DE19717511C2 - Process for the specific wet chemical treatment of flat material to be treated in continuous systems - Google Patents
Process for the specific wet chemical treatment of flat material to be treated in continuous systemsInfo
- Publication number
- DE19717511C2 DE19717511C2 DE19717511A DE19717511A DE19717511C2 DE 19717511 C2 DE19717511 C2 DE 19717511C2 DE 19717511 A DE19717511 A DE 19717511A DE 19717511 A DE19717511 A DE 19717511A DE 19717511 C2 DE19717511 C2 DE 19717511C2
- Authority
- DE
- Germany
- Prior art keywords
- treatment liquid
- circuit boards
- printed circuit
- individual
- foils
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/08—Rinsing
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0685—Spraying of electrolyte
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0692—Regulating the thickness of the coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Electrochemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Electroplating Methods And Accessories (AREA)
Description
Die Erfindung betrifft ein Verfahren zur spezifischen, naßchemischen Behandlung von flachem Behandlungsgut, wie Leiterplatten und Leiterfolien, in Durchlaufanlagen. Vorzugsweise findet sie Anwendung in horizontalen Durchlaufanlagen zur naßchemischen und/oder elektrochemischen Behandlung sowie zum Spülen von Behandlungsgut.The invention relates to a method for specific, wet chemical Treatment of flat items to be treated, such as printed circuit boards and foils, in Continuous systems. It is preferably used in horizontal Continuous systems for wet chemical and / or electrochemical treatment as well as for washing items to be treated.
Leiterplatten werden an der Oberfläche und in Bohrlöchern naßchemisch und/oder elektrolytisch behandelt. Hierzu muß die Oberfläche des Behandlungs gutes mit Behandlungslösung in Verbindung gebracht werden. Dies geschieht in der Praxis bei Durchlaufanlagen überwiegend durch Sprühen oder Schwallen aus entsprechenden Düsen, Düsenstöcken oder Schwalldüsen, nachfolgend auch Düsenanordnung genannt. Diese ist quer zur Transportrichtung des Behandlungsgutes angeordnet. Das flache Behandlungsgut wird von Walzen durch eine derartige Anlage transportiert. Zwischen den Transportwalzen in Transportrichtung gesehen befinden sich diese Düsenanordnungen.Printed circuit boards are wet-chemical on the surface and in boreholes and / or treated electrolytically. To do this, the surface of the treatment good to be associated with treatment solution. This happens in in practice in continuous systems mainly by spraying or gushing from corresponding nozzles, nozzle sticks or surge nozzles, hereinafter also Called nozzle arrangement. This is transverse to the transport direction of the Treated goods arranged. The flat material is treated by rollers transported through such a facility. Between the transport rollers in Seen in the direction of transport, these nozzle arrangements are located.
In der Patentschrift DE 26 06 984 wird eine Schwalldüse beschrieben. Aus einem Schlitzrohr tritt Behandlungsflüssigkeit unter Druck in Richtung Leiterplatte aus. Die Leiterplatte wird intensiv durchspült. Andruckrollen sorgen dafür, daß die Leiterplatten gegen die Transportrollen gedrückt werden, wenn der Schwall auf der Gegenseite auf die Leiterplatte trifft. Dieses Verfahren ist jedoch nur anwendbar, wenn es sich um zu behandelnde Platten mit einer bestimmten Mindestdicke handelt. Zur Behandlung von Folien eignet sich dieses Verfahren nicht. Die Folien werden durch den Schwall aus der Transportbahn ausgelenkt. Ein störungsfreier Transport ist nicht möglich. Die zunehmende Miniaturisierung in der Leiterplattentechnik führt zu immer dünneren Leiterfolien, die immer präzisier zu fertigen sind. Das Auslenken der Folien verursacht ein Recken derselben. Die Einhaltung der üblicherweise sehr engen Abmessungstoleranzen der Folie ist nicht mehr möglich.A surge nozzle is described in the patent DE 26 06 984. Out Treatment liquid under pressure flows towards a slotted tube PCB out. The circuit board is flushed intensively. Pinch rollers ensure that the circuit boards are pressed against the transport rollers when the surge hits the circuit board on the opposite side. This However, the method is only applicable when it comes to the plates to be treated a certain minimum thickness. Is suitable for the treatment of foils this procedure does not. The slides are removed from the Transport path deflected. Trouble-free transportation is not possible. The increasing miniaturization in circuit board technology always leads to thinner conductor foils that can be manufactured more and more precisely. The deflection of the Films cause them to stretch. Compliance with the usually very narrow dimensional tolerances of the film are no longer possible.
