DE19708291A1 - Guide for electronic components, esp. integrated circuit manipulation device - Google Patents

Guide for electronic components, esp. integrated circuit manipulation device

Info

Publication number
DE19708291A1
DE19708291A1 DE1997108291 DE19708291A DE19708291A1 DE 19708291 A1 DE19708291 A1 DE 19708291A1 DE 1997108291 DE1997108291 DE 1997108291 DE 19708291 A DE19708291 A DE 19708291A DE 19708291 A1 DE19708291 A1 DE 19708291A1
Authority
DE
Germany
Prior art keywords
guide
height
distance
integrated circuit
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE1997108291
Other languages
German (de)
Other versions
DE19708291C2 (en
Inventor
Gerhard Dipl Ing Wiederer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rasco GmbH
Original Assignee
WIEDERER GERHARD DIPL ING FH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WIEDERER GERHARD DIPL ING FH filed Critical WIEDERER GERHARD DIPL ING FH
Priority to DE1997108291 priority Critical patent/DE19708291C2/en
Publication of DE19708291A1 publication Critical patent/DE19708291A1/en
Application granted granted Critical
Publication of DE19708291C2 publication Critical patent/DE19708291C2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Framework For Endless Conveyors (AREA)
  • Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)

Abstract

The guide has two lateral guides (1) which are identical for all integrated circuit (IC) (5) dimensions and which limit the guide channels at the top, two identical distance pieces (2), whose thicknesses vary with IC height, and a base plate (3) whose IC movement surface and distance part support lie at a level defining the distance of the lateral guides and the distance parts. The components are made to match each other. The height and breadth of the guide are independently determined from the component dimensions.

Description

Stand der TechnikState of the art

Bekannt ist, daß ICs mittels Führungen durch den IC- Handhabungsautomaten geleitet werden.It is known that ICs are guided through the IC Handling machines are directed.

Um ICs mit unterschiedlichen Abmessungen zu führen, ist es notwendig, Führungen mit den unterschiedlichsten Abmessungen einzusetzen. Dadurch entsteht eine Vielzahl von verschiedenen Führungen (Kombinationen Höhe-Breite) Dies bedeutet einen erheblichen Fertigungsaufwand (Fräsbearbeitung).To run ICs with different dimensions, it is necessary tours with the most varied Use dimensions. This creates a multitude of various guides (combinations of height and width) This means a considerable manufacturing effort (Milling).

Problemproblem

Angabe der Wirkungen, die mit der Erfindung erzielt werden sollen.Indication of the effects to be achieved with the invention.

Der in Patentanspruch 1 angegebenen Erfindung liegt das Problem zugrunde, die Vielzahl von Führungen zu verringern, den Fertigungsaufwand (Fräsbearbeitung) zu minimieren und die Lagerhaltung der Führungen zu vereinfachen.The invention specified in claim 1 is Problem of reducing the number of guides, to minimize the manufacturing effort (milling) and to simplify the storage of the guides.

Lösungsolution

Dieses Problem wird durch die im Patentanspruch 1 aufgeführten Merkmale gelöst.This problem is solved by the in claim 1 listed features solved.

Erreichte VorteileAchieved advantages

Die mit der Erfindung erzielten Vorteile bestehen insbesondere darin, daß statt einer Vielzahl von unterschiedlichen Führungen für die verschiedenen IC-Abmessungen nur
The advantages achieved by the invention are, in particular, that instead of a variety of different guides for the different IC dimensions only

  • a) zwei identische Seitenführungen, die auch die Kanalhöhe begrenzen,a) two identical side guides that also the channel height limit,
  • b) zwei identische Distanzen pro IC-Höhe und b) two identical distances per IC height and  
  • c) eine Grundplatte pro IC-Breite hergestellt und auf Lager gehalten werden müssen.c) one base plate per IC width must be manufactured and kept in stock.
  • d) Der Fräsaufwand beschränkt sich auf
    • - Freifräsungen in der Grundplatte (hier 3 Rillen)
    • - Bearbeitung der Seitenführung: IC-Anlagekante
    d) The milling effort is limited to
    • - Free milling in the base plate (here 3 grooves)
    • - Machining the side guide: IC system edge
Beschreibung eines AusführungsbeispielsDescription of an embodiment

Ein Ausführungsbeispiel ist in der Zeichnung dargestellt und wird im folgenden näher beschrieben:
Die Höhenführung (1) begrenzt die Bahn des ICs (5) nach oben und dient als seitliche Führung. Die Funktion der Höhenführung ist unabhängig von den IC-Abmessungen.An embodiment is shown in the drawing and is described in more detail below:
The height guide ( 1 ) limits the path of the IC ( 5 ) upwards and serves as a lateral guide. The function of the height control is independent of the IC dimensions.

