DE19964339B4 - The laser diode - Google Patents
The laser diode Download PDFInfo
- Publication number
- DE19964339B4 DE19964339B4 DE19964339A DE19964339A DE19964339B4 DE 19964339 B4 DE19964339 B4 DE 19964339B4 DE 19964339 A DE19964339 A DE 19964339A DE 19964339 A DE19964339 A DE 19964339A DE 19964339 B4 DE19964339 B4 DE 19964339B4
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- Prior art keywords
- laser diode
- arrangement according
- plate
- diode
- diode arrangement
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1664—Laser beams characterised by the way of heating the interface making use of several radiators
- B29C65/1667—Laser beams characterised by the way of heating the interface making use of several radiators at the same time, i.e. simultaneous laser welding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1664—Laser beams characterised by the way of heating the interface making use of several radiators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1674—Laser beams characterised by the way of heating the interface making use of laser diodes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
- B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
- B29C66/816—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps
- B29C66/8167—Quick change joining tools or surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
- B29C66/818—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the cooling constructional aspects, or by the thermal or electrical insulating or conducting constructional aspects of the welding jaws or of the clamps ; comprising means for compensating for the thermal expansion of the welding jaws or of the clamps
- B29C66/8187—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the cooling constructional aspects, or by the thermal or electrical insulating or conducting constructional aspects of the welding jaws or of the clamps ; comprising means for compensating for the thermal expansion of the welding jaws or of the clamps characterised by the electrical insulating constructional aspects
- B29C66/81871—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the cooling constructional aspects, or by the thermal or electrical insulating or conducting constructional aspects of the welding jaws or of the clamps ; comprising means for compensating for the thermal expansion of the welding jaws or of the clamps characterised by the electrical insulating constructional aspects of the welding jaws
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/84—Specific machine types or machines suitable for specific applications
- B29C66/841—Machines or tools adaptable for making articles of different dimensions or shapes or for making joints of different dimensions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/02365—Fixing laser chips on mounts by clamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/301—Three-dimensional joints, i.e. the joined area being substantially non-flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2101/00—Use of unspecified macromolecular compounds as moulding material
- B29K2101/12—Thermoplastic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
- H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4018—Lasers electrically in series
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
- H01S5/4043—Edge-emitting structures with vertically stacked active layers
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Semiconductor Lasers (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Laserdiodenanordnung (10) mit:
einer Vielzahl von zweiseitigen, parallel angeordneten Metallplatten (12);
Befestigungseinrichtungen, die die Platten (12) tragen;
einer Vielzahl von Laserdioden (14), wobei auf einer Seite jeder Platte (12) eine Laserdiode (14) befestigt ist und wobei eine der beiden Elektroden jeder Diode (14) in elektrischem Kontakt mit der ersten Seite der Platte (12) ist, auf der die Diode (14) befestigt ist;
einer Vielzahl von elektrischen Kontakteinrichtungen zum Herstellen eines elektrischen Kontakts zwischen der anderen Elektrode einer Diode (14) und einer Platte (12); und Verriegelungseinrichtungen, welche die Befestigungseinrichtungen so erfassen, dass die Platten (12) durch die Befestigungseinrichtungen in ihrer Lage gehalten werden, wobei die Befestigungseinrichtungen die Metallplatten (12) elektrisch isoliert voneinander tragen und jede Kontakteinrichtung so angeordnet ist,
dass sie elektrischen Kontakt zwischen der anderen Elektrode einer Diode (14) und der zweiten Seite einer zugewandten, daneben angeordneten Metallplatte (12) herstellt, und wobei elektrisch isolierende Distanzeinrichtungen zwischen...Laser diode arrangement (10) with:
a plurality of two-sided, parallel metal plates (12);
Fastening devices that support the plates (12);
a plurality of laser diodes (14) having on one side of each plate (12) a laser diode (14) attached and one of the two electrodes of each diode (14) in electrical contact with the first side of the plate (12) the diode (14) is fixed;
a plurality of electrical contact means for making electrical contact between the other electrode of a diode (14) and a plate (12); and locking means which engage the fastening means to hold the panels (12) in place by the fastening means, the fastening means supporting the metal panels (12) in electrical isolation from each other and each contact means being arranged
in that it makes electrical contact between the other electrode of a diode (14) and the second side of a facing, adjacent metal plate (12), and wherein electrically insulating spacer means between ...
