DE19510227A1 - Application of UV-curable coating compsn. to both sides of circuit board - Google Patents

Application of UV-curable coating compsn. to both sides of circuit board

Info

Publication number
DE19510227A1
DE19510227A1 DE1995110227 DE19510227A DE19510227A1 DE 19510227 A1 DE19510227 A1 DE 19510227A1 DE 1995110227 DE1995110227 DE 1995110227 DE 19510227 A DE19510227 A DE 19510227A DE 19510227 A1 DE19510227 A1 DE 19510227A1
Authority
DE
Germany
Prior art keywords
coating
sliding contact
thickness
roller
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE1995110227
Other languages
German (de)
Inventor
Hans-Juergen Dipl Ing Schaefer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE1995110227 priority Critical patent/DE19510227A1/en
Priority to AT95923327T priority patent/ATE174750T1/en
Priority to AU27923/95A priority patent/AU2792395A/en
Priority to US08/765,076 priority patent/US5804256A/en
Priority to PCT/EP1995/002309 priority patent/WO1996000492A1/en
Priority to DE59504568T priority patent/DE59504568D1/en
Priority to EP95923327A priority patent/EP0766908B1/en
Publication of DE19510227A1 publication Critical patent/DE19510227A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0091Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1509Horizontally held PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1572Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • H05K3/0023Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/227Drying of printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Coating Apparatus (AREA)

Abstract

In coating circuit boards with a UV-curable coating applied to both sides by roll coating, the boards are kept at room temp. and coated with a photopolymerisable compsn. (I), contg. 70-95 wt.% solids and having a viscosity of 10-60 Pa.s at 25 deg C. (I) is kept in the 1-10 Pa.s viscosity range by using dosing rolls kept at 25-60 deg C. It is applied in thicknesses of 10-100 microns at a coating viscosity of 20-100 Pa.s and rate of 5-20 m/min. with gummed polished coating rolls cooled to a surface temp. of 5-20 deg C. and kept free from coating at the edge. The coating is dried for 60-120 s at 80-120 deg C. Also claimed is the appts. used.

Description

Das Walzenbeschichtungsverfahren ist das am häufigsten verwendete Beschich­ tungsverfahren. Es wird insbesondere zum Beschichten flächiger Trägerstoffe verwendet. Zum Beschichten ebener nicht saugfähiger Substrate mit niedrig­ viskosen Beschichtungsmitteln wird eine gummierte Auftragswalze benutzt, um die Substratunebenheiten auszugleichen. Da hierzu ein gewisser Anpressdruck erforderlich ist, wird ein niedrigviskoses Beschichtungsmittel abgequetscht, so daß eine Beschichtung nicht möglich ist. Daher werden die gummierten Auf­ tragswalzen mit feinen Rillen versehen, so daß das Beschichtungsmittel über das Volumen der Rillen aufgetragen werden kann. Somit ist eine gleichmäßige Auftragsmenge gewährleistet. Bei höherviskosen Beschichtungsmitteln läßt sich dieses Verfahren jedoch nicht anwenden. Die Auftragsmenge wird hierbei durch den zwischen Dosier- und Auftragswalze gebildeten Spalt bestimmt. Das Problem aller derartiger Walzenbeschichtungsanlagen besteht jedoch in der Parallelität des Walzenspaltes. Außerdem kann die Rundlaufgenauigkeit mangelhaft sein, so daß es sowohl auf den Außenseiten des Substrates wie auch in Beschichtungsrichtung zu erheblichen Auftrags und Dickenschwankungen kommt. Bei Schichtdicken unter 100 µm ist dies durch nachträgliches Messen nur schwer und häufig nicht ohne Zerstörung der Substrate zur Anfertigung von Schliffen feststellbar.The roller coating process is the most frequently used coating process. It is used in particular for coating flat substrates used. For coating flat, non-absorbent substrates with low A gummed applicator roller is used to make viscous coating agents to compensate for the substrate unevenness. Because of this, a certain contact pressure a low-viscosity coating agent is squeezed off, so that coating is not possible. Therefore, the rubberized on support rollers with fine grooves so that the coating agent over the volume of the grooves can be applied. So is an even one Order quantity guaranteed. With higher viscosity coating agents however, do not use this procedure. The order quantity is here determined by the gap formed between the metering and application roller. However, the problem with all such roll coating systems is the parallelism of the nip. In addition, the concentricity can be defective so that it is on both the outside of the substrate as well considerable coating and thickness fluctuations occur in the coating direction. In the case of layer thicknesses below 100 µm, this is only possible by subsequent measurement difficult and often not without destroying the substrates for the production of Grinding noticeable.

