DE1690255B2 - Circuit applied to a carrier plate with conductive paths manufactured using thick film technology - Google Patents

Circuit applied to a carrier plate with conductive paths manufactured using thick film technology

Info

Publication number
DE1690255B2
DE1690255B2 DE1690255A DE1690255A DE1690255B2 DE 1690255 B2 DE1690255 B2 DE 1690255B2 DE 1690255 A DE1690255 A DE 1690255A DE 1690255 A DE1690255 A DE 1690255A DE 1690255 B2 DE1690255 B2 DE 1690255B2
Authority
DE
Germany
Prior art keywords
adhesive
solid
thick film
carrier
connections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE1690255A
Other languages
German (de)
Other versions
DE1690255C3 (en
DE1690255A1 (en
Inventor
Dieter Dipl.-Ing. 7900 Ulm Gerdes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefunken Patentverwertungs GmbH
Original Assignee
Telefunken Patentverwertungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefunken Patentverwertungs GmbH filed Critical Telefunken Patentverwertungs GmbH
Publication of DE1690255A1 publication Critical patent/DE1690255A1/en
Publication of DE1690255B2 publication Critical patent/DE1690255B2/en
Application granted granted Critical
Publication of DE1690255C3 publication Critical patent/DE1690255C3/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)

Description

3. Schaltung nach Anspruch 1 oder 2, dadurch Man kann die einzelnen Festkörperschaltkreise gekennzeichnet, daß als aufdruckbares Isolierma- vollkommen mit einem Wall umschließen. Es wird in terial für den Wall (7) das auch zur Herstellung 25 vielen Fällen jedoch genügen, einen Schutzwall an von elektrisch isolierenden Schichten auf dem den Seiten der Festkörperschaltung vorzusehen, auf Trägerpiättchen (1) verwendete Material benutzt denen die benachbarten Verbindungsstellen liegen,
wird. Ein Ausführungsbeispiel einer erfindungsgemäß3. A circuit according to claim 1 or 2, characterized in that the individual solid-state circuits can be completely enclosed with a wall as a printable Isolierma-. In material for the wall (7), which is also sufficient for the production in many cases, however, a protective wall is provided on electrically insulating layers on the sides of the solid-state circuit, material used on carrier platelets (1) on which the adjacent connection points are located,
will. An embodiment of one according to the invention

aufgebauten Schaltung ist in der Zeichnung darge-circuit is shown in the drawing

30 stellt. Das Trägerpiättchen der Schaltung trägt das30 places. The carrier plate of the circuit carries that

Bezugszeichen 1. Auf dieser Platte, die der Einfachheit halber nur teilweise bestückt dargestellt ist, sindReference symbol 1. On this plate, which is shown only partially populated for the sake of simplicity, are

Die Erfindung betrifft eine juf eii- .m Trägerplätt- Leitungsbahnen 3 im Siebdruckverfahren aufgechen aufgebrachte Schaltung mit in Dickfilmtechnik bracht. Die am Rande liegenden Anschlüsse der hergestellten Leitungsbahnen und gegebenenfalls 35 Schaltung, die ebenfalls im Siebdruckverfahren herpassiven Schaltelementen und mit in die Schaltung gestellt wurden, tragen das Bezugszeichen 4. Auf das eingefügten, durch Klebung mechanisch befestigten Trägerpiättchen sind Festkörperschaltkreise 2 aufge-Festkörperschaltkreisen, deren Anschlüsse mit den bracht. Diese plättchenförmigen Festkörperschalt-Leitungsbahnen elektrisch verbindbar sind. kreise 2 sind auf der Trägerplatte 1, wie bereits obenThe invention relates to a juf egg .m carrier plate conductor tracks 3 in the screen printing process applied circuit in thick film technology. The connections of the produced conductor tracks and possibly 35 circuit, which are also herpassive in the screen printing process Switching elements and were placed in the circuit bear the reference number 4. On the Inserted, mechanically bonded carrier plates are solid-state circuits 2 solid-state circuits, their connections with the brought. These platelet-shaped solid-state circuit conductors are electrically connectable. circles 2 are on the support plate 1, as above

Bei dieser Technik, von der die Erfindung ausgeht, 40 erwähnt, aufgeklebt. Um zu verhindern, daß die inIn this technique, from which the invention is based, 40 mentioned, glued on. To prevent the in

dienen die in Dickfilmtechnik aufgebrachten Lei- der Nähe der Festkörperschaltkreise 2 liegenden An-the lines applied in thick film technology serve the proximity of the solid-state circuits 2

tungsbahnen also im wesentlichen der Zusammen- schlußpunkte zwischen den Leitungsbahnen 3 bzw.lines essentially the merging points between the lines 3 or

schaltung der Festkörperschaltkreise, also von Anschlüssen 4 und den Anschlußdrähtchen 6 dercircuit of the solid-state circuits, so of terminals 4 and the connecting wires 6 of the