Description
Die Erfindung bezieht sich auf Schweißen, Verbinden oder Verformen von thermoplastischen Werkstücken durch Laserenergie und betrifft den Aufbau einer Laserdiodenanordnung zum Versorgen eines Werkstückbereiches mit gleichförmiger und intensiver Laserstrahlung, um eine schnelle und gleichförmige Erhitzung des thermoplastischen Materials in diesem Bereich hervorzurufen. Insbesondere betrifft die Erfindung eine Laserdiodenanordnung mit einer Vielzahl von zweiseitigen, parallel angeordneten Metallplatten, Befestigungseinrichtungen, die die Platten tragen, einer Vielzahl von Laserdioden, wobei auf einer Seite jeder Platte eine Laserdiode befestigt ist und wobei eine der beiden Elektroden jeder Diode in elektrischem Kontakt mit der ersten Seite der Platte ist, auf der die Diode befestigt ist, einer Vielzahl von elektrischen Kontakteinrichtungen zum Herstellen eines elektrischen Kontakts zwischen der anderen Elektrode einer Diode und einer Platte, und Verriegelungseinrichtungen, welche die Befestigungseinrichtungen so erfassen, dass die Platten durch die Befestigungseinrichtungen in ihrer Lage gehalten werden, wobei die Befestigungseinrichtungen die Metallplatten elektrisch isoliert voneinander tragen und jede Kontakteinrichtung so angeordnet ist, dass sie elektrischen Kontakt zwischen der anderen Elektrode einer Diode und der zweiten Seite einer zugewandten, daneben angeordneten Metallplatte herstellt, und wobei elektrisch isolierende Distanzeinrichtungen zwischen jedem Satz von nebeneinander angeordneten Platten angeordnet sind.The This invention relates to welding, bonding or deformation of thermoplastic workpieces by laser energy and concerns the construction of a laser diode array for supplying a workpiece area with uniform and intense laser radiation to ensure rapid and uniform heating of the thermoplastic material in this area. In particular, the invention relates to a laser diode arrangement with a plurality of two-sided, parallel metal plates, Fasteners carrying the plates, a variety of laser diodes, wherein on one side of each plate a laser diode is attached and wherein one of the two electrodes of each diode in electrical Contact with the first side of the plate is mounted on the diode is, a plurality of electrical contact means for manufacturing an electrical contact between the other electrode of a Diode and a plate, and interlocking devices which the Grasp fastening devices so that the plates through the Fastening devices are held in position, the Fasteners the metal plates electrically isolated carry each other and each contactor is arranged so that they make electrical contact between the other electrode one Diode and the second side of a facing, arranged next to it Metal plate manufactures, and wherein electrically insulating distance means between each set of juxtaposed plates are arranged.
Das Schweißen und Verbinden von thermoplastischen Werkstücken durch Laserenergie ist gut bekannt. Der Bereich, in welchem Werkstücke verbunden werden sollen, wird mit einem Laserstrahl beleuchtet, und die resultierende Dissipation der Energie, wenn diese von ausreichender Größe ist, verursacht ein Erweichen und Fließen von thermoplastischem Material, wenn das erweichte Material mit Druck beaufschlagt wird. Bei dem Beendigen der Beaufschlagung mit Laserenergie kühlt das thermoplastische Material ab und erstarrt, so daß sich eine Verbindung ergibt.The welding and joining thermoplastic workpieces by laser energy well known. The area in which workpieces are to be connected, is illuminated with a laser beam, and the resulting dissipation the energy, if it is of sufficient size, causes a softening and flow of thermoplastic material when the softened material is under pressure is charged. At the termination of the application of laser energy that cools thermoplastic material from and solidifies, so that there is a compound.
