DE1817041A1 - Solder for ti containing zn alloys - Google Patents
Solder for ti containing zn alloysInfo
- Publication number
- DE1817041A1 DE1817041A1 DE19681817041 DE1817041A DE1817041A1 DE 1817041 A1 DE1817041 A1 DE 1817041A1 DE 19681817041 DE19681817041 DE 19681817041 DE 1817041 A DE1817041 A DE 1817041A DE 1817041 A1 DE1817041 A1 DE 1817041A1
- Authority
- DE
- Germany
- Prior art keywords
- zinc
- chloride
- alloys
- solders
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
- B23K35/3603—Halide salts
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Lötmittel für titanhaltige Zinklegierungen Die Erfindung betrifft ein Zink chlorid oder Zinkammonchlorid oder Zinkammonchlorid und Salzsäure enthaltendes Lötmittel fUr titanhaltige Zinklegierungen. Solder for Titanium Containing Zinc Alloys The invention relates to a zinc chloride or zinc ammonium chloride or zinc ammonium chloride and hydrochloric acid containing Solder for zinc alloys containing titanium.
Beim Löten von Zink und Zinklegierungen mit Blei-Zinnloten wird üblicherweise Zinkchlorid oder Zink-Ammoniumchlorid als Flußmittel in wässriger, meist salzsaurer Lösung verwendet. Sind keine störenden Legierungselemente im Zink vorhanden, so kann auch Salzsäure verwendet werden, die sich mit Zink zu Zinkchlorid umsetzt.When soldering zinc and zinc alloys with lead-tin solders, it is common Zinc chloride or zinc ammonium chloride as a flux in aqueous, mostly hydrochloric acid Solution used. If there are no interfering alloying elements in the zinc, then so Hydrochloric acid can also be used, which reacts with zinc to form zinc chloride.
Störende Legierungsbestandteile sind z.B. Tupfer, das, primär gelöst, einen schwarzen Niederschlag bildet. In diesem Falle wUrde neutrales Zink-Ammoniumchlorid als Flußmittel verwendet werden müssen.Disruptive alloy components are e.g. swabs that, primarily dissolved, forms a black precipitate. In this case it would be neutral zinc ammonium chloride must be used as flux.
Bei den in den letzten Jahren entwickelten dauerstandfesten Zink Kuprer-Titanlegierungen ergaben sich Schwierigkeiten auch bei binären, also kupfer-freien Legierungen. Es wurde eine schlechte benetzbarkeit der Lote bei Verwendung Von Salzsäure, Zinkchlorid und Zinkammonchlorid-Lösung beobachtet. Das unedlere Titan reagiert nämlich unter Bildung basischer Salze, die sich beim Erhitzen zersetzen und dadurch die schlechtere Benetzung des Lötmittels verursachen.In the case of the durable zinc copper-titanium alloys developed in recent years Difficulties also arose with binary, i.e. copper-free alloys. It a poor wettability of the solders when using hydrochloric acid, zinc chloride and zinc ammonium chloride solution observed. The less noble titanium namely underreacts Formation of basic salts, which decompose when heated and thus the worse Cause wetting of the solder.
Es wude nun gefunden, daß die Schwierigkeiten beim Weichlöten titan-haltiger Zinklegierungen völlig behoben werden können, wenn ein Zink chlorid oder Zinkammonchlorid oder Ztnkammonchlorid und Salzsäure enthaltendes Lötmittel verwendet wird, das erfindungsgemäß zusätzlich o,l bis 20 k Zinnchlorür (8nu12), bezogen auf die Menge der anderen Salze, aut-weist. Das Verfllltnis Zinkchlorid Ammonchlorid kann dabei beliebig gewählt werden, die Auf#sun$ der Salze in Wasser oder salzsaurem Wasser erfolgt in 50 bis Sioo com pro loo g Salz.It has now been found that the difficulties in soft soldering are titanium-containing Zinc alloys can be completely remedied if a zinc chloride or zinc ammonium chloride or solder containing zinc ammonium chloride and hydrochloric acid which is in accordance with the present invention additionally 0.1 to 20 k tin chloride (8nu12), based on the amount of the other salts, aut-wise. The liquor zinc chloride ammonium chloride can thereby can be chosen arbitrarily, the Auf # sun $ of the salts in water or hydrochloric acid water takes place in 50 to sioo com per loo g of salt.
