DE19717511A1 - Method for specific wet chemical treatment of flat products in continuous installations - Google Patents

Method for specific wet chemical treatment of flat products in continuous installations

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Publication number
DE19717511A1
DE19717511A1 DE19717511A DE19717511A DE19717511A1 DE 19717511 A1 DE19717511 A1 DE 19717511A1 DE 19717511 A DE19717511 A DE 19717511A DE 19717511 A DE19717511 A DE 19717511A DE 19717511 A1 DE19717511 A1 DE 19717511A1
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DE
Germany
Prior art keywords
treated
nozzles
nozzle
treatment
continuous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19717511A
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German (de)
Other versions
DE19717511C2 (en
Inventor
Reinhard Schneider
Lorenz Kopp
Manfred Maurer
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Atotech Deutschland GmbH and Co KG
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Atotech Deutschland GmbH and Co KG
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Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Priority to DE19717511A priority Critical patent/DE19717511C2/en
Publication of DE19717511A1 publication Critical patent/DE19717511A1/en
Application granted granted Critical
Publication of DE19717511C2 publication Critical patent/DE19717511C2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0685—Spraying of electrolyte
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0692—Regulating the thickness of the coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The method concerns specific treatment of flat products (3) in the framework of wet chemical and/or electrochemical treatment, as well as rinsing in a continuous installation with nozzles, nozzle blocks or flooding nozzles. It is characterised by the following steps: a) loading of the installation with products of different thickness in an arbitrary sequence; b) determination of the dimensions of the products before the first nozzle arrangement (13); c) tracking of the position of the products from the instant at which their dimensions were determined to the end to the last treatment and rinsing section; d) adjustment of the hydrodynamic conditions of the nozzle arrangements along the transport path to the requirements of the products in each particular nozzle zone.

Description

Die Erfindung betrifft ein Verfahren zur spezifischen naßchemischen Behandlung von flachem Behandlungsgut wie Leiterplatten und Leiterfolien in Durchlaufanlagen. Vorzugsweise findet sie Anwendung in horizontalen Durchlaufanlagen zur naßchemischen und/oder elektrochemischen Behandlung sowie zum Spülen von Behandlungsgut.The invention relates to a method for specific wet chemical Treatment of flat items such as printed circuit boards and foils in Continuous systems. It is preferably used in horizontal Continuous systems for wet chemical and / or electrochemical treatment as well as for washing items to be treated.

Leiterplatten werden an der Oberfläche und in Bohrlöchern naßchemisch und/oder elektrolytisch behandelt. Hierzu muß die Oberfläche des Behandlungs­ gutes mit Behandlungslösung in Verbindung gebracht werden. Dies geschieht in der Praxis bei Durchlaufanlagen überwiegend durch Sprühen oder Schwallen aus entsprechenden Düsen, Düsenstöcken oder Schwalldüsen, nachfolgend auch Düsenanordnung genannt. Diese ist quer zur Transportrichtung des Behandlungsgutes angeordnet. Das flache Behandlungsgut wird von Walzen durch eine derartige Anlage transportiert. Zwischen den Transportwalzen in Transportrichtung gesehen befinden sich diese Düsenanordnungen.Printed circuit boards are wet-chemical on the surface and in boreholes and / or treated electrolytically. To do this, the surface of the treatment good to be associated with treatment solution. This happens in in practice in continuous systems mainly by spraying or gushing from corresponding nozzles, nozzle sticks or surge nozzles, hereinafter also Called nozzle arrangement. This is transverse to the transport direction of the Treated goods arranged. The flat material is treated by rollers transported through such a facility. Between the transport rollers in Seen in the direction of transport, these nozzle arrangements are located.

