DE1914398A1 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung

Info

Publication number
DE1914398A1
DE1914398A1 DE19691914398 DE1914398A DE1914398A1 DE 1914398 A1 DE1914398 A1 DE 1914398A1 DE 19691914398 DE19691914398 DE 19691914398 DE 1914398 A DE1914398 A DE 1914398A DE 1914398 A1 DE1914398 A1 DE 1914398A1
Authority
DE
Germany
Prior art keywords
pressure
semiconductor device
semiconductor
plates
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19691914398
Other languages
German (de)
English (en)
Inventor
Isamn Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE1914398A1 publication Critical patent/DE1914398A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
DE19691914398 1968-03-22 1969-03-21 Halbleitervorrichtung Pending DE1914398A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1871168 1968-03-22

Publications (1)

Publication Number Publication Date
DE1914398A1 true DE1914398A1 (de) 1969-10-02

Family

ID=11979221

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19691914398 Pending DE1914398A1 (de) 1968-03-22 1969-03-21 Halbleitervorrichtung

Country Status (3)

Country Link
DE (1) DE1914398A1 (enrdf_load_stackoverflow)
FR (1) FR2004508A1 (enrdf_load_stackoverflow)
GB (1) GB1192169A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3686541A (en) * 1971-07-19 1972-08-22 Gen Electric A flexible resilient member for applying a clamping force to thyristor units
FR2495845A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif de serrage entre les elements superposes de groupes alignes, notamment pour la connexion electrique d'elements conducteurs
EP0100626A3 (en) * 1982-07-29 1985-11-06 LUCAS INDUSTRIES public limited company Semi-conductor assembly
US4628219A (en) * 1985-09-13 1986-12-09 Sundstrand Corporation Rectifier assembly for mounting in a rotor

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2135119A (en) * 1983-01-19 1984-08-22 Westinghouse Electric Corp Self-aligning, self-loading semiconductor clamp
US20040247925A1 (en) * 2003-06-06 2004-12-09 Cromwell Stephen Daniel Method and system for adjusting a curvature of a load plate based on a target load

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3686541A (en) * 1971-07-19 1972-08-22 Gen Electric A flexible resilient member for applying a clamping force to thyristor units
FR2495845A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif de serrage entre les elements superposes de groupes alignes, notamment pour la connexion electrique d'elements conducteurs
EP0055640A1 (fr) * 1980-12-05 1982-07-07 Bull S.A. Dispositif de serrage pour les éléments superposés de groupes alignés, notamment pour la connexion électrique d'éléments conducteurs
US4611869A (en) * 1980-12-05 1986-09-16 Compagnie Internationale Pour L'informatique Cii Honeywell Bull (Societe Anonyme) Clamping device
EP0100626A3 (en) * 1982-07-29 1985-11-06 LUCAS INDUSTRIES public limited company Semi-conductor assembly
US4642671A (en) * 1982-07-29 1987-02-10 Lucas Industries Public Limited Company Semi-conductor assembly
US4628219A (en) * 1985-09-13 1986-12-09 Sundstrand Corporation Rectifier assembly for mounting in a rotor

Also Published As

Publication number Publication date
GB1192169A (en) 1970-05-20
FR2004508A1 (enrdf_load_stackoverflow) 1969-11-28

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