DE202007017592U8 - Computerkühlgehäuse mit Luftansaugung - Google Patents

Computerkühlgehäuse mit Luftansaugung Download PDF

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Publication number
DE202007017592U8
DE202007017592U8 DE202007017592U DE202007017592U DE202007017592U8 DE 202007017592 U8 DE202007017592 U8 DE 202007017592U8 DE 202007017592 U DE202007017592 U DE 202007017592U DE 202007017592 U DE202007017592 U DE 202007017592U DE 202007017592 U8 DE202007017592 U8 DE 202007017592U8
Authority
DE
Germany
Prior art keywords
air intake
cooling housing
computer cooling
computer
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE202007017592U
Other languages
English (en)
Other versions
DE202007017592U1 (de
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chemtron Research LLC
Original Assignee
Cooler Master Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooler Master Co Ltd filed Critical Cooler Master Co Ltd
Publication of DE202007017592U1 publication Critical patent/DE202007017592U1/de
Publication of DE202007017592U8 publication Critical patent/DE202007017592U8/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE202007017592U 2007-08-08 2007-12-17 Computerkühlgehäuse mit Luftansaugung Expired - Lifetime DE202007017592U1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
TW096213055 2007-08-08
TW096213055U TWM329948U (en) 2007-08-08 2007-08-08 Negative-pressure inhaling type computer heat-dissipating case
CN096213055 2007-08-08

Publications (2)

Publication Number Publication Date
DE202007017592U1 DE202007017592U1 (de) 2008-02-28
DE202007017592U8 true DE202007017592U8 (de) 2008-09-18

Family

ID=39135093

Family Applications (1)

Application Number Title Priority Date Filing Date
DE202007017592U Expired - Lifetime DE202007017592U1 (de) 2007-08-08 2007-12-17 Computerkühlgehäuse mit Luftansaugung

Country Status (3)

Country Link
US (1) US20090038783A1 (de)
DE (1) DE202007017592U1 (de)
TW (1) TWM329948U (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2487399C1 (ru) * 2012-03-11 2013-07-10 Владимир Юрьевич Малякин Системный блок персонального компьютера (варианты)
US20150185792A1 (en) * 2013-12-26 2015-07-02 Shih-Wun Li DUAL-layer SYSTEM COMPUTER ENCLOSURE
US11343931B2 (en) 2019-05-02 2022-05-24 Apple Inc. Computer tower architecture and thermal management
US11567547B2 (en) 2019-05-31 2023-01-31 Apple Inc. Computer tower architecture