Beispiel: Ein Lötmittel besteht aus 75 g Zinkchlorid 25 g Ammonchlorid + 5 g Zinnchlorür, gelöst in 9o ccm Wasser + lo ccm Salzsäure Konz.Example: A solder consists of 75 g zinc chloride 25 g ammonium chloride + 5 g tin chloride, dissolved in 9o ccm water + lo ccm hydrochloric acid conc.
Zinnchlorür kann bis zur Hälfte des angegebenen Bereiches durch Wismutchlorid ersetzt werden, wodurch die Benetzung besonders bei bleireichen Loten noch verbessert wird.Tin chloride can be replaced by bismuth chloride up to half of the specified range replaced, which improves the wetting, especially with lead-rich solders will.
Die Verwendung von zinnchlorür-haltigen Flußmitteln beim Löten von titanhaltigen Zink legierungen ergibt nämlich noch einen weiteren wirtschaftlichen Vorteil: Titan-haltige Zlnkknetlegierungen rekristallisieren bekanntlich nicht beim Erhitzen bis 3800 C. Dadurch ergibt sich die M5glichkeit der Verwendung billiger zinnarmer Lote oder sogar von reinem Blei.The use of tin chloride-containing fluxes when soldering Titanium-containing zinc alloys result in yet another economical one Advantage: It is well known that zinc wrought alloys containing titanium do not recrystallize during Heating up to 3800 C. This makes it cheaper to use low-tin solders or even pure lead.
Lötversuche mit Loten, deren Schmelzpunkt über 3000 C lag, verliefen mit normalen Flußmitteln negativ, mit dem beschriebenen, zinnchlorür-haltigen Flußmittel war das Löten titan-haltiger Zinklegierungen selbst mit reinem Blei ohne Schwierigkeiten möglich.Soldering tests with solders with a melting point above 3000 C were carried out negative with normal fluxes, with the described flux containing tin chloride soldering zinc alloys containing titanium was no problem even with pure lead possible.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19681817041 DE1817041A1 (en) | 1968-12-27 | 1968-12-27 | Solder for ti containing zn alloys |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19681817041 DE1817041A1 (en) | 1968-12-27 | 1968-12-27 | Solder for ti containing zn alloys |
Publications (1)
Publication Number | Publication Date |
---|---|
DE1817041A1 true DE1817041A1 (en) | 1970-07-09 |
Family
ID=5717417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19681817041 Pending DE1817041A1 (en) | 1968-12-27 | 1968-12-27 | Solder for ti containing zn alloys |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE1817041A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0169656A1 (en) * | 1984-06-18 | 1986-01-29 | Copper Development Association, Inc. | Soldering compositions, fluxes and methods of use |
US4717430A (en) * | 1984-06-18 | 1988-01-05 | Copper Development Association, Inc. | Soldering compositions, fluxes and methods of use |
-
1968
- 1968-12-27 DE DE19681817041 patent/DE1817041A1/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0169656A1 (en) * | 1984-06-18 | 1986-01-29 | Copper Development Association, Inc. | Soldering compositions, fluxes and methods of use |
US4647308A (en) * | 1984-06-18 | 1987-03-03 | Copper Development Association, Inc. | Soldering compositions, fluxes and methods of use |
US4717430A (en) * | 1984-06-18 | 1988-01-05 | Copper Development Association, Inc. | Soldering compositions, fluxes and methods of use |
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