Schaltkreisen, bei denen die verschiedenen Schaltele- Festkörperschaltkreise 2 von dem Klebstoff benetztCircuits in which the various switching elements solid-state circuits 2 are wetted by the adhesive

tnente auf einem Halbleiterkörper z. B. durch Diffu- 45 werden, sind zwischen die Anschlußstellen und dieTnente on a semiconductor body z. B. by Diffu- 45 are between the connection points and the

sion erzeugt werden. Derartige Schaltkreise können Festkörperschaltkrcise kleine, den Klebstoff zurück-sion can be generated. Such circuits can cause small solid-state switching crises, the adhesive back

bekanntlich sehr klein aufgebaut werden. haltende wallförmige Erhebungen 7 vorgesehen.are known to be built very small. retaining wall-shaped elevations 7 are provided.

Wie bereits oben erwähnt, werden diese Festkör- Diese wallförmigen Erhebungen sind in der Zeichperschaltkreise mit Hilfe eines Klebstoffes, z. B. nung schraffiert eingezeichnet. Sie werden in derseleinem Harz, mechanisch auf dem Trägerpiättchen 50 ben Technik wie die Verbindungsleitungen 3 aufgeder Gesamtschaltung aufgebracht. Es hat sich nun druckt, und danach wird das aufgetragene Isoliermagezeigt, daß der zur Festlegung der Festkörperschalt- terial eingebrannt, so daß ein fester Wall entsteht, kreise benutzte Klebstoff auch die umliegenden Lei- Die Schaltung der Zeichnung enthält auch noch Widertungszüge benetzt. Hierdurch wird die Herstellung Standsbeläge 5. Es soll hierdurch verdeutlicht wervon elektrischen Verbindungen zwischen den auf den 55 den, daß man die erfindungsgemäße Ausbildung Trägerplättchen aufgedruckten Leitungszügen und auch dort anwenden kann, wo neben den Leitungszüden drahtförmigen Anschlüssen der Festkörper- gen auch Schaltelemente mit aufgedruckt werden, schaltkreise unmöglich gemacht. sich also nur ein Teil der Schaltelemente auf denAs already mentioned above, these solid bodies are These wall-shaped elevations are in the drawing circuit with the help of an adhesive, e.g. B. voltage shown hatched. You will be in the one Resin, mechanically on the carrier platelet 50 ben technology such as the connecting lines 3 aufgeder Overall circuit applied. It has now been printed, and then the applied insulating magenta is shown, that the solid-state switching material is burnt in, so that a solid wall is created, The circuit of the drawing also contains deductions wetted. This makes the production of floor coverings 5. This is intended to clarify which of them electrical connections between the on the 55 den that one the training according to the invention Carrier plate printed cable runs and can also be used where next to the cable runs wire-shaped connections of the solid state and switching elements can also be printed on, circuits made impossible. So only some of the switching elements are on the

Die der Erfindung zugrunde liegende Aufgabe be- Festkörper ehaltkreisen 2 befindet. Wie bereits er« »tetii darin, an dem Trägerpiättchen einer Schaltung 60 wähnt, kann man die Wälle7 aus dem gleichen Mader eingangs genannten Art Maßnahmen zu treffen, terial herstellen, das auch als Isoliermaterial bei der die das Benetzen der Leitungsbahnen mit Klebstoff Herstellung von elektrisch isolierenden Schichten, turntndest dort verhindern, wo elektrische Kontakt- wie z.B. an Kreuzungen von Leitungsbahnen, Ververbindungen hergestellt werden sollen. wertdung findet. An der Stelle 8 sind zwei benach-The object on which the invention is based is solid-state holding circuits 2. As already he " "Tetii in it, on the support plate of a circuit 60, one can see the walls7 from the same Mader To take measures mentioned at the beginning, produce material that is also used as an insulating material in the the wetting of the conductor tracks with adhesive production of electrically insulating layers, prevent turntndest where there is electrical contact, e.g. at crossings of cable tracks, connections should be produced. appreciation finds. At position 8 there are two

Zur Lösung dieser Aufgabe wird erfindungsgemäß 65 barte Wälle? verbunden, wobei der VerbindungsstegTo solve this problem, according to the invention, 65 barte walls? connected, the connecting web

rwischen den einzelnen Klebestellen und den be- die Isolierschicht für die Kreuzung an der Stelle 8Between the individual adhesive points and the insulating layer for the intersection at point 8

nachbart liegenden Verbindungsstellen der An* bildet.adjacent connection points of the An * forms.