Die Laserenergie wird am zweckmäßigsten durch eine Laserdiode geliefert, die aus einer elektrischen Stromquelle gespeist wird, welche im Dauerstrichbetrieb arbeitet. Zum Liefern eines Strahls, der größer ist als derjenige, der aus einer einzelnen Diode verfügbar ist, sind Diodenanordnungen entwickelt worden. Ein typisches kommerzielles Produkt beinhaltet 19 Dioden, die eine Ausgangsleistung von 20 W produzieren. Eine Anordnung dieses Typs ist relativ teuer und ist außerdem auf das Beleuchten einer im wesentlichen geraden, länglichen Werkstückoberfläche beschränkt.The Laser energy is most suitable a laser diode comes from an electrical power source is fed, which works in continuous wave mode. For delivery a jet that's bigger as the one available from a single diode, Diode arrangements have been developed. A typical commercial one Product includes 19 diodes, which have an output power of 20W to produce. An arrangement of this type is relatively expensive and is Furthermore on lighting a substantially straight, elongated Workpiece surface limited.
Aus
der
Die
Die
Aufgabe der Erfindung ist die Schaffung einer Laserdiodenanordnung, die einen hohen Grad an Flexibilität und Vielseitigkeit bietet, so dass sie zum Schweißen oder Verbinden von Werkstücken unterschiedlicher Formen, einschließlich gekrümmter, länglicher Werkstückbereiche, verwendet werden kann.The object of the invention is to provide a laser diode assembly which offers a high degree of flexibility and versatility, so that it can be used for welding or joining workpieces of different shapes, including curved, elongated workpiece areas, can be used.
Diese Aufgabe wird erfindungsgemäß durch eine Laserdiodenanordnung mit den Merkmalen des Anspruchs 1 gelöst.These The object is achieved by a Laser diode arrangement solved with the features of claim 1.
Erfindungsgemäß ist vorgesehen, dass die Befestigungseinrichtungen eine flexible Einrichtung umfassen, die der Anordnung ermöglicht, eine gekrümmte Konfiguration einzunehmen. Die erfindungsgemäße Laserdiodenanordnung ist eine relativ billige Anordnung, die einzelne Laserdioden umfaßt, wobei die Diodenmenge wählbar ist, um sie einem besonderen Anwendungsfall anzupassen. Darüber hinaus kann die Anordnung eine Form zum Beleuchten von entweder einem geraden oder einem gekrümmten, länglichen Werkstückbereich annehmen. Die Laserdiodenanordnung nach der Erfindung ist insbesondere zum Erhitzen und Schmelzen von thermoplastischem Material geeignet.According to the invention, it is provided in that the fastening devices comprise a flexible device, which allows the arrangement a curved one Configuration to take. The laser diode arrangement according to the invention is a relatively cheap arrangement comprising individual laser diodes, wherein the amount of diode selectable is to suit a particular application. Furthermore For example, the arrangement may have a shape for illuminating either a straight line or a curved, elongated Workpiece area accept. The laser diode arrangement according to the invention is in particular suitable for heating and melting thermoplastic material.
Vorteilhafte Ausgestaltungen der Erfindung bilden die Gegenstände der Unteransprüche.advantageous Embodiments of the invention form the subject of the dependent claims.