In der Patentschrift DE 26 06 984 wird eine Schwalldüse 4 beschrieben. Aus einem Schlitzrohr tritt Behandlungsflüssigkeit unter Druck in Richtung Leiterplatte aus. Die Leiterplatte wird intensiv durchspült. Andruckrollen 8 sorgen dafür, daß die Leiterplatten gegen die Transportrollen 1' gedrückt werden wenn der Schwall auf der Gegenseite auf die Leiterplatte trifft. Dieses Verfahren ist jedoch nur anwendbar, wenn es sich um zu behandelnde Platten mit einer bestimmten Mindestdicke handelt. Zur Behandlung von Folien eignet sich dieses Verfahren nicht. Die Folien werden durch den Schwall aus der Transportbahn ausgelenkt. Ein störungsfreier Transport ist nicht möglich. Die zunehmende Miniaturisierung in der Leiterplattentechnik führt zu immer dünneren Leiterfolien, die immer präziser zu fertigen sind. Das Auslenken der Folien verursacht ein Recken derselben. Die Einhaltung der üblicherweise sehr engen Abmessungstoleranzen der Folie ist nicht mehr möglich.In the patent DE 26 06 984 a surge nozzle 4 is described. Treatment liquid emerges from a slotted tube under pressure in the direction of the printed circuit board. The circuit board is flushed intensively. Pressure rollers 8 ensure that the circuit boards are pressed against the transport rollers 1 'when the surge hits the circuit board on the opposite side. However, this method can only be used if the panels to be treated are of a certain minimum thickness. This method is not suitable for the treatment of foils. The film is deflected out of the transport path by the surge. Trouble-free transportation is not possible. The increasing miniaturization in printed circuit board technology leads to ever thinner conductor foils, which can be manufactured more and more precisely. The deflection of the foils causes them to stretch. It is no longer possible to comply with the usually very narrow dimensional tolerances of the film.

In der Druckschrift DE 43 02 564 A1 werden Düsen in Form von Düsenstöcken beschrieben, die nahe an der Leiterplatte beidseitig angeordnet sind. Auch hier treten Führungsprobleme beim Transport und Toleranzprobleme auf, wenn Folien behandelt werden sollen. Praktisch läßt sich eine Folie durch eine derartige Anlage nicht transportieren, wenn abwechselnd auch Leiterplatten behandelt werden sollen. Folien werden durch den Schwall aus den Düsen so abgelenkt, daß es zu einem Folienstau in der Anlage kommt, weil der Schwalldruck für die Durchflutung der Bohrlöcher in entsprechend dickeren Leiterplatten ausgelegt ist. Praktisch bedeutet dies, daß eine Mischfahrweise, so wie sie in der Praxis gefordert wird, nicht möglich ist. Für jede Dicke des Behandlungsgutes sind die Schwallstrecken individuell einzustellen. Dies ist unwirtschaftlich oder unmöglich, wenn kleine Chargen bis herunter zu einzelnen Leiterplatten produziert werden sollen.In the publication DE 43 02 564 A1, nozzles are in the form of nozzle sticks described, which are arranged close to the circuit board on both sides. Here too leadership problems in transportation and tolerance issues arise when Foils to be treated. In practice, a film can be put through a Do not transport this type of system if there are alternating circuit boards should be treated. Foils are so through the surge from the nozzles distracted that there is a film jam in the system because of the Slug pressure for flooding the boreholes in correspondingly thicker ones PCB is designed. In practice, this means that a mixed mode of operation, so as is required in practice, is not possible. For every thickness of the The surge lines must be set individually for the goods to be treated. This is uneconomical or impossible if small batches down to individual Printed circuit boards are to be produced.

Aufgabe der Erfindung ist es, ein Verfahren zur naßchemischen und/oder elektrochemischen Behandlung und Spülung von flachem Behandlungsgut in Durchlaufanlagen anzugeben, das es ermöglicht, jedes vorkommende Behand­ lungsgut in Bezug auf die Behandlungsgutdicke und Chargengröße in beliebiger Reihenfolge unter jeweils optimalen hydrodynamischen Bedingungen zu produ­ zieren. Gelöst wird die Aufgabe durch das im Patentanspruch 1 beschriebene Verfahren.The object of the invention is a method for wet chemical and / or electrochemical treatment and rinsing of flat material to be treated in Specify continuous systems that make it possible to treat every treatment goods in relation to the treatment goods thickness and batch size in any Sequence under optimal hydrodynamic conditions to produ  adorn. The object is achieved by that described in claim 1 Method.

Die Erfindung wird anhand der Fig. 1 und 2 beschrieben.The invention will be described with reference to FIGS. 1 and 2.

Die Fig. 1 zeigt eine Schwalldüsenanordnung mit drehzahlver­ stellbaren Pumpen. Fig. 1 shows a surge nozzle assembly with drehzahlver adjustable pumps.

