DE102004051362A1 - Package structure of opto-electrical semiconductor, such as light emitting diode, has opto-electrical semiconductor structure attached on plane of internal side of shell body with heat-conductive laminate - Google Patents
Package structure of opto-electrical semiconductor, such as light emitting diode, has opto-electrical semiconductor structure attached on plane of internal side of shell body with heat-conductive laminate Download PDFInfo
- Publication number
- DE102004051362A1 DE102004051362A1 DE200410051362 DE102004051362A DE102004051362A1 DE 102004051362 A1 DE102004051362 A1 DE 102004051362A1 DE 200410051362 DE200410051362 DE 200410051362 DE 102004051362 A DE102004051362 A DE 102004051362A DE 102004051362 A1 DE102004051362 A1 DE 102004051362A1
- Authority
- DE
- Germany
- Prior art keywords
- thermally conductive
- main body
- construction according
- conductive main
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Abstract
Description
Die Erfindung schafft einen Gehäuseaufbau eines fotoelektrischen Halbleiters, insbesondere einen Gehäuseaufbau, der sich durch hohe Wärmeleitfähigkeit und einstückige Konfiguration auszeichnet und nur minimal auf Verformung beansprucht ist, so dass Fehlerlosigkeit und Qualität von der Umhüllung (Packaging) verbessert sind, um den Anforderungen an die Umhüllung von elektronischen Chips zu entsprechen. Da die Umhüllungsstärke und die wärmeleitfähige Konfiguration durch die einstückige Erstellung verbessert werden, wird vermieden, dass die Standzeit von fotoelektrischen Einrichtungen durch Überhitzen der fotoelektrischen Chips reduziert wird. Durch Verwendung von wärmeleitendem Material, wie wärmeleitfähiger Klebfolie oder einem Metallgehäuse, wird die Wärmeleitfähigkeit des Umhüllungskörpers gesteigert, wobei mit der einstückigen Konstruktion der Kostenaufwand herabgesetzt wird.The Invention provides a housing structure of a photoelectric semiconductor, in particular a housing structure, characterized by high thermal conductivity and one-piece Configuration characterized and only minimally stressed on deformation is so that flawlessness and quality of the wrapping (packaging) are improved to meet the requirements for the cladding of electronic chips correspond to. Since the serving strength and the thermally conductive configuration by the one-piece Creation will be improved, that will avoid the tool life of photoelectric devices by overheating the photoelectric Chips is reduced. By using heat conductive material, such as thermally conductive adhesive film or a metal case, becomes the thermal conductivity of the envelope body, being with the one-piece Construction of the cost is reduced.
In der Verpackungsindustrie wurde zunehmende Aufmerksamkeit auf das Packaging fotoelektrischer Halbleiter geschenkt, wobei das Packaging von Leuchtdioden (LED) und Lichtsensoren aufgrund der Anforderungen an Kompaktheit von elektronischen Produkten immer bedeutender wird. Leuchtdioden, die den Anforderungen an die Oberflächenmontagetechnik entsprechen und mit zwei, vier oder noch mehr Beinchen versehen sind, benötigen eine noch bessere Umhüllung. Gleichfalls stellen sie auch eine hohe Anforderung an die Helligkeit der umhüllten bzw. eingehüllten Fertigprodukte nach der Umhüllung.In The packaging industry has been receiving increasing attention Photoelectric semiconductor packaging, the packaging of Light emitting diodes (LED) and light sensors due to the requirements is becoming more and more important in the compactness of electronic products. LEDs that meet the requirements of surface mount technology match and have two, four or more legs are, need an even better serving. Likewise, they also make high demands on the brightness the wrapped one or wrapped Finished products after serving.
Wie bekannt ist, bedeutet die elektronische Umhüllungstechnik, dass elektronische Elemente in eine Baueinheit integriert sind, nachdem der Herstellvorgang integrierter Schaltung (IC) des Halbleiters oder der Leuchtdioden abgeschlossen ist. Daher wird ein elektronisches Produkt gefertigt, um alle Verfahren gewisser Gestaltung durchzuführen. Außerdem weist die elektronische Umhüllungstechnik die folgenden vier Funktionen auf: Leistungsverteilung, Signalverteilung, Wärmedissipation und Schutz sowie Unterstützung. Bei IC-Chipumhüllung und LED-Umhüllung findet elektronische Umhüllungstechnik häufig Verwendung.As is known, the electronic cladding means that electronic Elements are integrated into a structural unit after the manufacturing process integrated circuit (IC) of the semiconductor or the light-emitting diodes is completed. Therefore, an electronic product is made, to perform all the procedures of a certain design. In addition, the electronic Serving technology the following four functions: power distribution, signal distribution, heat dissipation and protection as well as support. For IC chip cladding and LED cladding finds electronic cladding technique often Use.
Wie
aus
Durch die Erfindung wird ein Gehäuseaufbau für einen fotoelektrischen Halbleiter geschaffen, der durch einfache Maßnahmen die oben genannten Nachteile nicht aufweist.By The invention will be a housing structure for a Photoelectric semiconductors created by simple measures does not have the above-mentioned disadvantages.
