DE20112166U1 - Montageklebeband zur verbesserten Fugenabdichtung und Montagebanddispenser - Google Patents
Montageklebeband zur verbesserten Fugenabdichtung und MontagebanddispenserInfo
- Publication number
- DE20112166U1 DE20112166U1 DE20112166U DE20112166U DE20112166U1 DE 20112166 U1 DE20112166 U1 DE 20112166U1 DE 20112166 U DE20112166 U DE 20112166U DE 20112166 U DE20112166 U DE 20112166U DE 20112166 U1 DE20112166 U1 DE 20112166U1
- Authority
- DE
- Germany
- Prior art keywords
- tape
- adhesive
- folded
- cover film
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007789 sealing Methods 0.000 title claims description 7
- 239000002390 adhesive tape Substances 0.000 claims description 65
- 230000001070 adhesive effect Effects 0.000 claims description 35
- 239000010410 layer Substances 0.000 claims description 35
- 239000013039 cover film Substances 0.000 claims description 34
- 239000000853 adhesive Substances 0.000 claims description 30
- 239000012790 adhesive layer Substances 0.000 claims description 29
- 239000011505 plaster Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 7
- 239000000123 paper Substances 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 5
- 238000010276 construction Methods 0.000 claims description 5
- 239000002985 plastic film Substances 0.000 claims description 2
- 229920006255 plastic film Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 2
- 244000309464 bull Species 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/18—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet characterized by perforations in the adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/22—Presence of unspecified polymer
- C09J2400/226—Presence of unspecified polymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/28—Presence of paper
- C09J2400/283—Presence of paper in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Adhesive Tapes (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE20112166U DE20112166U1 (de) | 2001-07-23 | 2001-07-23 | Montageklebeband zur verbesserten Fugenabdichtung und Montagebanddispenser |
| PL02355089A PL355089A1 (en) | 2001-07-23 | 2002-07-18 | Pressure-sensitive adhesive tape and tape dispenser therefor |
| CZ20022538A CZ20022538A3 (cs) | 2001-07-23 | 2002-07-22 | Samolepicí páska a její dávkovač |
| HU0202398A HUP0202398A2 (hu) | 2001-07-23 | 2002-07-22 | Öntapadó szalag házépítésnél keletkező hézagok lezárására, eltömítésére és leragasztására, valamint adagoló az öntapadó szalag számára |
| NO20023479A NO20023479L (no) | 2001-07-23 | 2002-07-22 | Montasjeklebebånd for bedre fugetetning samt montasjebånddispenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE20112166U DE20112166U1 (de) | 2001-07-23 | 2001-07-23 | Montageklebeband zur verbesserten Fugenabdichtung und Montagebanddispenser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE20112166U1 true DE20112166U1 (de) | 2001-10-25 |
Family
ID=7959620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE20112166U Expired - Lifetime DE20112166U1 (de) | 2001-07-23 | 2001-07-23 | Montageklebeband zur verbesserten Fugenabdichtung und Montagebanddispenser |
Country Status (5)
| Country | Link |
|---|---|
| CZ (1) | CZ20022538A3 (enrdf_load_stackoverflow) |
| DE (1) | DE20112166U1 (enrdf_load_stackoverflow) |
| HU (1) | HUP0202398A2 (enrdf_load_stackoverflow) |
| NO (1) | NO20023479L (enrdf_load_stackoverflow) |
| PL (1) | PL355089A1 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE20022503U1 (de) * | 2000-06-27 | 2001-11-15 | Silu Verwaltung Ag, Meggen | Montageklebeband zur verbesserten Fugenabdichtung und Montagebanddispenser |
-
2001
- 2001-07-23 DE DE20112166U patent/DE20112166U1/de not_active Expired - Lifetime
-
2002
- 2002-07-18 PL PL02355089A patent/PL355089A1/xx not_active Application Discontinuation
- 2002-07-22 HU HU0202398A patent/HUP0202398A2/hu unknown
- 2002-07-22 NO NO20023479A patent/NO20023479L/no unknown
- 2002-07-22 CZ CZ20022538A patent/CZ20022538A3/cs unknown
Also Published As
| Publication number | Publication date |
|---|---|
| NO20023479D0 (no) | 2002-07-22 |
| CZ20022538A3 (cs) | 2003-04-16 |
| NO20023479L (no) | 2003-01-24 |
| PL355089A1 (en) | 2003-01-27 |
| HU0202398D0 (enrdf_load_stackoverflow) | 2002-09-28 |
| HUP0202398A2 (hu) | 2004-05-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R207 | Utility model specification |
Effective date: 20011129 |
|
| R150 | Utility model maintained after payment of first maintenance fee after three years |
Effective date: 20041028 |
|
| R157 | Lapse of ip right after 6 years |
Effective date: 20080201 |