface of a substrate. Ink compositions are known and include organic compounds and inorganic materials, chemicals, biological materials, non-reactive materials and reactive materials, molecular compounds and particles, nanoparticles, self-assembling monolayer-forming materials, soluble compounds, polymers, ceramics, metals, magnetic Materials, metal oxides, major group elements, mixtures of compounds and materials, conducting polymers, biomolecules including nucleic acid materials, RNA, DNA, PNA, proteins and peptides, antibodies, enzymes, lipids, carbohydrates, and even organisms such as viruses. Sulfur-containing compounds including thiols and sulfides can be used. Each of the references cited herein describes other ink compositions that can be used. Methods of providing protrusions with ink compositions are known, e.g. B. includes dipping in solutions or vacuum evaporation. Comparisons z. See, for example, U.S. Patent Application No. 2005/0035983 (Cruchon-Dupeyrat et al.). Parameter for transferring the ink composition from the protrusions to the substrate, e.g. Holding time, patterning rate, and environmental conditions are also known. The patterns can include points, lines, circles, or other features. Comparisons z. See, for example, any of the references herein and U.S. Patent Application Nos. 2002/0063212 and 2002/0122873 (Mirkin et al.).

The leveling procedures and sampling procedures can be combined. Any of the leveling methods described above may further include the step of providing at least some of the protrusions of the object with an ink composition. The step of providing at least some of the protrusions with an ink composition may be before or after the following steps: contacting the attached object with the substrate and allowing the object to assume a parallel orientation. In other words, the protrusions may be coated with an ink composition before or after leveling the attached object. The projections can be coated before the fastened object is leveled. After the protrusions are coated and the fastened object is leveled, the method may include the step of transferring the ink composition from the protrusions to the substrate surface.

applications

The devices and devices described herein can be used for a variety of applications, including biological applications, pharmaceutical applications, and the fabrication of micro and nano-scale structures. Manufacturing applications include the formation of MEMS and NEMS. The acronym "MEMS" may include all microsystems, such as microelectromechanical, microelectrooptical, microelectromagnetic, and microfluidic systems. MEMS may also include nanoelectromechanical systems (NEMS). These and other applications are described in the references cited herein, such as in U.S. Patent Application No. 2008/0309688 (Haaheim et al.).

In biological applications, cell growth (including stem cell growth) can be controlled using arrays made with devices and instruments described herein. Protein arrays, nucleic acid arrays, and lipid and phospholipid arrays can also be made.

Manufacturing and assembly process

Known methods can be used to fabricate and assemble the components and devices described herein. This involves the training or customization of commercial instrumentation components and equipment. Additional, non-limiting embodiments are included in the 7 - 17 described.

7 (A) shows the basic concept of a multiplexed 2D DPN - all the tips draw the same shapes at the same time, but each tip can be loaded with different ink. A small water meniscus is shown representing a meniscus that can form under ambient conditions between the tip and the substrate and that is a vehicle for diffusion between classes of diffusion inks (eg, alkane thiols). 7 (B) narrows this idea to the multiplex-printing of proteins. This represents a vision for a rapid prototyping platform for creating customized assay kits.

This concept - controlled and consistent contact - is important in optimizing 2D-DPN. Conventional DPN with single tips or 1D arrays can be performed in the following ways to facilitate the application of a constant force (ie cantilever deflection) with respect to the substrate: force feedback or a laser beam that bounces off the cantilever and falls onto a photodetector. Due to the nature of mechanical amplification in an atomic force microscope, the range of cantilever deflection achievable in force feedback is necessarily limited by the dimensions of the photodetector. This cantilever deflection range is typically less than 2 μm. In contrast, 2D-DPN can be performed without force feedback, with the Z-actuator being set at a constant height with respect to the substrate. Within the range of force feedback conditions, DPN is substantially force independent, and patterns are generated nearly identically between minimum and maximum excursions. However, in extreme peak excursion situations (eg, greater than 10 μm), abnormal patterning behavior has been observed, such as twisted features and non-standard self-assembly monolayers (SAMs) formation. This results in two very important operating conditions for generating uniform and homogeneous patterns with 2D-DPN: (1) The general Z-position of the 2D array with respect to the substrate (ie, the average cantilever deflection) must be carefully controlled, and ( 2) the variation of cantilever deflection (ie cantilever deflection variance directly associated with array substrate planarity) must be minimized. In one embodiment, the improved optics of the NLP 2000 make point (1) easier to reach; The self-leveling bracket improves the accessibility of point (2) and at the same time allows unprecedented planarity.