Die Fig. 2 zeigt eine Düsenanordnung mit zuschaltbaren Bypaß- leitungen. Fig. 2 shows a nozzle assembly with switchable bypass lines.

Eine von überlicherweise mehreren Behandlungsstationen einer horizontalen Durchlaufanlage zur naßchemischen Behandlung oder Spülung zeigt Fig. 1 schematisch im Querschnitt. Innerhalb und außerhalb des Badbehälters 1 sind Transport- und Führungselemente 2 zum Transport des Behandlungsgutes 3 angeordnet. Die Transportrichtung zeigt der Pfeil 4.A plurality of treatment stations typically offering a horizontal conveyorized system for the wet chemical treatment or flushing Fig. 1 shows schematically in cross section. Transport and guide elements 2 for transporting the items 3 to be treated are arranged inside and outside the bath container 1 . Arrow 4 shows the direction of transport.

Die Transport- und Führungselemente 2 sind durch nicht dargestellte Antriebs­ elemente, wie zum Beispiel Achsen und Zahnräder, so miteinander verbunden, daß sie von einem Motor 5 gemeinsam angetrieben werden. Ein Sensor, zum Beispiel eine Einweglichtschranke 6 im Einlaufbereich 7 der Anlage erkennt den Beginn und das Ende einer Leiterplatte oder einer Leiterfolie, die in die Anlage einführt. Ein Dickensensor 8 erfaßt die Dicke des einfahrenden Behandlungs­ gutes 3. Mit dem Antrieb ist ein Wegsensor 9 gekoppelt. Der Wegsensor 9 besteht zum Beispiel aus einem Pulsrad 10 und einem Pulssensor 11. Durch die schlupffreie Koppelung aller Antriebselemente wird sichergestellt, daß ein Puls einer bestimmten Wegstrecke des Behandlungsgutes in der Anlage entspricht. Mit den Sensorsignalen ist es möglich, in der Anlagensteuerung 12 ein Abbild der Position aller zu behandelnden Platten und Folien in der Anlage zu führen. Damit ist die Steuerung mittels entsprechend ausgestalteter Fördermittel in der Lage, jede Düsenanordnung 13 zeitgenau mit der für jedes Behandlungsgut erforderlichen Menge an Behandlungsflüssigkeit zu speisen. Dies geschieht in dem Ausführungsbeispiel der Fig. 1 durch drehzahlveränderliche Pumpen­ motoren 14, die über Frequenzumrichter 15 mit elektrischem Strom gespeist werden. Die Anlagensteuerung 12 ermittelt anhand der Behandlungsgutdaten die momentan erforderlichen Drehzahlen für jedes Fördermittel, in der Regel Pumpen. Diese ermittelten Daten werden als Sollwerte den Frequenzumrichtern 15 zugeführt. Die Drehzahlverstellung bewirkt daß die Pumpen 16 mehr oder weniger Flüssigkeit fördern, die mit mehr oder weniger Druck gegen die Oberfläche des Behandlungsgutes geströmt wird. Bei Folien muß zur Vermeidung einer zu großen Auslenkung ein kleiner Druck eingestellt werden. Dies ist auch in Bezug auf die naßchemische Behandlung zulässig, weil bei Folien Bohrlöcher mit einer großen Bohrlochtiefe nicht vorkommen. In Extremfällen kann eine Pumpe völlig abgeschaltet werden, wenn zum Beispiel eine Leiterplattenvorderkante eine Düsenanordnung passiert. In dieser Zeit ist die Gefahr der Auslenkung der Leiterplatte und insbesondere einer Leiterfolie am größten. Die einseitige Anordnung der Düsen 13 in Fig. 1 ist charakteristisch für die Bohrlochbehandlung. Mit zunehmender Bohrlochtiefe, wie dies bei Leiterplatten der Fall ist, muß die Behandlungsflüssigkeit unter größerem Druck angeströmt werden. Bei derartigen Platten besteht keine Gefahr einer zu großen Plattenauslenkung und damit keine Staugefahr und keine Gefahr der Plattenreckung in der Durchlaufanlage. Die drehzahlverstellbaren Pumpenantriebe erlauben somit in Verbindung mit der beschriebenen Erfassung und Verfolgung der Daten des Behandlungsgutes die stufenlose Anpassung der hydrodynamischen Bedingungen bezüglich der Behandlungsflüssigkeit am Behandlungsgut und zwar individuell von Düsenanordnung 13 zu Düsenanordnung 13 in Transportrichtung. Gleiches gilt für das Ausführungsbeispiel gemäß Fig. 2. Die Sensoren, die Steuerung und der Antrieb des Behandlungsgutes sind hier nicht dargestellt. Diese Elemente ent­ sprechen den in Fig. 1 dargestellten Elementen. Quer zur Transportrichtung 4 sind hier obere und untere Schwalldüsen 17 eingezeichnet. Die oberen und unteren Düsen 17 sind zueinander leicht versetzt, um eine bessere Bohrloch­ durchflutung zu erzielen. Die