In der Druckschrift DE 43 02 564 A1 werden Düsen in Form von Düsenstöcken beschrieben, die nahe an der Leiterplatte beidseitig angeordnet sind. Auch hier treten Führungsprobleme beim Transport und Toleranzprobleme auf, wenn Folien behandelt werden sollen. Praktisch läßt sich eine Folie durch eine derartige Anlage nicht transportieren, wenn abwechselnd auch Leiterplatten behandelt werden sollen. Folien werden durch den Schwall aus den Düsen so abgelenkt, daß es zu einem Folienstau in der Anlage kommt, weil der Schwalldruck für die Duchflutung der Bohrlöcher in entsprechend dickeren Leiterplatten ausgelegt ist. Praktisch bedeutet dies, daß eine Mischfahrweise, so wie sie in der Praxis gefordert wird, nicht möglich ist. Für jede Dicke des Behandlungsgutes sind die Schwallstrecken individuell einzustellen. Dies ist unwirtschaftlich oder unmöglich, wenn kleine Chargen bis herunter zu einzelnen Leiterplatten produziert werden sollen.In the publication DE 43 02 564 A1, nozzles are in the form of nozzle sticks described, which are arranged close to the circuit board on both sides. Here too leadership problems in transportation and tolerance issues arise when Foils to be treated. In practice, a film can be put through a Do not transport this type of system if there are alternating circuit boards should be treated. Foils are so through the surge from the nozzles distracted that there is a film jam in the system because of the Flood pressure for flooding the boreholes in correspondingly thicker ones PCB is designed. In practice, this means that a mixed mode of operation, so as is required in practice, is not possible. For every thickness of the The surge lines must be set individually for the goods to be treated. This is uneconomical or impossible if small batches down to individual Printed circuit boards are to be produced.
Aus EP 0 354 266 A1 ist ein Verfahren zum Ätzen von Leiterplattenmaterial mit einem Ätzmittel bekannt, bei dem das Ätzmittel über Düsenstöcke mit Dü sen an die Leiterplatten herangeführt wird. Dabei sind die Düsen auf der Ober- und Unterseite der Leiterplatten senkrecht zueinander angeordnet. Während des Durchlaufs der Leiterplatten durch die Ätzmaschine werden die Sprühdrücke an den Düsenstöcken oder Düsen auf konstante Werte eingestellt und/oder durch eine Einrichtung in Abhängigkeit von der Menge des von der Ober- und Unter seite der Leiterplatten abzuätzenden Metalls individuell geregelt, um eine kon stante Ätzrate zu erhalten. Hierzu wird beim Eintritt in die Ätzmaschine auf beiden Seiten der Leiterplatten die abzutragende Metallschichtdicke über ge eignete Dickenmeßgeräte ermittelt.EP 0 354 266 A1 describes a method for etching printed circuit board material known with an etchant, in which the etchant via nozzle blocks with Dü is brought up to the circuit boards. The nozzles are on the top and the underside of the circuit boards arranged perpendicular to each other. During the As the circuit boards pass through the etching machine, the spray pressures are turned on the nozzle sticks or nozzles are set to constant values and / or by a facility depending on the amount of that of the upper and lower side of the circuit board metal to be etched individually to ensure a con constant etching rate. This is done when entering the etching machine both sides of the circuit board, the metal layer thickness to be removed via ge suitable thickness gauges determined.
In DE 38 42 835 A1 ist eine Maschine zum Behandeln von Leiterplatten be schrieben, die ein Rollenfördersystem mit oberen und unteren, auf querliegenden Wellen gelagerten Rollen umfaßt. Die oberen Rollen sind in vertikaler Richtung verschiebbar und werden mit einer Einrichtung zum Anheben und Absenken bewegt, um deren Position an die jeweilige Dicke der durchlaufenden Leiter platten anzupassen. Hierzu wird die Dicke der Platten mit einer Erfassungsein richtung ermittelt, die ein optisches System oder einen Lesekopf zur Erfassung eines an den Platten angebrachten Codes enthält.DE 38 42 835 A1 describes a machine for treating printed circuit boards wrote that a roller conveyor system with top and bottom, on transverse Shafts mounted roles includes. The top rollers are in the vertical direction movable and are equipped with a device for lifting and lowering moved to their position to the respective thickness of the continuous conductor plates adapt. For this purpose, the thickness of the plates is measured with one direction determined by an optical system or a reading head for detection contains a code attached to the plates.