Starting with the 2D Nano-PrintArray itself, shows 8 (A) a plan view of the silicon chip, which is attached to a plastic holder. The fixture is symmetrical along the x-axis, with a large central recess to allow for maximum light accessibility and maximum viewing area for the chip's observation openings. The observation openings are arranged in the form of a "Y" so that one can make measurements on each of the legs of the "Y" to define the three points of contact with the substrate. 8 (A) also shows the spherical sphere magnets used to attach the 2D nano-print array to the rest of the fixture. For ease of handling, storage and transportation, flat disc magnets are provided in the exterior of the fixture to allow the fixture to be securely attached to a magnetically permeable material can. The device is shown detached on its left side from the underside of a magnetically permeable metal can. 8 (B) shows the same composition in perspective from below; the "Y" configuration of the observation apertures is visible in the form of very small slits of light passing from the top of the chip. 8 (C) shows the inner three observation openings (1a, 2a, 3a) explicitly. In this orientation, the coated tips (eg, coated with alkanethiol, such as ODT) will point to the observer, and the density of the cantilever package will be spaced at 20x90 microns according to their arrangement.

The width of the observation openings allows the simultaneous view of a series of 13 adjacent cantilevers; This is very helpful when navigating in the Z direction to the substrate, as well as when navigating in the X and Y direction over the substrate. In front of the green-yellow background of the silicon support wafers, the silicon nitride (SiN) arms appear green and the pink SiN areas represent the armature of the support. This arrangement is explicitly illustrated in FIG 8 (D) The rows of SiN cantilevers are attached to the ridges of the silicon support wafers via a gold thermocompression bond. The areas below the cantilevers are etched away for maximum cantilever deflection. The 8 (E) zooms on a group of cantilevers in front of an observation port opening with a width of 260 microns, wherein 8 (F) the large FOT shows (typically 15-20 μm) available to each cantilever because of its high pitch and because of the areas etched away underneath. Solid SiN spacers (height 4 μm) are located at the outer corners of the device; these prevent the booms from ever being fully deflected. All tips can be made according to a standard oxide sharpening process resulting in a peak sharpness of ~ 15 nm (final radius).

The Freedom of Travel (FOT) available to the arms immediately defines the minimum allowable planarity at which all peaks come in contact with the substrate. 9 (A) shows a schematic representation of the array just before it comes into contact with the surface, wherein the array is at a minimum angle (φ). The difference between the highest and the lowest part of the array (DZ) is the same as the difference between the highest and the lowest peak -19.5 μm. As the array moves toward the substrate, the tips on the right begin to deflect in the order shown, which continues to the left until the leftmost tip just touches the surface. This happens at the same time that the rightmost spacer touches.

9 (B) shows why boomers with large FOT cause the leveling process to be more tolerant. 9 (B) Figure 12 also shows that it may be necessary to minimize φ in order to minimize the variance in the cantilever displacement across the array and to make the device as planar as possible. Planarity is accomplished using the self-leveling fixture. The operating concept is that a holder with two orthogonal axes of rotation (φ _x , φ _y ) takes up the planarity of everything that physically meets it. With the 2D Nano-PrintArray, this happens when all four SiN spacers contact the substrate at the corners. 3 shows how all the components fit together. The mount has three main components: the top mount attached to the rigid mount for probe holding, the middle mount, and the bottom mount glued to the 2D nano print array. There are two contact points between the center and the top: the fixed spherical magnetic balls attached to an inverted cone and groove by means of a two-point kinematic attachment, both magnetically permeable and magnets mounted behind. Similarly, there are two equivalent kinematic attachment contact points between the bracket and the middle part. The spherical balls mounted in the holder rotate freely in their mounts by φ _x , and the balls mounted in the center rotate freely around φ _y (it should be noted that this self-leveling support is not functional with only square centimeter-sized arrays Jibs and tips is limited, the generality of the design allows for a variety of miniaturized device leveling modes). The strength of the magnetic field is calibrated to be weak enough to allow for rotational compensation, to allow adjustment to the planarity of the substrate as the spacers contact each other; but strong enough to keep the exact planar alignment for all subsequent surgeries. 4 (A) is a transparent schematic representation of the device as it would actually be assembled, and 4 (B) shows the same assembly from the bottom, the observation ports are shown exaggerated. 4 (C) shows the real device as it is actually attached; the 2D Nano-PrintArray and its mount are deliberately tilted forward by φ _x to demonstrate the ranges of motion.

From this point on, the leveling process is straightforward: observe the cantilevers through the observation ports and move the substrate upwards in the Z direction until it meets the first corner of the device. Then it levels itself when the boom completely deflect. The deflection behavior of the boom is in the 10 To recognize (A and B); the cantilevers undergo a dramatic visual change indicating surface contact. Maximizing this displacement correlates with all spacers coming in contact, and the device is then self-leveling. This is considered as the step of "leveling". However, "rough leveling" can be understood as a relative term. 11 (A) shows a representative schematic representation of the "rough leveling" situation. In this case, it should be noted that the contact points at the observation openings (1b, 2b, 3b) according to the deflection behavior, as shown in the 10 (A and B) is shown. It is noteworthy that the clarity of the system optics allows the user to determine this contact point within ± 100 nm, so that the user can see how well the "rough leveling" was actually.

