DE19608513A1 - Chip card with ESD protection - Google Patents

Chip card with ESD protection

Info

Publication number
DE19608513A1
DE19608513A1 DE1996108513 DE19608513A DE19608513A1 DE 19608513 A1 DE19608513 A1 DE 19608513A1 DE 1996108513 DE1996108513 DE 1996108513 DE 19608513 A DE19608513 A DE 19608513A DE 19608513 A1 DE19608513 A1 DE 19608513A1
Authority
DE
Germany
Prior art keywords
chip
chip card
card
film
electrically conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE1996108513
Other languages
German (de)
Inventor
Paul-Werner V Basse
Doris Dr Schmitt-Landsiedel
Roland Thewes
Michael Dr Bollu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE1996108513 priority Critical patent/DE19608513A1/en
Priority to PCT/DE1997/000368 priority patent/WO1997033317A1/en
Publication of DE19608513A1 publication Critical patent/DE19608513A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The invention concerns a chip card made of a material which is at least partly electrically conductive, which makes it possible for a potential difference on the chip card to be diminished so rapidly that a chip integrated in the card is not damaged. For the same purpose, the top side of the chip card can be coated with a thin, electrically conductive film which is connected to conductive contacts of a chip by means of vertical conductive connections.

Description

Chipkarten werden in einer der Funktionsfähigkeit des Chips auf der Karte sehr abträglichen Umgebung benutzt. Die Chips können durch elektrische Spannungen und daraus resultierende Ströme beschädigt werden. Deshalb muß eine an der Karte an­ liegende Potentialdifferenz möglichst schnell abgebaut wer­ den. Vor allem die Kontakte des Chips sind besonders zu schützen. Bisher werden die Chips der Chipkarten vor allem durch Schutzstrukturen an den Anschlüssen der Chips ge­ schützt. Diese Schutzstrukturen leiten Überspannungen auf die Anschlüsse der Versorgungsspannung z. B. eines Lesegerätes ab. Eine gezielt eingeprägte Überspannung zwischen den Signalanschlüssen und den Anschlüssen der Versorgungsspan­ nungen zerstört den Chip. Diese Gefahr wird durch die Anord­ nung der Kontakte vermindert. Die Anschlußkontakte der Chips liegen dicht beieinander und sind leicht in die Oberfläche der Karte versenkt. Es wird damit nach Möglichkeit vermieden, den Anschlüssen des Chips unterschiedliche Potentiale zuzu­ führen. Besonders schwierig wird der ESD-Schutz der Chips, wenn die Kontakte nicht nahe beieinanderliegen und nicht ver­ senkt sind (ESD = electrostatic damage).Smart cards are one of the operational capabilities of the chip used on the map very detrimental environment. The chips can be caused by electrical voltages and resulting Currents are damaged. Therefore one has to be on the card potential difference lying down as quickly as possible the. The contacts of the chip are particularly closed protect. So far, the chips of the chip cards are mostly through protective structures on the connections of the chips protects. These protective structures conduct overvoltages on the Connections of the supply voltage z. B. a reader from. A deliberately impressed overvoltage between the Signal connections and the connections of the supply chip voltage destroys the chip. This danger is caused by the arrangement contact is reduced. The connection contacts of the chips are close together and are light in the surface the card sunk. It is avoided if possible different potentials to the connections of the chip to lead. ESD protection of the chips becomes particularly difficult if the contacts are not close together and not ver are reduced (ESD = electrostatic damage).

Aufgabe der vorliegenden Erfindung ist es, eine Chipkarte mit ausreichendem ESD-Schutz anzugeben.The object of the present invention is to use a chip card provide adequate ESD protection.

Diese Aufgabe wird mit der Chipkarte mit den Merkmalen des Anspruches 1, 2 oder 5 gelöst. Weitere Ausgestaltungen erge­ ben sich aus den abhängigen Ansprüchen.This task is carried out with the chip card with the characteristics of Claim 1, 2 or 5 solved. Other refinements ben from the dependent claims.

