DE19720226C5 - Method and device for the production of chip cards - Google Patents

Abstract

method for the production of smart cards, in which an electrically conductive Connection between a contact section (12, 13) of a first, in a card body (10) embedded component (11), in particular an antenna device (14) and a contact of a second, in or on a card body (10) on or aufzusetzenden Component is created, wherein in a surface of the card body by means of a Einsenkwerkzeugs (28, 29) has a recess (15) to a Depth is depressed, in which the contact portion (12, 13) is located, while during sinking an at least two-step measurement of a distance between the contact portion (12, 13) and the Einsenkwerkzeug performed and the sinking operation is then stopped when the measurement is substantially a touch of the contact portion results through the Einsenkwerkzeug, and the Impedance between a measuring electrode (22) and a counter electrode (30) is measured to which the embedded component via the Einenkewerkzeug electrically switchable in parallel, wherein the card body (10) with the embedded component (11) between the measuring electrode and ...

Description

The Invention relates to a method and a device for producing Vorrich of smart cards.

at Contactless chip cards are passive transmission elements, in particular Coils or electrically conductive layers for capacitive data and power transmission inside the card body poured or laminated.

In order to connect these components now to a chip, is in the EP 0 671 705 A2 suggested to leave an opening at the production where the contacts are. As a result, the production of the card body is much more difficult. In addition, the further handling (packaging, shipping, etc.) of such prefabricated card body to customers is very difficult and can make the card body useless if the customer wants to use individual chips.

From the DE 195 00 925 A1 a chip card of this type is known, in which a separate, so additional transfer module is used to produce the electrically conductive connection between the component embedded in the card body and the chip. This arrangement and this method are expensive.

From the DE 42 41 482 A1 For example, a method and a device for producing IC cards are known. In this case, a trough is first introduced into a plastic card, wherein an IC module is provided only external contact surfaces. To produce the trough, a blind hole is first introduced into the card, preferably by milling. Subsequently, the trough is formed by means of a stamping die, wherein the displaced by the die stamping material escapes into the blind hole. The molding of the trough is preferably carried out by hot stamping.

From the US 5 563 444 a transportable object is known which has a cavity for receiving a microcircuit in a plastic carrier. The microcircuit includes a conductive chip with electrically isolated zones. The bottom surface of the cavity has an outline formed by a series of arcs having a relatively small radius relative to the chip diameter. The lateral boundaries of the cavity are inclined inwards by about 10 °. This geometric arrangement allows a microcircuit to be mounted in the cavity with relatively little adhesive.

Out WO 97/05571 A1 is a data carrier with a module, the one Component, and a coil known. Furthermore, it is a Method for producing such a data carrier described. The coil turns The coil are arranged so that they at least in their zu the area adjacent to the component in an outside of the component level range lying Windungsniveaubereich lie. Two connection contacts of the component are designed so that they form two coil terminal contacts extending in the Windungsniveaubereich. An immediate one contact the coil terminal contacts with the connection contacts of the device is not provided. The electrical connection between the coil terminal contacts and the terminal contacts of Component is made by an electrically conductive adhesive.

From the DE 43 40 249 A1 a device for deep drilling of printed circuit boards is known, in which under the surface of the plate lying circuit boards are pulled through to the edge. In this case, the drilling tool is set either by direct mechanical contacting or else inductively / capacitively to a first potential and the lower-lying conductor layer by direct contacting to another potential, so that the potential differences can be used for a contact measurement. Such contacting of the embedded component is not possible with smart cards.

The known suggestions are therefore not suitable, a secure component contacting with to enable simple means.

Of the Invention is based on the object to show a way how In a simple way, a secure component contacting can be achieved.

These Task is procedurally by the The subject of claim 1 and device by the subject of the Claim 5 solved.

One essential point of the invention is that you have a real Regulation of the Einsenkvorgangs performed by that to be contacted Component itself or its position in the machining process or included in the scheme. So it is no longer assumed that the layer to be contacted at a certain depth below the map surface lies - what through Manufacturing tolerances can be very different - it will Rather, assume that you have the distance between the Countersink tool and the layer to be contacted at least so can that the direct contact between the Einsenkwerkzeug and the contact portion is determined.

In a preferred embodiment of the invention, the electrical impedance between the electrical component and at least one measuring electrode connected to the Einsenkwerkzeug measured. Capacitance measurement (or even a loss factor measurement) is particularly suitable for this purpose, since the component embedded in the card body is initially "insulated" at the beginning of the countersinking operation shorted this impedance, so undergoes an extremely strong change.

