DE19807202A1 - Process and arrangement for fixing and making electrical contact of electronic components on a circuit board - Google Patents

Abstract

The contact surfaces and or conductors are fixed to the circuit board (1) by spraying on of a fluid that hardens as it cools and is electrically conductive at least when hardened. Contact to the circuit components (3) is made by their positioning prior to fluid hardening. After hardening, an electrically conducting and adhesive contact is made between the components and conductors or contacts. An Independent claim is made for a device arrangement for positioning and fixing chips on a circuit board. The device includes a spray device (7) for output of the fixing fluid and associated equipment for controlling its movement and spray angle.

Description

The invention relates to a method for positioning kidneys of electronic components, such as construction elements ten of discrete circuit technology and / or chips, on one circuit board and for contacting the components connections with contact surfaces and / or conductor tracks that are arranged on the circuit carrier. The invention be continues on an arrangement and its Ausge Organization to carry out the procedure.

The need for ever higher integration density in the micro electronics requires manufacturing and connection electronic assemblies increasingly procedures and devices the optimal use of the available scarf enable carrier surfaces. When equipping Circuit carriers is the ratio of the available circuit board area to the area that is used for the Components are needed, a measure of packing density. In the rule is about the optimal packing density Circuit carriers with conductor lines to provide the components elements at their pre-calculated location on the circuit board to place and fasten or the components to connect conclusions with the conductor lines.

As far as the handling of the components is concerned, in particular especially their transport, alignment and positioning, technical solutions are known in the prior art, de basic principles, even with smaller components can still be largely maintained. So at for example for the assembly of multi-pole components uses the so-called pick & place method, in which the  Assembly process the transport of the individual components from the pick-up to the loading position on the ladder plate surface and where an exact Posi tioning is possible. In contrast, when it came to the assembly with simple, about two-pole components, that's the way it is enforced called chip shooter principle, in which the Be less precise, but with a higher number of components performance can be made. These procedures are meant to are not considered further here.

The application of the conductor tracks has been constant Demand for increased packing density and complexity electronic circuits from single layer to multilayers circuit led, but disadvantageously with growing number of layers and the associated higher heat Removal problems have arisen during soldering.

The solution to the problem has led to micro-wire technology. Here a wiring machine is added via a CAD system controls the insulated circuit wires in a program mated circuit pattern. Changes in the conductor rail Images can be executed directly in the CAD system and as Control data are passed on to the laying machine. However, this technology is necessary because of that quite complicated construction of the laying machine and the Need for mechanical fixation of the wire the circuit carrier is quite complex.

DE-OS 35 39 781 A1 describes a "method and (a) Device for producing an electrically conductive Structure "in particular to create conductor patterns represented a circuit board. It is provided that conductive structure or the conductor pattern on the board  by means of a sprayable liquid, which at least in ge dry state is electrically conductive, contactless to apply. To perform this procedure is a pre Direction indicated that a nozzle for generating a river and a device for disassembling it Jet into individual liquid drops. The An order is also provided with a deflection device, with which the radiation direction of the liquid can be influenced is. The process and arrangement are inkjet printing technology borrowed.

The conductor tracks are applied by coordination the interaction of the sprayer with the deflector no direction on the one hand and the movement of the carrier material than on which the electrically conductive liquid is applied to be worn, on the other hand. This procedure forms the basis for the effective production of lei but it doesn't solve the problem of simple ren and less expensive to manufacture one with high inte Gration-tight assembled circuit board.

With regard to the connection of electronic contacts Components when placed on a circuit board it is known for example from the chip assembly To connect the chip to the circuit carrier so that its active side, i.e. the one that contains the structures for the Circuit carrier is aligned. The contact connection then takes place via so-called bumps before the chip assembly applied to the silicon substrate in a separate process have been brought. These bumps can go all over Chip area be distributed, or the silicon carrier has analog contact point pattern in the form of con clock pads or bumps. With this as a flip  Chip technology is known above all the required circuit carrier area is reduced.

The disadvantage of all technologies presented so far stands in the fact that a uniform and consistent Process starting with the application of the line pattern on the circuit board via the feed and positioning tion of the electronic components up to the contact binding of the components is not possible, but the basic manufacturing technologies always locally separate process steps and therefore a lot Effort for transport, adjustment, etc. and also a lot Require manufacturing time.

Proceeding from this, the object of the invention is to create a method and an associated arrangement, with which a reduction of the process steps as well as a higher manufacturing flexibility and thus a clear knock-out reduction in the production of fitted scarf carriers can be achieved.