Aufgabe der Erfindung ist es, ein Verfahren zur naßchemischen, elektrochemischen und Spül-Behandlung von Leiterplatten und Leiterfolien in Durchlaufanlagen anzugeben, das es ermöglicht, jedes vorkommende Behand lungsgut in Bezug auf die Behandlungsgutdicke und Chargengröße in beliebiger Reihenfolge unter jeweils optimalen, hydrodynamischen Bedingungen zu produ zieren. Gelöst wird die Aufgabe durch das im Patentanspruch 1 beschriebene Verfahren.The object of the invention is to provide a method for wet chemical electrochemical and flushing treatment of printed circuit boards and foils in Specify continuous systems that make it possible to treat every treatment goods in relation to the treatment goods thickness and batch size in any Sequence under optimal, hydrodynamic conditions to produ adorn. The object is achieved by that described in claim 1 Method.
Die Erfindung wird anhand der Fig. 1 und 2 beschrieben.The invention will be described with reference to FIGS. 1 and 2.
Die Fig. 1 zeigt eine Schwalldüsenanordnung mit drehzahlver stellbaren Pumpen. Fig. 1 shows a surge nozzle assembly with drehzahlver adjustable pumps.
Die Fig. 2 zeigt eine Düsenanordnung mit zuschaltbaren Bypass leitungen. Fig. 2 shows a nozzle arrangement with switchable bypass lines.
Eine von üblicherweise mehreren Behandlungsstationen einer horizontalen Durchlaufanlage zur naßchemischen Behandlung oder Spülung zeigt Fig. 1 schematisch im Querschnitt. Innerhalb und außerhalb des Badbehälters 1 sind Transport- und Führungselemente 2 zum Transport des Behandlungsgutes 3 angeordnet. Die Transportrichtung zeigt der Pfeil 4.One of usually several treatment stations of a horizontal conveyorized system for the wet chemical treatment or flushing Fig. 1 shows schematically in cross section. Transport and guide elements 2 for transporting the items 3 to be treated are arranged inside and outside the bath container 1 . Arrow 4 shows the direction of transport.
Die Transport- und Führungselemente 2 sind durch nicht dargestellte Antriebs elemente, wie zum Beispiel Achsen und Zahnräder, so miteinander verbunden, daß sie von einem Motor 5 gemeinsam angetrieben werden. Ein Sensor, zum Beispiel eine Einweglichtschranke 6 im Einlaufbereich 7 der Anlage erkennt den Beginn und das Ende einer Leiterplatte oder einer Leiterfolie, die in die Anlage einfährt. Ein Dickensensor 8 erfaßt die Dicke des einfahrenden Behandlungs gutes 3. Mit dem Antrieb ist ein Wegsensor 9 gekoppelt. Der Wegsensor 9 besteht zum Beispiel aus einem Pulsrad 10 und einem Pulssensor 11. Durch die schlupffreie Koppelung aller Antriebselemente wird sichergestellt, daß ein Puls einer bestimmten Wegstrecke des Behandlungsgutes in der Anlage entspricht. Mit den Sensorsignalen ist es möglich, in der Anlagensteuerung 12 ein Abbild der Position aller zu behandelnden Platten und Folien in der Anlage zu führen. Damit ist die Steuerung mittels entsprechend ausgestalteter Fördermittel in der Lage, jede Düsenanordnung 13 zeitgenau mit der für jedes Behandlungsgut erforderlichen Menge an Behandlungsflüssigkeit zu speisen. Dies geschieht in dem Ausführungsbeispiel der Fig. 1 durch drehzahlveränderliche Pumpen motoren 14, die über Frequenzumrichter 15 mit elektrischem Strom gespeist werden. Die Anlagensteuerung 12 ermittelt anhand der Behandlungsgutdaten die momentan erforderlichen Drehzahlen für jedes Fördermittel, in der Regel Pumpen. Diese ermittelten Daten werden als Sollwerte den Frequenzumrichtern 15 zugeführt. Die Drehzahlverstellung bewirkt, daß die Pumpen 16 mehr oder weniger Flüssigkeit fördern, die mit mehr oder weniger Druck gegen die Oberfläche des Behandlungsgutes geströmt wird. Bei Folien muß zur Vermeidung einer zu großen Auslenkung ein kleiner Druck eingestellt werden. Dies ist auch in Bezug auf die naßchemische Behandlung zulässig, weil bei Folien Bohrlöcher mit einer großen Bohrlochtiefe nicht vorkommen. In Extremfällen kann eine Pumpe völlig abgeschaltet werden, wenn zum Beispiel eine Leiterplattenvorderkante eine Düsenanordnung passiert. In dieser Zeit ist die Gefahr der Auslenkung der Leiterplatte und insbesondere einer Leiterfolie am größten. Die einseitige Anordnung der Düsen 13 in Fig. 1 ist charakteristisch für die Bohrlochbehandlung. Mit zunehmender Bohrlochtiefe, wie dies bei Leiterplatten der Fall ist, muß die Behandlungsflüssigkeit unter größerem Druck angeströmt werden. Bei derartigen Platten besteht keine Gefahr einer zu großen Plattenauslenkung und damit keine Staugefahr und keine Gefahr der Plattenreckung in der Durchlaufanlage. Die drehzahlverstellbaren Pumpenantriebe erlauben somit in Verbindung mit der beschriebenen Erfassung und Verfolgung der Daten des Behandlungsgutes die stufenlose Anpassung der