There are several optical indicators that allow for this degree of precision: most striking is that the "butterfly wing" formation in red-orange refracted light within the pyramidal peak ( 10 (A) ) Shape and color changes dramatically as the position of the tip changes (in Z, bearing, or tilt). The apparent color and intensity of the boom body also changes. The simplicity and clarity of these measurements allows the user to minimize surface contact times with these inked tips; Alternatively, one can level the device in a sacrificial substrate area and then place 1 cm to the predetermined clean patterning area. At each point in time, the measurements are made by rapidly actuating and retracting the Z stage, determining whether the expected visual indicators are manifested at the particular viewing port. In 1 (A) these contact point measurements yield a set of three Z coordinates (-539.0, -539.1 and -537.4) indicating the planarity of the device; the software calculates the corresponding "slope" (φ) and ΔZ using the device dimensions. 11 (A) shows these measurements, as they are made immediately after the coarse self-leveling: With a slope of 0.0381 and ΔZ = 9.8 microns, the result obtained at "coarse level" is indeed very good. Not only is it as good as the best that can be achieved with conventional methods - where ΔZ falls within the range of the boom FOT (ΔZ = 9.8 μm <FOT = 19.5 μm), indicating that all the tips can touch it is also below the extremal peak deflection limit (10 μm). If desired, one could have started directly with the sampling and could have achieved relatively homogeneous results.

However, this situation naturally results in a "fine leveling" step by itself. Using the measured Z coordinates from the 11 (A) the system can automatically adjust the φ _x -φ _y steps to correct for the low measured misalignments ("perform leveling"). 11 (B) shows the results measured immediately after the fine leveling step: The slope of 0.002 ° and ΔZ = 600 nm corresponds to the detection limit for the cantilever deflection of ± 100 nm. The device was as planar as could be measured by these methods. For size comparison, ΔZ = 0.6 μm over the device width of 10,000 μm corresponds to a ΔZ of 5 nm over the length of a football field.

If the variation in cantilever deflection is minimized (ie, the device is extremely leveled), then it is straightforward to observe the cantilever deflection at an observation port to calibrate the general Z position of the array with respect to the substrate (a cantilever deflection of 2 μm after the first contact point can be optimal). After the two important operating conditions for homogeneous sampling are met, subsequent results confirmed the expected homogeneity ( 12 and 13 ). 12 (A-D) shows images obtained with dark field microscopy taken from the four corners of the general square centimeter pattern as dictated by the software design input ( 12 (E) ). The dot holding times were 2 seconds and the dot pitch was 3 μm. The dark field photographs show gold structures with a thickness of 15 nm on a SiO ₂ substrate, with high uniformity between the four corners.

The large spot in the lower left corner of the 5x5 array was formed by holding on the substrate for several seconds prior to the start of the patterning. 13 (A) argues for overall uniformity over the entire square centimeter, with 56 brightfield microscope images compiled to illustrate the consistency across the sample. In earlier work (eg Salaita et al. 2006 ), a standard deviation of 16% in feature sizes was measured over a square centimeter-sized sample. The present work ( 13 (A) ) shows a standard deviation of 5.4% in feature size over the square centimeter-sized sample, taking measurements from all 56 frames. The central area of the general pattern is in 13 (B) enlarged, showing a new pattern based on the "DPN DPN" design 13 (C) based (the holding time for each point was 20 s). This level of homogeneity in 55,000 point printing is extremely difficult to achieve without proper leveling techniques. The self-leveling bracket makes this quick and easy.

The 14 (A and B) show the ability of the self-leveling fixture to maintain its so-achieved planarity over several lithographic runs. The stability tests for self-leveling bracket # 1 are in 14 (A) and are a direct result of the precisely calibrated magnetic field strength: If the magnets were too weak, the device would not be able to maintain the planar consistency in runs 1-8. In this experiment, the first four runs included the following: The array was brought into contact with the substrate, the contact points for the observation openings (1b, 2b, 3b) were measured, it was retracted by 100 μm, and this procedure was repeated. Runs 5-8 included the following: The array was brought into contact with the substrate, a movement of 20 μm until after complete boom deflection was performed, and then retraction by 100 μm. The consistency of the measured viewing aperture positions means that the self-leveling fixture assumes a very stable orientation, regardless of the size of the subsequent cantilever deflection. However, the discrepancy between observation aperture contact points is itself an indirect measure of the angular resolution of the self-leveling fixture, which in turn is representative of the material surface between the spherical magnetic spheres and their kinematic fixtures.