According to the invention, this object is achieved in a method of Resolved above in that the contact surfaces and / or conductor tracks by spraying a liquid, solidifying after spraying and at least solidifying state of electrically conductive substance on the scarf tion carrier are applied and the contact connection of the electronic components is made while the substance sprayed onto the circuit carrier surface at least not yet in the area of the component connections is in a solidified state. With the progressive The substance then solidifies electrically conductive and at the same time mechanical connection between the  Conductor tracks on the circuit board and the electronic Component or its connections.

It is thus advantageously possible to apply the lei cables on the circuit board, feeding and positioning kidney of the electronic components and the contacting the component connections with contact surfaces and / or Lei terzügen on the circuit board in a continuous Process. This has the advantage that the design of the line pattern only from the control function for the device is dependent on the spraying of the electrically conductive liquid is made. Also the Positioning of the electronic components is only depends on the control function of the unit, which the Zu guidance and positioning of the respective component takes. So that the design of the populated circuit largely reduced to a software problem, which results in high manufacturing flexibility. Change For example, the conductor pattern or the conductor track leadership can be carried out quickly and easily the. The effectiveness in producing with discrete electronic components populated circuit boards and this also applies to circuit carriers provided with chips no longer depend on quantities as in the prior art pending.

A variant of the invention provides for this hen that the components before spraying or during the spraying of the substance can be positioned and the Substance right up to the component connections and contacting them on the circuit board is brought. Alternatively, however, it is conceivable that the components after spraying the substance, however  even before their complete solidification, who positions the and the component connections to the not yet solidified substance, if necessary under pressure become.

With this procedure, an essential effectiveness Increase in crime achieved in that no longer as previously in independent from one another, and also spatially separated and Process steps requiring transport first of all Conductor tracks applied and then in further steps electronic components and their contacts are connected to the conductor tracks, for which purpose the conductor track at least melted again at the contact points Need to become.

Another major advantage of the inventive solution is that with the electrical contact Components also mechanically durable on the scarf tungsten beams are attached. It follows that not necessarily commonly re-meltable substances for contact connection the component connections or for the conductor tracks must be.

According to the invention, the components can nevertheless be provided elements with the help of an electrically non-conductive Attach adhesive to the circuit board. In order to increases functional reliability and the lifespan of populated circuit boards that have a higher thermal or exposed to permanent mechanical stress.

A method for positioning is within the scope of the invention ren of electronic components on a circuit carrier and for the electrical connection of the connections  different, on one and the same circuit carrier ordered components among each other. Here are in one first step the components are positioned and then the conductor tracks that follow the component connections connect a given line pattern to each other, applied to the circuit carrier. That's the way it is development of a circuit carrier with several electronics the components is assembled in a continuous technological process possible.

The increase in effectiveness results from the fact that the scarf tungsten carrier or the bare board only once trans ported and aligned in one position of both the conductor tracks and the electronic ones Components can be applied. All still at the booth the technology required intermediate steps to continue transport, put down and reposition the board omitted in the placement device.

Another very advantageous embodiment of the Erfin dung provides that initially one or more conductors trains are applied to the circuit board and a form the first managerial level. These traces are now ins as a whole or in sections with an elec tric non-conductive, forming a thin insulating layer Material covered. Then over this insulating layer more, the conductor tracks given under the insulating layer if crossing traces are applied that way form a second managerial level.

It is simple and technological space-saving possible, multiple conductor tracks or conductor tracks to arrange planes one above the other on a circuit board,  the advantage of the already mentioned flexibility of the inventive method is retained. The alternate Application of conductor tracks and insulating layers can be done in this way often take place until a predetermined number of n conductors NEN with an insulating layer in between are arranged one above the other.

According to the invention it is further provided that the Aufbrin against the insulating layer by spraying an electrical non-conductive, liquid during spraying, after splashing and then firmly on the bottom adhering material. It is also at ent speaking modification of the process steps possible, crossing conductor lines from different conductor levels NEN electrically to connect by the desired Posi tion is not sprayed on insulation material.

An embodiment of the invention also consists in that after applying the conductor tracks in one or more Ren conductor levels and / or after the contact connection of the Components, ie after the completion of the electronics circuit arrangement, via the conductor tracks and / or over the components a protective coating from an electrical non-conductive material that solidifies after spraying, about a transparent plastic.

