DE20006210U1 - Layer arrangement for the production of a printed circuit board - Google Patents

Layer arrangement for the production of a printed circuit board

Info

Publication number
DE20006210U1
DE20006210U1 DE20006210U DE20006210U DE20006210U1 DE 20006210 U1 DE20006210 U1 DE 20006210U1 DE 20006210 U DE20006210 U DE 20006210U DE 20006210 U DE20006210 U DE 20006210U DE 20006210 U1 DE20006210 U1 DE 20006210U1
Authority
DE
Germany
Prior art keywords
layer
arrangement according
metal foil
layer arrangement
metallic carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20006210U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
POST STEFAN
Original Assignee
POST STEFAN
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by POST STEFAN filed Critical POST STEFAN
Priority to DE20006210U priority Critical patent/DE20006210U1/en
Publication of DE20006210U1 publication Critical patent/DE20006210U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
    • B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßtThe description text was not recorded electronically

Claims (7)

1. Schichtanordnung zur Herstellung einer Leiterplatte mit einer Metallfolie, die an mindestens einer Seite dersel­ ben mit einer metallischen Trägerschicht verbunden ist, dadurch gekennzeichnet, dass die Metallfolie (4, 6) durch Punktschweißen mit der metallischen Trägerschicht (3, 5) verbunden ist.1. Layer arrangement for producing a printed circuit board with a metal foil, which is connected to a metallic carrier layer on at least one side thereof, characterized in that the metal foil ( 4 , 6 ) is connected to the metallic carrier layer ( 3 , 5 ) by spot welding. 2. Schichtanordnung nach Anspruch 1, dadurch gekennzeich­ net, dass die Metallfolie (4, 6) in einem umlaufenden Randbereich (8) durch eine Mehrzahl von voneinander be­ abstandeten Punktschweißstellen (7) mit der metallischen Trägerschicht (3, 5) verbunden ist.2. Layer arrangement according to claim 1, characterized in that the metal foil ( 4 , 6 ) in a peripheral edge area ( 8 ) by a plurality of spaced apart spot welds ( 7 ) with the metallic carrier layer ( 3 , 5 ) is connected. 3. Schichtanordnung nach Anspruch 1 oder 2, dadurch gekenn­ zeichnet, dass der Abstand benachbarter Punktschweiß­ stellen (7) in einem Bereich von 1 bis 10 cm liegt.3. Layer arrangement according to claim 1 or 2, characterized in that the distance between adjacent spot welds ( 7 ) is in a range of 1 to 10 cm. 4. Schichtanordnung nach einem der Ansprüche 1 bis 3, da­ durch gekennzeichnet, dass eine Mehrzahl von Schichtpa­ keten (P1, P2) gebildet sind, wobei benachbart zu einer der Lamination dienenden Laminationsplatte (2) ein äuße­ res Schichtpaket (P1) angeordnet ist, das aus einer ein­ zigen der Laminationsplatte (2) zugewandten metallischen Trägerschicht (3) und einer mit derselben verbundenen Metallfolie (4) besteht, und dass sich den äußeren Schichtpaketen (P1) auf einer der Laminationsplatte (2) abgewandten Seite mehrere innere Schichtpakte (P2) an­ schließen, die jeweils aus einer einzigen metallischen Trägerschicht (5) und zu beiden Seiten derselben ange­ ordneten Metallfolien (6) bestehen, und dass zwischen den Schichtpaketen (P1, P2) jeweils eine nichtmetalli­ sche Schicht (10) angeordnet ist.4. Layer arrangement according to one of claims 1 to 3, characterized in that a plurality of layer packets (P1, P2) are formed, an outer layer packet (P1) being arranged adjacent to a lamination plate ( 2 ) serving for lamination, which consists of a single one of the lamination plate ( 2 ) facing metallic carrier layer ( 3 ) and a metal foil ( 4 ) connected to it, and that the outer layer packs (P1) on a side facing away from the lamination plate ( 2 ) have a plurality of inner layer packs (P2 ) close, each consisting of a single metallic carrier layer ( 5 ) and on both sides of the same arranged metal foils ( 6 ), and that between the layer packages (P1, P2) each have a non-metallic layer ( 10 ) is arranged. 5. Schichtanordnung nach einem der Ansprüche 1 bis 4, da­ durch gekennzeichnet, dass die nichtmetallische Schicht als eine Polymerschicht (10) ausgebildet ist, die als Trägerschicht für die Leiterplatte dient.5. Layer arrangement according to one of claims 1 to 4, characterized in that the non-metallic layer is designed as a polymer layer ( 10 ) which serves as a carrier layer for the printed circuit board. 6. Schichtanordnung nach einem der Ansprüche 1 bis 5, da­ durch gekennzeichnet, dass die Metallfolie (4, 6) aus Kupfer besteht.6. Layer arrangement according to one of claims 1 to 5, characterized in that the metal foil ( 4 , 6 ) consists of copper. 7. Schichtanordnung nach einem der Ansprüche 1 bis 6, da­ durch gekennzeichnet, dass die metallische Trägerschicht (3, 5) aus einem Stahlwerkstoff besteht.7. Layer arrangement according to one of claims 1 to 6, characterized in that the metallic carrier layer ( 3 , 5 ) consists of a steel material.
DE20006210U 2000-04-05 2000-04-05 Layer arrangement for the production of a printed circuit board Expired - Lifetime DE20006210U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE20006210U DE20006210U1 (en) 2000-04-05 2000-04-05 Layer arrangement for the production of a printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20006210U DE20006210U1 (en) 2000-04-05 2000-04-05 Layer arrangement for the production of a printed circuit board

Publications (1)

Publication Number Publication Date
DE20006210U1 true DE20006210U1 (en) 2000-08-03

Family

ID=7939795

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20006210U Expired - Lifetime DE20006210U1 (en) 2000-04-05 2000-04-05 Layer arrangement for the production of a printed circuit board

Country Status (1)

Country Link
DE (1) DE20006210U1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005095146A2 (en) * 2004-03-31 2005-10-13 Johnson Controls Gmbh Component, particularly for an adjusting element and especially for a vehicle, adjusting element, especially for a vehicle, and method for the production of a component, particularly for an adjusting element and especially for a vehicle

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005095146A2 (en) * 2004-03-31 2005-10-13 Johnson Controls Gmbh Component, particularly for an adjusting element and especially for a vehicle, adjusting element, especially for a vehicle, and method for the production of a component, particularly for an adjusting element and especially for a vehicle
WO2005095146A3 (en) * 2004-03-31 2006-07-13 Johnson Controls Gmbh Component, particularly for an adjusting element and especially for a vehicle, adjusting element, especially for a vehicle, and method for the production of a component, particularly for an adjusting element and especially for a vehicle

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20000907

R156 Lapse of ip right after 3 years

Effective date: 20031031