Eine Sicherheit, daß kein Bereich der Beschichteten Oberfläche den vorgege­ benen Toleranzbereich unterschritten hat, ist nicht gegeben.A certainty that no area of the coated surface specified below the tolerance range is not given.

Desweiteren ist es problematisch einen beschichtungsfreien Substratrand zu erzielen, der den Transport des Substrates zum Trockner ermöglicht.Furthermore, it is problematic to have a coating-free substrate edge achieve, which enables the transport of the substrate to the dryer.

Der vorliegenden Erfindung liegt daher die Aufgabe zugrunde, eine Vorrichtung bereitzustellen, mit der sowohl eine Parallelität der Dosier- und Auftrags­ walzen, eine über die Breite und in Beschichtungsrichtung gleichmäßige Schicht­ dicke sowie ein beschichtungsfreier Substratrand erzielbar ist. The present invention is therefore based on the object of a device provide with both a parallelism of dosing and application roll a layer that is uniform across the width and in the coating direction thickness and a coating-free substrate edge can be achieved.  

Zur Lösung dieser Probleme wird erfindungsgemäß eine doppelseitige Walzen­ beschichtungsanlage verwendet, (Fig. 1) die aus zwei Dosierwalzen (Fig. 1/1 und 2) und aus zwei Auftragswalzen (Fig. 1/3 und 4) besteht.To solve these problems, a double-sided roller coating system is used according to the invention ( Fig. 1), which consists of two metering rollers ( Fig. 1/1 and 2) and two application rollers ( Fig. 1/3 and 4).

Die bevorzugten Schichtdicken insbesondere für die Beschichtung von Leiter­ platten sind 10 µm, 50 µm, und 100 µm.The preferred layer thicknesses in particular for the coating of conductors plates are 10 µm, 50 µm, and 100 µm.

Zum Auftragen dieser Schichtdicken mit einer Toleranz von 10% wird eine erfindungsgemäße Walzenbeschichtungsanordnung (Fig. 2) verwendet, die im Randbereich der Dosierwalzen (Fig. 2/1) eine galvanische Metallisierung (Fig. 2/2) in der gewünschten Beschichtungsdicke aufweist.To apply these layer thicknesses with a tolerance of 10%, a roller coating arrangement according to the invention ( Fig. 2) is used which has a galvanic metallization ( Fig. 2/2) in the desired coating thickness in the edge region of the metering rollers ( Fig. 2/1).

Hierbei handelt es sich vorzugsweise um eine Chrom- bzw. Chrom/Nickelschicht in den Dicken von 10 µm, 50 µm und 100 µm.This is preferably a chrome or chrome / nickel layer in the thicknesses of 10 µm, 50 µm and 100 µm.

Über diese auf einer beliebigen Breite von ca. 1 bis 20 cm galvanisch auf­ gebrachten Metallschicht, läßt sich ein Höchstmaß an Parallelität erreichen. Gleichzeitig läßt sich die Rundlaufgenauigkeit ermitteln, wenn diese Metall­ schicht ihren Kontakt zur gummierten Auftragswalze (Fig. 2/3) verliert.A maximum degree of parallelism can be achieved by means of this galvanically applied metal layer on any width of approximately 1 to 20 cm. At the same time, the concentricity can be determined if this metal layer loses its contact with the rubberized application roller ( Fig. 2/3).

Um eine gleichmäßige Dicke des Beschichtungsfilms sicher zu stellen, muß gewährleistet werden, daß diese Metalldistanzschicht immer im Kontakt mit der Auftragswalze bleibt, ohne in diese einzudringen.To ensure a uniform thickness of the coating film, must be ensured that this metal spacer is always in contact with the The application roller remains without penetrating it.

