DE19733124C1 - Chip for contact-less transmission of data and/or energy to external apparatus - Google Patents
Chip for contact-less transmission of data and/or energy to external apparatusInfo
- Publication number
- DE19733124C1 DE19733124C1 DE1997133124 DE19733124A DE19733124C1 DE 19733124 C1 DE19733124 C1 DE 19733124C1 DE 1997133124 DE1997133124 DE 1997133124 DE 19733124 A DE19733124 A DE 19733124A DE 19733124 C1 DE19733124 C1 DE 19733124C1
- Authority
- DE
- Germany
- Prior art keywords
- chip
- electrically conductive
- potting compound
- card body
- chip module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
Die Erfindung betrifft eine Chipkarte für kontaktlose Daten- und/oder Energieübertragung zu einem externen Gerät gemäß dem Oberbegriff des Patentanspruchs 1 sowie ein Verfahren zu de ren Herstellung gemäß dem Oberbegriff des Patentanspruchs 4.The invention relates to a chip card for contactless data and / or energy transfer to an external device according to the Preamble of claim 1 and a method for de Ren manufacture according to the preamble of claim 4.
Chipkarten dieser Art werden häufig als Kreditkarten, Tele fonkarten etc. verwendet. Sie weisen einen Chip mit einem in tegrierten Schaltkreis auf, um Daten oder Informationen spei chern bzw. mit einem externen Lesegerät wieder auslesen zu können. Zur kontaktfreien Daten- und/oder Energieübertragung zum externen Gerät weisen derartige kontaktfreie Chipkarten im Inneren des Kartenkörpers eine als Antenne wirkende Spule auf, die mit dem Chip in Wirkverbindung steht.Chip cards of this type are often called credit cards, tele phone cards etc. used. You assign a chip with an in integrated circuit to store data or information or read again with an external reader can. For contactless data and / or energy transfer Such contact-free chip cards point to the external device inside the card body a coil acting as an antenna that is in operative connection with the chip.
Derartige kontaktfreie Chipkarten werden von kontaktbehafte ten Chipkarten unterschieden, bei welchen der Daten- oder Energieaustausch mit dem externen Gerät über Kontaktflächen auf der Oberseite der Chipkarte erfolgt, die mit entsprechen den Kontakten des externen Geräts in Verbindung gebracht wer den. Daneben existieren auch sogenannte Kombi-Chipkarten, die sowohl eine kontaktbehaftete als auch eine kontaktfreie Si gnal- und/oder Energieübertragung ermöglichen.Such contactless chip cards are used by contact th smart cards differentiated in which of the data or Energy exchange with the external device via contact surfaces done on the top of the chip card that correspond with who contacts the external device the. There are also so-called combination chip cards, the both a contact-based and a contact-free Si Enable signal and / or energy transmission.
Chipkarten können bekannterweise derart hergestellt werden, daß zunächst der Kartenkörper durch Laminieren mehrerer Schichten oder durch ein Spritzverfahren hergestellt und an schließend in den Kartenkörper eine Kavität eingefräst wird, in welche ein Chipmodul eingesetzt wird. Dieses Chipmodul kann beispielsweise aus einem Chipträger in Form eines lei tenden Trägerbandes und einem darauf befestigten Chip beste hen, der zur Fixierung und zum Schutz des Chips und der An schlußdrähtchen in eine Vergießmasse aus Harz eingegossen ist. Bei kontaktfreien Chipkarten muß das Chipmodul mit sich im Bereich der Kavität befindenden, freigelegten Spulenenden elektrisch verbunden werden, was üblicherweise mittels Lot oder einem elektrisch leitfähigen Kleber erfolgt. Zusätzlich muß auch das Chipmodul in der Kavität festgeklebt werden.As is known, chip cards can be produced in such a way that that first the card body by laminating several Layers or produced by a spray process and on a cavity is then milled into the card body, in which a chip module is inserted. This chip module can, for example, from a chip carrier in the form of a lei tendency carrier tape and a chip attached to it best hen to fix and protect the chip and the An final wire is cast into a resin casting compound is. In the case of contactless chip cards, the chip module must be with it exposed coil ends in the area of the cavity be electrically connected, which is usually by means of solder or an electrically conductive adhesive. In addition the chip module must also be glued into the cavity.
