DE19510227A1 - Application of UV-curable coating compsn. to both sides of circuit board - Google Patents
Application of UV-curable coating compsn. to both sides of circuit boardInfo
- Publication number
- DE19510227A1 DE19510227A1 DE1995110227 DE19510227A DE19510227A1 DE 19510227 A1 DE19510227 A1 DE 19510227A1 DE 1995110227 DE1995110227 DE 1995110227 DE 19510227 A DE19510227 A DE 19510227A DE 19510227 A1 DE19510227 A1 DE 19510227A1
- Authority
- DE
- Germany
- Prior art keywords
- coating
- sliding contact
- thickness
- roller
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Coating Apparatus (AREA)
Abstract
Description
Das Walzenbeschichtungsverfahren ist das am häufigsten verwendete Beschich tungsverfahren. Es wird insbesondere zum Beschichten flächiger Trägerstoffe verwendet. Zum Beschichten ebener nicht saugfähiger Substrate mit niedrig viskosen Beschichtungsmitteln wird eine gummierte Auftragswalze benutzt, um die Substratunebenheiten auszugleichen. Da hierzu ein gewisser Anpressdruck erforderlich ist, wird ein niedrigviskoses Beschichtungsmittel abgequetscht, so daß eine Beschichtung nicht möglich ist. Daher werden die gummierten Auf tragswalzen mit feinen Rillen versehen, so daß das Beschichtungsmittel über das Volumen der Rillen aufgetragen werden kann. Somit ist eine gleichmäßige Auftragsmenge gewährleistet. Bei höherviskosen Beschichtungsmitteln läßt sich dieses Verfahren jedoch nicht anwenden. Die Auftragsmenge wird hierbei durch den zwischen Dosier- und Auftragswalze gebildeten Spalt bestimmt. Das Problem aller derartiger Walzenbeschichtungsanlagen besteht jedoch in der Parallelität des Walzenspaltes. Außerdem kann die Rundlaufgenauigkeit mangelhaft sein, so daß es sowohl auf den Außenseiten des Substrates wie auch in Beschichtungsrichtung zu erheblichen Auftrags und Dickenschwankungen kommt. Bei Schichtdicken unter 100 µm ist dies durch nachträgliches Messen nur schwer und häufig nicht ohne Zerstörung der Substrate zur Anfertigung von Schliffen feststellbar.The roller coating process is the most frequently used coating process. It is used in particular for coating flat substrates used. For coating flat, non-absorbent substrates with low A gummed applicator roller is used to make viscous coating agents to compensate for the substrate unevenness. Because of this, a certain contact pressure a low-viscosity coating agent is squeezed off, so that coating is not possible. Therefore, the rubberized on support rollers with fine grooves so that the coating agent over the volume of the grooves can be applied. So is an even one Order quantity guaranteed. With higher viscosity coating agents however, do not use this procedure. The order quantity is here determined by the gap formed between the metering and application roller. However, the problem with all such roll coating systems is the parallelism of the nip. In addition, the concentricity can be defective so that it is on both the outside of the substrate as well considerable coating and thickness fluctuations occur in the coating direction. In the case of layer thicknesses below 100 µm, this is only possible by subsequent measurement difficult and often not without destroying the substrates for the production of Grinding noticeable.
Eine Sicherheit, daß kein Bereich der Beschichteten Oberfläche den vorgege benen Toleranzbereich unterschritten hat, ist nicht gegeben.A certainty that no area of the coated surface specified below the tolerance range is not given.
Desweiteren ist es problematisch einen beschichtungsfreien Substratrand zu erzielen, der den Transport des Substrates zum Trockner ermöglicht.Furthermore, it is problematic to have a coating-free substrate edge achieve, which enables the transport of the substrate to the dryer.
Der vorliegenden Erfindung liegt daher die Aufgabe zugrunde, eine Vorrichtung bereitzustellen, mit der sowohl eine Parallelität der Dosier- und Auftrags walzen, eine über die Breite und in Beschichtungsrichtung gleichmäßige Schicht dicke sowie ein beschichtungsfreier Substratrand erzielbar ist. The present invention is therefore based on the object of a device provide with both a parallelism of dosing and application roll a layer that is uniform across the width and in the coating direction thickness and a coating-free substrate edge can be achieved.