Die Erfindung weist insbesondere die in Anspruch 1 angegebenen Merkmale auf. In den Unteransprüchen sind Ausgestaltungen der Erfindung angegeben.The Invention has in particular the features specified in claim 1 on. In the dependent claims embodiments of the invention are given.
Im Folgenden werden Aufgaben, Merkmale und Funktionsweise der Erfindung anhand des bevorzugten Ausführungsbeispiels und der beigefügten Zeichnungen näher erläutert werden. Es zeigen:in the Following are objects, features and operation of the invention on the basis of the preferred embodiment and the accompanying drawings be explained in more detail. Show it:
Ein erfindungsgemäßes Grundprinzip besteht darin, dass die Verbesserung der Qualität von Lichtquellen durch Verwendung einer Linse zur Fokussierung auf einen Punkt erfolgt und unnötige Komponenten weggelassen sind. Dies gilt insbesondere bei optischen Einrichtungen z.B. Scanner oder digitalen Kameras mit hohen Anforderungen an Helligkeit für ein bestimmtes Arbeitsumfeld. Bei einem Scanner wird eine gleichmäßige Strahlung auf ein Papier und bei digitalen Kameras wird eine ausreichende Lichtquelle für die aufzunehmenden Gegenstände benötigt. Mit dem einstückigen, erfindungsgemäßen Gehäuse wird die Leistung der Wärmeübertragung erhöht und sein Zusammenbau begünstigt.One inventive principle is that improving the quality of light sources by using a lens to focus on one point and unnecessary components are omitted. This applies in particular to optical devices e.g. Scanners or digital cameras with high demands on brightness for a specific work environment. In a scanner, a uniform radiation on a paper and digital cameras will be sufficient Light source for the objects to be picked up needed. With the one-piece, housing according to the invention is the power of heat transfer elevated and its assembly favors.
Für die erfindungsgemäße Plättchenumhüllung kann
auch Drahtbonden angewendet werden, wie in
Nachfolgend
wird Bezug auf
Es
sind insbesondere folgende geringfügig abgewandelte Ausführungsbeispiele
möglich.
Der fotoelektrische Halbleiter
Die Erfindung zeichnet sich dadurch aus, dass sich der bekannte Reflexionsbecher erübrigt, sodass der fokussierte Bereich eine gleichmäßige Helligkeit aufweist, und wobei mit der einstückigen Bauweise des erfindungsgemäßen Gehäuseaufbaus, bei dem Kunststoff, Keramik oder Metall in die metallische Halterung eingebettet sind, die optische Eigenschaft verbessert und der Zusammenbau erleichtert wird, was eine kostengünstige Installierung bewirkt und zu nur geringer Einwirkung auf herkömmliche Chipumhüllungsfließbänder von Leuchtdioden führt. Daher ist die erfindungsgemäße Installierung sehr einfach. Außerdem verbessert der erfindungsgemäße Gehäuseaufbau nicht nur die Leuchtqualität, sondern weist auch einen einfachen Zusammenbau auf. Des Weiteren wirkt der erfindungsgemäße Gehäuseaufbau sich wenig auf das Verarbeitungsverfahren aus und kann völlig in das herkömmliche Umhüllungsverfahren integriert werden, sodass die Umhüllungsmaschine nur gering geändert werden muss. Dies ist als praktisch anzusehen.The Invention is characterized in that the known reflection cup is unnecessary, so the focused area has uniform brightness, and being with the one-piece construction the housing structure according to the invention, in the case of the plastic, ceramic or metal in the metallic holder embedded, the optical property improves and the assembly is facilitated, which causes a cost-effective installation and with little impact on conventional die wrap production lines of LED leads. Therefore, the installation according to the invention is very easy. Furthermore improves the housing structure according to the invention not just the luminosity, but also has a simple assembly. Furthermore, the effect of housing construction according to the invention There is little on the processing and can be completely in the conventional one wrapping method be integrated so that the wrapping machine has to be changed only slightly. This is considered practical.
Zusammengefasst lassen sich mit dem erfindungsgemäßen System beispielsweise folgende Vorteile realisieren:
- 1. Das neue Verfahren lässt sich leicht installieren, was nur geringe Anforderungen sowohl an die Preise der neu aufgebauten Anlagen als auch an die benötigten Erfahrungen und Technik stellen.
- 2. Mit der einstückigen Erstellung wird der Zusammenbau erleichtert.
- 3. Die herkömmlichen Umhüllungsanlagen sind noch benutzbar.
- 4. Im Hinblick auf die Leuchtwirkung liegt eine Gleichmäßigkeit zur Anpassung an optische Anlagen vor.
- 1. The new method is easy to install, which places only small demands both on the prices of the newly constructed systems and on the experience and technology required.
- 2. With the one-piece creation of the assembly is facilitated.
- 3. The conventional wrapping plants are still usable.
- 4. With regard to the lighting effect is a uniformity to adapt to optical systems before.