Bei dieser bekannten Art der Chipkartenherstellung besteht häufig das Problem, daß aufgrund der Geometrie des Chipmoduls und der räumlichen Anordnung seiner Anschlußkontakte die freizulegenden Spulenenden und damit die gesamte Spule inner halb des Kartenkörpers häufig aussermittig im Bezug auf die Dicke des Kartenkörpers angeordnet werden müssen, wodurch beim Verbiegen der Chipkarte hohe Spannungen auf das Chipmo dul übertragen werden können. Dies kann zu einer Beschädigung des Chipmoduls oder der Verbindung zwischen den Spulenenden und den Anschlußkontakten des Chipmoduls führen. Weiterhin kann die Temperaturbelastung beim Verlöten der Spulenenden mit den Anschlußkontakten des Chipmoduls ein Problem darstel len.In this known type of chip card production often the problem that due to the geometry of the chip module and the spatial arrangement of its contacts exposed coil ends and thus the entire coil inside half of the card body often off-center in relation to the Thickness of the card body must be arranged, which when bending the chip card high voltages on the chipmo dul can be transferred. This can cause damage of the chip module or the connection between the coil ends and lead the connection contacts of the chip module. Farther can be the temperature load when soldering the coil ends with the connection contacts of the chip module represent a problem len.
Eine Chipkarte sowie ein Verfahren zu deren Herstellung gemäß dem Oberbegriff des Anspruchs 1 bzw. 4 sind aus der DE 195 00 925 A1 bekannt. Die Anschlußkontaktflächen des Chipmoduls sind dort über einen leitfähigen Kleber mit Anschlußflächen eines die Spule tragenden Übertragungsmoduls verbunden.A chip card and a method for its production in accordance the preamble of claim 1 and 4 are from DE 195 00 925 A1 known. The connection contact surfaces of the chip module are there over a conductive adhesive with pads a transmission module carrying the coil.
Der Erfindung liegt die Aufgabe zugrunde, eine Chipkarte ge mäß dem Oberbegriff des Anspruches 1 zu schaffen, die auf möglichst einfache und kostengünstige Weise eine sichere me chanische und elektrische Verbindung zwischen dem Chipmodul und dem Kartenkörper gewährleistet und eine Anordnung der Spule in mittiger Höhenlage innerhalb des Kartenkörpers er möglicht. Außerdem soll ein Verfahren zur Herstellung einer derartigen Chipkarte geschaffen werden. The invention is based, a chip card ge according to the preamble of claim 1 to create the as simple and inexpensive as possible a safe me mechanical and electrical connection between the chip module and the card body guaranteed and an arrangement of Coil at a high altitude within the card body possible. In addition, a method for producing a such chip card can be created.
Diese Aufgabe wird erfindungsgemäß durch die Merkmale des An spruches 1 bzw. 4 gelöst. Vorteilhafte Ausführungsformen der Erfindung sind in den weiteren Ansprüchen beschrieben. This object is achieved by the features of the An saying 1 or 4 solved. Advantageous embodiments of the Invention are described in the further claims.
Bei der erfindungsgemäßen Chipkarte gemäß Anspruch 1 weist das Chipmodul innerhalb der Vergießmasse im Bereich einer je den Trägerband-Anschlußkontaktfläche einen durch die Vergieß masse hindurchgehenden, zur Anschlußkontaktfläche führenden Hohlraum auf, der mit einem elektrisch leitfähigen Material gefüllt ist, das mit einer elektrisch leitfähigen Klebe schicht in Kontakt ist, welche zwischen dem Kontaktkörper im Bereich eines Spulenendes und der Vergießmasse vorgesehen ist.In the chip card according to the invention according to claim 1 the chip module within the casting compound in the range of one each the carrier tape connection contact surface one through the potting mass passing through, leading to the connection contact surface Cavity on that with an electrically conductive material is filled with an electrically conductive adhesive layer in contact, which is between the contact body in the Provided area of a coil end and the potting compound is.