Zur Lösung dieser Probleme wird erfindungsgemäß eine doppelseitige Walzen beschichtungsanlage verwendet, (Fig. 1) die aus zwei Dosierwalzen (Fig. 1/1 und 2) und aus zwei Auftragswalzen (Fig. 1/3 und 4) besteht.To solve these problems, a double-sided roller coating system is used according to the invention ( Fig. 1), which consists of two metering rollers ( Fig. 1/1 and 2) and two application rollers ( Fig. 1/3 and 4).
Die bevorzugten Schichtdicken insbesondere für die Beschichtung von Leiter platten sind 10 µm, 50 µm, und 100 µm.The preferred layer thicknesses in particular for the coating of conductors plates are 10 µm, 50 µm, and 100 µm.
Zum Auftragen dieser Schichtdicken mit einer Toleranz von 10% wird eine erfindungsgemäße Walzenbeschichtungsanordnung (Fig. 2) verwendet, die im Randbereich der Dosierwalzen (Fig. 2/1) eine galvanische Metallisierung (Fig. 2/2) in der gewünschten Beschichtungsdicke aufweist.To apply these layer thicknesses with a tolerance of 10%, a roller coating arrangement according to the invention ( Fig. 2) is used which has a galvanic metallization ( Fig. 2/2) in the desired coating thickness in the edge region of the metering rollers ( Fig. 2/1).
Hierbei handelt es sich vorzugsweise um eine Chrom- bzw. Chrom/Nickelschicht in den Dicken von 10 µm, 50 µm und 100 µm.This is preferably a chrome or chrome / nickel layer in the thicknesses of 10 µm, 50 µm and 100 µm.
Über diese auf einer beliebigen Breite von ca. 1 bis 20 cm galvanisch auf gebrachten Metallschicht, läßt sich ein Höchstmaß an Parallelität erreichen. Gleichzeitig läßt sich die Rundlaufgenauigkeit ermitteln, wenn diese Metall schicht ihren Kontakt zur gummierten Auftragswalze (Fig. 2/3) verliert.A maximum degree of parallelism can be achieved by means of this galvanically applied metal layer on any width of approximately 1 to 20 cm. At the same time, the concentricity can be determined if this metal layer loses its contact with the rubberized application roller ( Fig. 2/3).
Um eine gleichmäßige Dicke des Beschichtungsfilms sicher zu stellen, muß gewährleistet werden, daß diese Metalldistanzschicht immer im Kontakt mit der Auftragswalze bleibt, ohne in diese einzudringen.To ensure a uniform thickness of the coating film, must be ensured that this metal spacer is always in contact with the The application roller remains without penetrating it.
Dies wird erfindungsgemäß durch das Anbringen eines leitfähigen Gleitkontakt rings erzielt, (Fig. 2/4) der auf die gleiche Dicke der Gummierung ge schliffen wurde.This is achieved according to the invention by attaching a conductive sliding contact ring, ( Fig. 2/4) which was ground to the same thickness of the rubber coating.
Wird an einen leitfähigen Gleitkontaktring Spannung angelegt, so beginnt der Strom zu fließen, sobald beide Ringe Kontakt mit der Metalldistanzschicht der Dosierwalze haben. Sollten mangelhafte Rundlaufeigenschaften zur Kontakt unterbrechung führen, so kann dies über ein Meßgerät (Fig. 2/5) erfaßt und über eine Steuerung korrigiert bzw. die Anlage abgeschaltet werden.If voltage is applied to a conductive sliding contact ring, the current begins to flow as soon as both rings come into contact with the metal spacer layer of the metering roller. If poor concentricity results in contact interruption, this can be recorded using a measuring device ( Fig. 2/5) and corrected using a controller or the system can be switched off.
Der leitfähige Gleitkontaktring sollte eine ähnliche thermische Ausdehnung wie der Gummi besitzen, jedoch nicht verformbar sein. Eine Isolation (Fig. 2/6) zum Metallkern der Walze sollte gewährleistet sein. Vorteilhafterweise besteht er mit der gleichen Dicke wie die Gummierung und einer Breite von vorzugsweise 0,5 bis 20 mm aus Kunststoff, wobei nur die äußere Schicht leitfähig ist.The conductive sliding contact ring should have a thermal expansion similar to that of the rubber, but should not be deformable. Insulation ( Fig. 2/6) to the metal core of the roller should be ensured. It is advantageously made of plastic with the same thickness as the rubber coating and a width of preferably 0.5 to 20 mm, only the outer layer being conductive.