hydrodynamischen Bedingungen bezüglich der Behandlungsflüssigkeit am Behandlungsgut, und zwar individuell von Düsenanordnung 13 zu Düsenanordnung 13 in Transportrichtung. Gleiches gilt für das Ausführungsbeispiel gemäß Fig. 2. Die Sensoren, die Steuerung und der Antrieb des Behandlungsgutes sind hier nicht dargestellt. Diese Elemente ent sprechen den in Fig. 1 dargestellten Elementen. Quer zur Transportrichtung 4 sind hier obere und untere Schwalldüsen 17 eingezeichnet. Die oberen und unteren Düsen 17 sind zueinander leicht versetzt, um eine bessere Bohrloch durchflutung zu erzielen. Die Veränderung des Druckes der Behandlungs flüssigkeit an der Oberfläche des Behandlungsgutes erfolgt hier in Stufen. Bypassleitungen 18 werden parallel zur Düsenspeiseleitung 19 mittels Magnet ventilen 20 geschaltet. Die Menge der im Nebenschluß abfließenden Behand lungsflüssigkeit wird mittels manuell einstellbarer Ventile 21 vorgewählt. Die individuelle Steuerung der Magnetventile 20 erfolgt auch hier durch das nicht dargestellte Steuerungssystem.The transport and guide elements 2 are connected by drive elements, not shown, such as axles and gears, so that they are driven by a motor 5 together. A sensor, for example a one-way light barrier 6 in the inlet area 7 of the system, recognizes the beginning and the end of a printed circuit board or a conductor foil that enters the system. A thickness sensor 8 detects the thickness of the incoming treatment 3 . A displacement sensor 9 is coupled to the drive. The displacement sensor 9 consists, for example, of a pulse wheel 10 and a pulse sensor 11 . The slip-free coupling of all drive elements ensures that a pulse corresponds to a certain distance of the material to be treated in the system. With the sensor signals, it is possible to carry out an image of the position of all plates and foils to be treated in the system in the system controller 12 . The control is thus able, by means of appropriately designed conveying means, to feed each nozzle arrangement 13 precisely with the amount of treatment liquid required for each item to be treated. This is done in the embodiment of FIG. 1 by variable-speed pump motors 14 , which are supplied with electrical current via frequency converter 15 . The system controller 12 uses the material to be treated to determine the speeds currently required for each conveying means, usually pumps. These determined data are supplied to the frequency inverters 15 as setpoints. The speed adjustment causes the pumps 16 to convey more or less liquid which is flowed against the surface of the material to be treated with more or less pressure. In the case of foils, a small pressure must be set to avoid excessive deflection. This is also permissible in relation to the wet chemical treatment, because holes with a large hole depth do not occur in foils. In extreme cases, a pump can be switched off completely if, for example, a printed circuit board leading edge passes through a nozzle arrangement. During this time, the risk of deflection of the printed circuit board and in particular of a printed circuit film is greatest. The one-sided arrangement of the nozzles 13 in FIG. 1 is characteristic of the borehole treatment. As the depth of the borehole increases, as is the case with printed circuit boards, the treatment liquid must be flown under greater pressure. With such plates there is no risk of excessive plate deflection and therefore no risk of jamming and no risk of plate stretching in the continuous system. The speed-adjustable pump drives thus, in conjunction with the described recording and tracking of the data of the material to be treated, allow the hydrodynamic conditions with regard to the treatment liquid on the material to be continuously adjusted, individually from nozzle arrangement 13 to nozzle arrangement 13 in the transport direction. The same applies to the exemplary embodiment according to FIG. 2. The sensors, the control and the drive of the material to be treated are not shown here. These elements correspond to the elements shown in FIG. 1. Upper and lower surge nozzles 17 are shown transversely to the transport direction 4 . The upper and lower nozzles 17 are slightly offset from one another in order to achieve a better borehole flood. The change in the pressure of the treatment liquid on the surface of the material to be treated takes place here in stages. Bypass lines 18 are connected in parallel to the nozzle feed line 19 by means of solenoid valves 20 . The amount of treatment liquid flowing out of the shunt is preselected by means of manually adjustable valves 21 . The individual control of the solenoid valves 20 is also carried out here by the control system, not shown.