Here again there is an increase in effectiveness characterized in that the application of the protective coating assembled board can remain in the position in which the assembly with the components or the application of the Conductor paths have taken place. This eliminates further complex Handling steps, such as realignment in different production stations, as shown in  the prior art for applying protective coating trains were required.

The invention further relates to an arrangement for Manufacture of circuit boards using electronic Components, such as chips or wafers, are equipped, wherein the component connections with contact surfaces and / or Lei tracks, which are also to be arranged on the circuit board are in an electrically conductive connection.

It is provided according to the invention that a relative to the circuit carrier movable injection device for a liquid that solidifies after application and the con Substances forming contact areas or conductor tracks are present and is coupled to a first drive. Still is a positioning device for the components is provided and coupled to a second drive, both An drives with a control unit for specifying movements for the sprayer when applying the substance and to specify movements for positioning the Components are connected.

For this there is at least one rake in the control unit Circuit for the temporal and spatial coordination of the Be movements of the injection device and the movements to Positioning of the components on top of each other is provided.

With this arrangement it is advantageously possible to depend ability of one using, for example, a CAD Systems designed circuit variant both the position nation of the components as well as the application of the Lei tracks or ladder tracks.  

In embodiment variants of the invention, it can be preferred can be seen that the output from the control unit Movement specifications for the injection device and for the Positioning of the components can be coordinated with each other are that the positioning of a component is optional immediately before or after applying the substance follows.

It is possible, depending on the chosen one Manufacturing technology first spray the conductor tracks and in immediate succession, d. H. even before the electric conductive liquid substance is cured, the component to put on the contact surfaces. Alternatively, is it is possible to position the components first and then contacting the component connections by opening inject the electrically conductive substance into the area between the pads on the component and the contact to make areas on the circuit carrier or the conductor tracks spray on, starting from the contact surfaces of a building element to the contact surfaces of a second or third component.

According to the invention, the spray device can be used for this purpose device with a device for changing the inclination α Injection direction can be coupled relative to the circuit carrier. This makes it possible to change the position of the scarf tion carrier to choose the spray direction so that this for example, at right angles to the circuit carrier is aimed, for example, for applying conductor tracks, or (during the injection process) can be changed, so that the manufacturing transition from spraying a Conductor for injecting the substance into an area  between a component connection and the circuit carrier can be made immediately.

For example, it is conceivable to change the spray direction by ei NEN angle α of 45 ° to tend to the electrically conductive To be able to bring liquid into a room that is between rule the circuit carrier and one vertically above the Circuit carrier positioned component connection out forms is.

It is within the scope of the arrangement according to the invention that the Injection device one with the electrically conductive Substance filled in liquid state, at least one dosing pump to convey the substance, ei NEN drive for each dosing pump, at least one spray nozzle se for dispensing the substance and transport channels for the liquid substance from the storage container to the respective Includes spray nozzle. Especially from the point of view of Controllability, it is advantageous if a piezoelectric shear drive is provided for the metering pump and this with a generator for generating drive pulses in Connection is established. The control pulses cause the Conveying the liquid substance from the reservoir to Spray nozzle and finally dispensing the substance from the Spray nozzle in the form of drops. Exemplary with everyone Control pulse ver the output of a drop of substance be caused.

With the corresponding configuration of the spraying device can be provided according to the invention that as a substance electrically conductive, curing under UV radiation Plastic provided and the spraying device with egg UV directed at the sprayed substance  Radiation source is coupled. So that's it, for example possible to use a non-re-meltable substance the, whose curing after placing the component with the activation of the UV radiation source is initiated. Alternatively, it is of course also possible as a sub punch an electrically conductive paint to provide the un cures at room temperature. Then the application of the Conductor tracks and putting on the electronic components to coordinate in time so that the contact dung takes place before the paint hardens.

It is also within the scope of the invention that as elec trically conductive substance an easily meltable metal Alloy provided and the reservoir with a hot is connected to the melting device Substance causes the substance to remain in the liquid state provided.

In a further very preferred embodiment variant it is provided that the spray device over several separately controllable, connected with separate spray nozzles Dosing pumps has, the spray directions of Spray nozzles are coordinated so that the of the individual spray nozzles on the circuit carrier th drops overlap each other. So it is possible depending on the number of spray nozzles put into operation elongation of a conductor track, for example, in its width to influence. The more jets arranged side by side nozzles are controlled and thereby put into operation this is how the conductor track is applied, for example to the end formation of connection or contact surfaces.  

