DE202004016256U1 - LED casing structure for a photoelectric semiconductor e.g. in flashlight, has an embedded injection-molded element, an LED chip and a lens to act as a focusing point - Google Patents
LED casing structure for a photoelectric semiconductor e.g. in flashlight, has an embedded injection-molded element, an LED chip and a lens to act as a focusing point Download PDFInfo
- Publication number
- DE202004016256U1 DE202004016256U1 DE200420016256 DE202004016256U DE202004016256U1 DE 202004016256 U1 DE202004016256 U1 DE 202004016256U1 DE 200420016256 DE200420016256 DE 200420016256 DE 202004016256 U DE202004016256 U DE 202004016256U DE 202004016256 U1 DE202004016256 U1 DE 202004016256U1
- Authority
- DE
- Germany
- Prior art keywords
- thermally conductive
- main body
- construction according
- conductive main
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 27
- 239000002184 metal Substances 0.000 claims abstract description 13
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 3
- 239000010703 silicon Substances 0.000 claims abstract description 3
- 238000010276 construction Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 9
- 239000002313 adhesive film Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 238000001746 injection moulding Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 229910010293 ceramic material Inorganic materials 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- 238000010292 electrical insulation Methods 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000005253 cladding Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Abstract
Description
Die Erfindung schafft einen Gehäuseaufbau eines fotoelektrischen Halbleiters, insbesondere einen Gehäuseaufbau, der sich durch hohe Wärmeleitfähigkeit und einstückige Konfiguration auszeichnet und nur minimal auf Verformung beansprucht ist, so dass Fehlerlosigkeit und Qualität von der Umhüllung (Packaging) verbessert sind, um den Anforderungen an die Umhüllung von elektronischen Chips zu entsprechen. Da die Umhüllungsstärke und die wärmeleitfähige Konfiguration durch die einstückige Erstellung verbessert werden, wird vermieden, dass die Standzeit von fotoelektrischen Einrichtungen durch Überhitzen der fotoelektrischen Chips reduziert wird. Durch Verwendung von wärmeleitendem Material, wie wärmeleitfähiger Klebfolie oder einem Metallgehäuse, wird die Wärmeleitfähigkeit des Umhüllungskörpers gesteigert, wobei mit der einstückigen Konstruktion der Kostenaufwand herabgesetzt wird.The Invention provides a housing structure of a photoelectric semiconductor, in particular a housing structure, characterized by high thermal conductivity and one-piece Configuration characterized and only minimally stressed on deformation is so that flawlessness and quality of the wrapping (packaging) are improved to meet the requirements for the cladding of electronic chips correspond to. Since the serving strength and the thermally conductive configuration by the one-piece Creation will be improved, that will avoid the tool life of photoelectric devices by overheating the photoelectric Chips is reduced. By using heat conductive material, such as thermally conductive adhesive film or a metal case, becomes the thermal conductivity of the envelope body, being with the one-piece Construction of the cost is reduced.
In der Verpackungsindustrie wurde zunehmende Aufmerksamkeit auf das Packaging fotoelektrischer Halbleiter geschenkt, wobei das Packaging von Leuchtdioden (LED) und Lichtsensoren aufgrund der Anforderungen an Kompaktheit von elektronischen Produkten immer bedeutender wird. Leuchtdioden, die den Anforderungen an die Oberflächenmontagetechnik entsprechen und mit zwei, vier oder noch mehr Beinchen versehen sind, benötigen eine noch bessere Umhüllung. Gleichfalls stellen sie auch eine hohe Anforderung an die Helligkeit der umhüllten bzw. eingehüllten Fertigprodukte nach der Umhüllung.In The packaging industry has been receiving increasing attention Photoelectric semiconductor packaging, the packaging of Light emitting diodes (LED) and light sensors due to the requirements is becoming more and more important in the compactness of electronic products. LEDs that meet the requirements of surface mount technology match and have two, four or more legs are, need an even better serving. Likewise, they also make high demands on the brightness the wrapped one or wrapped Finished products after serving.