Besteht die Düsenanordnung 13 aus einzelnen Düsen, so lassen sich die hydrodynamischen Bedingungen an der Behandlungsgutoberfläche, insbesondere der Druck der auf die Oberfläche auftreffenden Flüssigkeit, durch Zu- und Abschalten einzelner Düsen verändern. Die Steuerung hierfür erfolgt ebenso, wie sie anhand des Beispiels in der Fig. 1 beschrieben wurde. Eine Vereinfachung der Sensorik ist immer dann möglich, wenn die Daten über das Behandlungsgut bereits im Steuerungssystem vorhanden sind. Bei der heute üblichen konse quenten Verfolgung eines Produktes zum Zwecke der Produktionsdatenauf zeichnung durch alle Fertigungslinien liegen diese Daten in der Regel vor. In diesem Falle kann mindestens der Dickensensor 8 entfallen. If the nozzle arrangement 13 consists of individual nozzles, the hydrodynamic conditions on the surface of the material to be treated, in particular the pressure of the liquid hitting the surface, can be changed by switching individual nozzles on and off. The control for this takes place in the same way as was described using the example in FIG. 1. A simplification of the sensors is always possible if the data about the material to be treated is already available in the control system. With the consequent consistent tracking of a product for the purpose of recording production data across all production lines, this data is usually available. In this case, at least the thickness sensor 8 can be omitted.
11
Badbehälter
Bath container
22nd
Transport und Führungselemente
Transport and guidance elements
33rd
Behandlungsgut
Material to be treated
44th
Transportrichtungspfeil
Transport direction arrow
55
Motor
engine
66
Einweglichtschranke
One-way light barrier
77
Einlaufbereich
Infeed area
88th
Dickensensor
Thickness sensor
99
Wegsensor
Displacement sensor
1010th
Pulsrad
Pulse wheel
1111
Pulssensor
Pulse sensor
1212th
Anlagensteuerung
Plant control
1313
Düsenanordnung
Nozzle arrangement
1414
Pumpenmotor
Pump motor
1515
Frequenzumrichter
frequency converter
1616
Pumpe
pump
1717th
Schwalldüsen
Surge nozzles
1818th
Bypassleitung
Bypass line
1919th
Düsenspeiseleitung
Nozzle feed line
2020th
Magnetventile
Solenoid valves
2121
Ventile
Valves
Claims (9)
- a) Beschicken der Durchlaufanlage mit Leiterplatten und/oder Leiterfo lien, die unterschiedliche Dicken aufweisen, in beliebiger Reihenfolge;
- b) Ermitteln der Dicken der Leiterplatten und/oder Leiterfolien vor dem Anlaufen der in Transportrichtung gesehen ersten Düsenanordnung;
- c) Verfolgen der Position der Leiterplatten und/oder Leiterfolien vom Zeit punkt der Ermittlung der Dicke bis nach dem Durchlaufen der in Trans portrichtung gesehen letzten Düsenanordnung in der Durchlaufanlage;
- d) Einstellen individueller Druckwerte der aus den einzelnen Düsenan ordnungen austretenden und an die Leiterplatten und Leiterfolien ange strömten Behandlungsflüssigkeit,
- a) loading the continuous system with circuit boards and / or Leiterfo lines, which have different thicknesses, in any order;
- b) determining the thicknesses of the printed circuit boards and / or conductive foils before the first nozzle arrangement seen in the transport direction starts up;
- c) tracking the position of the circuit boards and / or conductor foils from the time of determining the thickness until after passing through the last nozzle arrangement seen in the transport direction in the continuous system;
- d) setting of individual pressure values of the treatment liquid emerging from the individual nozzle arrangements and flowing onto the printed circuit boards and foil,
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19717511A DE19717511C2 (en) | 1997-04-25 | 1997-04-25 | Process for the specific wet chemical treatment of flat material to be treated in continuous systems |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19717511A DE19717511C2 (en) | 1997-04-25 | 1997-04-25 | Process for the specific wet chemical treatment of flat material to be treated in continuous systems |