Bei der erfindungsgemäßen Chipkarte ist zumindest ein Anteil des dafür verwendeten Materiales so ausreichend elektrisch leitend, daß an der Chipkarte auftretende Potentialdifferen­ zen ausgeglichen werden, bevor ein in der Karte angeordneter Chip beschädigt wird. Zumindest Potentialdifferenzen bis zu einem vorgegebenen Wert können auf diese Weise ausreichend schnell abgebaut werden, ohne daß die Anschlüsse des in der Karte vorhandenen Chips dauerhaft kurzgeschlossen werden, was die Funktionsfähigkeit des Chips beeinträchtigen würde. Das Material der Chipkarte, üblicherweise ein Kunststoff, kann so gewählt werden, daß es einen spezifischen elektrischen Wider­ stand aufweist, der so niedrig ist, daß eine an der Chipkarte anliegende Potentialdifferenz, die einen vorgegebenen Wert nicht übersteigt, so schnell abgebaut wird, daß der Chip durch diese Potentialdifferenz nicht beschädigt wird. Der elektrische Widerstand des Materiales ist andererseits so hoch, wie für die Funktionsfähigkeit des Chips erforderlich ist. Ein derartiges Material wird zumindest in solchem Umfang bei der Chipkarte verwendet, daß ein Potential, das beim Be­ rühren der Chipkarte an die Karte angelegt wird, auf den ge­ samten Chip übertragen wird, so daß der Chip jeweils auf das aktuelle Potential, mit dem die Chipkarte in Kontakt steht, gebracht wird.There is at least a portion of the chip card according to the invention the material used for this is sufficiently electrical conductive that potential differences occurring on the chip card zen be balanced before a card is placed on the map  Chip is damaged. At least potential differences up to a given value can be sufficient in this way can be dismantled quickly without the connections of the in the Card existing chips are permanently short-circuited what would affect the functionality of the chip. The Material of the chip card, usually a plastic, can be so be chosen to have a specific electrical cons stood, which is so low that one on the chip card applied potential difference, which is a predetermined value does not exceed, degrades so quickly that the chip is not damaged by this potential difference. Of the electrical resistance of the material is so on the other hand high, as required for the functionality of the chip is. Such a material is at least to such an extent used in the chip card that a potential that the Be stirring the chip card is placed on the card on the ge Whole chip is transmitted, so that the chip on the current potential with which the chip card is in contact, brought.

Besonders geeignet für diesen Zweck ist ein Material mit spannungsabhängiger Leitfähigkeit, das eine höhere elektri­ sche Leitfähigkeit bekommt, wenn eine elektrische Spannung ausreichender Größe angelegt wird. Ein solches Material wird z. B. durch einen elektrisch isolierenden Kunststoff mit darin dispergierten winzigen Metallteilchen oder -splittern gebildet. Lagert man nämlich feine Metallteile in Kunststoff ein, kann bei geeigneter Dosierung dieser metallischen Zu­ sätze erreicht werden, daß dieses Material zunächst elek­ trisch isolierend oder zumindest hochohmig bleibt und erst beim Ansteigen einer daran angelegten elektrischen Spannung auf ausreichend hohe Werte elektrisch leitend wird. Die Span­ nung schlägt dann im Innern des Kunststoffes zwischen den Me­ tallteilchen durch, wodurch eine niederohmige Verbindung ge­ schaffen wird, die bei Verringerung der anliegenden Spannung unterbrochen wird, so daß das Material wieder hochohmig wird. A material with is particularly suitable for this purpose voltage-dependent conductivity, which is a higher electri cal conductivity gets when an electrical voltage sufficient size is created. Such a material will e.g. B. with an electrically insulating plastic tiny metal particles or chips dispersed therein educated. If you store fine metal parts in plastic one, with a suitable dosage of these metallic additives sentences are achieved that this material is initially elek tric isolating or at least high impedance and only when an electrical voltage applied to it rises becomes electrically conductive to sufficiently high values. The Span voltage then strikes inside the plastic between the me tallpartchen by, whereby a low-resistance connection ge will create that while reducing the applied voltage is interrupted so that the material becomes high-resistance again.  

Besonders geeignet für ein bevorzugtes weiteres Ausführungs­ beispiel ist ein richtungsabhängig unterschiedlich stark elektrisch leitendes Material. Bei einem solchen Material ist also der spezifische elektrische Widerstand in verschiedenen Richtungen unterschiedlich groß. Bei Verwendung eines solchen Materiales (z. B. eine aromatische oder heteroaromatische organische Verbindung) kann erreicht werden, daß die elektrisch leitende Verbindung von der Oberfläche der Chip­ karte zu den Anschlüssen oder Kontakten des Chips niederohmig ist, die Verbindungen dieser Anschlüsse oder Kontakte unter­ einander aber für die Funktionsfähigkeit des Chips ausrei­ chend hochohmig bleiben. Anisotrop leitende Materialien sind z. B. elektrisch leitende Kunststoffe, die durch Strecken, d. h. Dehnen in einer Richtung, oder Walzen ihre Leitfähigkeit in einer Richtung ändern. Ähnliche Herstellungsverfahren sind z. B. bei Transformatorblechen bekannt.Particularly suitable for a preferred further embodiment example is a directionally different strength electrically conductive material. With such a material thus the specific electrical resistance in different Directions of different sizes. When using one Material (e.g. an aromatic or heteroaromatic organic compound) can be achieved that the electrically conductive connection from the surface of the chip Card to the connections or contacts of the chip with low resistance is, the connections of these connectors or contacts below each other out for the functionality of the chip stay high impedance. Anisotropically conductive materials are e.g. B. electrically conductive plastics by stretching, d. H. Stretch in one direction, or roll their conductivity change in one direction. Similar manufacturing processes are e.g. B. known in transformer sheets.

