DE1900258U - PRINTED CIRCUIT BOARD WITH ELECTRICAL COMPONENTS. - Google Patents

PRINTED CIRCUIT BOARD WITH ELECTRICAL COMPONENTS.

Info

Publication number
DE1900258U
DE1900258U DE1964S0048564 DES0048564U DE1900258U DE 1900258 U DE1900258 U DE 1900258U DE 1964S0048564 DE1964S0048564 DE 1964S0048564 DE S0048564 U DES0048564 U DE S0048564U DE 1900258 U DE1900258 U DE 1900258U
Authority
DE
Germany
Prior art keywords
contact holes
circuit board
printed circuit
connecting wires
electrical components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE1964S0048564
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE1964S0048564 priority Critical patent/DE1900258U/en
Publication of DE1900258U publication Critical patent/DE1900258U/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0281—Conductive fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10454—Vertically mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10878—Means for retention of a lead in a hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

Siemens & Halske ' München 2Siemens & Halske 'Munich 2

"Aktiengesellschaft Wittelsbaclierplatz 2"Aktiengesellschaft Wittelsbaclierplatz 2

64/23264/232

Gedruckte Sciialtungsplatte mit elektrischen BauelementenPrinted circuit board with electrical components

Die Neuerung betrifft eine gedruckte Schaltungsplatte aus-Hatpapier oder organischen verformbaren Kunststoff mit
elektrischen Bauelementen* die runde Anschlußdrähte aufweisens welche in Kontalctlöcher der Platte klemmend eingesetztThe innovation concerns a printed circuit board made of hat paper or with organic deformable plastic
electrical components * having round lead wires which s in the plate clamping Kontalctlöcher used

ΡΛ 9/491/90T/904 b :. - - - 2ΡΛ 9/491 / 90T / 904 b:. - - - 2

Bck/Grü 21.4.64Bck / Grü 21.4.64

Vk 9/491/901/904b ' - 2 - Vk 9/491/901 / 904b '- 2 -

sind ο' Auf gate der 'Feuerung ist es, den Halt der Bauelemente auf gedruckten Schaltungsplatten vom Einsetzen bis wenigstens zur Verlötung wackelfrei zu gewährleisten οare ο 'on gate of the' furnace is to hold the structural elements Ensure that there are no wobbles on printed circuit boards from insertion to at least soldering ο

Bauelemente im Sinne der Neuerung können stabförmige Widerstände oder Kondensatoren oder auch Transistoren sein, wobei diese Bauelemente jeweils parallel oder senkrecht zur Trägerplatte angeordnet sind.Components in the sense of the innovation can be rod-shaped resistors or capacitors or transistors, these components each being parallel or perpendicular to the carrier plate are arranged.

Ss ist bekannt/den Halt der Bauelemente \om Einsetzen bis zur Verlötung und auch darüberhinäuö, insbesondere falls keine Verlötung erfolgt, durch Hülsen oder durch Verformung der Anschlußdrähte'zu bewirken=Ss is known / the hold of the components \ om insertion until Soldering and also beyond that, especially if none Soldering takes place by means of sleeves or by deforming the connecting wires

Eine einfachere Lösung der wackelfreien Halterung der Bauelemente schlägt die Neuerung vor, die dadurch gekennzeichnet ist, daß bei den eingangs genannten gedruckten Schaltungsplitten Teile der Wandungen der Kontaktlöcher, durch die runden Anschlußdrähte verformt sind und die Kontaktlöcher nur teilweise mit den Anschlußdrälifen ausgefüllt sind»A simpler solution of the wobble-free mounting of the components suggests the innovation, which is characterized by it is that in the aforementioned printed circuit board Parts of the walls of the contact holes through the round ones Connecting wires are deformed and the contact holes are only partially filled with the connecting wires »

"Vorzugsweise werden vieleckige Kontaktlöcher vorgeschlagen» wobei der Radius der AnSchlußdrähte größer ist als der Abstand der .Seitenflächen der Vielecke von der Mittelachse ="Preferably, polygonal contact holes are suggested» the radius of the connecting wires being greater than the distance the .Side surfaces of the polygons from the central axis =

Unter bestimmten Voraussetzungen/ ist es vorteilhaft, Anschlußdrähte aus jeweils wenigstens zwei, vorzugsweise drei,Under certain conditions / it is advantageous to use connecting wires of at least two, preferably three,