In this context, it is also conceivable that the Spraying device is provided with several spray nozzles, their geometric arrangement on the spraying device for example the arrangement of the connections on a chip corresponds. A spray nozzle is thus supplied to each connection arranges, and all connections of this chip can with An control of the spray nozzles simultaneously with the circuit carriers can be contacted.

In a further embodiment of the invention, it is provided hen that the sprayer over at least one se separately controllable, with a separate storage container and a separate spray nozzle connected dosing pump is equipped, the reservoir with an elec non-conductive, liquid during spraying, solidifies after spraying and then adheres firmly and so an insulating layer forming material is filled. This is immediately after applying a conductive Substance also the application of a non-conductive substance possible, for example to create insulating layers between several conductor track levels or for application a final protective layer.

The invention is described below with reference to an embodiment game are explained in more detail. In the associated drawing shows:

Fig. 1 shows a schematic diagram of the arrangement according to the invention

Fig. 2 shows the view A of FIG. 1

In Fig. 1, an arrangement for implementing the method according to the invention is shown in a schematic diagram. A circuit carrier 1 is to be provided on its upper side 2 with an electronic component 3 and with conductor tracks 4 , the component connections 5 and 6 being to be contacted with the conductor tracks 4 .

For this purpose, a relative to the circuit carrier 1 in the coordinates X, Y, Z movable spray device 7 is provided for an easily fusible metal alloy and coupled to a drive 8 , which is designed to generate the relative movements between the circuit carrier 1 and the Aufspritzein device 7 .

Furthermore, a positioning device 9 is present and coupled to a second drive 10 . Both drives 8 , 10 are connected via signal lines 11 , 12 to outputs of a control unit 13 , which in turn is connected to a computer 14 equipped, for example, with a CAD system.

The spraying device 7 is provided with a plurality of spray nozzles 15 (cf. also FIG. 2) for applying the liquid metal alloy. In addition, the spraying device 7 comprises a reservoir filled with the meltable metal alloy in the liquid state, metering pumps for conveying the liquid metal alloy, the number of metering pumps corresponding to the number of spray nozzles 15 , separate drives for each of the metering pumps and transport channels which are within the spray device 7 for Lei device of the liquid to be sprayed serve from the reservoir to the spray nozzles 15 .

Of the above-mentioned modules of the spraying device 7, only the spray nozzle 15 are shown in Fig. 1 and Fig. 2 illustrates Darge. The basic structure of the spray device 7 can be found, for example, in the publication "Three-dimensional micro forming using metal jet", Katsumi at all, Nagoya University, Furo-Cho, Chikusa-ku, Nagoya, 464-01 Japan.

According to the invention, the spray nozzles 15 are coupled to a Kippvor device 16 , which allows a change in the direction of injection by an angle ± Δα relative to the top 2 of the scarf device carrier 1 . Within the Aufspritzeinrich device 7 , the metering pumps are connected to piezoelectric drives (also not shown), which are controlled separately with a pulse-shaped clock signal, with each control pulse promoting a drop of the liquid metal alloy from the reservoir to the associated spray nozzle 15 and the application of this drop caused by the spray nozzle 15 on the top 2 of the circuit carrier 1 . Depending on the pulse frequency, droplets are overlapped in time succession and due to the feed rate and direction of movement of the spraying device 7 and form a conductor track 4 on the surface of the circuit carrier 1 .

To melt the metal alloy, the reservoir is connected within the spraying device 7 with a heating device.

The positioning device 9 is equipped with a holding device 17 for the component 2 . The liability of the construction element 2 to the holding device 17 can be brought about, for example, by a suction vacuum. Positionierein device 9 and holding device 17 can be designed so that one or more components can be taken up, transported and positioned in the desired position above the circuit carrier 1 .

The arrangement shown is operated, for example, in such a way that, after determining the positions of the component or components and after designing the conductor pattern with the aid of the CAD program in the computer 14, the positioning device 9 is controlled via the control unit 13 and the collection the components from a memory, the transport to the circuit carrier and the Po sitioning on the circuit carrier 1 performs. Then travels caused by the control unit 13 according to the layout for the strip conductors 4, the jetting means 7 takes the route from the conductor track guide, by turning on the metering pumps one or more selected nozzles 15 control the drop-shaped spraying of the liquid metal alloy from these spray nozzles 15 °.