Die Laseranordnung umfaßt eine Vielzahl von Laserdioden, die jeweils auf einer Seite einer Metallplatte befestigt sind, welche als eine Kühlrippe dient, und die Vielzahl der Platten, die an Befestigungseinrichtungen angeordnet sind, welche die Platten in einer Position tragen, in der sie beabstandet und nebeneinander angeordnet sind, bilden so die Anordnung. Die Befestigungseinrichtungen umfassen in einer Ausgestaltung flexible, elektrisch nichtleitfähige Stäbe, welche die Platten durchdringen. Die Stäbe bewirken, wenn sie gebogen sind, daß die Anordnung eine entsprechende Konfiguration einnimmt, wodurch der Anordnung ermöglicht wird, nicht nur einen geraden, länglichen Oberflächenbereich eines Werkstückes zu beleuchten, sondern auch einen gekrümmten Bereich, wie beispielsweise eine abgerundete Ecke. Die Dioden sind elektrisch in Reihe geschaltet, um sicherzustellen, daß jede Diode im wesentlichen dieselbe Menge an Laserenergie liefert, wenn ein Werkstück beleuchtet wird. Aufgrund dessen, daß die Diodenmenge wählbar ist, entspricht der beleuchtete Bereich der Diodenmenge, welche die Anordnung bildet. Außerdem läßt sich eine defekte Diode leicht austauschen, wodurch die Notwendigkeit vermieden wird, die gesamte Anordnung auszutauschen.The Laser arrangement includes a variety of laser diodes, each one on one side of a Metal plate are attached, which serves as a cooling fin, and the variety the plates, which are arranged on fastening devices, which carry the plates in a position in which they are spaced and arranged side by side, so form the arrangement. The fastening devices In one embodiment, flexible, electrically non-conductive rods which penetrate the plates. The bars cause, if they are bent, that the arrangement an appropriate Configuration, thereby allowing the arrangement to not just a straight, elongated one surface area a workpiece to illuminate, but also a curved area, such as a rounded corner. The diodes are electrically connected in series, to make sure each one Diode delivers substantially the same amount of laser energy when a workpiece is illuminated. Due to the fact that the amount of diodes is selectable, corresponds to the illuminated area of the diode set, which is the arrangement forms. In addition, can be easily replace a defective diode, eliminating the need it is avoided to exchange the entire arrangement.
Ausführungsbeispiele der Erfindung werden im Folgenden unter Bezugnahme auf die Zeichnungen näher beschrieben. Es zeigtembodiments The invention will be described below with reference to the drawings described in more detail. It shows
In
den Figuren und insbesondere in den
Befestigungseinrichtungen
in Form eines Satzes von drei Stäben
Die
Platten
Die
Platten
Von
den beiden Elektroden einer Laserdiode ist, wie oben gesagt, die
Kathodenelektrode mit der Platte
Jede
metallische Anschlußklemme
Um
einen guten elektrischen Kontakt zwischen der Anschlußklemme
Wenn
die Tragstäbe
ausreichend biegsam sind, kann die Anordnung veranlaßt werden,
eine gekrümmte
Konfiguration
Um
die Schaffung einer gekrümmten
oder gebogenen Anordnung zu erleichtern, müssten die Tragstäbe flexibel
sein. Zum Beispiel hat sich isolierter mehradriger Kupferdraht mit
einem Außendurchmesser
von 3 mm (Nr. 14 AWG (American Wire Gauge oder Amerikanische Drahtlehre))
als zum Herstellen dieses Zustands geeignet erwiesen. Darüber hinaus
kann das Biegen der Anordnung durch eine geeignete Form der Distanzscheiben,
die zwischen den einzelnen Platten angeordnet sind, verbessert werden.
Statt der mit ebenen Seiten versehenen Distanzscheiben
Es
ist klar, daß die
Verriegelungseinrichtung, die die Tragstäbe erfaßt, um die Platten
Die
Dioden, wie sie in
Bei
Bedarf können
eine oder mehrere Dioden durch einen einstellbaren Widerstand
Wenn eine Laserdiode ausfällt, läßt sich die Anordnung leicht öffnen, die fehlerhafte Diode entfernen und eine neue Diode installieren. Dieses Merkmal stellt einen bedeutsamen Vorteil gegenüber versiegelten und verschweißten Anordnungen dar.If a laser diode fails, let yourself slightly open the arrangement, remove the faulty diode and install a new diode. This feature represents a significant advantage over sealed ones and welded Arrangements represent.
Ein
weiteres wichtiges Merkmal der Erfindung ist die Tatsache, daß die Menge
an Laserdioden wählbar
ist, um sie einem besonderen Werkstück anzupassen. Die Platten
In einer weiteren Ausführungsform können die Tragstäbe aus Metalldraht bestehen, der mit einer isolierenden Ummantelung versehen ist.In a further embodiment can they carrying bars Made of metal wire, with an insulating sheath is provided.