PA-9/491/90 V9041J - 5 -PA-9/491/90 V9041J - 5 -

parallel oder verdrillt verlaufenden runden Einzeldrähten zu.verwenden, die in solche Kontaktlöcher eingesetzt sind, daß der größte Abstand von der gemeinsamen Achse des Anschlußdrahtbündels größer ist als der kleinste Abstand der Kontaktlochwandungen von der Achse der Kontaktlöcher -parallel or twisted round individual wires to. use, which are inserted into such contact holes, that the greatest distance from the common axis of the connecting wire bundle is greater than the smallest distance between the contact hole walls and the axis of the contact holes -

In den Abbildungen aind einige Beispiele gezeigt, anhand deren die Neuerung erläutert werden soll.Some examples are shown in the figures, based on which the innovation should be explained.

Figur 1 zeigt ein mit- Anschlußdrähten 1 und 2 versehenes Bauelement- 3., das in Kontaktlöcher 4 der Sehxltungsplatte senkrecht eingebaut ist.Die Enden der Anschlußdrähte 1 und 2 sind zu ihrer besseren Einführung in die Kontaktlöcher 4.etwas verjüngt. Figure 1 shows a with-connecting wires 1 and 2 provided Component 3rd, which is perpendicular in contact holes 4 of the Sehxltungsplatte The ends of the connecting wires 1 and 2 are tapered a little to facilitate their introduction into the contact holes 4.

Die Figuren 2 und 3 zeigen Ausschnitte aus der gedruckten Schaltungsplatte mit Kontaktlcciern 4 und 5, die quadratisch oder dreieckig sind. In diesen Kontaktlöchern sind runde Anschlußdrähte 1 eingesetzt,- deren Radius'r größer ist als der senkrechte Abstand a der Yiandungen der Kontaktlöcher von der Mittelachse 8; die Kontaktlöcher .werden aber nicht vollständig von den Anschlußdrähten ausgefüllt, so daß in diese Zwischenräume beimlötprozeß Lötmaterial eindringen kann. In den Figuren 4 und 5 sind ebenfalls Ausschnitte aus der gedruckten Schaltungsplatte dargestellt, wobei ein dreieckiges Kontaktloch 5 bzw. uin rundes Knntaktloch 6 zu sehen sind. In diesen Kontaktlöchern ist jeweils ein Bündel aus mehreren Drähten 7 eingesetzt, die zusammen den Anschlußdraht bilden. Auch hierFigures 2 and 3 show sections of the printed circuit board with Kontaktlcciern 4 and 5, which are square or triangular. Round connecting wires are in these contact holes 1 used, - whose Radius'r is greater than the vertical distance a of the Yiandungen of the contact holes from the Central axis 8; but the contact holes are not complete filled by the connecting wires, so that soldering material can penetrate into these spaces during the soldering process. In the Figures 4 and 5 are also excerpts from the printed version Circuit board shown, with a triangular contact hole 5 and a round contact hole 6 can be seen. In these Contact holes a bundle of several wires 7 is used, which together form the connecting wire. Here too

M 9/491 /9Of/9O4"b - 4 -M 9/491 / 9Of / 9O4 "b - 4 -

sind Kontaktloch und Anschlußdrahtbündel in ihren Abmessungen einander derart zugeordnet, daß der größte Abstand Tq von der gemeinsamen Mittelachse 9 des Bündels größer als der kleino te Wandabstand c von der Achse dec Kontaktlocftes"ist» Es versteht sich, daß bei dem oben bezeichneten Material (Hartpapier oder organischer verformbarer Kunststoff) durch das
Eindrücken der.Anschlußdrähte eine Verformung einzelner Teile der Wandungen der Kontaktlöcher erfolgt. Die Abmessungen a in den Piguren 2 und 3 und c in den Figuren 4 und 5 gelten für das nicht verformte Kontaktloch.the dimensions of the contact hole and the connecting wire bundle are assigned to one another in such a way that the greatest distance Tq from the common central axis 9 of the bundle is greater than the smallest distance c from the wall c from the axis dec contact locations or organic deformable plastic) by the
If the connection wires are pressed in, individual parts of the walls of the contact holes are deformed. The dimensions a in Figures 2 and 3 and c in Figures 4 and 5 apply to the non-deformed contact hole.