Veränderung des Druckes der Behandlungs­ flüssigkeit an der Oberfläche des Behandlungsgutes erfolgt hier in Stufen. Bypaßleitungen 18 werden parallel zur Düsenspeiseleitung 19 mittels Magnet­ ventile 20 geschaltet. Die Menge der im Nebenschluß abfließenden Behand­ lungsflüssigkeit wird mittels manuell einstellbarer Ventile 21 vorgewählt. Die individuelle Steuerung der Magnetventile 20 erfolgt auch hier durch das nicht dargestellte Steuerungssystem.The transport and guide elements 2 are connected by drive elements, not shown, such as axles and gears, so that they are driven by a motor 5 together. A sensor, for example a one-way light barrier 6 in the inlet area 7 of the system, recognizes the beginning and the end of a printed circuit board or a conductor foil that leads into the system. A thickness sensor 8 detects the thickness of the incoming treatment 3 . A displacement sensor 9 is coupled to the drive. The displacement sensor 9 consists, for example, of a pulse wheel 10 and a pulse sensor 11 . The slip-free coupling of all drive elements ensures that a pulse corresponds to a certain distance of the material to be treated in the system. With the sensor signals, it is possible to carry out an image in the system controller 12 of the position of all the plates and foils to be treated in the system. In this way, the control, by means of appropriately designed conveying means, is able to feed each nozzle arrangement 13 precisely in time with the amount of treatment liquid required for each item to be treated. This is done in the embodiment of FIG. 1 by variable-speed pump motors 14 , which are supplied with electrical current via frequency converter 15 . The system controller 12 uses the material to be treated to determine the speeds currently required for each conveying means, usually pumps. These determined data are supplied to the frequency inverters 15 as setpoints. The speed adjustment causes the pumps 16 to convey more or less liquid which is flowed against the surface of the material to be treated with more or less pressure. In the case of foils, a small pressure must be set to avoid excessive deflection. This is also permissible in relation to the wet chemical treatment, because holes with a large hole depth do not occur in foils. In extreme cases, a pump can be switched off completely if, for example, a printed circuit board leading edge passes through a nozzle arrangement. During this time, the risk of deflection of the printed circuit board and in particular of a printed circuit film is greatest. The one-sided arrangement of the nozzles 13 in FIG. 1 is characteristic of the borehole treatment. As the depth of the borehole increases, as is the case with printed circuit boards, the treatment liquid must be flown under greater pressure. With such plates there is no risk of excessive plate deflection and therefore no risk of jamming and no risk of plate stretching in the continuous system. The speed-adjustable pump drives, in conjunction with the described recording and tracking of the data of the material to be treated, permit the continuous adjustment of the hydrodynamic conditions with regard to the treatment liquid on the material to be treated, specifically individually from nozzle arrangement 13 to nozzle arrangement 13 in the transport direction. The same applies to the exemplary embodiment according to FIG. 2. The sensors, the control and the drive of the material to be treated are not shown here. These elements correspond to the elements shown in FIG. 1. Upper and lower surge nozzles 17 are shown transversely to the transport direction 4 . The upper and lower nozzles 17 are slightly offset from one another in order to achieve a better borehole flood. The change in the pressure of the treatment liquid on the surface of the material to be treated takes place here in stages. Bypass lines 18 are connected in parallel to the nozzle feed line 19 by means of solenoid valves 20 . The amount of treatment liquid flowing out of the shunt is preselected by means of manually adjustable valves 21 . The individual control of the solenoid valves 20 is also carried out here by the control system, not shown.