Hierzu 1 Blatt Zeichnungen1 sheet of drawings

Claims (2)

1 2 scblußdrfthtehen der Festkörperschaltkreise mit den Patentansprüche: Leitungsbahnen bzw. Anschlüssen auf dem Trägerpiättchen ein den Klebstoff zurückhaltender kleiner1 2 scblußdrfthtehen the solid-state circuits with the claims: Conductor tracks or connections on the carrier platelets a smaller adhesive that retains the adhesive 1. Auf einem Trggerplättchen aufgebrachte Wall aus aufdruck- und einbrennbarem IsoUermate-Scbaltung mit in Dickfilmtechnik hergestellten 5 rial angebracht.1. Wall of imprintable and burn-in IsoUermate circuitry attached to a carrier plate with 5 rials made in thick film technology. Leitungsbabnen und gegebenenfalls passiven Günstigerweise verwendet man zur Herstellung des Schaltelementen und mit in die Schaltung einge- Walls das Material, das auch zur Herstellung anderer fügten, durch Klebung mechanisch befestigten Isolierschichten auf dem Trägerpiättchen verwendet Festkörperschaltkreisen, deren Anschlüsse mit wird. Es hat sich gezeigt, daß in einer Flüssigkeit, den Leitungsbahnen elektrisch verbindbar sind, io beispielsweise in einem öl, aufgeschlämnstes Glasdadurcb gekennzeichnet, daß zwischen pulver sich bei Anwendung der Dickfilmtechnik als den einzelnen Klebestellen und den benachbart Isoliermaterial sehr gut eignet, da dieses Material liegenden Verbindungsstellen der Anschlußdräht- nach dem Siebdruckverfahren aufgebracht werden chen (6) der Festkörperschaltkreise (2) mit den kann und danach eine gute Festigkeit durch das Ein-Leitungsbahnen (3) bzw. Anschlüssen (4) auf 15 brennen erhält. Die Herstellung von Isolierschichten dem Trägerpiättchen (1) ein den Klebstoff zu- im ^iebdruckverfahren unter Verwendung von aufgerückhaltender kleiner Wall (7) aus aufdruck- und schJämmtem Glaspulver ist an sich bekannt (»Elekeinbrennbarem Isoliermaterial angebracht ist. trisches Nachrichtenwesen«, Band 41, Nr. 4, 1966, S.Cable trunks and possibly passive ones are favorably used for the production of the Switching elements and with in the circuit- Walls the material, which is also used for the manufacture of other added insulating layers mechanically fastened by adhesive bonding to the carrier platelets Solid-state circuits whose connections are made with. It has been shown that in a liquid, the conductor tracks can be electrically connected, for example in an oil-slurried glass thickness characterized in that between powder when using the thick film technique as the individual adhesive points and the adjacent insulating material is very suitable, as this material lying connection points of the connecting wires are applied after the screen printing process chen (6) of the solid-state circuits (2) with the can and then a good strength through the single-conductor tracks (3) or connections (4) to 15 burn. The production of insulating layers the carrier platelet (1) a silk-screen printing process using the adhesive small wall (7) made of imprinted and molded glass powder is known per se (»Elekeinbrennbarem Insulating material is attached. trisches Nachrichtenwesen ", Volume 41, No. 4, 1966, p. 2. Schaltung nach Anspruch 1, gekennzeichnet 432 und 433).2. Circuit according to claim 1, characterized 432 and 433). durch die Verwendung von in Flüssigkeit aufge- 20 Weiterhin kann auch aufgeschlämmteb Aiuminium-through the use of suspended in liquid 20 Furthermore, Aiuminium- schlämmtem Glaspulver als aufdruckbares Iso- oxydpulver, Siliziumkarbidpulver u. dgl. zum Ein-slurried glass powder as printable iso-oxide powder, silicon carbide powder and the like to liermaterial. sat/ kommen.liner material. sat / come.
DE1690255A 1967-03-14 1967-03-14 Circuit applied to a carrier plate with conductive paths manufactured using thick film technology Granted DE1690255B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DET0033434 1967-03-14

Publications (3)

Publication Number Publication Date
DE1690255A1 DE1690255A1 (en) 1971-05-13
DE1690255B2 true DE1690255B2 (en) 1975-01-09
DE1690255C3 DE1690255C3 (en) 1975-08-21

Family

ID=7557765

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1690255A Granted DE1690255B2 (en) 1967-03-14 1967-03-14 Circuit applied to a carrier plate with conductive paths manufactured using thick film technology

Country Status (2)

Country Link
DE (1) DE1690255B2 (en)
GB (1) GB1199231A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55156482U (en) * 1979-04-26 1980-11-11
US4761881A (en) * 1986-09-15 1988-08-09 International Business Machines Corporation Single step solder process
CA1278876C (en) * 1986-12-25 1991-01-08 Sho Masujima Adhesive mounted electronic circuit element
ATE554642T1 (en) 2009-09-22 2012-05-15 Micronas Gmbh INTEGRATION OF SMD COMPONENTS INTO AN IC HOUSING

Also Published As

Publication number Publication date
DE1690255C3 (en) 1975-08-21
GB1199231A (en) 1970-07-15
DE1690255A1 (en) 1971-05-13

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
E771 Valid patent as to the heymanns-index 1977, willingness to grant licences
EHJ Ceased/non-payment of the annual fee