The application of the metal alloy can begin at the component 5 , the spray nozzles 15 or the direction of spraying, as shown in FIG. 1 by means of an indicated spraying device 7 , with the aid of the tilting device 16 at an angle -Δα of approximately 45 ° against the upper side 2 of the circuit carrier 1 is inclined, whereby the liquid metal alloy is introduced into the free space between the component connection 5 and the upper side 2 who can.

The application of the liquid metal alloy to the upper side 2 is continued according to the programmed sequence of movements, the injection direction being set at a right angle to the upper side 2 during the spraying. This step is continued until the conductor track reaches the edge of the circuit carrier 1 or, which is also conceivable, reaches the component connection of a further component positioned above the circuit carrier 1 but not yet contacted. Then he follows an adjustment of the spraying direction with the aid of the tilting device 16 by the angle + Δα ≈ 45 °, as a result of which the liquid metal alloy can also be introduced into the space between the component connection and the upper side 2 here.

In this way, it is possible to connect the connections of all of the components arranged on the circuit board 1 (not shown in the drawing) in accordance with the precalculated conductor routing.

In Fig. 2 it can be seen in view A from Fig. 1 that the spraying device 7 has a plurality of spray nozzles 15 , each of which, as already explained, can be controlled by separate metering pumps. The spray directions of the spray nozzles 15 are aligned parallel to one another; the spacers of the individual spray nozzles 15 to one another are selected such that the liquid drops applied from two adjacent spray nozzles 15 overlap each other after they strike the top 2 . It is thus possible to change the width of the conductor track 4 by controlling a plurality of spray nozzles 15 lying next to one another, even during the spraying process. This is useful, for example, when the end section of a conductor track 4 is to end in a contact area with the width b toward the edge of the circuit carrier 1 .

In addition, it is conceivable to equip the spraying device 7 with at least one spray nozzle 18 which, like the spray nozzles 15 , can be controlled via a separate metering pump, but is also connected to a separate storage container in which an initially liquid, electrically non-conductive and after which Spraying onto the circuit carrier 1 is stored under room temperature curing lacquer.

When this spray nozzle 18 is actuated instead of the spray nozzle 15 , the dropwise application of the paint takes place, for example for the purpose of applying an insulating layer over the conductor tracks 4 or for the purpose of applying an insulating protective layer over the component connections.

Reference list

1

Circuit carrier

2nd

Top

3rd

electronic component

4th

Conductor tracks

5

,

6

Component connections

7

Spraying device

8th

first drive

9

Positioning device

10th

second drive

11

,

12th

Signal paths

13

Control unit

14

computer

15

Spray nozzle

16

Tilting device

17th

Holding device

18th

Spray nozzle

Claims (17)

1. A method for positioning electronic components ( 3 ), such as chips or wafers, on a circuit carrier ( 1 ) and for electrically contacting the component connections ( 5 , 6 ) with contact surfaces and / or conductor tracks arranged on the circuit carrier ( 1 ) , characterized in that the contact surfaces and / or conductor tracks by spraying a liquid, solidifying after spraying and at least in the solidified th electrically conductive substance are applied to the circuit carrier and the Kontaktie tion is made while the sprayed substance at least in the area Component connections ( 5 , 6 ) are not yet in the solidified state, after which, as the substance solidifies, there is an electrically conductive and adhesive connection between circuit carrier ( 1 ), component ( 3 ) and contact surfaces or conductor tracks ( 4 ). 2. The method according to claim 1, characterized in that the components ( 3 ) are positioned before spraying or during the spraying of the substance so that the component connections ( 5 , 6 ) are on or near the top of the circuit carrier ( 2 ) and then the Substance directly up to the Bauelementeean connections ( 5 , 6 ) and contacting this is applied to the circuit carrier ( 1 ). 3. The method according to claim 1, characterized in that the substance is first sprayed onto the circuit carrier ( 1 ) and then, but before the substance completely solidifies, the components ( 3 ) are positioned and the component connections ( 5 , 6 ) placed on the not yet solidified substance. 4. The method according to any one of the preceding claims, characterized in that the components ( 3 ) additional Lich with the aid of an electrically non-conductive adhesive material are attached to the circuit carrier ( 1 ). 5. The method according to any one of the preceding claims, wherein, however, a plurality of components ( 3 ) to be arranged on a circuit carrier ( 1 ) and the connections of which are to be electrically conductively connected, characterized in that first the components ( 3 ) are positioned and then conductor tracks ( 4 ) by spraying the substance onto the circuit carrier ( 1 ), the substance up to the components connections ( 5 , 6 ) and bringing them up contacting. 6. The method according to any one of the preceding claims, characterized in that one or more conductor tracks ( 4 ), forming a first conductor level, are applied to the circuit carrier ( 1 ), these conductor tracks ( 4 ) at least in sections with an electrically non-conductive , an insulating layer forming material are covered and then over the insulating layer one or more further conductor tracks, the conductor tracks ( 4 ) crossing under the insulating layer and forming a second conductor level, are applied, the alternating application of conductor tracks ( 4 ) and insulating layers so often takes place until a predetermined number of n conductor levels are arranged one above the other, each with an intermediate insulating layer. 7. The method according to claim 6, characterized in that the application of the insulating layer by spraying nes electrically non-conductive, during spraying liquid, solidifying after spraying and then material adhering to the surface follows. 8. The method according to any one of the preceding claims, characterized in that on the with components ( 3 ) and provided with conductor tracks ( 4 ) and contact surfaces top ( 2 ) of the circuit carrier ( 1 ), a protective coating of an electrically non-conductive material, preferably a transparent plastic, is sprayed on. 9. An arrangement for producing elements of electronic Bauele (3), such as chips or wafers, equipped TIC carriers (1) in which the terminals (5, 6) of the components (3) on the circuit carrier (1) arranged contact surfaces and / or conductor tracks ( 4 ) are in an electrically conductive connection, characterized in that

