DE19730582A1 - Photolithographic processing of microelectronic components - Google Patents

Abstract

The Si discs (5) are transported by handling robots, or they pass through the individual stations (1, 2) by gravity, eg. by rolling through. The individual stations are typically located one behind the other, contg. an inlet, a transport path, and an outlet for the vertical discs and especially an inclined guide track for the discs. The discs may be removed from the guide track and supplied to a separate processing zone. There are stations for applying an adhesive lacquer, charging with photolacquers, lacquer films, equalising lacquer layers, drying, developing, rinsing, for wet processing such as etching etc., and exposing.

Description

The invention relates to a method and a device for processing wafers for manufacturing microelectronic components in photolithographic Method.

The manufacture of microelectronic components that are also commonly called chips on z. B. round Silicon wafers are made using photolithographic processes by the structures on photosensitive coatings applied to the substrate surface exposed through masks. The photosensitive Lacquer layer (photoresist) is in a horizontal position  hurled onto the substrate, the subsequent processes such as drying the paint layer, Exposing, developing, etching, etc., applying Adhesion promoters before application of the lacquer layer, only in the horizontal substrate position. The handling between the individual processing steps is done by complex handling robots suitable for clean rooms.

It is considered a disadvantage that larger expecting substrates, e.g. B. 300 mm diameter, the systems become very large with horizontal substrate processing. The Clean room space for the installation of the system is relative expensive and contamination of the substrates with dirt is very large for horizontal substrate processing. Alone through the impacting laminar-guided clean room air, the silicon wafers are the ones that contain residual particles significantly contaminated. Also, when bouncing on a substrate surface causes turbulence that too lead to additional particle contamination.

These problems become advantageous in a method of avoided at the outset in that the Silicon wafers in a vertical orientation through the individual stations of the photolithographic Machining system can be performed.  

Due to the vertical alignment of the silicon wafers The main advantage is that the system is essential easier on changing dimensions of the discs is adaptable and significantly less clean room area is needed. In addition, much less bounce Residual dirt particles on the substrate surface, so that contamination is also reduced.

The silicon wafers are preferably over Handling robot transported. The discs are on gripped their edges, for what z. B. conical recesses serve on the robots.

An alternative method provides that the Silicon slices the individual stations by gravity go through, especially roll through. This has the significant advantage that no handling robot is required be, which makes the system relatively inexpensive.

The task mentioned at the beginning is also with a Process solved in which the individual stations are arranged one behind the other and one inlet, one Transport route and an outlet for the vertical have aligned discs and in particular a inclined plane as a guideway for the silicon wafers having.  

In the device according to the invention, the Disks in vertical alignment each Processing stations, so that the discs on both sides can be edited. Are vapor phases or Wet processes used, e.g. B. when applying a Adhesion promoter, when developing, when etching, when rinsing etc., the individual stations can be arranged that the fluids are used cascaded, i.e. H. the Fluid from a subsequent station is then in a previous station, in which e.g. Legs Pretreatment or another side of the substrate is used.

Stations for applying one are advantageous Adhesion promoter, for treatment with photoresists, Protective lacquers, leveling lacquer layers, for drying, for Development, for rinsing, for wet processes such as etching etc., intended for exposure, etc. In all of these Stations can align the substrates vertically be treated.

The station with at least one stopper is advantageous Mistake. In this way, the individual substrates stay in the station for a predetermined time and are then released for further transport. The stations can also be equipped with rotary drive elements  be provided so that the substrates during their Stay in the station. A Continuing education provides that before or after the stations Magazines are provided in which the discs in vertical arrangement are included. From these stations the disks z. B. transported out by stamp and used in the stations or the magazines tilted and the desired substrate falls over the inlet to the first station. One aperture holds the rest Substrates in the magazine.