Durch die Zuordnung von Kontaktlöchern und Anschlußdrähten gemäß der feuerung ist es möglich, einen sicheren Halt der Bauelemente zu bewirken. Die Bauelemente sitzen wackelfrei fest, was im übrigen auch gegeben ist, wenn nur ein Anschlußdraht eines Bauelementes, der lehre' der Feuerung entspricht, während der andere Änschlußdraht ohne weiteres Abmessungen ■aufweisen kenn, die nicht zu einer Verformung des Kontaktloches führen. ..By assigning contact holes and connecting wires according to the fire, it is possible to ensure a secure hold of the To effect components. The components sit wobble-free fixed, which is also the case if only one connecting wire of a component, which corresponds to the theory of the furnace, while the other connecting wire easily has dimensions ■ have know that do not lead to a deformation of the contact hole. ..

5 Figuren5 figures

3 Patentansprüche3 claims

5-5-

Claims (2)

9/491/90 V904b - 5 - Schutzansprüche :9/491/90 V904b - 5 - Protection claims: 1. Gedruckte Schaltungsplatte aus Hartpapier oder organischem .. verformbaren Kunststoff mit elektrischen Bauelementen, die Anschlußdrähte aufweisen, welche in Kontaktlöcher der Platte klemmend eingesetzt sind, dadurch gekennzeichnet, daß . Teile der Wandungen der Kontaktlöcher (4,5,6) durch runde .Anschlußdrähte (1,7) verformt und. die Kontaktlöcher (4,5,6) nur teilweise mit den Anschlußdrähten ausgefüllt sind»1. Printed circuit board made of hard paper or organic .. deformable plastic with electrical components that Have connecting wires, which in contact holes of the plate are used clamping, characterized in that. Parts of the walls of the contact holes (4,5,6) by round ones . Connecting wires (1,7) deformed and. the contact holes (4,5,6) are only partially filled with the connecting wires » 2. Gedruckte Schaltungsplatte nach Anspruch 1, dadurch gekennzeichnet, daß die Kontaktlöcher (4,5) vieleckig sind, wobei der Radius (r). der Anschlußdrähte (i) größer ist als der senkrechte Abstand (a) der Seitenflächen'der Vielecke von der Mittelachse (8).2. Printed circuit board according to claim 1, characterized in that that the contact holes (4,5) are polygonal, the radius (r). the connecting wires (i) is larger than the vertical distance (a) of the side faces of the polygons from the central axis (8). •3 ο Gedruckte Schaltungsplatte nach Anspruch 1, dadurch ge-r kennzeichnet, daß die Anschlußdrähte jeweils aus wenigstens zwei, insbesondere dreiT parallel oder verdrillt verlaufenden Einzeldrähten (7) bestehen, wobei der größte Abstand (b) von der gemeinsamen Achse (9) des Bündels größer ist als der kleinste Abstand (c) der Kontaktlochwandungen von der Achse (9) der Kontaktlöcher.• 3 ο printed circuit board according to claim 1, characterized in that the connecting wires each consist of at least two, in particular three T individual wires (7) running parallel or twisted, the greatest distance (b) from the common axis (9) of the bundle is greater than the smallest distance (c) of the contact hole walls from the axis (9) of the contact holes.
DE1964S0048564 1964-04-24 1964-04-24 PRINTED CIRCUIT BOARD WITH ELECTRICAL COMPONENTS. Expired DE1900258U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE1964S0048564 DE1900258U (en) 1964-04-24 1964-04-24 PRINTED CIRCUIT BOARD WITH ELECTRICAL COMPONENTS.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1964S0048564 DE1900258U (en) 1964-04-24 1964-04-24 PRINTED CIRCUIT BOARD WITH ELECTRICAL COMPONENTS.

Publications (1)

Publication Number Publication Date
DE1900258U true DE1900258U (en) 1964-09-10

Family

ID=33182829

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1964S0048564 Expired DE1900258U (en) 1964-04-24 1964-04-24 PRINTED CIRCUIT BOARD WITH ELECTRICAL COMPONENTS.

Country Status (1)

Country Link
DE (1) DE1900258U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009054011A1 (en) * 2007-10-25 2009-04-30 Osram Gesellschaft mit beschränkter Haftung A method of soldering components on circuit boards and corresponding circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009054011A1 (en) * 2007-10-25 2009-04-30 Osram Gesellschaft mit beschränkter Haftung A method of soldering components on circuit boards and corresponding circuit board

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