Für die erfindungsgemäße Chipkarte ist somit charakteri stisch, daß eine elektrisch leitfähige Klebeschicht verwendet wird, welche eine Verbindung zwischen dem Kartenkörper und der Vergießmasse des implantierten Chipmoduls schafft und gleichzeitig für die elektrische Verbindung zwischen dem Chipmodul und der Antenne dient. Die elektrische Verbindung zwischen den Anschlußkontaktflächen des leitfähigen Träger bands und der Klebeschicht erfolgt über eine "Brücke" aus elektrisch leitfähigem Material, so daß die Klebeschicht und damit auch die Spulenenden und die als Antenne wirkende Spule in größerem Abstand zum Trägerband und damit etwa in mittiger Höhenlage (in der neutralen Zone) des Kartenkörpers angeord net werden können. Dadurch wird verhindert, daß Spannungen, welche durch Biegebeanspruchungen der Karte erzeugt werden, auf das Chipmodul übertragen werden. Die Gefahr einer Beschä digung des Chipmoduls oder der Verbindung zwischen Kartenkör per und Chipmodul beim Verbiegen der Chipkarte wird daher be deutend verringert. Ein weiterer Vorteil ist, daß auf diese Weise auf keiner der beiden Kartenseiten die Spule durch scheint und das optische Erscheinungsbild beeinträchtigt.Characterized for the chip card according to the invention that an electrically conductive adhesive layer is used which is a connection between the card body and the potting compound of the implanted chip module creates and at the same time for the electrical connection between the Chip module and the antenna is used. The electrical connection between the terminal contact surfaces of the conductive carrier bands and the adhesive layer is made over a "bridge" electrically conductive material, so that the adhesive layer and hence the coil ends and the coil acting as an antenna at a greater distance from the carrier tape and thus approximately in the middle Height (in the neutral zone) of the map body can be net. This prevents tensions, which are generated by bending the card, be transferred to the chip module. The risk of damage Damage to the chip module or the connection between the card body per and chip module when bending the chip card is therefore be significantly reduced. Another advantage is that on this Do not wind the coil on either side of the card seems and affects the visual appearance.
Zweckmäßigerweise besteht das Material zur Füllung der Hohl räume sowie die Klebeschicht zwischen dem Kartenkörper und der Vergießmasse aus einem elektrisch leitfähigen Epoxykle ber. The material for filling the hollow expediently consists spaces as well as the adhesive layer between the card body and the potting compound from an electrically conductive epoxy adhesive about.
Das erfindungsgemäße Verfahren ist dadurch gekennzeichnet, daß bei der Herstellung des Chipmoduls innerhalb der Vergieß masse Hohlräume freigehalten und anschließend mit einem elek trisch leitfähigem Material gefüllt werden, welches mit den Anschlußkontaktflächen des Trägerbands in elektrischem Kon takt und zur gegenüberliegenden Seite der Vergießmasse hin frei zugänglich ist, und daß vor dem Einsetzen des fertigen Chipmoduls in die Kavität eine elektrisch leitfähige Klebe schicht zumindest im Bereich der freigelegten Spulenenden eingebracht wird, die mit dem elektrisch leitfähigen Material der Hohlräume und der Vergießmasse in Verbindung gebracht wird.The method according to the invention is characterized in that that in the manufacture of the chip module within the potting Keep empty cavities and then with an elec trically conductive material, which with the Terminal contact surfaces of the carrier tape in electrical con clock and towards the opposite side of the casting compound is freely accessible, and that before inserting the finished one Chip module in the cavity an electrically conductive adhesive layer at least in the area of the exposed coil ends is introduced with the electrically conductive material of the cavities and the potting compound becomes.
Vorteilhafter Weise werden die Hohlräume während des Aufbrin gens der Vergießmasse auf den Chip mittels entfernbarer Stem pel freigehalten.Advantageously, the cavities become during the application gens the potting compound on the chip by means of removable stem pel kept free.