Further advantages, features and details arise from the subclaims and the following Description in which with reference to the drawing particularly preferred embodiment in detail is shown. You can do that in the drawing shown and in the claims as well as in the Description mentioned features each individually or be essential to the invention in any combination. The drawing shows:

Figure 1 shows a section of the processed device with vertically arranged silicon wafers.

Fig. 2 shows a station in which the substrate undergoes a processing process.

In Fig. 1 two stations 1 and 2 are shown a processing device 3 and a magazine 4, in which silicon wafers stored. From this magazine 4 , the silicon wafers 5 z. B. by tilting the magazine 4 in the direction of arrow 6 or by a handling system in the first station 1 in a vertical orientation. In station 1 , the silicon wafers 5 are held at their edges against tipping over by guide elements 7 and 8 . Since the guide elements 7 and 8 are arranged at an incline and the guide element 8 forms a raceway 9 , the silicon wafer 5 rolls in the transport direction by gravity, ie in the direction of the arrow 10 . In the station 1 , the silicon wafer 5 is held by a stopper 11 so that it is held in this position and can be processed. There, the silicon wafer 5 z. B. are rotated by means of a rotary drive element 14 so that it is machined evenly. After processing, the station 1 is returned to the starting position and the stopper 11 releases the silicon wafer 5 , so that it can roll into the next station 2 via an intermediate element 15 .

Fig. 2 shows an embodiment of a station, for. B. the station 2 , via which the disc 5 after moving the guide elements 7 and 8 in the direction of arrows 12 and 13 , whereby the disc 5 is released, is transported by transport in the direction of arrow 16 in a separate treatment zone 17 . In the separate treatment zone 17 z. B. Applying fluids to the surface 18 of the substrate. The substrate is z. B. held with a substrate holder 19 and rotated. Excess fluids are thrown off the surface 18 . In thermal processes, the substrate holder 19 can also be heated. After the treatment, the disk 5 is returned to the guide elements 7 , 8 by moving the substrate holder 19 , so that the disk 5 can be fed to the next station over the track.

Total 5 that relatively little space is needed for the treatment of these disks 5 by the vertical alignment of the individual disks can be held. This leads to a reduction in the costs of the clean room and the entire system. The particle contamination is relatively low due to the vertical substrate position, which meets the requirement for keeping the substrates clean during the process in view of the ever smaller structures.

Claims (9)

1. A method for treating microelectronic components in the photolithographic process, characterized in that silicon wafers ( 5 ) are guided in a vertical orientation through the individual stations ( 1 , 2 ) of the photolithographic processing system ( 3 ). 2. Device according to claim 1, characterized in that the silicon wafer ( 5 ) are transported via handling robots. 3. Device according to one of the preceding claims, characterized in that the silicon wafer ( 5 ) pass through the individual stations ( 1 , 2 ) by gravity, in particular roll through. 4. Device for producing microelectronic components in the photolithographic process according to one of the preceding claims, characterized in that the individual stations ( 1 , 2 ) are arranged one behind the other and have an inlet, a transport path and an outlet for the vertically aligned disks ( 5 ) and in particular has an inclined plane as a guideway ( 9 ) for the silicon wafer ( 5 ). 5. The device according to claim 4, characterized in that the disks ( 5 ) of the guideways ( 9 ) are removable and a separate processing zone ( 17 ) can be fed. 6. The device according to claim 4 or 5, characterized characterized that stations for applying a Adhesion promoter, for loading with photoresists, Layered lacquers, leveling lacquer layers, for drying, for development, for rinsing, for wet processes such as Etching, etc. are provided for exposure. 7. The method according to any one of claims 4 to 6, characterized in that the station ( 1 or 2 ) is provided with at least one stopper ( 11 ). 8. The method according to any one of claims 4 to 7, characterized in that the station ( 1 or 2 ) is provided with rotary drive elements ( 14 ). 9. The method according to any one of claims 4 to 8, characterized in that before or after the stations ( 1 , 2 ) magazines ( 4 ) are provided, in which the discs ( 5 ) are contained in a vertical arrangement.