DE202006018623U1 - Heating/cooling system, for walls and ceilings, has heat exchanger plates bonded to carrier plates by an adhesive leveling layer - Google Patents

Abstract

The heating/cooling system with connections (3) for the heating/coolant medium , for walls and ceilings, has plate-shaped heat exchangers with an adhesive leveling layer on carrier plates (1) of plasterboard to bond the heat exchanger plates (2). The three layers form a unit with a thickness of 12.5 mm, with the heat exchanger plate thickness of 1.5 mm outside the water path (4).

Description

The invention relates to a new construction of heating and cooling ceilings using heat exchanger plates, wherein expressly heating or cooling walls are included. The heating or cooling ceiling system achieves high performance (W / m ² ).

It is known that usual Heating and cooling ceilings executed in such a way are that a heated or chilled liquid Medium as an energy carrier (in usually water is used) by copper pipes, with ceiling tiles connected. It is important to ensure that as good as possible heat transfer given is. The larger the contact area between the copper pipes and ceiling tiles, the better Heat transfer. Accordingly, according to the state of Technique the copper pipes routed meandering and pressed in aluminum profiles, thus providing a larger contact surface to get the ceiling tiles. In this embodiment, the contact area between Copper tube and aluminum profile limited to approx. 50% tube surface. A very precise execution the contact surfaces is necessary, because even 0.1 mm air gap leads to considerable reduction the one to be transferred Performance on the ceiling tiles.

To the State of the art or the offers on the cooling ceiling market include Wärmeleitprofile Made of aluminum, which together with copper or plastic pipe meanders in the ceiling construction hooked or screwed in. Below these are carrier plates made of plasterboard, sheet steel or aluminum or composite panels attached to several layers of material (planking). The heat conduction profiles with the meanders of the pipe to press then with a spring mechanism o. Ä. On the planking described and thus achieve a more or less good contact. The losses in the energy transfer can not be insignificant.

A another variant is that heat conduction profiles on metal, composite or plasterboard using Adhesive films are glued on; The pipe meanders are then attached to the heat conduction profiles pressed. The finished elements will be later on the construction site attached to ceiling or wall constructions. The Energy of the cooling or heating medium in the copper or Kunststoffrohrmäandern is possibly over the heat conducting only selectively transferred to the underlying plates and then radiated to the environment.

From greater Importance is therefore always the contact of the medium-carrying Rohrmäander with underneath plates made of sheet steel, aluminum, metal composite plates or plasterboard.

To summarize, the currently common systems have several vulnerabilities:
Copper pipe or plastic pipe is pressed into heat conduction profiles made of aluminum. Here, the connection of different building materials or components can cause problems. If the pressing is not 100% consistent, corrosion between copper and aluminum may occur; Therefore, then the temperature can be passed only insufficiently to the heat conduction. Here, the contact that needs to be bridged represents an insecurity.

heat conducting made of aluminum or other materials are usually on with adhesive films the carrier plate applied. When gluing process there are unavoidable air pockets, the reduce contact again and negative impact on performance the cooling ceiling to have. There is also the possibility that the contact entirely is interrupted when such an item during transport or installation is twisted or bent.

heat conducting be after another known variant with the planking bolted to underlying plates. Here it is always like that an absolute contact exists in the area of the screw, otherwise But then takes the contact with the distance of the screw clearly from.

heat conducting become punctiform according to another variant (about every 60-100 cm) by spring pressure on the underlying plate or the panel pressed. Here there is contact in the region of the compression spring; between but maybe only limited.

Cooling blankets are active only where Rohrmäander and heat conducting sheets are; about that in addition only indirectly to a small extent. The cooling or heating agent distribution on the ceiling or wall surfaces is linear in the lateral distance of about 10-15 cm, the temperature is then from the heat conduction profiles, the not nationwide are arranged, insufficient passed.

It is therefore the object of the invention, a heating and cooling ceiling system to propose (which also for the walls can be used), compared to the prior art lower Has a loss of performance that a homogeneous nationwide Temperature distribution allows and the layer structure of the system has a total thickness that compatible for the production of DIN-compliant flat ceilings or wall surfaces is.

According to the invention, the object is achieved as follows, wherein with regard to the basic invent is concerned with the protection claim 1.

The Further embodiment of the invention results from the protection claims 2 to 5th

to Presentation of the invention will be made further embodiments.

The Heating and cooling system for ceilings and walls consists of several components and functionally related products, namely the plate heat exchangers, preferably made of aluminum, which through its finely branched Waterways on the entire plate surface for a homogeneous, area-wide Ensure temperature distribution. All surfaces directly below the plate heat exchangers are heating or cooling technology active.

Of the Plate heat exchanger consists of two aluminum plates, which under pressure a metallic Make contact. The waterways are treated with release agents and expanded with compressed air. On the lower side (at a Ceiling) or on the inner side (on a wall) is the plate heat exchanger absolutely plan, while on the back increases show the ramified Represent waterways.

These back is in common Protected against corrosion, z. B. by powder coating or painting.

Outside In the waterways, the plate heat exchangers have a thickness of 1.5 mm.

The Medium as an energy source is generally a water mixture with inhibitor as a corrosion inhibitor. The inhibitor also prevents biological attack.