Die Erfindung wird nachfolgend anhand der Zeichnungen bei spielshaft näher erläutert. In diesen zeigen:The invention is described below with reference to the drawings explained in more detail. In these show:
Fig. 1: eine schematische Draufsicht auf ein Chipmodul oh ne darüberliegendem Trägerband, Fig. 1 is a schematic plan view of a chip module oh ne overlying carrier tape,
Fig. 2: einen Schnitt entlang der Linie II-II von Fig. 1 mit Trägerband, und Fig. 2: a section along the line II-II of Fig. 1 with carrier tape, and
Fig. 3: eine Schnittdarstellung der erfindungsgemäßen Chipkarte im Bereich des Chipmoduls, wobei das Chipmodul in gleicher Weise wie das Chipmodul der Fig. 1 und 2 aufgebaut ist, jedoch etwas andere Dimensionen aufweist. FIG. 3, but something has different dimensions a sectional view of the inventive chip card in the area of the chip module, the chip module is constructed in the same manner as the chip module of Figs. 1 and 2.
Aus den Fig. 1 bis 3 ist ein Chipmodul 1 ersichtlich, das aus einem oberen elektrisch leitfähigen Trägerband 2 aus Me tall, einer darunterliegenden Trägerschicht 3 aus nichtlei tendem Kunststoff, einem Chip 4 mit einem integrierten Schaltkreis und einer Vergießmasse 5 aus Epoxyharz besteht.From FIGS. 1 to 3, a chip module 1 it can be seen that an underlying carrier layer 3 of nichtlei tendem plastic, a chip 4 with an integrated circuit and a potting compound 5 is made tall of an upper electrically conductive carrier tape 2 Me of epoxy resin.
Das Trägerband 2 weist zwei voneinander getrennte Anschluß kontaktflächen 2a, 2b auf, die voneinander durch einen Schlitz 6 elektrisch getrennt sind.The carrier tape 2 has two separate contact surfaces 2 a, 2 b, which are electrically separated from each other by a slot 6 .
Bei der Herstellung des Chipmoduls 1 wird zunächst der Chip 4 auf dem Trägerband 2 festgeklebt und über Anschlußdrähtchen 7 mit den entsprechenden Anschlußkontaktflächen 2a bzw. 2b des Trägerbands 2 kontaktiert. Die Trägerschicht 3 ist derart ausgestaltet, daß sie im Bereich der Kontaktstelle der An schlußdrähtchen 7 mit dem Trägerband 2 weite Kontaktfenster 8 aufweist, durch welche die freien Enden der Anschlußdrähtchen 7 maschinell hindurchgeführt und an den entsprechenden An schlußkontaktflächen 2a, 2b festgelötet werden können.In the manufacture of the chip module 1 , the chip 4 is first glued to the carrier tape 2 and contacted via connecting wires 7 with the corresponding terminal contact surfaces 2 a and 2 b of the carrier tape 2 . The carrier layer 3 is designed such that it has in the area of the contact point on the connecting wire 7 with the carrier tape 2 wide contact window 8 through which the free ends of the connecting wire 7 are passed mechanically and can be soldered to the corresponding contact surfaces 2 a, 2 b .
Im folgenden wird die Vergießmasse 5 aus Harz über den Chip 4 und die Anschlußdrähtchen 7 aufgebracht, so daß diese voll kommen eingekapselt werden. Hierbei werden mittels eines nicht dargestellten Stempels kreisförmige Hohlräume 9 neben den Kontaktfenstern 8 innerhalb der Vergießmasse 5 freigehal ten, die sich an angrenzende durchgehende Hohlräume 10 inner halb der Trägerschicht 3 anschließen. Die hintereinanderlie genden, fluchtenden Hohlräume 9, 10 durchdringen daher den gesamten Chipmodulkörper bis hin zum Trägerband 2.In the following, the potting compound 5 made of resin is applied over the chip 4 and the connecting wires 7 so that they come fully encapsulated. Here, by means of a stamp, not shown, circular cavities 9 next to the contact windows 8 within the potting compound 5 are kept, which adjoin adjacent continuous cavities 10 inside the carrier layer 3 . The one behind the other, aligned cavities 9 , 10 therefore penetrate the entire chip module body up to the carrier tape 2 .