Dies wird erfindungsgemäß durch das Anbringen eines leitfähigen Gleitkontakt­ rings erzielt, (Fig. 2/4) der auf die gleiche Dicke der Gummierung ge­ schliffen wurde.This is achieved according to the invention by attaching a conductive sliding contact ring, ( Fig. 2/4) which was ground to the same thickness of the rubber coating.

Wird an einen leitfähigen Gleitkontaktring Spannung angelegt, so beginnt der Strom zu fließen, sobald beide Ringe Kontakt mit der Metalldistanzschicht der Dosierwalze haben. Sollten mangelhafte Rundlaufeigenschaften zur Kontakt­ unterbrechung führen, so kann dies über ein Meßgerät (Fig. 2/5) erfaßt und über eine Steuerung korrigiert bzw. die Anlage abgeschaltet werden.If voltage is applied to a conductive sliding contact ring, the current begins to flow as soon as both rings come into contact with the metal spacer layer of the metering roller. If poor concentricity results in contact interruption, this can be recorded using a measuring device ( Fig. 2/5) and corrected using a controller or the system can be switched off.

Der leitfähige Gleitkontaktring sollte eine ähnliche thermische Ausdehnung wie der Gummi besitzen, jedoch nicht verformbar sein. Eine Isolation (Fig. 2/6) zum Metallkern der Walze sollte gewährleistet sein. Vorteilhafterweise besteht er mit der gleichen Dicke wie die Gummierung und einer Breite von vorzugsweise 0,5 bis 20 mm aus Kunststoff, wobei nur die äußere Schicht leitfähig ist.The conductive sliding contact ring should have a thermal expansion similar to that of the rubber, but should not be deformable. Insulation ( Fig. 2/6) to the metal core of the roller should be ensured. It is advantageously made of plastic with the same thickness as the rubber coating and a width of preferably 0.5 to 20 mm, only the outer layer being conductive.

Dieser leitfähige Gleitkontaktring läßt sich vorteilhafterweise aus einem Hartgeweberohr herausschneiden, daß den Innendurchmesser der Metallwalze hat und dessen äußere Gewebelagen mit einem leitfähigen Material hergestellt wurden. This conductive sliding contact ring can advantageously be made from one Cut out the hard tissue tube that the inside diameter of the metal roller has and the outer fabric layers made with a conductive material were.  

Über einen Schreiber (Fig. 2/5) läßt sich nun der gleichmäßige Stromfluß dokumentieren, so daß eine aufwendige Untersuchung an den Substraten nicht erforderlich ist.The uniform current flow can now be documented using a recorder ( Fig. 2/5), so that a complex examination of the substrates is not necessary.

Die Breite zwischen den beiden Metalldistanzschichten bestimmt die Beschichtungsbreite. (Fig. 2/7).The width between the two metal spacers determines the coating width. ( Fig. 2/7).

Es ist somit erforderlich, Dosierwalzen für die gängigen Schichtstärken und Breiten zu bevorraten.It is therefore necessary to use dosing rollers for the common layer thicknesses and To stock widths.

Diese erfindungsgemäße Vorrichtung ermöglicht es erstmalig bei Schichtdicken unter 100 µm eine gleichmäßige Schichtverteilung sowohl über die Substrat­ breite wie über die Länge zu gewährleisten, ohne daß hierzu Messungen auf dem beschichteten Substrat notwendig sind.This device according to the invention makes it possible for the first time with layer thicknesses less than 100 µm a uniform layer distribution both over the substrate to ensure wide as well as over the length without taking measurements the coated substrate are necessary.

Gleichzeitig wird insbesondere bei hochviskosen und tixotropen Beschich­ tungsmitteln ein beschichtungsfreier Rand erzeugt, der für den Weitertrans­ port der Substrate in den Trockner erforderlich ist.At the same time, especially with highly viscous and tixotropic coating a coating-free edge generated for the further trans port of the substrates in the dryer is required.

