PL355089A1 - Pressure-sensitive adhesive tape and tape dispenser therefor - Google Patents
Pressure-sensitive adhesive tape and tape dispenser thereforInfo
- Publication number
- PL355089A1 PL355089A1 PL02355089A PL35508902A PL355089A1 PL 355089 A1 PL355089 A1 PL 355089A1 PL 02355089 A PL02355089 A PL 02355089A PL 35508902 A PL35508902 A PL 35508902A PL 355089 A1 PL355089 A1 PL 355089A1
- Authority
- PL
- Poland
- Prior art keywords
- tape
- pressure
- sensitive adhesive
- adhesive tape
- dispenser therefor
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/18—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet characterized by perforations in the adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/22—Presence of unspecified polymer
- C09J2400/226—Presence of unspecified polymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/28—Presence of paper
- C09J2400/283—Presence of paper in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE20112166U DE20112166U1 (en) | 2001-07-23 | 2001-07-23 | Assembly tape for improved joint sealing and assembly tape dispenser |
Publications (1)
Publication Number | Publication Date |
---|---|
PL355089A1 true PL355089A1 (en) | 2003-01-27 |
Family
ID=7959620
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL02355089A PL355089A1 (en) | 2001-07-23 | 2002-07-18 | Pressure-sensitive adhesive tape and tape dispenser therefor |
Country Status (5)
Country | Link |
---|---|
CZ (1) | CZ20022538A3 (en) |
DE (1) | DE20112166U1 (en) |
HU (1) | HUP0202398A2 (en) |
NO (1) | NO20023479L (en) |
PL (1) | PL355089A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10031214B4 (en) * | 2000-06-27 | 2005-10-27 | Silu Verwaltung Ag | Mounting tape for improved joint sealing and assembly tape dispenser |
-
2001
- 2001-07-23 DE DE20112166U patent/DE20112166U1/en not_active Expired - Lifetime
-
2002
- 2002-07-18 PL PL02355089A patent/PL355089A1/en not_active Application Discontinuation
- 2002-07-22 NO NO20023479A patent/NO20023479L/en unknown
- 2002-07-22 HU HU0202398A patent/HUP0202398A2/en unknown
- 2002-07-22 CZ CZ20022538A patent/CZ20022538A3/en unknown
Also Published As
Publication number | Publication date |
---|---|
CZ20022538A3 (en) | 2003-04-16 |
DE20112166U1 (en) | 2001-10-25 |
HU0202398D0 (en) | 2002-09-28 |
NO20023479L (en) | 2003-01-24 |
HUP0202398A2 (en) | 2004-05-28 |
NO20023479D0 (en) | 2002-07-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
REFS | Decisions on refusal to grant patents (taken after the publication of the particulars of the applications) |