Eine verbesserte Kühlung der Anordnung kann erreicht werden, indem Kühlluft durch den Zwischenraum zwischen den Platten geblasen wird, wodurch eine erhöhte Wärmeübertragung zwischen den Platten und der Umgebung erzielt wird.An improved cooling of the arrangement can be achieved by cooling air through the Zwi space between the plates is blown, whereby an increased heat transfer between the plates and the environment is achieved.
Claims (19)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/159,735 US6205160B1 (en) | 1998-09-24 | 1998-09-24 | Laser diode array |
US09/159,735 | 1998-09-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE19964339A1 DE19964339A1 (en) | 2003-11-27 |
DE19964339B4 true DE19964339B4 (en) | 2009-09-17 |
Family
ID=22573792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19964339A Expired - Fee Related DE19964339B4 (en) | 1998-09-24 | 1999-09-17 | The laser diode |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR20000023349A (en) |
CA (1) | CA2282918A1 (en) |
DE (1) | DE19964339B4 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011012511A1 (en) * | 2011-02-25 | 2012-08-30 | Limo Patentverwaltung Gmbh & Co. Kg | Device for superposing laser beams of a plurality of laser light sources in a working plane |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2957841B1 (en) * | 2010-03-24 | 2012-07-06 | Plasticell | APPARATUS FOR WELDING THERMOPLASTIC MEMBRANES |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3555452A (en) * | 1967-10-02 | 1971-01-12 | Litton Precision Prod Inc | Laser apparatus |
US3771031A (en) * | 1973-03-05 | 1973-11-06 | Texas Instruments Inc | Header assembly for lasers |
US4716568A (en) * | 1985-05-07 | 1987-12-29 | Spectra Diode Laboratories, Inc. | Stacked diode laser array assembly |
US4719631A (en) * | 1986-01-10 | 1988-01-12 | The United States Of America As Represented By The Secretary Of The Air Force | Conductively cooled laser diode array pumped laser |
US4826269A (en) * | 1987-10-16 | 1989-05-02 | Spectra Diode Laboratories, Inc. | Diode laser arrangement forming bright image |
US5764675A (en) * | 1994-06-30 | 1998-06-09 | Juhala; Roland E. | Diode laser array |
-
1999
- 1999-09-17 DE DE19964339A patent/DE19964339B4/en not_active Expired - Fee Related
- 1999-09-21 KR KR1019990040688A patent/KR20000023349A/en not_active Application Discontinuation
- 1999-09-22 CA CA002282918A patent/CA2282918A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3555452A (en) * | 1967-10-02 | 1971-01-12 | Litton Precision Prod Inc | Laser apparatus |
US3771031A (en) * | 1973-03-05 | 1973-11-06 | Texas Instruments Inc | Header assembly for lasers |
US4716568A (en) * | 1985-05-07 | 1987-12-29 | Spectra Diode Laboratories, Inc. | Stacked diode laser array assembly |
US4719631A (en) * | 1986-01-10 | 1988-01-12 | The United States Of America As Represented By The Secretary Of The Air Force | Conductively cooled laser diode array pumped laser |
US4826269A (en) * | 1987-10-16 | 1989-05-02 | Spectra Diode Laboratories, Inc. | Diode laser arrangement forming bright image |
US5764675A (en) * | 1994-06-30 | 1998-06-09 | Juhala; Roland E. | Diode laser array |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011012511A1 (en) * | 2011-02-25 | 2012-08-30 | Limo Patentverwaltung Gmbh & Co. Kg | Device for superposing laser beams of a plurality of laser light sources in a working plane |
Also Published As
Publication number | Publication date |
---|---|
KR20000023349A (en) | 2000-04-25 |
DE19964339A1 (en) | 2003-11-27 |
CA2282918A1 (en) | 2000-03-24 |
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