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* Cited by examiner, † Cited by third party
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JPH0795771A (ja) * 1993-09-20 1995-04-07 Sansha Electric Mfg Co Ltd 電源装置の冷却構造
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DE69630677T2 (de) * 1996-05-14 2004-09-30 Hewlett-Packard Co. (N.D.Ges.D.Staates Delaware), Palo Alto Einrichtung zur Kühlung von Komponenten in einem elektrischen Gerät mit interner Stromversorgungseinheit
US5828549A (en) * 1996-10-08 1998-10-27 Dell U.S.A., L.P. Combination heat sink and air duct for cooling processors with a series air flow
JP3251180B2 (ja) * 1996-10-11 2002-01-28 富士通株式会社 ノートブック型コンピュータの放熱構造
US5870284A (en) * 1997-03-17 1999-02-09 Astec International Limited Integrated power supply frame including integrated circuit (IC) mounting and cooling
US6031719A (en) * 1997-06-25 2000-02-29 Dell Usa L.P. Fan flange retention in a fan carrier
US5852547A (en) * 1997-07-14 1998-12-22 Sun Microsystems, Inc. Module shroud attachment to motherboard
FR2776908B1 (fr) * 1998-04-02 2000-06-09 Seb Sa Appareil electrique recuperateur de dechets
US6050618A (en) * 1998-04-20 2000-04-18 Southco, Inc. Slide latch
TW444894U (en) * 1998-08-31 2001-07-01 Hon Hai Prec Ind Co Ltd Computer components rotation hanging rack
US6040981A (en) * 1999-01-26 2000-03-21 Dell Usa, L.P. Method and apparatus for a power supply cam with integrated cooling fan
US6193339B1 (en) * 1999-04-12 2001-02-27 Inclose Design, Inc. Docking adapter for memory storage devices
HUP0201698A2 (en) * 1999-06-01 2002-09-28 Volker Dalheimer Housing system for housing electronic components, especially a flat desktop pc or multimedia housing
TW541247B (en) * 2000-01-31 2003-07-11 Hewlett Packard Co Latch and handle arrangement for a replaceable ink container
JP2001267771A (ja) * 2000-03-17 2001-09-28 Hitachi Ltd 電子装置
US6940716B1 (en) * 2000-07-13 2005-09-06 Intel Corporation Method and apparatus for dissipating heat from an electronic device
US6370023B1 (en) * 2000-07-21 2002-04-09 Inventec Corporation Case assembly for computer mainframe
US6504719B2 (en) * 2001-03-30 2003-01-07 Intel Corporation Computer system that can be operated without a cooling fan
TW553411U (en) * 2002-04-11 2003-09-11 Avance Technologies Inc Auxiliary positioning and heat sink device of interface card
AU2003272935C1 (en) * 2002-10-11 2009-06-25 Otsuka Pharmaceutical Co., Ltd. Powder inhalation device
US7752858B2 (en) * 2002-11-25 2010-07-13 American Power Conversion Corporation Exhaust air removal system
US7054155B1 (en) * 2003-03-17 2006-05-30 Unisys Corporation Fan tray assembly
US20050047086A1 (en) * 2003-08-27 2005-03-03 Elias Gedamu Heat dissipation apparatus and method
US7242576B2 (en) * 2004-01-08 2007-07-10 Apple Inc. Quick release structures for a computer
US6980435B2 (en) * 2004-01-28 2005-12-27 Hewlett-Packard Development Company, L.P. Modular electronic enclosure with cooling design
US7218517B2 (en) * 2004-12-07 2007-05-15 International Business Machines Corporation Cooling apparatus for vertically stacked printed circuit boards
US7333330B2 (en) * 2005-02-04 2008-02-19 Technology Advanced Group, Inc. Electronic component chassis with isolated power supply cooling
US7394653B2 (en) * 2005-10-25 2008-07-01 Shuttle Inc. Heat dissipating system of multi-media computer
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US7347666B2 (en) * 2006-01-26 2008-03-25 International Business Machines Corporation AMD packaging apparatus for minimal external space, hot plug, and redundant installation
US20070192992A1 (en) * 2006-02-23 2007-08-23 Steven Su Cover module for a computer case
US7344439B2 (en) * 2006-03-06 2008-03-18 International Business Machines Corporation System, method, and apparatus for distributing air in a blade server
US7423872B2 (en) * 2006-04-10 2008-09-09 Super Micro Computer, Inc. Air shroud installed on a circuit board
US7310228B2 (en) * 2006-04-10 2007-12-18 Super Micro Computer, Inc. Air shroud for dissipating heat from an electronic component
TWM306460U (en) * 2006-07-24 2007-02-11 Cooler Master Co Ltd Heat dissipating structure of computer case
US7324338B1 (en) * 2006-08-29 2008-01-29 Silver-Stone Technology Co., Ltd. Heat dissipating apparatus of a computer system
US7824155B2 (en) * 2007-04-16 2010-11-02 Inventec Corporation Fan holder
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Also Published As

Publication number Publication date
TWM329948U (en) 2008-04-01
US20090038783A1 (en) 2009-02-12
DE202007017592U1 (de) 2008-02-28

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20080403

R150 Utility model maintained after payment of first maintenance fee after three years

Effective date: 20110118

R082 Change of representative

Representative=s name: TER MEER STEINMEISTER & PARTNER GBR PATENTANWA, DE

Representative=s name: TER MEER STEINMEISTER & PARTNER GBR PATENTANWAELTE

R081 Change of applicant/patentee

Owner name: CHEMTRON RESEARCH LLC, DOVER, US

Free format text: FORMER OWNER: COOLER MASTER CO., LTD., CHUNG-HO, TAIPEH, TW

Effective date: 20120116

R082 Change of representative

Representative=s name: TER MEER STEINMEISTER & PARTNER PATENTANWAELTE, DE

Effective date: 20120116

R157 Lapse of ip right after 6 years
R157 Lapse of ip right after 6 years

Effective date: 20140701