- 1a1a
- LED-GehäuseaufbauLED housing construction
- 10a10a
- eingebettetes Spritzgußelementembedded injection element
- 11a11a
- Beinchenleg
- 12a12a
- Linselens
- 20a20a
- LED-ChipLED chip
- 30a30a
- Metallplättchenmetal plates
- 40a40a
- Sockel-BecherSocket cup
- 50a50a
- Sockelbase
- 1010
- Gehäusecasing
- 1212
- wärmeleitfähiger Hauptkörperthermally conductive main body
- 1414
- Beinchenleg
- 1616
- Isolationshülleinsulating sleeve
- 2020
- fotoelektrischer Halbleiterphotoelectric semiconductor
- 3030
- wärmeleitendes Plättchenthermally conductive Tile
- 3232
- Substratsubstratum
- 3434
- Flanschflange
- 4040
- Linseneinrichtunglens means
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200410051362 DE102004051362A1 (en) | 2004-10-21 | 2004-10-21 | Package structure of opto-electrical semiconductor, such as light emitting diode, has opto-electrical semiconductor structure attached on plane of internal side of shell body with heat-conductive laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200410051362 DE102004051362A1 (en) | 2004-10-21 | 2004-10-21 | Package structure of opto-electrical semiconductor, such as light emitting diode, has opto-electrical semiconductor structure attached on plane of internal side of shell body with heat-conductive laminate |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102004051362A1 true DE102004051362A1 (en) | 2006-04-27 |
Family
ID=36128900
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200410051362 Ceased DE102004051362A1 (en) | 2004-10-21 | 2004-10-21 | Package structure of opto-electrical semiconductor, such as light emitting diode, has opto-electrical semiconductor structure attached on plane of internal side of shell body with heat-conductive laminate |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE102004051362A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1744415A3 (en) * | 2005-07-11 | 2007-06-13 | Osram Opto Semiconductors GmbH | Housing for a diode laser device, diode laser device and method for producing a diode laser device |
JP2017098549A (en) * | 2015-11-18 | 2017-06-01 | 日亜化学工業株式会社 | Light-emitting device |
JP2021090062A (en) * | 2015-05-20 | 2021-06-10 | 日亜化学工業株式会社 | Light emitting device |
US11428382B2 (en) | 2015-05-20 | 2022-08-30 | Nichia Corporation | Light-emitting device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19945675A1 (en) * | 1998-11-05 | 2000-05-18 | Hewlett Packard Co | Surface-mountable LED housing |
GB2374459A (en) * | 2000-12-18 | 2002-10-16 | Samsung Electro Mech | Light Emitting Device |
DE10326130A1 (en) * | 2002-06-12 | 2003-12-24 | Lumileds Lighting Us | Semiconductor light-emitting device with fluoropolymer lens |
EP1467414A1 (en) * | 2001-12-29 | 2004-10-13 | Hangzhou Fuyang Xinying Dianzi Ltd. | A led and led lamp |
-
2004
- 2004-10-21 DE DE200410051362 patent/DE102004051362A1/en not_active Ceased
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19945675A1 (en) * | 1998-11-05 | 2000-05-18 | Hewlett Packard Co | Surface-mountable LED housing |
GB2374459A (en) * | 2000-12-18 | 2002-10-16 | Samsung Electro Mech | Light Emitting Device |
EP1467414A1 (en) * | 2001-12-29 | 2004-10-13 | Hangzhou Fuyang Xinying Dianzi Ltd. | A led and led lamp |
DE10326130A1 (en) * | 2002-06-12 | 2003-12-24 | Lumileds Lighting Us | Semiconductor light-emitting device with fluoropolymer lens |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1744415A3 (en) * | 2005-07-11 | 2007-06-13 | Osram Opto Semiconductors GmbH | Housing for a diode laser device, diode laser device and method for producing a diode laser device |
US7502399B2 (en) | 2005-07-11 | 2009-03-10 | Osram Opto Semiconductors Gmbh | Package for a laser diode component, laser diode component and method for producing laser diode component |
JP2021090062A (en) * | 2015-05-20 | 2021-06-10 | 日亜化学工業株式会社 | Light emitting device |
US11428382B2 (en) | 2015-05-20 | 2022-08-30 | Nichia Corporation | Light-emitting device |
US11655958B2 (en) | 2015-05-20 | 2023-05-23 | Nichia Corporation | Light-emitting device |
US11892155B2 (en) | 2015-05-20 | 2024-02-06 | Nichia Corporation | Light-emitting device |
JP7455077B2 (en) | 2015-05-20 | 2024-03-25 | 日亜化学工業株式会社 | light emitting device |
JP2017098549A (en) * | 2015-11-18 | 2017-06-01 | 日亜化学工業株式会社 | Light-emitting device |
JP2022009833A (en) * | 2015-11-18 | 2022-01-14 | 日亜化学工業株式会社 | Light-emitting device |
JP7284424B2 (en) | 2015-11-18 | 2023-05-31 | 日亜化学工業株式会社 | light emitting device |
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