Im nächsten Herstellschritt des Chipmoduls 1 werden diese Hohlräume 9, 10 mit einem elektrisch leitfähigen Material 11 aus einem elektrisch leitfähigen Epoxykleber gefüllt, der an schließend aushärtet (z. B. silbergefüllter Epoxykleber mit einer Aushärtezeit von 150°C/1 min), siehe Fig. 3. Dieses elektrisch leitfähige Material 11 kontaktiert somit die ent sprechende Anschlußkontaktfläche 2a, 2b des Trägerbands 2 und reicht bis zum Boden der Vergießmasse 5, der im gezeigten Ausführungsbeispiel eben ausgebildet ist.In the next manufacturing step of the chip module 1 , these cavities 9 , 10 are filled with an electrically conductive material 11 made of an electrically conductive epoxy adhesive, which then hardens (e.g. silver-filled epoxy adhesive with a curing time of 150 ° C / 1 min), see Fig . 3. This electrically conductive material 11 thus contacts the ent speaking terminal contact surface 2 a, 2 b of the carrier strip 2 and extends to the bottom of the potting compound 5 which is flat in the embodiment shown.
Das auf diese Weise hergestellte Chipmodul 1 wird in eine Ka vität 12 eines Kartenkörpers 13 eingesetzt. In diesem Karten körper 13 befindet sich in mittlerer Höhenlage eine als An tenne wirkende Spule 14, deren Wicklungen ausserhalb der Ka vität 12 angeordnet sind und die zwei freie Spulenenden 15 aufweist, die nach innen in den Bereich der Kavität 12 ge führt sind. In Fig. 3 ist lediglich eines dieser Spulenenden (15) dargestellt. Die Spulenenden 15 liegen auf gleicher Höhe wie die übrigen Wicklungen der Spule 14, d. h. in der mittigen oder neutralen Faser 16 des Kartenkörpers 13.The chip module 1 produced in this way is used in a Ka vity 12 of a card body 13 . In this card body 13 is in the middle of an altitude acting as a tenne coil 14 , the windings are arranged outside the Ka vität 12 and the two free coil ends 15 , which leads to the inside in the region of the cavity 12 leads. In Fig. 3 only one of these coil ends ( 15 ) is shown. The coil ends 15 are at the same height as the other windings of the coil 14 , ie in the central or neutral fiber 16 of the card body 13 .
Die Kavität 12 erstreckt sich ebenfalls bis zur neutralen Fa ser 16 hinab, so daß etwa die Hälfte der Spulenenden 15 frei gefräst wird. Das anschließende Befestigen des Chipmoduls 1 innerhalb der Kavität 2 erfolgt nun nicht mehr, wie dies beim Stand der Technik bekannt ist, durch Einkleben von Randberei chen des Moduls ausserhalb der Vergießmasse 5, sondern über eine elektrisch leitfähige Klebeschicht 17, welche direkt den Boden der Vergießmasse 6 auf den Grund der Kavität 12 klebt. Dazu werden zwei leitfähige Klebestreifen im Kartengrund auf gebracht, welche die Spulenenden 15 jeweils mit einschließen. Danach wird das Chipmodul 1 derart eingesetzt, daß jeweils ein gefüllter Hohlraum 9, 10 auf dieser Klebeschicht 17 zu liegen kommt. Dadurch entsteht eine leitfähige Verbindung von den Spulenenden 15 über die Klebeschicht 17 und das elek trisch leitfähige Material 11 innerhalb der Hohlräume 9, 10 bis zur dazugehörigen Anschlußkontaktfläche 2a, 2b. Gleich zeitig wird durch die Klebeschicht 17 eine feste Verbindung zwischen Kartenkörper 13 und Chipmodul 1 hergestellt.The cavity 12 also extends down to the neutral fa water 16 so that approximately half of the coil ends 15 are milled freely. The subsequent attachment of the chip module 1 within the cavity 2 is no longer carried out, as is known in the prior art, by gluing the peripheral areas of the module outside the casting compound 5 , but via an electrically conductive adhesive layer 17 which directly covers the bottom of the casting compound 6 sticks to the bottom of the cavity 12 . For this purpose, two conductive adhesive strips are placed in the base of the card, each of which includes the coil ends 15 . Then the chip module 1 is inserted in such a way that a filled cavity 9 , 10 comes to rest on this adhesive layer 17 . This creates a conductive connection from the coil ends 15 via the adhesive layer 17 and the elec trically conductive material 11 within the cavities 9 , 10 to the associated connection contact surface 2 a, 2 b. At the same time, a firm connection between the card body 13 and the chip module 1 is established by the adhesive layer 17 .