Runs 9-11 show the beginning of the fine leveling steps leading to the expected minimized ΔZ (0.5 μm). 14 (B) shows the same behavior with a second device holder # 2. This device exhibits the above rough leveling results (ΔZ ~ 8-12 μm) and comparable stability of planar alignment. A fine leveling iteration reached ΔZ = 0.6 μm. The slightly different widths of the observation openings, which in 14 (B) can be seen resulting from a slightly different ball-mounting material interface due to manufacturing and polishing variations that are within conventional tolerances.

The 15A C are photographs showing perspective views of the device and object during the self-leveling process. The strength of the magnets and the surface material impart rigidity to the structure within a desirable range, which is what is known in the art 14A and 14B shown, repeatable behavior allows.

The 16A C are photographs showing perspective views of the device and object during the self-leveling process.

The 17A -C show the process of determining the first contact point by the evaluation of the "butterfly wing" light diffraction behavior of the protrusions (pyramids).

Different embodiments of a self-leveling fixture for 2D DPN patterning have been demonstrated which greatly minimize the time required to level the device, simplify the leveling procedure, and enable much better coplanarity than heretofore achievable. Fine leveling routines can result in a misalignment of less than 0.002 ° with respect to the substrate - that is a Z difference of less than 600 nm over 1 cm ² surface area. The degree of planarity directly correlates with the homogeneity which determines the quality of sampling over large areas. The simplicity and accuracy of this method improves access to the three categories of 2D nanoscale patterning applications mentioned above: (1) rapidly and flexibly creating nanostructures (eg, Au, Si) via etching -resistant techniques; (2) chemically directed assembly and patterning templates for either biological molecules (eg, proteins, viruses, and cell adhesion complexes) or inorganic materials (eg, CNTs, quantum dots); and (3) direct writing of biological materials. It has been patterned with both phospholipids and alkanethiols, as well as with functional thiol groups including methyl, hydroxyl, amine and carboxyl functional groups. It can be used to generate hundreds of millions of chemically tailored nanostructures in minutes, tailoring functional groups to meet specific requirements.

Heretofore, it has been either very difficult or impossible to flexibly fabricate patterns of different materials with resolution of DPN (14 nm) over square centimeter areas. In essence, this allows for direct writing in a flexible manner with different molecules, simultaneously producing large numbers (e.g., 55,000) of duplicates with the resolution of single-pin DPN. By improving the speed, simplicity and precision of the process, self-leveling technology enables the practical realization of nano-scale manufacturing.

Materials and procedures

NanoInk, Inc. commercially available 2D nano-print array devices were used. Prior to sampling, the 2D tip arrays were vapor-deposited with ODT; namely three steaming cycles were performed: 60 minutes at 65 ° C and 100 minutes cooling time at 0.1 ° C / min. The Sampling was performed on a NLP 2000 (NanoInk, Inc.). This device has also been used to obtain optical images of cantilever deflection behavior. The sampling was carried out at ambient conditions (22 ° C, 30% RH). After patterning, the substrate was etched to produce metallic nanostructures; this was done based on published procedures (eg Salaita et al. 2006 ). Scanning electron micrographs were obtained with a Hitachi S4800 SEM, Tokyo, Japan. Brightfield and darkfield optical images were taken on a Zeiss Axio-Imager Z1M, Thonrwood, NY.

references

The following references may be further used to implement the various embodiments described herein.
Bullen et al .: Parallel dip-nanolithography with arrays of individually addressable cantilevers. Appl Phys Lett 84, 789-791 (2004) ,
Demers et al., Direct patterning of modified oligonucleotides on metals and insulators by dip-pen nanolithography. Science 296, 1836-1838 (2002) ,
Demers et al.: Orthogonal assembly of nanoparticle building blocks on dips nanolithographically generated templates of DNA. Angew Chem Int Ed 40, 3071-3073 (2001) ,
Ginger et al .: The evolution of dip-nanolithography. Angew Chem Int Ed 43, 30-45 (2004) ,
Haaheim et al .: Dip Pen Nanolithography (DPN): process and instrument performance with NanoInk's NSCRIPTOR system. Ultramicroscopy 103, 117-132 (2005) ,
Haaheim et al. Scanning 30, 137-150 (2008) ,
Huck WTS: Self-assembly meets nanofabrication: recent developments in microcontact printing and dip-nanolithography. Angew Chem Int Ed 46, 2754-2757 (2007) ,
Lee KB, et al .: Protein nanostructures formed via direct-write dip-pen nanolithography. J Am Chem Soc 125, 5588-5589 (2003) ,
Lee KB, et al, Protein nanoarrays generated by dip-pen nanolithography. Science 295, 1702-1705 (2002) ,
Lenhert S: Materials integration by dip-nanolithography in Nanotechnology, Vol. 2 - Nanoprobes. WILEY-VCH Weinheim, Berlin (2008) ,
Lenhert et al .: Massively parallel dip-nanolithography of heterogenous supported phospholipid multilayer patterns. Small 3, 71-75 (2007) ,
Nafday et al .: Site-specific dual ink dip nanolithography. Scanning 31, 122-126 (2009) ,
Piner et al .: Dip-pen nanolithography. Science. 283, 661-663 (1999) ,
Rosner: Dip pen nanolithography: applications and functional extensions in the Dekker Encyclopedia of Nanoscience and Nanotechnology. Taylor and Francis Group, New York (2005) ,
Salaita et al .: DPN-generated nanostructures as positive resists for preparing lithographic masters or hole arrays. Nano Lett 6, 2493-2498 (2006a) ,
Salaita et al .: Sub-100 nm, centimeter-scale, parallel dip-pen nanolithography. Small 1, 940-945 (2005) ,
Salaita et al .: Massively parallel dip-pen nanolithography with 55000-pen two-dimensional arrays. Angew Chem. Int 45, 7220-7223 (2006b) ,
Salaita et al .; Applications of dip-pen nanolithography. Nat Nanotechnol 2, 145-155 (2007) ,
Sanedrin et al.: Polyethylene glycol as a novel resist and sacrificial material for positive and negative nanostructures. Small 4, 920-924 (2008) ,
Sekula et al .: Multiplexed lipid dip-nanolithography on subcellular scales for the templating of functional proteins and cell culture. Small 4, 1785-1793 (2008) ,
Vega et al .: Monitoring single-cell infectivity from viral particle nanoarrays fabricated by parallel dip-pen nanolithography. Small 3, 1482-1485 (2007) ,
Vettiger et al .: The "Millipede" - more than one thousand future tips AFM data storage. IBM J Res Develop 44, 323-340 (2000) ,
Wang et al .: Controlling the shape, orientation, and linkage of carbon nanotube features with nano affinity templates. Proc Natl Acad Sci USA 103, 2026-2031 (2006) ,
Wang et al .: Toward conductive traces: Dip pen nanolithographies of silver nanoparticle-based inks. Appl Phys Lett 93, 143105-1-143105-3 (2008) ,
Zhang et al .: High-throughput dip-nanolithography-based fabrication of Si nanostructures. Small 3, 81-85 (2007) ,
Zhang et al.: Fabrication of sub-50nm solid-state nanostructures on the basis of dip-nanolithography. Nano Lett 3, 43-45 (2003) ,
Zhang et. Synthesis of open-ended, cylindrical Au-Ag alloy nanostructures on a Si / SiOx surface. Nano Lett 4, 1493-1495 (2004) ,
Zou S, et al.: Single-walled carbon nanotubes: molecular-template directed assembly and Monte Carlo modeling. Nano Lett 7, 276-280 (2007) ,

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

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• US 6518189 [0001]
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• US 6827979 [0001, 0077]
• US 2008/0105042 [0001]
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• WO 2009/132321 [0078]
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Cited non-patent literature

