DE19708291C2 - Guide for electronic components, in particular of integrated circuits (IC), in IC handling devices - Google Patents

Guide for electronic components, in particular of integrated circuits (IC), in IC handling devices

Info

Publication number
DE19708291C2
DE19708291C2 DE1997108291 DE19708291A DE19708291C2 DE 19708291 C2 DE19708291 C2 DE 19708291C2 DE 1997108291 DE1997108291 DE 1997108291 DE 19708291 A DE19708291 A DE 19708291A DE 19708291 C2 DE19708291 C2 DE 19708291C2
Authority
DE
Germany
Prior art keywords
guide
height
parts
integrated circuits
spacers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE1997108291
Other languages
German (de)
Other versions
DE19708291A1 (en
Inventor
Gerhard Wiederer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rasco GmbH
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE1997108291 priority Critical patent/DE19708291C2/en
Publication of DE19708291A1 publication Critical patent/DE19708291A1/en
Application granted granted Critical
Publication of DE19708291C2 publication Critical patent/DE19708291C2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Framework For Endless Conveyors (AREA)
  • Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)

Description

Bekannt ist, daß ICs mittels Führungen durch den IC-Handhabungsautomaten geleitet werden.It is known that ICs by means of guides through the IC handling machine be directed.

Um ICs mit unterschiedlichen Abmessungen zu führen, ist es notwendig, Führungen mit den unterschiedlichsten Abmessungen einzusetzen. Dadurch entsteht eine Vielzahl von verschiedenen Führungen (Kombinationen Höhe-Breite). Nach dem Stand der Technik werden diese Führungen speziell für jeden IC gefertigt (gefräst). Dabei ist eine hohe Fertigungspräzision notwendig, um den IC einerseits sicher in seiner Lage zu halten, andererseits ein störungsfreies Gleiten des IC in der Führung zu gewährleisten. Der Transport des IC in der Führung erfolgt durch z. B. Schwerkraft, Druckluft o. Ä.In order to guide ICs with different dimensions, it is necessary to use guides with different dimensions. This creates one Variety of different guides (combinations of height and width). After this State of the art, these guides are specially manufactured (milled) for each IC. A high level of manufacturing precision is required to securely hold the IC on the one hand to keep its position, on the other hand a trouble-free sliding of the IC in the guide to ensure. The transport of the IC in the guide is done by z. B. Gravity, compressed air or similar

Dies bedeutet einen erheblichen Fertigungsaufwand (Fräsbearbeitung) sowie einen hohen Aufwand bei der Lagerhaltung.This means a considerable manufacturing effort (milling) and one high expenditure in warehousing.

Dieser Stand der Technik ist nicht druckschriftlich zu belegen, dem Fachmann aber geläufig.This state of the art cannot be documented in printed form, but to the person skilled in the art common.

Der Stand der Technik für eine weitere Möglichkeit der Führung von ICs ist in der Druckschrift US 5 348 033 wie folgt beschrieben:
ICs werden auf Endlos-Bändern befördert, die durch Rollen, über die sie gespannt sind, vorwärts bewegt werden. Diese Bänder weisen ein dem beförderten IC angepaßtes Profil auf, durch das die ICs sicher in ihrer Lage auf dem Band gehalten werden. Es findet keine Relativbewegung zwischen der Führung, also dem Band, und dem IC statt. Der Transport des IC erfolgt durch die Vorwärtsbewegung des Bandes.The prior art for a further possibility of guiding ICs is described in US Pat. No. 5,348,033 as follows:
ICs are transported on endless belts that are moved forward by rollers over which they are stretched. These tapes have a profile adapted to the transported IC, by means of which the ICs are held securely in their position on the tape. There is no relative movement between the guide, i.e. the belt, and the IC. The IC is transported by moving the tape forward.

Der Erfindung liegt das Problem zugrunde, die Vielzahl von Führungen zu verringern, den Fertigungsaufwand (Fräsbearbeitung) zu minimieren und die Lagerhaltung der Führungen zu vereinfachen. The invention is based on the problem of the large number of guides reduce the manufacturing effort (milling) and minimize the Simplify storage of the guides.  

Dieses Problem wird durch die im Patentanspruch 1 aufgeführten Merkmale gelöst. Vorteilhafte Ausgestaltungen sind im Unteranspruch angegeben.This problem is solved by the features listed in claim 1. Advantageous configurations are specified in the subclaim.

Die mit der Erfindung erzielten Vorteile bestehen insbesondere darin, daß statt einer Vielzahl von unterschiedlichen Führungen für die verschiedenen IC-Abmessungen nur
The advantages achieved by the invention are, in particular, that instead of a variety of different guides for the different IC dimensions only

  • a) zwei identische Seitenführungsteile, die auch die Kanalhöhe begrenzen,a) two identical side guide parts, which also limit the channel height,
  • b) zwei identische Distanzteile pro IC-Höhe undb) two identical spacers per IC height and
  • c) eine Grundplatte pro IC-Breitec) one base plate per IC width

hergestellt und auf Lager gehalten werden müssen.must be manufactured and kept in stock.