Eine entsprechende Wirkung, nämlich eine richtungsabhängige Leitfähigkeit der Chipkarte kann auch durch die Strukturie­ rung des Materials der Chipkarte erreicht werden. Entspre­ chend den Darstellungen der Fig. 1, die eine erfindungsge­ mäße Chipkarte im Querschnitt zeigt, und der zugehörigen Fig. 2, die den in Fig. 1 eingezeichneten Schnitt darstellt, befindet sich auf der Oberfläche der Karte bei diesem Ausfüh­ rungsbeispiel ein elektrisch leitender Film 1, z. B. eine dünne elektrisch leitende Folie. Dieser Film 1 und die elek­ trischen Anschlüsse 3 (Kontakte oder Leiterbahnen) des Chips sind mit elektrisch leitenden Verbindungen 2 miteinander ver­ bunden. Wie in Fig. 2 erkennbar, sind diese Verbindungen 2 bei diesem Ausführungsbeispiel vorzugsweise in etwa zylin­ drisch, wobei eine Grundfläche des Zylinders jeweils auf der Kontaktfläche des Leiters 3 aufliegt bzw. in der Ebene des Films 1 angeordnet ist. Diese elektrisch leitenden Verbindun­ gen 2 bilden eine Art dicker, kurzer Pfosten innerhalb der Chipkarte. Auf der Unterseite der Karte befindet sich eine dünne Trägerplatte 4 und auf der Rückseite ggf. ein weiterer elektrisch leitender Film 5, z. B. wieder eine dünne elek­ trisch leitende Folie. Der Bereich zwischen diesen Bestand­ teilen ist durch ein dielektrisches Material 6, z. B. einen Kunststoff ausgefüllt.A corresponding effect, namely a direction-dependent conductivity of the chip card can also be achieved by structuring the material of the chip card. Correspondingly, the representations of FIG. 1, which shows a chip card according to the invention in cross section, and the associated FIG. 2, which shows the section drawn in FIG 1 , e.g. B. a thin electrically conductive film. This film 1 and the electrical connections 3 (contacts or conductor tracks) of the chip are connected to one another with electrically conductive connections 2 . As can be seen in FIG. 2, in this exemplary embodiment these connections 2 are preferably approximately cylindrical, a base area of the cylinder in each case resting on the contact surface of the conductor 3 or being arranged in the plane of the film 1 . These electrically conductive connections 2 form a kind of thick, short post within the chip card. On the underside of the card there is a thin carrier plate 4 and on the back, if necessary, another electrically conductive film 5 , e.g. B. again a thin electrically conductive foil. The area between these parts is divided by a dielectric material 6 , z. B. filled a plastic.

Claims (6)

1. Chipkarte aus einem Material mit einem spezifischen elek­ trischen Widerstand, der so niedrig ist, daß eine an der Karte anliegende Potentialdifferenz, die einen vorgegebenen Wert nicht übersteigt, in einer vorgegebenen Zeit abgebaut wird, und der so hoch ist, daß die Funktionsfähigkeit eines in der Karte angeordneten Chips nicht beeinträchtigt wird.1. Chip card made of a material with a specific elec trical resistance that is so low that one at the Map applied potential difference that a predetermined Value does not exceed, dismantled in a given time and is so high that the functionality of a chips in the card are not affected. 2. Chipkarte aus einem Material, dessen spezifischer elektri­ scher Widerstand richtungsabhängig ist.2. Chip card made of a material, the specific electrical shear resistance is directional. 3. Chipkarte nach Anspruch 2, auf der ein Chip so angeordnet ist, daß der Abstand zweier Anschlußkontakte dieses Chips in einer Richtung hohen spezi­ fischen elektrischen Widerstandes minimal ist.3. Chip card according to claim 2, on which a chip is arranged so that the distance between two Terminal contacts of this chip in one direction high spec fish electrical resistance is minimal. 4. Chipkarte nach Anspruch 2 oder 3 aus einer aromatischen oder heteroaromatischen chemischen Verbindung.4. Chip card according to claim 2 or 3 from an aromatic or heteroaromatic chemical compound. 5. Chipkarte, deren Oberfläche mit einem elektrisch leitenden Film bedeckt ist und bei der zwischen diesem Film und elek­ trischen Leitern eines in der Karte angeordneten Chips elek­ trisch leitende Verbindungen vorhanden sind.5. Chip card, the surface of which is electrically conductive Film is covered and where between this film and elek electrical conductors of a chip arranged in the card trically conductive connections are available. 6. Chipkarte nach Anspruch 5, bei der die elektrisch leitenden Verbindungen zwischen dem Film und elektrischen Leitern eines in der Karte angeordneten Chips zumindest näherungsweise die Form eines Zylinders mit einer in der Ebene dieses Films angeordneten Grundfläche ha­ ben.6. Chip card according to claim 5, in which the electrically conductive connections between the Film and electrical conductors one arranged in the card Chips at least approximately having the shape of a cylinder of a base area ha arranged in the plane of this film ben.
DE1996108513 1996-03-05 1996-03-05 Chip card with ESD protection Withdrawn DE19608513A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE1996108513 DE19608513A1 (en) 1996-03-05 1996-03-05 Chip card with ESD protection
PCT/DE1997/000368 WO1997033317A1 (en) 1996-03-05 1997-02-28 Chip card with esd-protection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1996108513 DE19608513A1 (en) 1996-03-05 1996-03-05 Chip card with ESD protection

