DE19680517D2 - Method and device for connecting plates provided with heat sources, in particular electrical printed circuit boards, to metallic heat dissipation plates - Google Patents

Method and device for connecting plates provided with heat sources, in particular electrical printed circuit boards, to metallic heat dissipation plates

Info

Publication number
DE19680517D2
DE19680517D2 DE19680517T DE19680517T DE19680517D2 DE 19680517 D2 DE19680517 D2 DE 19680517D2 DE 19680517 T DE19680517 T DE 19680517T DE 19680517 T DE19680517 T DE 19680517T DE 19680517 D2 DE19680517 D2 DE 19680517D2
Authority
DE
Germany
Prior art keywords
printed circuit
circuit boards
particular electrical
heat dissipation
electrical printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19680517T
Other languages
German (de)
Inventor
Manfred Ebisch
Richard Sabatier
Joseph Luchino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Laboratories Europe GmbH
Original Assignee
3M Laboratories Europe GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Laboratories Europe GmbH filed Critical 3M Laboratories Europe GmbH
Priority to DE19680517T priority Critical patent/DE19680517D2/en
Application granted granted Critical
Publication of DE19680517D2 publication Critical patent/DE19680517D2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/04—Punching, slitting or perforating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
DE19680517T 1995-06-30 1996-06-13 Method and device for connecting plates provided with heat sources, in particular electrical printed circuit boards, to metallic heat dissipation plates Ceased DE19680517D2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19680517T DE19680517D2 (en) 1995-06-30 1996-06-13 Method and device for connecting plates provided with heat sources, in particular electrical printed circuit boards, to metallic heat dissipation plates

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19523871 1995-06-30
DE19680517T DE19680517D2 (en) 1995-06-30 1996-06-13 Method and device for connecting plates provided with heat sources, in particular electrical printed circuit boards, to metallic heat dissipation plates
PCT/DE1996/001032 WO1997002723A1 (en) 1995-06-30 1996-06-13 Process and device for joining electric, heat source-bearing printed circuit boards to metallic heat dissipating plates

Publications (1)

Publication Number Publication Date
DE19680517D2 true DE19680517D2 (en) 1999-05-12

Family

ID=7765687

Family Applications (2)

Application Number Title Priority Date Filing Date
DE1995149354 Withdrawn DE19549354A1 (en) 1995-06-30 1995-06-30 Method of connecting circuit board to at least one metallic heat-sink plate - involves forming connection with adhesion provided by pressure-sensitive adhesive
DE19680517T Ceased DE19680517D2 (en) 1995-06-30 1996-06-13 Method and device for connecting plates provided with heat sources, in particular electrical printed circuit boards, to metallic heat dissipation plates

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE1995149354 Withdrawn DE19549354A1 (en) 1995-06-30 1995-06-30 Method of connecting circuit board to at least one metallic heat-sink plate - involves forming connection with adhesion provided by pressure-sensitive adhesive

Country Status (3)

Country Link
AU (1) AU5996096A (en)
DE (2) DE19549354A1 (en)
WO (1) WO1997002723A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19631852A1 (en) * 1996-08-07 1998-02-12 Esselte Meto Int Gmbh Method and device for applying material sections to a material web
US6687969B1 (en) 1997-05-16 2004-02-10 Micron Technology, Inc. Methods of fixturing flexible substrates and methods of processing flexible substrates
US5972152A (en) 1997-05-16 1999-10-26 Micron Communications, Inc. Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier
EP0902609A1 (en) * 1997-09-05 1999-03-17 Ascom Hasler AG Process for manufacturing a circuit board, circuit board and device for carrying out the process
JPH11186003A (en) * 1997-12-25 1999-07-09 Yazaki Corp Heat sink structure of ptc device
DE19835127A1 (en) * 1998-08-04 2000-02-10 Wuerth Elektronik Gmbh Circuit board with a heatsink and method for attaching a heatsink
DE10102848B4 (en) * 2000-05-31 2004-04-15 Sebastian Erb Process for positive and bubble-free gluing of populated or non-populated printed circuits with flat heat sinks using adhesive foils
CN1452853A (en) * 2000-08-03 2003-10-29 哈米尔顿森德斯特兰德公司 Adhesive bonding of printed circuit boards to heat sinks
FR2835689A1 (en) * 2002-02-01 2003-08-08 Siemens Vdo Automotive Method of gluing a rigid integrated circuit on an aluminum plate, used in the fabrication of IC chips

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2969300A (en) * 1956-03-29 1961-01-24 Bell Telephone Labor Inc Process for making printed circuits
GB1598554A (en) * 1978-05-30 1981-09-23 Ferranti Ltd Circuit assemblies
US4882000A (en) * 1985-05-23 1989-11-21 O. Key Printed Wiring Co., Ltc. Method of manufacturing printed circuit boards
DE4108667C2 (en) * 1991-03-16 2000-05-04 Bosch Gmbh Robert Composite arrangement of a metallic base plate and a ceramic printed circuit board and method for their production
DE4137936A1 (en) * 1991-11-18 1993-05-19 Pelikan Ag TRANSFER TAPE

Also Published As

Publication number Publication date
WO1997002723A1 (en) 1997-01-23
DE19549354A1 (en) 1997-01-09
AU5996096A (en) 1997-02-05

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Legal Events

Date Code Title Description
8131 Rejection