Publications (2)
Publication Number | Publication Date |
---|---|
DE19717511A1 DE19717511A1 (en) | 1998-10-29 |
DE19717511C2 true DE19717511C2 (en) | 2000-09-14 |
Family
ID=7827746
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19717511A Expired - Fee Related DE19717511C2 (en) | 1997-04-25 | 1997-04-25 | Process for the specific wet chemical treatment of flat material to be treated in continuous systems |
Country Status (1)
Country | Link |
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DE (1) | DE19717511C2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105075406A (en) * | 2013-04-23 | 2015-11-18 | 德国艾托特克公司 | Device and method for the wet-chemical treatment of flat material to be treated |
TWI809115B (en) * | 2018-06-04 | 2023-07-21 | 德商雷納科技有限公司 | Item handling procedures and equipment for executing procedures |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10210538B4 (en) * | 2002-03-05 | 2004-11-18 | Atotech Deutschland Gmbh | Horizontal continuous system and method for the galvanotechnical treatment of material to be treated |
DE102007054090A1 (en) * | 2007-11-13 | 2009-05-20 | Rena Sondermaschinen Gmbh | Apparatus and method for one-sided wet treatment of good |
EP3072994B1 (en) * | 2015-03-27 | 2018-08-08 | ATOTECH Deutschland GmbH | Flooding device for a horizontal galvanic or wet-chemical process line for metal deposition on a substrate |
NL2030054B1 (en) * | 2021-12-07 | 2023-06-22 | Meco Equipment Eng B V | Device and method for the electrolytic treatment of substrates. |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2606948A1 (en) * | 1975-02-22 | 1976-09-02 | Sony Corp | CIRCUIT FOR GENERATING A CONTROL SIGNAL FOR A SWITCHING DEVICE |
EP0354266A1 (en) * | 1988-08-12 | 1990-02-14 | International Business Machines Corporation | Etching process and apparatus for work pieces composed at least partly of metals |
DE3842835A1 (en) * | 1988-12-20 | 1990-06-21 | Hoellmueller Maschbau H | Machine for treating board-like objects, especially for producing printed circuit boards |
DE4302564A1 (en) * | 1993-01-29 | 1994-08-04 | Hoellmueller Maschbau H | Etching, pickling or developing appts. esp. for fine structuring |
-
1997
- 1997-04-25 DE DE19717511A patent/DE19717511C2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2606948A1 (en) * | 1975-02-22 | 1976-09-02 | Sony Corp | CIRCUIT FOR GENERATING A CONTROL SIGNAL FOR A SWITCHING DEVICE |
EP0354266A1 (en) * | 1988-08-12 | 1990-02-14 | International Business Machines Corporation | Etching process and apparatus for work pieces composed at least partly of metals |
DE3842835A1 (en) * | 1988-12-20 | 1990-06-21 | Hoellmueller Maschbau H | Machine for treating board-like objects, especially for producing printed circuit boards |
DE4302564A1 (en) * | 1993-01-29 | 1994-08-04 | Hoellmueller Maschbau H | Etching, pickling or developing appts. esp. for fine structuring |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105075406A (en) * | 2013-04-23 | 2015-11-18 | 德国艾托特克公司 | Device and method for the wet-chemical treatment of flat material to be treated |
CN105075406B (en) * | 2013-04-23 | 2018-02-09 | 德国艾托特克公司 | Apparatus and method for the wet chemical treatment of pending planarization material |
TWI809115B (en) * | 2018-06-04 | 2023-07-21 | 德商雷納科技有限公司 | Item handling procedures and equipment for executing procedures |
Also Published As
Publication number | Publication date |
---|---|
DE19717511A1 (en) | 1998-10-29 |
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Legal Events
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OP8 | Request for examination as to paragraph 44 patent law | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |