DE19638668A1 - Release method for lead-on-chip mounted semiconductor chips - Google Patents

Release method for lead-on-chip mounted semiconductor chips

Info

Publication number
DE19638668A1
DE19638668A1 DE1996138668 DE19638668A DE19638668A1 DE 19638668 A1 DE19638668 A1 DE 19638668A1 DE 1996138668 DE1996138668 DE 1996138668 DE 19638668 A DE19638668 A DE 19638668A DE 19638668 A1 DE19638668 A1 DE 19638668A1
Authority
DE
Germany
Prior art keywords
chip
chips
lead
attached
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE1996138668
Other languages
German (de)
Inventor
Teo-Kian Tiong
Tong-Soon Hock
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies Malaysia Sdn Bhd
Original Assignee
Siemens Components Snd Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Components Snd Bhd filed Critical Siemens Components Snd Bhd
Priority to DE1996138668 priority Critical patent/DE19638668A1/en
Publication of DE19638668A1 publication Critical patent/DE19638668A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/4951—Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/799—Apparatus for disconnecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

The release method is used to release the chips (2) from a lead-frame (1) to which they are attached via an insulating adhesion layer (4) by contacting the individual chips via contact electrodes (3), providing electrical energy for localised heating of the chip. The chips are removed from the lead-frame via a release device (5) after a relatively short interval sufficient for heating of the chip and the adhesion layer. for softening the latter.

Description

Die Erfindung betrifft ein Verfahren zum Ablösen von mittels Lead-On-Chip-Montage an Leadframes befestigten Chips, mit ei­ ner Befestigungsschicht zwischen den Leadframes und den Chips.The invention relates to a method for detaching means Lead-on-chip assembly on chips attached to leadframes, with egg ner mounting layer between the leadframes and the Crisps.

Die Chips werden bei der Lead-On-Chip-(LOC-)Montage üblicher­ weise mittels einer Klebefolie auf den Leadframe befestigt bzw. auf den Leadframe gebondet. Erfahrungsgemäß ist nach der LOC-Montage ein Teil der auf den Leadframes befestigten bzw. gebondeten Chips unbrauchbar. Diese müssen wieder entfernt werden. Üblicherweise werden die an dem Leadframe befestigten Chips auf einen durch ein Thermoelement geregelten beheizten Chuck gelegt. Dadurch erhitzen sich die Leadframes und damit auch die gebondete bzw. geklebte Verbindungen zwischen Chips und Leadframes. Die Verbindung zwischen Chip und Leadframe wird weich und der unbrauchbare Chip kann entfernt werden.The chips are becoming more common in lead-on-chip (LOC) assembly attached to the leadframe with an adhesive film or bonded to the leadframe. Experience has shown that after LOC assembly a part of the attached or lead frame bonded chips unusable. These have to be removed again will. Usually they are attached to the leadframe Chips on a heated, controlled by a thermocouple Chuck laid. This heats up the lead frames and thus also the bonded or glued connections between chips and lead frames. The connection between chip and leadframe becomes soft and the unusable chip can be removed.

Allerdings bewirkt der beheizte Chuck auch das Erhitzen von Nachbarelementen, wodurch diese oxidieren können bzw. die Qualität der LOC-gebondeten bzw. geklebten Verbindung beein­ trächtigt wird.However, the heated chuck also heats Neighboring elements, which can oxidize or the The quality of the LOC-bonded or glued connection affects is pregnant.

Der Erfindung liegt die Aufgabe zugrunde, ein Verfahren zum Entfernen von Chips von einem Leadframe anzugeben, bei wel­ chem diese Nachteile nicht auftreten.The invention has for its object a method for Removing chips from a leadframe to indicate where chem these disadvantages do not occur.

Die Aufgabe wird mittels eines Verfahrens gemäß Patentan­ spruch 1 gelöst. Eine Ausgestaltung des Erfindungsgedankens ist Gegenstand des Patentanspruchs 2. The object is achieved by means of a method according to Patentan spell 1 solved. An embodiment of the inventive concept is the subject of claim 2.  

Die Erfindung wird nachfolgend anhand des in der einzigen Figur der Zeichnung dargestellten Ausführungsbeispiels näher erläutert.The invention is described below in the single Figure of the drawing shown embodiment closer explained.