Dieser leitfähige Gleitkontaktring läßt sich vorteilhafterweise aus einem Hartgeweberohr herausschneiden, daß den Innendurchmesser der Metallwalze hat und dessen äußere Gewebelagen mit einem leitfähigen Material hergestellt wurden. This conductive sliding contact ring can advantageously be made from one Cut out the hard tissue tube that the inside diameter of the metal roller has and the outer fabric layers made with a conductive material were.
Über einen Schreiber (Fig. 2/5) läßt sich nun der gleichmäßige Stromfluß dokumentieren, so daß eine aufwendige Untersuchung an den Substraten nicht erforderlich ist.The uniform current flow can now be documented using a recorder ( Fig. 2/5), so that a complex examination of the substrates is not necessary.
Die Breite zwischen den beiden Metalldistanzschichten bestimmt die Beschichtungsbreite. (Fig. 2/7).The width between the two metal spacers determines the coating width. ( Fig. 2/7).
Es ist somit erforderlich, Dosierwalzen für die gängigen Schichtstärken und Breiten zu bevorraten.It is therefore necessary to use dosing rollers for the common layer thicknesses and To stock widths.
Diese erfindungsgemäße Vorrichtung ermöglicht es erstmalig bei Schichtdicken unter 100 µm eine gleichmäßige Schichtverteilung sowohl über die Substrat breite wie über die Länge zu gewährleisten, ohne daß hierzu Messungen auf dem beschichteten Substrat notwendig sind.This device according to the invention makes it possible for the first time with layer thicknesses less than 100 µm a uniform layer distribution both over the substrate to ensure wide as well as over the length without taking measurements the coated substrate are necessary.
Gleichzeitig wird insbesondere bei hochviskosen und tixotropen Beschich tungsmitteln ein beschichtungsfreier Rand erzeugt, der für den Weitertrans port der Substrate in den Trockner erforderlich ist.At the same time, especially with highly viscous and tixotropic coating a coating-free edge generated for the further trans port of the substrates in the dryer is required.
Claims (5)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1995110227 DE19510227A1 (en) | 1995-03-23 | 1995-03-23 | Application of UV-curable coating compsn. to both sides of circuit board |
AT95923327T ATE174750T1 (en) | 1994-06-23 | 1995-06-14 | METHOD AND DEVICE FOR COATING CIRCUIT BOARDS, IN PARTICULAR FOR PRODUCING MULTI-CHIP MODULES |
AU27923/95A AU2792395A (en) | 1994-06-23 | 1995-06-14 | Method and device for coating printed-circuit boards, in particular for the manufacture of multi-chip-modules |
US08/765,076 US5804256A (en) | 1994-06-23 | 1995-06-14 | Method and device for coating printed-circuit boards |
PCT/EP1995/002309 WO1996000492A1 (en) | 1994-06-23 | 1995-06-14 | Method and device for coating printed-circuit boards, in particular for the manufacture of multi-chip-modules |
DE59504568T DE59504568D1 (en) | 1994-06-23 | 1995-06-14 | METHOD AND DEVICE FOR COATING PCBS, ESPECIALLY FOR THE PRODUCTION OF MULTI-CHIP MODULES |
EP95923327A EP0766908B1 (en) | 1994-06-23 | 1995-06-14 | Method and device for coating printed-circuit boards, in particular for the manufacture of multi-chip-modules |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1995110227 DE19510227A1 (en) | 1995-03-23 | 1995-03-23 | Application of UV-curable coating compsn. to both sides of circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
DE19510227A1 true DE19510227A1 (en) | 1996-09-26 |
Family
ID=7757278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1995110227 Withdrawn DE19510227A1 (en) | 1994-06-23 | 1995-03-23 | Application of UV-curable coating compsn. to both sides of circuit board |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE19510227A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE29701547U1 (en) * | 1997-01-30 | 1997-03-20 | Voith Sulzer Papiermaschinen GmbH, 89522 Heidenheim | Roller for application device |
-
1995
- 1995-03-23 DE DE1995110227 patent/DE19510227A1/en not_active Withdrawn
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE29701547U1 (en) * | 1997-01-30 | 1997-03-20 | Voith Sulzer Papiermaschinen GmbH, 89522 Heidenheim | Roller for application device |
US5967035A (en) * | 1997-01-30 | 1999-10-19 | Voith Sulzer Papiermaschinen Gmbh | Applicator system roll |
US6202557B1 (en) | 1997-01-30 | 2001-03-20 | Voith Sulzer Papiermaschinen Gmbh | Applicator system roll |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8122 | Nonbinding interest in granting licenses declared | ||
8139 | Disposal/non-payment of the annual fee |