  • a) Der Fräsaufwand beschränkt sich auf
    • - Freifräsungen in der Grundplatte (hier 3 Rillen)
    • - Bearbeitung der Seitenführung: IC-Anlagekante
    a) The milling effort is limited to
    • - Free milling in the base plate (here 3 grooves)
    • - Machining the side guide: IC system edge

Ein Ausführungsbeispiel der Erfindung ist in der Zeichnung dargestellt und wird im folgenden näher beschrieben; es zeigen:An embodiment of the invention is shown in the drawing and is in following described in more detail; show it:

Fig. 1: Vorderansicht einer kompletten Führung Fig. 1: Front view of a complete tour

Fig. 2: Draufansicht einer kompletten Führung Fig. 2: Top view of a complete tour

Fig. 3: Seitenansicht einer kompletten Führung Fig. 3: Side view of a complete guide

Die Höhenführungsteile (1) begrenzen die Bahn des ICs (5) nach oben und dienen als seitliche Führung. Die Funktion der Höhenführung ist unabhängig von den IC-Abmessungen.The height guide parts ( 1 ) limit the path of the IC ( 5 ) upwards and serve as a lateral guide. The function of the height control is independent of the IC dimensions.

Die Distanzteile (2) bestimmen die Führungskanalhöhe, unabhängig von der Führungskanalbreite.The spacers ( 2 ) determine the guide channel height, regardless of the guide channel width.

Die Grundplatte (3) bestimmt durch die Positionen der Zylinderstifte (4) die Breite des Führungskanals.The base plate ( 3 ) determines the width of the guide channel through the positions of the cylindrical pins ( 4 ).

Claims (2)

1. Führung für elektronische Bauelemente, insbesondere von integrierten Schaltungen (IC), in IC-Handhabungsgeräten, dadurch gekennzeichnet, daß die Führung
  • a) aus zwei, für alle IC-Abmessungen, identischen Seitenführungsteilen (1), die auch den Führungskanal nach oben begrenzen,
  • b) aus zwei identischen Distanzteilen (2), deren Dicke je nach IC-Höhe variiert, und
  • c) aus einer Grundplatte (3), deren IC-Lauffläche und Distanzauflagen auf einem Niveau liegen, welche den Abstand der Seitenführungsteile (1) und der Distanzteile (2) vorgibt,
zusammengesetzt ist, wobei
  • a) die Komponenten gemäß a), b) und c) je für sich hergestellt sind und
  • b) die Höhe und die Breite der Führung unabhängig voneinander, durch Einsetzen der vorgenannten Komponenten a) bis c) bestimmt sind.
1. Guide for electronic components, in particular of integrated circuits (IC), in IC handling devices, characterized in that the guide
  • a) from two, for all IC dimensions, identical side guide parts ( 1 ), which also limit the guide channel upwards,
  • b) from two identical spacers ( 2 ), the thickness of which varies depending on the IC height, and
  • c) from a base plate ( 3 ), the IC running surface and spacers of which are at a level which specifies the distance between the side guide parts ( 1 ) and the spacer parts ( 2 ),
is composed, whereby
  • a) the components according to a), b) and c) are each manufactured individually and
  • b) the height and the width of the guide are determined independently of one another by inserting the aforementioned components a) to c).
2. Führung nach Patentanspruch 1 dadurch gekennzeichnet,
  • a) daß die Distanzteile (2) zur Einstellung der IC-Höhe aus einem genormten Präzisionshalbzeug mit geringer Dickentoleranz hergestellt sind.
  • b) daß die Grundplatte (3) ein- oder zweiteilig ist.
2. leadership according to claim 1, characterized in
  • a) that the spacers ( 2 ) for setting the IC height are made from a standardized precision semi-finished product with a small thickness tolerance.
  • b) that the base plate ( 3 ) is in one or two parts.
DE1997108291 1997-02-28 1997-02-28 Guide for electronic components, in particular of integrated circuits (IC), in IC handling devices Expired - Lifetime DE19708291C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE1997108291 DE19708291C2 (en) 1997-02-28 1997-02-28 Guide for electronic components, in particular of integrated circuits (IC), in IC handling devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1997108291 DE19708291C2 (en) 1997-02-28 1997-02-28 Guide for electronic components, in particular of integrated circuits (IC), in IC handling devices

Publications (2)

Publication Number Publication Date
DE19708291A1 DE19708291A1 (en) 1998-09-10
DE19708291C2 true DE19708291C2 (en) 2001-10-18

Family

ID=7821907

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1997108291 Expired - Lifetime DE19708291C2 (en) 1997-02-28 1997-02-28 Guide for electronic components, in particular of integrated circuits (IC), in IC handling devices

Country Status (1)

Country Link
DE (1) DE19708291C2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1950576A1 (en) * 2007-01-24 2008-07-30 Rasco GmbH Guiding device and testing device for electronic assembly parts

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5348033A (en) * 1991-10-01 1994-09-20 National Semiconductor Corporation Method and apparatus for handling singulated electronic components

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5348033A (en) * 1991-10-01 1994-09-20 National Semiconductor Corporation Method and apparatus for handling singulated electronic components

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1950576A1 (en) * 2007-01-24 2008-07-30 Rasco GmbH Guiding device and testing device for electronic assembly parts
US7948251B2 (en) 2007-01-24 2011-05-24 Rasco Gmbh Guide device and test apparatus for electronic devices

Also Published As

Publication number Publication date
DE19708291A1 (en) 1998-09-10

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: RASCO GMBH, 83059 KOLBERMOOR, DE

8381 Inventor (new situation)

Inventor name: WIEDERER, GERHARD, DIPL.-ING. (FH), 83109 GROS, DE

R082 Change of representative

Representative=s name: GRUENECKER, KINKELDEY, STOCKMAIR & SCHWANHAEUS, DE

Representative=s name: GRUENECKER PATENT- UND RECHTSANWAELTE PARTG MB, DE

R071 Expiry of right