• 1. that a relative to the circuit carrier ( 1 ) movable spray device ( 7 ) for a liquid, solidifying after spraying, the contact surfaces and / or the conductor tracks ( 4 ) forming substance and a first drive ( 8 ) for generating the relative movement between the circuit carrier ( 1 ) and spray device ( 7 ) are seen before
• 2. that a positioning device ( 9 ) is provided for the components ( 3 ) and is coupled to a second drive ( 10 ),
• 3. that the two aforementioned drives ( 9 , 10 ) with a control unit ( 13 ) for specifying relative movements between the spray device ( 7 ) and the scarf device carrier ( 1 ) during the spraying of the substance and movements of the positioning device ( 9 ) for the purpose the positioning of the components ( 3 ) are connected and
• 4. that in the control unit ( 13 ) at least one arithmetic circuit for timing and spatial coordination of the movements for spraying the substance with the movements for positioning the components ( 3 ) is hen hen.

10. The arrangement according to claim 9, characterized in that the movements can be coordinated with one another in such a way that the positioning of a component ( 3 ) optionally follows immediately before or after the substance is sprayed on. 11. The arrangement according to claim 9 or 11, characterized in that the spray device ( 7 ) with an on device ( 16 ) for changing the spray direction rela tively to the circuit carrier top ( 2 ) is coupled by an angle ± Δα. 12. Arrangement one of claims 9 to 11, characterized in that the spraying device ( 7 ) a Vorratsbe container filled with the substance in the liquid state, at least one metering pump for conveying the substance, a drive for the metering pump, at least one spray nozzle ( 15 ) for applying the substance and transport channels for the liquid substance from the reservoir to the spray nozzle. 13. The arrangement according to claim 12, characterized in that a piezoelectric drive for the metering pump seen before and this is connected to a generator for generating control pulses, the control pulses to the dropwise conveyance of the liquid substance from the reservoir to the spray nozzle ( 15 ) and cause the substance to be dispensed dropwise from the spray nozzle ( 15 ). 14. Arrangement according to one of claims 9 to 13, characterized in that the substance is an electrically conductive plastic that cures under UV radiation and the spraying device ( 17 ) is coupled to a sprayed substance directed at the UV radiation source or as Substance is an electrically conductive, the varnish cure under room temperature is provided. 15. The arrangement according to claim 12, characterized in that the storage container is heated and as a substance an in meltable within the temperature range up to 250 ° C re metal alloy is provided. 16. Arrangement according to one of claims 9 to 15, characterized in that the spraying device ( 7 ) is equipped with a plurality of spray nozzles ( 15 ) which can be controlled via separate metering pumps, the spraying directions of the spray nozzles ( 15 ) being aligned with one another in such a way that the droplets from the various spray nozzles ( 15 ) on the top of the circuit carrier ( 2 ) overlap each other. 17. Arrangement according to one of claims 9 to 16, characterized in that the spraying device ( 7 ) is equipped with at least one controllable via a separate metering pumps and controllable with a separate storage nozzle connected spray nozzle ( 18 ) and the storage container with a liquid, electrically non-conductive, solidifies after spraying, then firmly adheres to the substrate and forms an insulating layer.