These capacity or Loss factor measurement can be achieved by detecting a resonant frequency (and / or damping) a resonant circuit in which the measuring electrode and the embedded component as well as the intermediate card material are involved. In this case, the resonant circuit is excited short pulses (blips) and observes the decay of the vibration in terms of zero crossings, to determine the resonance frequency or the damping of the resonant circuit. Then, when the countersink tool shorts the impedance, it experiences Decay process an extremely strong change.

Around one possible to achieve high working speed and yet not due Of feed dead times often very thin (15 micron thick) contact layers to destroy or break, it is beneficial if you have a significant Part of the recess to be incorporated in the control mode performs at which the countersinking tool is guided on the basis of stored control data. These are then adapted to the expected tolerances that the contacts are certainly not touched by the countersink tool, as long as you work in control mode. In this mode of operation becomes the countersink tool with an increased feed rate operated. Once the preset depth limit is reached, is switched to a lower feed rate to to stop the feed then, if the countersink tool makes electrical contact with the contact portion in the card body has produced embedded component.

preferably, the impedance between the embedded component and a holding device is measured, on which the card body with his, the surface across from lying lower surface rests. Then, when the Einsenkwerkzeug an electrical contact to the contact portion of the embedded component and this with the measuring electrode electrically connects, increases the capacity between the holding device and the measuring electrode.

following The invention will be explained with reference to Ausfüh tion examples, the with reference to the attached Figure will be described. Show here

1 : a plan view of a map cut in its median plane,

2 : a section through a complete map in a position similar to line II-II in 1 is implied

3 : a longitudinal section according to the 2 by a card body and a processing device, in which the card body is inserted,

4 : An electrical equivalent circuit diagram of the measuring arrangement with the involvement of the device 3 .

5 A second embodiment of the invention in a view similar to that of FIG 3 but with a matched measuring electrode,

6 FIG. 2: an electrical equivalent circuit diagram for the embodiment of the invention according to FIG 5 .

7 a further embodiment of the invention with a representation similar to that according to the 3 and 5 , and

8th : An arrangement electric equivalent circuit 7 ,

In The following diagram is for the same and the same effect Parts used the same reference numerals.

In the 1 and 2 is very schematic a card body 10 shown in which a component 11 , here a coil consisting of a conductor track 14 and a first and a second contact portion 12 and 13 is embedded. In a card body thus prepared now have the contact sections 12 and 13 be exposed in such a way that the metal layer (usually copper), which is very thin, is not broken.

This is the card body 10 as schematized in the 3 . 5 and 7 shown on a holding device 20 hung up the card body 10 with its top, in which recesses 15 should be introduced against a pressure plate 30 pushes and holds in this position. As a result, the card body is completely fixed during processing.

The pressure plate 30 in this example has a first and a second bore 31 and 32 on, so in the pressure plate 30 are attached, that they over the contact sections 12 and 13 at are ordered. They are dimensioned so that the milling head 28 a milling tool 29 through the holes 31 . 32 passed and into the material of the card body 10 can be driven into it.

The holding device 20 now includes a stamp 21 , which is movable up and down to a card body 10 to clamp and release. In the stamp 21 is an electrode 22 over an insulator 23 kept isolated, on which the card body 10 rests. The electrode 22 is connected to a terminal A The pressure plate 30 in turn connected to ground, as well as the milling tool 29 together with the milling head 28 ,

The following is based on 4 a possible measuring device explained by means of which can be determined when the milling head 28 an electrical contact to the component 11 or to the first contact section 13 manufactures.

In the 4 Meßanorndung shown is (of course at first glance) to be recognized as Wheatstone bridge, a pair of branches of resistive resistors R1, R2 is formed and the other branches of which a (lower) branch of a measuring capacitor C1 is formed. The other capacitor is on the one hand by the surface of the electrode 22 formed, on the other hand by the opposite surface of the pressure plate 30 ,

The component 11 or his contact sections 12 . 13 as well as its trace 14 form another capacitor surface, that of the electrode 22 opposite. First, so if the milling tool 29 or the milling head 28 the contact section 13 not touched while the recess 15 is created, the electrical component (the contact sections 12 . 13 and the track 14 ) in the air, so to speak. The in 4 shown switch is open. Then, when the milling head 28 an electrical contact to the contact portion 13 produces, becomes the component 11 grounded, so that the surface portions formed from the contact portions 12 and 13 as well as the conductor track 14 - Are electrically connected in parallel to the pressure plate 30 , As a result, the capacity in the Wheatstone bridge W increases, so that when a suitable prior tuning of the bridge an output from a measuring generator G AC no longer compensated but given a measuring rectifier to a differential amplifier A and fed from this as an amplified signal to a control device S. can be, which (not shown) feeding mechanism for the milling tool 29 stops and ends the sinking process.