Die einzige Figur zeigt ein Ausführungsbeispiel für ein Ver­ fahren zur Entfernung von einzelnen LOC-montierten Chips von einem Leadframe. Ein Chip 2 ist über eine isolierende Befe­ stigungsschicht 4 an einem Leadframe 1 durch LOC-Montage be­ festigt. Bei der Befestigungsschicht handelt es sich vorzugs­ weise um eine beidseitig klebende Folie. Die isolierende Be­ festigung zwischen Chip und Leadframe kann aber durch Bonden hergestellt werden.The single figure shows an embodiment of a method for removing individual LOC-mounted chips from a lead frame. A chip 2 is attached to an insulating fastening layer 4 on a lead frame 1 by LOC mounting. The attachment layer is preferably a double-sided adhesive film. The insulating fastening between chip and leadframe can be produced by bonding.

Um einen einzelnen Chip von dem Leadframe entfernen zu kön­ nen, werden folgende aufeinanderfolgende Verfahrensschritte durchgeführt: Der Chip wird über zwei Elektroden 3 positio­ niert. Die Elektroden stellen einen elektrischen Kontakt an der Chiprückseite her. An den Elektroden wird eine Spannung angelegt. Durch die angelegte Spannung fließt ein Strom von der positiv geladenen Elektrode über den Chip zur negativ ge­ ladenen Elektrode. Durch den Stromfluß wird der Chip erwärmt. Nach kurzer Zeit hat sich der Chip und damit auch die Befe­ stigungsschicht so erhitzt, daß er vom Leadframe abgelöst werden kann. Hierzu wird ein Stoßvorrichtung 5 über dem Chip an der Chipvorderseite so positioniert, daß durch einen ent­ sprechenden Stoß auf die Chipvorderseite der Chip vom Lead­ frame abgelöst wird und herabfällt. Das Ablösen des Chips vom Leadframe kann auch durch eine äquivalente Vorrichtung, bei­ spielsweise einer Ansaugvorrichtung, durchgeführt werden. Statt eine Spannung an die zu entfernenden Chips anzulegen wird bevorzugt ein Strom in die Chips eingeprägt.In order to be able to remove a single chip from the lead frame, the following successive method steps are carried out: The chip is positioned over two electrodes 3 . The electrodes make electrical contact on the back of the chip. A voltage is applied to the electrodes. Due to the applied voltage, a current flows from the positively charged electrode via the chip to the negatively charged electrode. The chip is heated by the current flow. After a short time, the chip and thus also the attachment layer has heated up so that it can be detached from the lead frame. For this purpose, a pushing device 5 is positioned above the chip on the front of the chip so that the chip is detached from the lead frame by a corresponding push on the front of the chip and falls off. The chip can also be detached from the leadframe by an equivalent device, for example a suction device. Instead of applying a voltage to the chips to be removed, a current is preferably impressed into the chips.

Durch das beschriebene Verfahren ist es möglich einzelne Chips, beispielsweise unbrauchbare Chips, zu entfernen. Durch das lokale Erhitzen werden Chips in unmittelbarer Nachbar­ schaft zu den unbrauchbaren Chips nicht erwärmt. Sie werden daher auch nicht oxidiert und ihre Befestigungsverbindung bleibt stabil. Das Verfahren bittet zudem den Vorteil, un­ brauchbare Chips in sehr viel kürzerer Zeit zu entfernen als mit den herkömmlichen Verfahren.With the described method it is possible to use individual ones Remove chips, for example unusable chips. By local heating will be chips in the immediate vicinity shaft to the unusable chips not heated. you will be therefore not oxidized and their fastening connection  remains stable. The process also offers the advantage of un remove usable chips in a much shorter time than with the conventional methods.

BezugszeichenlisteReference list

1 Leadframe
2 Chip
3 I/U-Elektroden
4 isolierende Befestigungsschicht zwischen Chip und Leadframe
5 Stoßvorrichtung 1 lead frame
2 chip
3 I / U electrodes
4 insulating mounting layer between chip and leadframe
5 pushing device

Claims (5)