Besteht die Düsenanordnung 13 aus einzelnen Düsen, so läßt sich die hydrodynamische Bedingung an der Behandlungsgutoberfläche durch Zu- und Abschalten einzelner Düsen verändern. Die Steuerung hierfür erfolgt ebenso, wie sie anhand des Beispiels in der Fig. 1 beschrieben wurde. Eine Vereinfachung der Sensorik ist immer dann möglich, wenn die Daten über das Behandlungsgut bereits im Steuerungssystem vorhanden sind. Bei der heute üblichen konse­ quenten Verfolgung eines Produktes zum Zwecke der Produktionsdatenauf­ zeichnung durch alle Fertigungslinien liegen diese Daten in der Regel vor. In diesem Falle kann mindestens der Dickensensor 8 entfallen. If the nozzle arrangement 13 consists of individual nozzles, the hydrodynamic condition on the surface of the material to be treated can be changed by switching individual nozzles on and off. The control for this takes place in the same way as was described using the example in FIG. 1. A simplification of the sensors is always possible if the data about the material to be treated is already available in the control system. With the consequent consistent tracking of a product for the purpose of recording production data across all production lines, this data is usually available. In this case, at least the thickness sensor 8 can be omitted.

BezugszeichenlisteReference list

11

Badbehälter
Bath container

22nd

Transport und Führungselemente
Transport and guidance elements

33rd

Behandlungsgut
Material to be treated

44th

Transportrichtungspfeil
Transport direction arrow

55

Motor
engine

66

Einweglichtschranke
One-way light barrier

77

Einlaufbereich
Infeed area

88th

Dickensensor
Thickness sensor

99

Wegsensor
Displacement sensor

1010th

Pulsrad
Pulse wheel

1111

Pulssensor
Pulse sensor

1212th

Anlagensteuerung
Plant control

1313

Düsenanordnung
Nozzle arrangement

1414

Pumpenmotor
Pump motor

1515

Frequenzumrichter
frequency converter

1616

Pumpe
pump

1717th

Schwalldüsen
Surge nozzles

1818th

Bypaßleitung
Bypass line

1919th

Düsenspeiseleitung
Nozzle feed line

2020th

Magnetventile
Solenoid valves

2121

Ventile
Valves

Claims (10)