Publications (1)

Publication Number Publication Date
DE19608513A1 true DE19608513A1 (en) 1997-09-11

Family

ID=7787292

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1996108513 Withdrawn DE19608513A1 (en) 1996-03-05 1996-03-05 Chip card with ESD protection

Country Status (2)

Country Link
DE (1) DE19608513A1 (en)
WO (1) WO1997033317A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999041784A1 (en) * 1998-02-12 1999-08-19 Rose Research, L.L.C. Method and apparatus for coupling circuit components

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2983995A1 (en) 2011-12-12 2013-06-14 Ingenico Sa ELECTROSTATIC DISCHARGE DEVICE

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE6919055U (en) * 1969-05-09 1969-08-21 Jean Hoefler & Co Kg Fa COMBINED BLOW AND MOVEMENT TOYS.
DE2002404B2 (en) * 1969-01-31 1977-12-15 N.V. Philips' Gloeilampenfabrieken, Eindhoven (Niederlande) VOLTAGE-DEPENDENT RESISTANCE MADE FROM AN INSULATING FILM WITH EMBEDDED CORES MADE OF SEMICONDUCTOR MATERIAL
DE3118298A1 (en) * 1981-05-08 1982-12-02 Gao Ges Automation Org ID CARD WITH STORED IC BLOCK
DE3332453A1 (en) * 1982-09-09 1984-04-05 Sony Corp., Tokio/Tokyo MEMORY ID CARD

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3130324A1 (en) * 1981-07-31 1983-02-17 GAO Gesellschaft für Automation und Organisation mbH, 8000 München CARRIER ELEMENT FOR AN IC COMPONENT
JPS6142085A (en) * 1984-08-02 1986-02-28 Toppan Printing Co Ltd Ic card
JPS61151791A (en) * 1984-12-26 1986-07-10 Hitachi Ltd Ic card
JPS61286989A (en) * 1985-06-13 1986-12-17 Matsushita Electric Ind Co Ltd Ic card
IT1214634B (en) * 1985-10-23 1990-01-18 Pentasystem Srl SUPPORT FOR PAPER OR CARD IN GLOBAL PLASTIC MATERIAL A MEMORY INTEGRATED CIRCUIT.
FR2636776A1 (en) * 1988-09-16 1990-03-23 Trt Telecom Radio Electr DEVICE COMPRISING AN ELECTRONIC CIRCUIT MOUNTED ON A FLEXIBLE SUPPORT, PROTECTING AGAINST STATIC ELECTRICITY DISCHARGES, AND A FLEXIBLE CARD COMPRISING SAME
DE4036081C2 (en) * 1990-04-26 1994-10-06 Mitsubishi Electric Corp Semiconductor memory plug-in module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2002404B2 (en) * 1969-01-31 1977-12-15 N.V. Philips' Gloeilampenfabrieken, Eindhoven (Niederlande) VOLTAGE-DEPENDENT RESISTANCE MADE FROM AN INSULATING FILM WITH EMBEDDED CORES MADE OF SEMICONDUCTOR MATERIAL
DE6919055U (en) * 1969-05-09 1969-08-21 Jean Hoefler & Co Kg Fa COMBINED BLOW AND MOVEMENT TOYS.
DE3118298A1 (en) * 1981-05-08 1982-12-02 Gao Ges Automation Org ID CARD WITH STORED IC BLOCK
DE3332453A1 (en) * 1982-09-09 1984-04-05 Sony Corp., Tokio/Tokyo MEMORY ID CARD

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999041784A1 (en) * 1998-02-12 1999-08-19 Rose Research, L.L.C. Method and apparatus for coupling circuit components
US6396712B1 (en) 1998-02-12 2002-05-28 Rose Research, L.L.C. Method and apparatus for coupling circuit components

Also Published As

Publication number Publication date
WO1997033317A1 (en) 1997-09-12

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