The in the 5 and 6 shown variant of the invention differs from that according to the 3 and 4 only in that the electrode 22 not like in 3 shown over the entire surface but the shape of the component 11 or its conductor track 14 is adapted. This will increase the capacity between the pressure plate 30 and the electrode 22 reduced, but not between the electrode 22 and the component 11 or the conductor track 14 , This in turn causes the capacitance change in contact between the milling head 28 and the second contact portion 13 is greater than the capacity change in the embodiment of the invention according to 3 ,

The in the 7 and 8th embodiment of the invention shown differs from that according to the 5 and 6 in that no fixed measuring capacitor C1 is provided. Rather, the second portion of the capacitive bridge branch is formed by a capacitor whose one surface of the pressure plate 30 and its other surface through an electrode 22 ' is formed, as well as the electrode 22 over an insulator 23 ' in the stamp 21 is held. This electrode 22 ' is now at one point of the stamp 21 (For example, in its center) arranged, at which not the conductor track 14 but only the pressure plate 30 is arranged. This makes it possible to construct the overall arrangement (with a corresponding tuning of the measuring resistors R1 and R2) according to the respective card thickness so to speak self-calibrating.

Of course, it is also possible to use other measuring devices or measuring methods or to combine the options explained here with each other. It is important that the electrical contact between the milling head 28 and the component 11 (or a contact section 12 . 13 ) is used to end the sinking process.

In particular, it should be noted that the electrodes 22 of course not only in the stamp 21 , but also readily in the pressure plate 30 can be provided.

10

card body

11

component

12

first Contact section

13

second Contact section

14

conductor path

15

recess

20

holder

21

stamp

22

electrode

23

insulator

28

milling head

29

milling tool

30

platen

31

first drilling

32

second drilling

Claims (5)

Method for producing chip cards, in which an electrically conductive connection between a contact section ( 12 . 13 ) of a first, in a card body ( 10 ) embedded component ( 11 ), in particular an antenna device ( 14 ) and a contact of a second, in or on a card body ( 10 ) is created or inserted on a component, wherein in a surface of the card body by means of a Einsenkwerkzeugs ( 28 . 29 ) a recess ( 15 ) is sunk to a depth in which the contact section ( 12 . 13 ), wherein during the sinking an at least two-stage measurement of a distance between the contact portion ( 12 . 13 ) and the countersinking tool is stopped and the Einsenkvorgang then aborted when the measurement essentially results in a contact of the contact portion by the Einsenkwerkzeug, and the impedance between a measuring electrode ( 22 ) and a counter electrode ( 30 ) is measured, to which the embedded component is electrically connected in parallel via the Einsenkwerkzeug, wherein the card body ( 10 ) with the embedded component ( 11 ) is arranged between the measuring electrode and the counter electrode. Method according to claim 1, characterized in that that the Measurement by detecting a resonance frequency and / or damping of a resonant circuit takes place, in which the measuring electrode and the component is involved. Method according to one of the preceding claims, characterized characterized in that Sinking tool according to preset control values close the surface with higher Speed is lowered than in deeper areas of the card body. Method according to claim 1, characterized in that that the Impedance between the embedded component and a holding device is measured on which the card body with its, the surface opposite undersurface rests. Device for producing chip cards, in which an electrically conductive connection between a contact section ( 12 . 13 ) of a first, in a card body ( 10 ) embedded component ( 11 ), in particular an antenna device ( 14 ) and a contact of a second, in or on the card body on or aufzusetzenden component is provided, comprising a Einsenkwerkzeug ( 28 . 29 ), in particular a milling cutter for countersinking a recess ( 15 ) in a surface of the card body ( 10 ) to a depth at which the contact section (FIG. 12 . 13 ), and a measuring device, which during the lowering of the distance between the Einsenkwerkzeug ( 28 . 29 ) and the contact section ( 12 . 13 ) measures in at least two stages and then terminates the sinking operation if the measurement involves touching the contact portion ( 12 . 13 ) by the Einsenkwerkzeug ( 28 . 29 ), wherein the measuring device is designed to perform an impedance measurement and with a holding device ( 20 ) for fixing the card body ( 10 ), preferably with its surface opposite the lower surface, the at least one, the embedded component ( 12 - 14 ) covering measuring electrode ( 22 ) which is arranged in an electrically insulated manner such that the impedance / capacitance between the measuring electrode ( 22 ) and the embedded component ( 12 - 14 ) is measurable.