Das Befestigen und Kontaktieren des Chipmoduls 1 mittels der Klebeschicht 17 hat weiterhin den Vorteil, daß keine zusätz liche Wärme zum Erweichen eines Lotes etc. eingebracht werden muß, wodurch der Kunststoff des Chipmoduls 1 und des Karten körpers 13 geschont wird.The attachment and contact of the chip module 1 by means of the adhesive layer 17 has the further advantage that no additional heat to soften a solder etc. has to be introduced, whereby the plastic of the chip module 1 and the card body 13 is protected.
Claims (5)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1997133124 DE19733124C1 (en) | 1997-07-31 | 1997-07-31 | Chip for contact-less transmission of data and/or energy to external apparatus |
| PCT/DE1998/002079 WO1999006949A1 (en) | 1997-07-31 | 1998-07-23 | Chip card for contactless data and energy transmission and method for its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1997133124 DE19733124C1 (en) | 1997-07-31 | 1997-07-31 | Chip for contact-less transmission of data and/or energy to external apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE19733124C1 true DE19733124C1 (en) | 1998-12-10 |
Family
ID=7837571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE1997133124 Expired - Fee Related DE19733124C1 (en) | 1997-07-31 | 1997-07-31 | Chip for contact-less transmission of data and/or energy to external apparatus |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE19733124C1 (en) |
| WO (1) | WO1999006949A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1065624A2 (en) * | 1999-06-28 | 2001-01-03 | Giesecke & Devrient GmbH | Chip module for installation in a chip card carrier |
| EP1093082A2 (en) * | 1999-10-12 | 2001-04-18 | Fujitsu Limited | Combination card having an IC chip module |
| DE102007019329A1 (en) * | 2007-04-24 | 2008-10-30 | Innovaris Gmbh & Co. Kg | Components produced by thermal spraying from predominantly metallic materials |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2937448B1 (en) | 2008-10-17 | 2012-11-16 | Oberthur Technologies | MODULE, MICROCIRCUIT CARD AND CORRESPONDING MANUFACTURING METHOD. |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19500925A1 (en) * | 1995-01-16 | 1996-07-18 | Orga Kartensysteme Gmbh | Integrated circuit (I.C) card or "chip" card |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2674052A1 (en) * | 1991-03-15 | 1992-09-18 | Philips Composants | MICROCIRCUIT CARD. |
| DE59611233D1 (en) * | 1995-08-01 | 2005-07-14 | Austria Card | DATA CARRIER WITH A COMPONENT MODULE AND WITH A COIL AND METHOD FOR PRODUCING SUCH A DATA CARRIER |
-
1997
- 1997-07-31 DE DE1997133124 patent/DE19733124C1/en not_active Expired - Fee Related
-
1998
- 1998-07-23 WO PCT/DE1998/002079 patent/WO1999006949A1/en active Application Filing
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19500925A1 (en) * | 1995-01-16 | 1996-07-18 | Orga Kartensysteme Gmbh | Integrated circuit (I.C) card or "chip" card |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1065624A2 (en) * | 1999-06-28 | 2001-01-03 | Giesecke & Devrient GmbH | Chip module for installation in a chip card carrier |
| EP1065624A3 (en) * | 1999-06-28 | 2002-01-02 | Giesecke & Devrient GmbH | Chip module for installation in a chip card carrier |
| EP1093082A2 (en) * | 1999-10-12 | 2001-04-18 | Fujitsu Limited | Combination card having an IC chip module |
| EP1093082A3 (en) * | 1999-10-12 | 2002-06-12 | Fujitsu Limited | Combination card having an IC chip module |
| DE102007019329A1 (en) * | 2007-04-24 | 2008-10-30 | Innovaris Gmbh & Co. Kg | Components produced by thermal spraying from predominantly metallic materials |
Also Published As
| Publication number | Publication date |
|---|---|
| WO1999006949A1 (en) | 1999-02-11 |
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| 8100 | Publication of the examined application without publication of unexamined application | ||
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| 8339 | Ceased/non-payment of the annual fee |