Wie
bekannt ist, bedeutet die elektronische Umhüllungstechnik, dass elektronische
Elemente in eine Baueinheit integriert sind, nachdem der Herstellvorgang
integrierter Schaltung (IC) des Halbleiters oder der Leuchtdioden
abgeschlossen ist. Daher wird ein elektronisches Produkt gefertigt,
um alle Verfahren gewisser Gestaltung durchzuführen. Außerdem weist die elektronische
Umhüllungstechnik
die folgenden vier Funktionen auf:
Leistungsverteilung, Signalverteilung,
Wärmedissipation
und Schutz sowie Unterstützung.
Bei IC-Chipumhüllung
und LED-Umhüllung
findet elektronische Umhüllungstechnik
häufig
Verwendung.As is known, the electronic cladding technique means that electronic elements are integrated into a package after the manufacturing process of the integrated circuit (IC) of the semiconductor or the LEDs is completed. Therefore, an electronic product is made to perform all the procedures of some design. In addition, the electronic cladding technique has the following four functions:
Power distribution, signal distribution, heat dissipation and protection as well as support. In IC chip cladding and LED cladding, electronic cladding technology is often used.
Wie
aus
Durch die Erfindung wird ein Gehäuseaufbau für einen fotoelektrischen Halbleiter geschaffen, der durch einfache Maßnahmen die oben genannten Nachteile nicht aufweist.By The invention will be a housing structure for a Photoelectric semiconductors created by simple measures does not have the above-mentioned disadvantages.
Die Erfindung weist insbesondere die in Anspruch 1 angegebenen Merkmale auf. In den Unteransprüchen sind Ausgestaltungen der Erfindung angegeben.The Invention has in particular the features specified in claim 1 on. In the dependent claims embodiments of the invention are given.
Im Folgenden werden Aufgaben, Merkmale und Funktionsweise der Erfindung anhand des bevorzugten Ausführungsbeispiels und der beigefügten Zeichnungen näher erläutert werden. Es zeigen:in the Following are objects, features and operation of the invention on the basis of the preferred embodiment and the accompanying drawings be explained in more detail. Show it:
Ein erfindungsgemäßes Grundprinzip besteht darin, dass die Verbesserung der Qualität von Lichtquellen durch Verwendung einer Linse zur Fokussierung auf einen Punkt erfolgt und unnötige Komponenten weggelassen sind. Dies gilt insbesondere bei optischen Einrichtungen z.B. Scanner oder digitalen Kameras mit hohen Anforderungen an Helligkeit für ein bestimmtes Arbeitsumfeld. Bei einem Scanner wird eine gleichmäßige Strahlung auf ein Papier und bei digitalen Kameras wird eine ausreichende Lichtquelle für die aufzunehmenden Gegenstände benötigt. Mit dem einstückigen, erfindungsgemäßen Gehäuse wird die Leistung der Wärmeübertragung erhöht und sein Zusammenbau begünstigt.One inventive principle is that improving the quality of light sources by using a lens to focus on one point and unnecessary components are omitted. This applies in particular to optical devices e.g. Scanners or digital cameras with high demands on brightness for a specific work environment. In a scanner, a uniform radiation on a paper and digital cameras will be sufficient Light source for the objects to be picked up needed. With the one-piece, housing according to the invention is the power of heat transfer elevated and its assembly favors.
Für die erfindungsgemäße Plättchenumhüllung kann
auch Drahtbonden angewendet werden, wie in
Nachfolgend
wird Bezug auf
Es
sind insbesondere folgende geringfügig abgewandelte Ausführungsbeispiele
möglich.