1. Verfahren zum Ablösen von mittels Lead-On-Chip-Montage an Leadframes (1) befestigten Chips (2), mit einer isolierenden Befestigungsschicht (4) zwischen den Leadframes (1) und den Chips (2), dadurch gekennzeichnet, daß folgenden Verfahrensschritte nacheinander ausgeführt wer­ den:
  • - ein einzelner Chip (2) wird mittels Kontaktelektroden (3) kontaktiert,
  • - über Kontaktelektroden (3) wird elektrische Leistung in den Chip (2) eingekoppelt, wodurch der Chip (2) lokal erhitzt wird,
  • - mittels einer Ablösevorrichtung (5) kann der Chip (2) nach kurzer Zeit, in der sich der Chip (2) und die Befestigungs­ schicht (4) ausreichend stark erwärmt haben, vom Leadframe (1) entfernt werden.
1. A method for detaching chips ( 2 ) attached to leadframes ( 1 ) by means of lead-on-chip assembly, with an insulating fastening layer ( 4 ) between the leadframes ( 1 ) and the chips ( 2 ), characterized in that the following Process steps are carried out one after the other:
  • a single chip ( 2 ) is contacted by means of contact electrodes ( 3 ),
  • - Electrical contact is coupled into the chip ( 2 ) via contact electrodes ( 3 ), as a result of which the chip ( 2 ) is heated locally,
  • - by means of a release device (5) of the chip (2), after a short time, in which the chip (2) and the fastening in layers (4) have warmed sufficiently strong to be removed from the lead frame (1).
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die elektrischer Leistung durch Einprägung eines elektri­ schen Stromes in Chip (2) eingekoppelt wird.2. The method according to claim 1, characterized in that the electrical power is injected into the chip ( 2 ) by impressing an electrical current. 3. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die elektrischer Leistung durch Anlegen einer elektri­ schen Spannung an den Chip (2) eingekoppelt wird.3. The method according to claim 1, characterized in that the electrical power is coupled by applying an electrical voltage to the chip ( 2 ). 4. Verfahren nach einem der Ansprüche 1-3, dadurch gekennzeichnet, daß die Chips (2) auf die Leadframes (1) gebondet sind.4. The method according to any one of claims 1-3, characterized in that the chips ( 2 ) on the lead frames ( 1 ) are bonded. 5. Verfahren nach einem der Ansprüche 1-3, dadurch gekennzeichnet, daß die Chips (2) über eine beidseitig klebende Folie an den Leadframes (1) befestigt sind.5. The method according to any one of claims 1-3, characterized in that the chips ( 2 ) are attached to the lead frames ( 1 ) via a double-sided adhesive film.
DE1996138668 1996-09-20 1996-09-20 Release method for lead-on-chip mounted semiconductor chips Withdrawn DE19638668A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE1996138668 DE19638668A1 (en) 1996-09-20 1996-09-20 Release method for lead-on-chip mounted semiconductor chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1996138668 DE19638668A1 (en) 1996-09-20 1996-09-20 Release method for lead-on-chip mounted semiconductor chips

Publications (1)

Publication Number Publication Date
DE19638668A1 true DE19638668A1 (en) 1998-04-02

Family

ID=7806401

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1996138668 Withdrawn DE19638668A1 (en) 1996-09-20 1996-09-20 Release method for lead-on-chip mounted semiconductor chips

Country Status (1)

Country Link
DE (1) DE19638668A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0051165A1 (en) * 1980-11-03 1982-05-12 BURROUGHS CORPORATION (a Michigan corporation) Repairable IC package with thermoplastic chip attach
US4506139A (en) * 1983-04-04 1985-03-19 Honeywell Inc. Circuit chip
EP0587305A2 (en) * 1992-08-26 1994-03-16 Hitachi, Ltd. Method and apparatus for removing an electronic component from a board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0051165A1 (en) * 1980-11-03 1982-05-12 BURROUGHS CORPORATION (a Michigan corporation) Repairable IC package with thermoplastic chip attach
US4506139A (en) * 1983-04-04 1985-03-19 Honeywell Inc. Circuit chip
EP0587305A2 (en) * 1992-08-26 1994-03-16 Hitachi, Ltd. Method and apparatus for removing an electronic component from a board

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
DUNKEL, W.E.: "Replaceble Chip to Heat Sink Connection on Circuit Boards", in: IBM Techn.Discl.Bul., Vol. 14, No. 11, April 1972, S. 3332 *
SLYMAN, D.: "Anisotropleitende Kleber", in: Productronic 10/96, S. 30-36 *
Wärmeleitfähige Klebstoff-Filme", in: EPP, Sept. 93, Heft 9, S. 34 *

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8127 New person/name/address of the applicant

Owner name: INFINEON TECHNOLGIES(MALAYSIA), MALACCA, MY

8139 Disposal/non-payment of the annual fee