DE175123C - - Google Patents

Info

Publication number
DE175123C
DE175123C DENDAT175123D DE175123DA DE175123C DE 175123 C DE175123 C DE 175123C DE NDAT175123 D DENDAT175123 D DE NDAT175123D DE 175123D A DE175123D A DE 175123DA DE 175123 C DE175123 C DE 175123C
Authority
DE
Germany
Prior art keywords
short
parts
regulating
alternating current
phase difference
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DENDAT175123D
Other languages
German (de)
English (en)
Publication of DE175123C publication Critical patent/DE175123C/de
Active legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R11/00—Electromechanical arrangements for measuring time integral of electric power or current, e.g. of consumption
    • G01R11/36—Induction meters, e.g. Ferraris meters

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Details Of Television Scanning (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
DENDAT175123D Active DE175123C (enrdf_load_html_response)

Publications (1)

Publication Number Publication Date
DE175123C true DE175123C (enrdf_load_html_response)

Family

ID=439804

Family Applications (1)

Application Number Title Priority Date Filing Date
DENDAT175123D Active DE175123C (enrdf_load_html_response)

Country Status (1)

Country Link
DE (1) DE175123C (enrdf_load_html_response)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4709849A (en) * 1985-11-27 1987-12-01 Fry Metals, Inc. Solder preform and methods employing the same
US4851966A (en) * 1986-11-10 1989-07-25 Motorola, Inc. Method and apparatus of printed circuit board assembly with optimal placement of components

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4709849A (en) * 1985-11-27 1987-12-01 Fry Metals, Inc. Solder preform and methods employing the same
US4851966A (en) * 1986-11-10 1989-07-25 Motorola, Inc. Method and apparatus of printed circuit board assembly with optimal placement of components

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