1. Verfahren zur spezifischen Behandlung von flachem Behandlungsgut während der naßchemischen und/oder elektrochemischen Behandlung sowie zur Spülung in Durchlaufanlagen mit Düsen, Düsenstöcken oder Schwalldüsen, aus welchen die Behandlungsflüssigkeit an die Oberfläche des Behandlungsguts angeströmt wird, gekennzeichnet durch die Ver­ fahrensschritte
  • a) Beschickung der Durchlaufanlage mit Behandlungsgut mit unter­ schiedlicher Dicke in beliebiger Reihenfolge.
  • b) Ermittlung der Abmessungen des Behandlungsgutes vor der ersten Düsenanordnung.
  • c) Verfolgung der Position des Behandlungsgutes vom Zeitpunkt der Ermittlung der Abmessungen bis zum Ende der letzten Behandlungs- und Spülstrecke in der Durchlaufanlage.
  • d) Einstellung der hydrodynamischen Bedingungen der Düsenanordnungen entlang des Transportweges auf die Erfordernisse des Behandlungsgutes, das sich gerade im jeweiligen Düsenbereich befindet.
1. A method for the specific treatment of flat material to be treated during the wet chemical and / or electrochemical treatment and for rinsing in continuous systems with nozzles, nozzle sticks or surge nozzles, from which the treatment liquid is flown to the surface of the material to be treated, characterized by the process steps
  • a) Loading the continuous system with material to be treated with different thicknesses in any order.
  • b) determining the dimensions of the material to be treated in front of the first nozzle arrangement.
  • c) Tracking the position of the material to be treated from the time the dimensions were determined to the end of the last treatment and rinsing section in the continuous system.
  • d) Setting the hydrodynamic conditions of the nozzle arrangements along the transport path to the requirements of the material to be treated, which is currently in the respective nozzle area.
2. Verfahren nach Anspruch 1 dadurch gekennzeichnet, daß die Dicke des Behandlungsgutes mittels eines Sensors, der an der Beschickung der Durchlaufanlage angeordnet ist, erfolgt. 2. The method according to claim 1, characterized in that the thickness of the Treated goods by means of a sensor that is attached to the feed of the Continuous plant is arranged, takes place.   3. Verfahren nach den Ansprüchen 1 und 2 dadurch gekennzeichnet, daß die Länge des Behandlungsguts in Transportrichtung mittels eines Sensors gemessen wird.3. The method according to claims 1 and 2, characterized in that the Length of the material to be treated in the direction of transport using a sensor is measured. 4. Verfahren nach Anspruch 1 dadurch gekennzeichnet, daß die Ab­ messungen des Behandlungsgutes während der Beschickung einem Datenspeicher der Anlagensteuerung entnommen werden.4. The method according to claim 1, characterized in that the Ab Measurements of the material to be treated during loading Data storage can be taken from the system control. 5. Verfahren nach den Ansprüchen 1 bis 4 dadurch gekennzeichnet, daß in der Anlagensteuerung der Weg jedes Behandlungsgutes in Abhängig­ keit von der Transportgeschwindigkeit in der Durchlaufanlage so ver­ folgt wird, daß jederzeit bekannt ist, welche Art von Behandlungsgut sich im Bereich jeder Düsenanordnung befindet.5. The method according to claims 1 to 4, characterized in that in the path of each item to be treated depends on the system control speed of the transport in the continuous system it follows that it is known at all times what type of material to be treated is located in the area of each nozzle arrangement. 6. Verfahren nach den Ansprüchen 1 bis 5 dadurch gekennzeichnet, daß die individuelle Einstellung der hydrodynamischen Bedingungen der Düsenanordnung durch Veränderung des Druckes der Behandlungs­ flüssigkeit in den Düsen erfolgt.6. The method according to claims 1 to 5, characterized in that the individual adjustment of the hydrodynamic conditions of the Nozzle arrangement by changing the pressure of the treatment liquid occurs in the nozzles. 7. Verfahren nach den Ansprüchen 1 bis 5 dadurch gekennzeichnet, daß die individuelle Einstellung der hydrodynamischen Bedingungen der Düsen­ anordnung durch Begrenzung der Flüssigkeitsmenge in den Düsen mittels Zuschaltung/Abschaltung verschiedener Bypaßleitungen erfolgt. 7. The method according to claims 1 to 5, characterized in that the individual adjustment of the hydrodynamic conditions of the nozzles arrangement by limiting the amount of liquid in the nozzles by means of Different bypass lines are switched on / off.   8. Verfahren nach den Ansprüchen 1 bis 5 dadurch gekennzeichnet, daß die individuelle Einstellung der hydrodynamischen Bedingungen der Düsen­ anordnung durch teilweises Abschalten von Düsen einer Düsenanordnung erfolgt.8. The method according to claims 1 to 5, characterized in that the individual adjustment of the hydrodynamic conditions of the nozzles arrangement by partially switching off the nozzles of a nozzle arrangement he follows. 9. Verfahren nach Anspruch 6 dadurch gekennzeichnet, daß die Verände­ rung des Druckes und der Fördermenge der Behandlungsflüssigkeit durch Veränderung der Pumpendrehzahl erfolgt.9. The method according to claim 6, characterized in that the changes tion of the pressure and the delivery rate of the treatment liquid The pump speed is changed. 10. Verfahren nach mindestens einem der Ansprüche 1 bis 5 dadurch ge­ kennzeichnet, daß Düsenanordnungen zeitweise völlig abgeschaltet werden.10. The method according to at least one of claims 1 to 5 thereby ge indicates that nozzle arrangements are temporarily switched off completely will.
DE19717511A 1997-04-25 1997-04-25 Process for the specific wet chemical treatment of flat material to be treated in continuous systems Expired - Fee Related DE19717511C2 (en)

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DE102007054090A1 (en) * 2007-11-13 2009-05-20 Rena Sondermaschinen Gmbh Apparatus and method for one-sided wet treatment of good
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