The carrier plates are preferably designed as plasterboard (10 mm thickness). When carrier plates can also thermogypsum plates, gypsum fiberboards, plaster-graphite-carbon fiber plates, aluminum honeycomb composite plates or other metallic plates (as far as the metallic ones Plates are not excluded from the outset because of the weight). How later still explained is 10 mm thick plasterboard for the execution of the invention are very advantageous. As an adhesive bond between the plate heat exchangers and the carrier plates advantageously comes gypsum-based plastic offset adhesive for application or joint adhesive, two-component adhesive, hot melt adhesive o. Ä .. The adhesive makes one by the type of application (e.g., by a trowel) direct, non-positive and bubble-free connection between the plate heat exchangers and the carrier plates ago. The homogeneous compound produced in this way almost ensures unhindered temperature transfer from the plate and heat exchanger to the carrier plate. As essential it should be emphasized that the adhesive bond, which is 1 mm thick, represents a leveling layer, um - how still explained will the requirement for the creation of DIN-compliant, flat ceiling surfaces to create (apart from the task, a steady, possible lossless heat transfer to allow).

• – Trägerplatte (bevorzugt Gipskarton) mit einer Dicke von 10 mm
• – 1 mm dicke Klebeschicht
• – Platten-Wärmeaustauscher mit einer Gesamtdicke außerhalb der Wasserwege von 1,5 mm. (Es ist an sich selbstverständlich, dass bei diesem Aufbau die Rückseite des Platten-Wärmeaustauschers mit den Erhöhungen für die Wasserwege bei Decken vom Raum aus betrachtet nach oben bzw. bei Wänden nach außen zeigt).

The structure of the heating or cooling elements is thus obtained (in the case of ceilings from the room side to the top):

• - Support plate (preferably plasterboard) with a thickness of 10 mm
• - 1 mm thick adhesive layer
• - Plate heat exchanger with a total thickness outside the waterways of 1.5 mm. (It is self-evident that in this structure, the back of the plate heat exchanger with the ridges for the waterways in ceilings from the room upwards or walls outwards).

The Invention will now be explained with reference to an embodiment.

The Figures show a schematic diagram:

1 : two plates - Heat exchangers are glued on a plasterboard, top view

2 : Cut AA according to 1

The used reference symbols mean:

1

Plasterboard as a carrier plate

2

Plate heat exchanger made of aluminium

3

connection for heating / cooling medium

4

waterways

5

adhesive layer

The especially in 2 highly visible layer structure, marked with the position mark 1 . 2 and 5 represents in its combination the new heating and cooling ceiling system.

On a plasterboard 1 with a thickness of 10 mm are using the adhesive layer 5 two plate heat exchangers 2 arranged. 1 shows particularly vividly the finely branched waterways 4 , The connections for the heating and cooling medium are with the position mark 5 designated.

It is especially the function of the adhesive layer 5 as a 1 mm thick Nivelierschicht hervorgeho ben, so in any case, between the flat front sides of the plate heat exchanger 2 and the gypsum board a gleichmüßiger heat / cold transition takes place with very low energy losses, whereby the initially stated object of the invention is fully met.

The so-called Nivelier adhesive bond between heat exchanger 2 and support plate 1 also allows the use of aluminum heat exchangers with bilateral waterways. These plate heat exchangers are on the one hand because of the larger surface more powerful and cheaper on the other hand in the production.

The already on his performance tested Heating or cooling ceiling system brings with its performance values significant user benefits itself and has indirect benefits in significant economic Dimensions in the field of building services, z. B. by saving water, due to lower pumping capacities, savings in the piping.

In the tested version with aluminum plate heat exchanger and leveling adhesive layer of plaster joint adhesive and Rigips CliMax ^® thermoplas- tic plate 10.0 mm, the cooling ceiling achieves 92 watts / m ² according to DIN EN 14240 at 10 K.

Compared to today's standard plasterboard cooling ceilings (maximum power 72 watt / m ² at 10 K)) the power advantage is 20 watts / m ² . More important is the performance advantage, if one includes the possible, active area in the comparison. In the known systems, approximately 20% of the area must be largely deducted as inactive in the construction area; The power, based on the ceiling area then drops to about 55 watts / m ² , compared to still about 80 watts / m ² in the new cooling ceiling system described here.

In conclusion, be still pointed out that with careful attention to the dimensions the thickness of the components (plasterboard 10 mm, adhesive layer 1 mm, not water-bearing Layer of plate heat exchanger aluminum 1.5 mm) for the heating and cooling ceiling system gives a thickness of 12.5 mm. This is with 12.5 mm total thickness the system compatible for the production of DIN-compliant flat ceilings or wall surfaces. (The inactive areas can Planked with standard plasterboard panels 12.5 mm.) Thus became in this respect, too, is the initial task Fulfills.

Claims (6)

Heating and cooling system for ceilings and walls using plate heat exchangers, characterized in that on support plates ( 1 ) an adhesive layer ( 5 ) is applied in the sense of a leveling layer and thereon plate heat exchanger ( 2 ), whereby as a prerequisite for the production of DIN-appropriate flat ceiling or wall surfaces, the sum of the thickness of support plates ( 1 ), Adhesive layer ( 5 ) and plate heat exchangers ( 2 12.5 mm thickness, here the thickness of the plate heat exchangers ( 1 ) outside the waterways. Heating and cooling system according to protection claim 1, characterized in that the carrier plates ( 1 ) a thickness of 10 mm, the adhesive layer ( 5 ) a thickness of 1 mm and the plate heat exchangers ( 2 ) have a thickness of 1.5 mm outside the waterways. Heating and cooling system according to protection claim 1, characterized in that the carrier plates ( 1 ) are preferably plasterboard. Heating and cooling system according to protection claim 1, characterized in that the adhesive layer ( 5 ) preferably made of plastic-crosslinked gypsum-based adhesive. Heating and cooling system according to claim 1 to 4 or one or more of claims 1 to 4, characterized in that the plate heat exchangers ( 2 ) are arranged on the entire support plate surface such that all surfaces below the plate heat exchangers ( 2 ) are heating or cooling technology active. Heating and cooling system according to claim 1, characterized in that in an acoustically effective System the plate heat exchangers partially on the hole arrangement with holes provided carrier plate are coordinated.