Der fotoelektrische Halbleiter
Die Erfindung zeichnet sich dadurch aus, dass sich der bekannte Reflexionsbecher erübrigt, sodass der fokussierte Bereich eine gleichmäßige Helligkeit aufweist, und wobei mit der einstückigen Bauweise des erfindungsgemäßen Gehäuseaufbaus, bei dem Kunststoff, Keramik oder Metall in die metallische Halterung eingebettet sind, die optische Eigenschaft verbessert und der Zusammenbau erleichtert wird, was eine kostengünstige Installierung bewirkt und zu nur geringer Einwirkung auf herkömmliche Chipumhüllungsfließbänder von Leuchtdioden führt. Daher ist die erfindungsgemäße Installierung sehr einfach. Außerdem verbessert der erfindungsgemäße Gehäuseaufbau nicht nur die Leuchtqualität, sondern weist auch einen einfachen Zusammenbau auf. Des Weiteren wirkt der erfindungsgemäße Gehäuseaufbau sich wenig auf das Verarbeitungsverfahren aus und kann völlig in das herkömmliche Umhüllungsverfahren integriert werden, sodass die Umhüllungsmaschine nur gering geändert werden muss. Dies ist als praktisch anzusehen.The invention is characterized in that the known reflection cup is unnecessary, so that the focused area has a uniform brightness, and wherein with the one-piece construction of the housing structure according to the invention, in which plastic, ceramic or metal are embedded in the metallic holder, the optical property improved and the assembly he is facilitated, which causes a low-cost installation and leads to little impact on conventional chip wrapping conveyor belts of light-emitting diodes. Therefore, the installation according to the invention is very simple. In addition, the housing structure according to the invention not only improves the luminous quality, but also has a simple assembly. Furthermore, the housing structure according to the invention has little effect on the processing method and can be fully integrated into the conventional wrapping method, so that the wrapping machine need only be slightly changed. This is considered practical.
Zusammengefasst lassen sich mit dem erfindungsgemäßen System beispielsweise folgende Vorteile realisieren:
- 1. Das neue Verfahren lässt sich leicht installieren, was nur geringe Anforderungen sowohl an die Preise der neu aufgebauten Anlagen als auch an die benötigten Erfahrungen und Technik stellen.
- 2. Mit der einstückigen Erstellung wird der Zusammenbau erleichtert.
- 3. Die herkömmlichen Umhüllungsanlagen sind noch benutzbar.
- 4. Im Hinblick auf die Leuchtwirkung liegt eine Gleichmäßigkeit zur Anpassung an optische Anlagen vor.
- 1. The new method is easy to install, which places only small demands both on the prices of the newly constructed systems and on the experience and technology required.
- 2. With the one-piece creation of the assembly is facilitated.
- 3. The conventional wrapping plants are still usable.
- 4. With regard to the lighting effect is a uniformity to adapt to optical systems before.
- 1a1a
- LED-GehäuseaufbauLED housing construction
- 10a10a
- eingebettetes Spritzgußelementembedded injection element
- 11a11a
- Beinchenleg
- 12a12a
- Linselens
- 20a20a
- LED-ChipLED chip
- 30a30a
- Metallplättchenmetal plates
- 40a40a
- Sockel-BecherSocket cup
- 50a50a
- Sockelbase
- 1010
- Gehäusecasing
- 1212
- wärmeleitfähiger Hauptkörperthermally conductive main body
- 1414
- Beinchenleg
- 1616
- Isolationshülleinsulating sleeve
- 2020
- fotoelektrischer Halbleiterphotoelectric semiconductor
- 3030
- wärmeleitendes Plättchenthermally conductive Tile
- 3232
- Substratsubstratum
- 3434
- Flanschflange
- 4040
- Linseneinrichtunglens means
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200420016256 DE202004016256U1 (en) | 2004-10-21 | 2004-10-21 | LED casing structure for a photoelectric semiconductor e.g. in flashlight, has an embedded injection-molded element, an LED chip and a lens to act as a focusing point |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200420016256 DE202004016256U1 (en) | 2004-10-21 | 2004-10-21 | LED casing structure for a photoelectric semiconductor e.g. in flashlight, has an embedded injection-molded element, an LED chip and a lens to act as a focusing point |
Publications (1)
Publication Number | Publication Date |
---|---|
DE202004016256U1 true DE202004016256U1 (en) | 2005-02-10 |
Family
ID=34202727
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200420016256 Expired - Lifetime DE202004016256U1 (en) | 2004-10-21 | 2004-10-21 | LED casing structure for a photoelectric semiconductor e.g. in flashlight, has an embedded injection-molded element, an LED chip and a lens to act as a focusing point |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE202004016256U1 (en) |
-
2004
- 2004-10-21 DE DE200420016256 patent/DE202004016256U1/en not_active Expired - Lifetime
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 20050317 |
|
R150 | Term of protection extended to 6 years |
Effective date: 20071120 |
|
R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H01L0033000000 Ipc: H01L0033620000 Effective date: 20101203 |
|
R151 | Term of protection extended to 8 years |
Effective date: 20101116 |
|
R158 | Lapse of ip right after 8 years |
Effective date: 20130501 |