• CM Sotomayor Torres, Alternative Lithography: Unleashing the Potentials of Nanotechnology (Nanostructure Science and Technology), 2003 [0001]
• Haaheim et al., "Self-Leveling Two-Dimensional Probe Arrays for Dip Pen Nanolithography", Scanning, 32, 49-59 (2010) [0062]
• Hong et al. "Micromachined elastomeric tip array for variable dot size and density printing", J. Micromech. Microeng. 18 (2008) [0076]
• "The Nanopositioning Book. Moving and Measuring to Rescuer than a Nanometer ", TR Hicks et al., 2000 [0079]
• Salaita et al. 2006 [0130]
• Salaita et al. 2006 [0138]
• Bullen et al .: Parallel dip-nanolithography with arrays of individually addressable cantilevers. Appl Phys Lett 84, 789-791 (2004) [0139]
• Demers et al., Direct patterning of modified oligonucleotides on metals and insulators by dip-pen nanolithography. Science 296, 1836-1838 (2002) [0139]
• Demers et al.: Orthogonal assembly of nanoparticle building blocks on dips nanolithographically generated templates of DNA. Angew Chem Int Ed 40, 3071-3073 (2001) [0139]
• Ginger et al .: The evolution of dip-nanolithography. Angew Chem Int Ed. 43, 30-45 (2004) [0139]
• Haaheim et al .: Dip Pen Nanolithography (DPN): process and instrument performance with NanoInk's NSCRIPTOR system. Ultramicroscopy 103, 117-132 (2005) [0139]
• Haaheim et al. Scanning 30, 137-150 (2008) [0139]
• Huck WTS: Self-assembly meets nanofabrication: recent developments in microcontact printing and dip-nanolithography. Angew Chem Int Ed. 46, 2754-2757 (2007) [0139]
• Lee KB, et al .: Protein nanostructures formed via direct-write dip-pen nanolithography. J Am Chem Soc 125, 5588-5589 (2003) [0139]
• Lee KB, et al, Protein nanoarrays generated by dip-pen nanolithography. Science 295, 1702-1705 (2002) [0139]
• Lenhert S: Materials integration by dip-nanolithography in Nanotechnology, Vol. 2 - Nanoprobes. WILEY-VCH Weinheim, Berlin (2008) [0139]
• Lenhert et al .: Massively parallel dip-nanolithography of heterogenous supported phospholipid multilayer patterns. Small 3, 71-75 (2007) [0139]
• Nafday et al .: Site-specific dual ink dip nanolithography. Scanning 31, 122-126 (2009) [0139]
• Piner et al .: Dip-pen nanolithography. Science. 283, 661-663 (1999) [0139]
• Rosner: Dip pen nanolithography: applications and functional extensions in the Dekker Encyclopedia of Nanoscience and Nanotechnology. Taylor and Francis Group, New York (2005) [0139]
• Salaita et al .: DPN-generated nanostructures as positive resists for preparing lithographic masters or hole arrays. Nano Lett 6, 2493-2498 (2006a) [0139]
• Salaita et al .: Sub-100 nm, centimeter-scale, parallel dip-pen nanolithography. Small 1, 940-945 (2005) [0139]
• Salaita et al .: Massively parallel dip-pen nanolithography with 55000-pen two-dimensional arrays. Angew Chem. Int 45, 7220-7223 (2006b) [0139]
• Salaita et al .; Applications of dip-pen nanolithography. Nat Nanotechnol 2, 145-155 (2007) [0139]
• Sanedrin et al.: Polyethylene glycol as a novel resist and sacrificial material for positive and negative nanostructures. Small 4, 920-924 (2008) [0139]
• Sekula et al .: Multiplexed lipid dip-nanolithography on subcellular scales for the templating of functional proteins and cell culture. Small 4, 1785-1793 (2008) [0139]
• Vega et al .: Monitoring single-cell infectivity from viral particle nanoarrays fabricated by parallel dip-pen nanolithography. Small 3, 1482-1485 (2007) [0139]
• Vettiger et al .: The "Millipede" - more than one thousand future tips AFM data storage. IBM J Res Develop 44, 323-340 (2000) [0139]
• Wang et al .: Controlling the shape, orientation, and linkage of carbon nanotube features with nano affinity templates. Proc Natl Acad Sci USA 103, 2026-2031 (2006) [0139]
• Wang et al .: Toward conductive traces: Dip pen nanolithographies of silver nanoparticle-based inks. Appl Phys Lett 93, 143105-1-143105-3 (2008) [0139]
• Zhang et al .: High-throughput dip-nanolithography-based fabrication of Si nanostructures. Small 3, 81-85 (2007) [0139]
• Zhang et al.: Fabrication of sub-50nm solid-state nanostructures on the basis of dip-nanolithography. Nano Lett 3, 43-45 (2003) [0139]
• Zhang et. Synthesis of open-ended, cylindrical Au-Ag alloy nanostructures on a Si / SiOx surface. Nano Lett 4, 1493-1495 (2004) [0139]
• Zou S, et al.: Single-walled carbon nanotubes: molecular-template directed assembly and Monte Carlo modeling. Nano Lett 7, 276-280 (2007) [0139]

Claims (50)