Claims (5)

1. Vorrichtung zur parallelen randfreien Beschichtung von Leiterplatten im Walzenbeschichtungsverfahren, dadurch gekennzeichnet, daß auf die Dosier­ walzen im Randbereich durch galvanische Beschichtung eine 10 bis 200 µm dicke Metalldistanzschicht mit einer bevorzugten Breite von 10 bis 100 mm aufgetragen wird und daß im Randbereich der Auftragswalzen ein 0,5 bis 20 mm breiter leitfähiger Gleitkontaktring angebracht ist, der die Dicke der Gum­ mierung aufweist und über dessen Kontakt mit der Metalldistanzschicht die Beschichtungsdicke einstellbar ist.1. Device for parallel edge-free coating of printed circuit boards in the roller coating process, characterized in that a 10 to 200 µm thick metal spacer layer is applied to the metering rollers in the edge area by galvanic coating with a preferred width of 10 to 100 mm and that in the edge area of the application rollers 0.5 to 20 mm wide conductive sliding contact ring is attached, which has the thickness of the rubber coating and the contact thickness of the coating thickness is adjustable via its contact. 2. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß die galvanisch aufgebrachte Metalldistanzschicht aus Chrom- oder Chrom/Nickel besteht.2. Device according to claim 1, characterized in that the galvanically applied metal spacer layer consists of chrome or chrome / nickel. 3. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß der Gleitkontakt­ ring aus leitfähigem Kunststoff bevorzugt aus leitfähigem Hartgewebe besteht, und zum inneren Walzenkern isoliert ist.3. Device according to claim 1, characterized in that the sliding contact ring made of conductive plastic, preferably made of conductive hard tissue, and is insulated from the inner roll core. 4. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß der Gleitkontakt­ ring aus Kupfer oder Messing besteht.4. The device according to claim 1, characterized in that the sliding contact ring is made of copper or brass. 5. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß die Beschichtungs­ vorrichtung nur dann betrieben werden kann, wenn der Stromfluß über die Gleitkontaktringe und die Dosierwalze gewährleistet ist.5. The device according to claim 1, characterized in that the coating device can only be operated if the current flow through the Sliding contact rings and the metering roller is guaranteed.
DE1995110227 1994-06-23 1995-03-23 Application of UV-curable coating compsn. to both sides of circuit board Withdrawn DE19510227A1 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE1995110227 DE19510227A1 (en) 1995-03-23 1995-03-23 Application of UV-curable coating compsn. to both sides of circuit board
AT95923327T ATE174750T1 (en) 1994-06-23 1995-06-14 METHOD AND DEVICE FOR COATING CIRCUIT BOARDS, IN PARTICULAR FOR PRODUCING MULTI-CHIP MODULES
AU27923/95A AU2792395A (en) 1994-06-23 1995-06-14 Method and device for coating printed-circuit boards, in particular for the manufacture of multi-chip-modules
US08/765,076 US5804256A (en) 1994-06-23 1995-06-14 Method and device for coating printed-circuit boards
PCT/EP1995/002309 WO1996000492A1 (en) 1994-06-23 1995-06-14 Method and device for coating printed-circuit boards, in particular for the manufacture of multi-chip-modules
DE59504568T DE59504568D1 (en) 1994-06-23 1995-06-14 METHOD AND DEVICE FOR COATING PCBS, ESPECIALLY FOR THE PRODUCTION OF MULTI-CHIP MODULES
EP95923327A EP0766908B1 (en) 1994-06-23 1995-06-14 Method and device for coating printed-circuit boards, in particular for the manufacture of multi-chip-modules

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1995110227 DE19510227A1 (en) 1995-03-23 1995-03-23 Application of UV-curable coating compsn. to both sides of circuit board

Publications (1)

Publication Number Publication Date
DE19510227A1 true DE19510227A1 (en) 1996-09-26

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE1995110227 Withdrawn DE19510227A1 (en) 1994-06-23 1995-03-23 Application of UV-curable coating compsn. to both sides of circuit board

Country Status (1)

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DE (1) DE19510227A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29701547U1 (en) * 1997-01-30 1997-03-20 Voith Sulzer Papiermaschinen GmbH, 89522 Heidenheim Roller for application device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29701547U1 (en) * 1997-01-30 1997-03-20 Voith Sulzer Papiermaschinen GmbH, 89522 Heidenheim Roller for application device
US5967035A (en) * 1997-01-30 1999-10-19 Voith Sulzer Papiermaschinen Gmbh Applicator system roll
US6202557B1 (en) 1997-01-30 2001-03-20 Voith Sulzer Papiermaschinen Gmbh Applicator system roll

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