Die Distanz (2) bestimmt die Führungskanalhöhe, unabhängig von der Führungskanalbreite.The distance ( 2 ) determines the guide channel height, regardless of the guide channel width.

Die Grundplatte (3) bestimmt durch die Positionen der Zylinderstifte (4) die Breite des Führungskanals.The base plate ( 3 ) determines the width of the guide channel through the positions of the cylindrical pins ( 4 ).

Claims (2)

1. Führung für elektronische Bauelemente, insbesondere von integrierten Schaltungen (IC), in IC-Handhabungsgeräten, dadurch gekennzeichnet, daß die Führung
  • a) aus zwei, für alle IC-Abmessungen, identischen Seitenführungen die auch den Führungskanal nach oben begrenzen,
  • b) aus zwei identischen Distanzen, deren Dicke je nach IC- Höhe variiert, und
  • c) aus einer Grundplatte, deren IC-Lauffläche und Distanzauflagen auf einem Niveau liegen, welche den Abstand der Seitenführungen a) und der Distanzen b) vorgibt, zusammengesetzt wird.
  • d) Die Komponenten a), b) und c) werden je für sich hergestellt.
  • e) Die Höhe und Breite der Führung werden, unabhängig voneinander, durch einsetzen der oben erwähnten Komponenten a) bis c) bestimmt.
1. Guide for electronic components, in particular of integrated circuits (IC), in IC handling devices, characterized in that the guide
  • a) from two, for all IC dimensions, identical side guides that also limit the guide channel upwards,
  • (b) two identical distances, the thickness of which varies depending on the IC height, and
  • c) from a base plate, the IC tread and distance pads are at a level that specifies the distance between the side guides a) and the distances b).
  • d) Components a), b) and c) are each manufactured individually.
  • e) The height and width of the guide are determined independently of one another by using the above-mentioned components a) to c).
2. Führung nach Patentanspruch 1, dadurch gekennzeichnet,
  • a) daß die Distanzen zur Einstellung der IC-Höhe aus einem genormten Präzisionshalbzeug mit geringer Dickentoleranz hergestellt werden.
  • b) daß die Grundplatten ein- oder zweiteilig sein können.
2. leadership according to claim 1, characterized in
  • a) that the distances for setting the IC height are made from a standardized precision semi-finished product with a small thickness tolerance.
  • b) that the base plates can be one or two parts.
DE1997108291 1997-02-28 1997-02-28 Guide for electronic components, in particular of integrated circuits (IC), in IC handling devices Expired - Lifetime DE19708291C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE1997108291 DE19708291C2 (en) 1997-02-28 1997-02-28 Guide for electronic components, in particular of integrated circuits (IC), in IC handling devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1997108291 DE19708291C2 (en) 1997-02-28 1997-02-28 Guide for electronic components, in particular of integrated circuits (IC), in IC handling devices

Publications (2)

Publication Number Publication Date
DE19708291A1 true DE19708291A1 (en) 1998-09-10
DE19708291C2 DE19708291C2 (en) 2001-10-18

Family

ID=7821907

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1997108291 Expired - Lifetime DE19708291C2 (en) 1997-02-28 1997-02-28 Guide for electronic components, in particular of integrated circuits (IC), in IC handling devices

Country Status (1)

Country Link
DE (1) DE19708291C2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE461458T1 (en) 2007-01-24 2010-04-15 Rasco Gmbh GUIDING DEVICE AND TEST DEVICE FOR ELECTRONIC COMPONENTS

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5348033A (en) * 1991-10-01 1994-09-20 National Semiconductor Corporation Method and apparatus for handling singulated electronic components

Also Published As

Publication number Publication date
DE19708291C2 (en) 2001-10-18

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: RASCO GMBH, 83059 KOLBERMOOR, DE

8381 Inventor (new situation)

Inventor name: WIEDERER, GERHARD, DIPL.-ING. (FH), 83109 GROS, DE

R082 Change of representative

Representative=s name: GRUENECKER, KINKELDEY, STOCKMAIR & SCHWANHAEUS, DE

Representative=s name: GRUENECKER PATENT- UND RECHTSANWAELTE PARTG MB, DE

R071 Expiry of right