An apparatus comprising: a support structure configured to secure an object, the object having a plurality of protrusions configured to form a pattern on a surface of a substrate upon contact of the object with the surface; and at least one flexible connection assembly secured to the support structure and configured to allow the object to assume a parallel orientation with respect to the surface upon contact of the object with the surface. The device of claim 1, wherein the at least one flexible connection assembly is further configured to maintain the parallel alignment after contact with the surface is broken. The device of claim 1, wherein the object is an array of nanoscopic tips. The device of claim 1, wherein the at least one flexible connection assembly is characterized by a coefficient of sliding friction and a coefficient of static friction, and further wherein the coefficient of sliding friction is sufficiently small to allow the object to move and the parallel alignment upon contact of the object with the surface and the static coefficient of friction is sufficiently large to allow the object to maintain the parallel alignment after contact with the surface is broken. The device of claim 1, wherein the at least one flexible interconnect assembly comprises: a ball; and a connector attached to the ball, the connector having a depression shaped to receive the ball. The device of claim 1, wherein the at least one flexible interconnect assembly is a magnetic interconnect assembly comprising: a ball; and a fastener attached to the ball, the fastener having a depression shaped to receive the ball, wherein the ball or the connecting element is magnetic. The device of claim 2, wherein the at least one flexible interconnect assembly is a magnetic interconnect assembly comprising: a ball; and a fastener attached to the ball, the fastener having a depression shaped to receive the ball, wherein the connecting element is magnetic. The device of claim 1, wherein the at least one flexible interconnect assembly comprises: a ball; and a fastener attached to the ball, the fastener having a depression shaped to receive the ball, wherein the connecting element is a socket. The device of claim 1, further comprising a mounting structure attached to the at least one flexible connector assembly, the mounting structure being adapted to be attached to a patterning instrument. The device of claim 1, further comprising a mounting structure secured to the at least one flexible connector assembly, the mounting structure adapted to be attached to a scanning probe instrument. The device of claim 1, further comprising a signaling system coupled to the device, wherein the signaling system is configured to signal when the parallel alignment has been taken. The device of claim 11, wherein the signaling system comprises an electrical circuit comprising: a power source; a light source electrically coupled to the power source; a mounting structure secured to the flexible connector assembly and electrically coupled to the power source, the mounting structure adapted to be attached to a patterning instrument via a hinge member at one end of the mounting structure; and a bearing member that is electrically coupled to the power source and that is configured to support the other end of the mounting structure. An apparatus comprising: a support structure configured to secure an array of nanoscopic tips, the array being configured to form a pattern on a surface of a substrate upon contact of the array with the surface; and at least one magnetic flexible connection assembly secured to the support structure, comprising: a ball; and a magnetic fastener, wherein the fastener has a depression shaped to receive the ball, wherein the magnetic flexible interconnect assembly is configured to allow the array to be parallel with respect to the surface upon contact of the object to occupy the surface. The device of claim 13, wherein the at least one flexible connection assembly is configured to maintain the parallel alignment after contact with the surface is broken. An institution comprising: a support structure configured to secure an object, the object including a plurality of protrusions configured to form a pattern on a surface of a substrate upon contact of the object with the surface; and a plurality of flexible interconnect assemblies attached to the support structure, the plurality of interconnect assemblies comprising: a first flexible connection assembly positioned along a first axis parallel to the support structure; a second flexible connection assembly positioned along the first axis and opposite the first flexible connection assembly; a third flexible connection assembly positioned along a second axis parallel to the support structure and perpendicular to the first axis; and a fourth flexible connection assembly positioned along the second axis and opposite the third flexible connection assembly; wherein the plurality of flexible connection assemblies are configured to allow the object to assume a parallel orientation with respect to the surface upon contact of the object with the surface. The apparatus of claim 15, wherein the plurality of flexible connection assemblies are further configured to maintain the parallel alignment after contact with the surface is broken. The device of claim 15, wherein the object is an array of scanning probe tips. The device of claim 15, wherein one or more of the flexible interconnect assemblies comprises: a ball; and a connector attached to the ball, the connector having a depression shaped to receive the ball. The device of claim 15, wherein one or more of the flexible interconnect assemblies is a magnetic, flexible interconnect assembly comprising: a ball; and a fastener attached to the ball, the fastener having a depression shaped to receive the ball, wherein the ball or the connecting element is magnetic. The device of claim 15, wherein one or more of the flexible interconnect assemblies is a magnetic, flexible interconnect assembly comprising: a ball; and a fastener attached to the ball, the fastener having a depression shaped to receive the ball, the ball being magnetic. The device of claim 15, wherein one or more of the flexible interconnect assemblies is a magnetic, flexible interconnect assembly comprising: a ball; and a fastener attached to the ball, the fastener having a depression shaped to receive the ball, wherein the connecting element is magnetic. The device of claim 15, wherein each of the flexible interconnect assemblies comprises: a ball; and a fastener attached to the ball, the fastener having a depression shaped to receive the ball, wherein the connecting element is a socket. The device of claim 15, wherein each of the flexible connection assemblies comprises: a ball; and a connector secured to the ball, the connector having a depression shaped to receive the ball, wherein the connector of the first and third flexible connector assemblies is a socket, and further wherein the connector of the second and fourth flexible connecting assembly is a socket, the two opposite has long sides and two opposite short sides. The device of claim 15, wherein the device further comprises: a center structure positioned on the support structure and attached to the first flexible connection assembly and the second flexible connection assembly; and an upper structure positioned on the center structure and attached to the third flexible connection assembly and the fourth flexible connection assembly. The device of claim 24, wherein the shape of the support structure and the center structure cause rotation of the object about the second axis is possible, but rotation of the object about the first axis is limited, and wherein the shape of the central structure and the upper structure causes in that a rotation of the object about the first axis is possible, but a rotation of the object about the second axis is limited. The device of claim 24, wherein the device further comprises: a first magnet and a second magnet positioned between the support structure and the center structure, and a third magnet and a fourth magnet positioned between the center structure and the top structure; wherein the first magnet is attached to the first flexible assembly, the second magnet is attached to the second flexible assembly, the third magnet is attached to the third flexible assembly, and the fourth magnet is attached to the fourth flexible assembly. The device of claim 24, wherein the support structure, the center structure, and the upper structure each have a central opening formed to allow a view of the object. The device of claim 24, further comprising a mounting structure attached to the upper structure, the mounting structure being adapted to be attached to a patterning instrument. The device of claim 24, further comprising a mounting structure secured to the upper structure, the mounting structure being adapted to be attached to a scanning probe instrument. The device of claim 15, wherein the support structure is adapted to be attached to a device for coating the plurality of protrusions. The device of claim 15, wherein the support structure comprises one or more magnets to secure the support structure to a device for coating the plurality of protrusions. An institution comprising: a support structure configured to secure an array of nanoscopic tips, the array being configured to form a pattern on a surface of a substrate upon contact of the array with the surface; a first magnetic flexible connection assembly secured to the support structure and positioned along a first axis parallel to the support structure; a second magnetic flexible connection assembly secured to the support structure and positioned along the first axis and opposite the first magnetic flexible connection assembly; a center structure positioned on the support structure and secured to the first magnetic flexible connection assembly and the second magnetic flexible connection assembly; a third magnetic flexible connection assembly secured to the center structure and positioned along a second axis parallel to the support structure and perpendicular to the first axis; a fourth magnetic flexible connection assembly secured to the center structure and positioned along the second axis and opposite the third magnetic flexible connection assembly; and an upper structure positioned on the center structure and attached to the third magnetic flexible connection assembly and the fourth magnetic flexible connection assembly; wherein each of the magnetic flexible interconnect assemblies comprises: a ball; and a connector, the connector having a depression shaped to receive the ball, the ball or connector being magnetic, and further wherein the magnetic, flexible interconnect assemblies are configured to allow the array to assume parallel alignment with respect to the surface upon contact of the array with the surface. The device of claim 32, wherein the magnetic flexible connection assemblies are further configured to maintain the parallel alignment after contact with the surface is broken. An apparatus comprising a patterning instrument and means, the apparatus being affixed to the patterning instrument, the apparatus further comprising: a support structure configured to secure an object, the object having a plurality of protrusions, which are adapted to form a pattern on a surface of a substrate upon contact of the object with the surface; and at least one flexible connection assembly secured to the support structure and configured to allow the object to assume a parallel orientation with respect to the surface upon contact of the object with the surface. The device of claim 34, wherein the object is an array of scanning probe tips. The apparatus of claim 34, wherein the patterning instrument is a raster probe instrument. Apparatus according to claim 34, wherein the sampling instrument comprises: at least one multi-axis assembly having at least five nanopositioning stages; at least one scanning probe tip assembly, wherein the scanning probe tip assembly and the multi-axis assembly are configured to transfer material from the scanning probe tip assembly to the substrate, the substrate being positioned by the multi-axis assembly; at least one observation assembly; and at least one controller. An apparatus comprising a raster probe instrument and apparatus according to claim 13, wherein the apparatus is attached to the raster probe instrument. An apparatus comprising a scanning probe instrument and apparatus according to claim 15, wherein the means is attached to the scanning probe instrument. An apparatus comprising a raster probe instrument and apparatus according to claim 32, wherein the apparatus is attached to the raster probe instrument. A mounting bracket configured to assist in securing an object to a support structure, the object having a plurality of protrusions configured to form a pattern on a surface of a substrate upon contact of the object with the surface. A mounting bracket according to claim 41, wherein the bracket is adapted to assist the adhesive attachment of the object to the support structure. The mounting bracket of claim 41, wherein the support structure is configured to be coupled to a device having at least one flexible connection assembly secured to the support structure and configured to allow the object to be aligned in parallel to occupy the surface upon contact of the object with the surface. The mounting bracket of claim 41, wherein the object is an array of scanning probe tips. The mounting bracket of claim 41, wherein the mounting bracket includes a cavity configured to hold the object in a fixed position leaving a mounting surface exposed on the object during a mounting process. The mounting bracket of claim 41, wherein the mounting bracket has a cavity configured to hold the object in a fixed position leaving a mounting surface exposed on the object during a mounting process, and further wherein the cavity has a lug formed therein to store the object along at least part of the edge of the object. The mounting bracket of claim 41, wherein the mounting bracket has a channel that is shaped to receive a surface of the mounting structure that is placed on a mounting surface of the object. The mounting bracket of claim 41, wherein the mounting bracket includes a clamping member configured to hold the mounting structure in a fixed position on a mounting surface of the object. A mounting bracket according to claim 41, wherein the mounting bracket comprises: a cavity configured to hold the object in a fixed position leaving a mounting surface exposed on the object during a mounting process; a channel shaped to receive a surface of the support structure placed on a mounting surface of the object; and a clamping member configured to hold the support structure in a fixed position on a mounting surface of the object. A kit comprising a device according to claim 1.

Images