DE1690255A1 - Circuit applied to a carrier plate with conductive paths produced using thick film technology - Google Patents

Circuit applied to a carrier plate with conductive paths produced using thick film technology

Info

Publication number
DE1690255A1
DE1690255A1 DE19671690255 DE1690255A DE1690255A1 DE 1690255 A1 DE1690255 A1 DE 1690255A1 DE 19671690255 DE19671690255 DE 19671690255 DE 1690255 A DE1690255 A DE 1690255A DE 1690255 A1 DE1690255 A1 DE 1690255A1
Authority
DE
Germany
Prior art keywords
circuit
solid
carrier plate
thick film
film technology
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19671690255
Other languages
German (de)
Other versions
DE1690255B2 (en
DE1690255C3 (en
Inventor
Dieter Dipl-Ing Gerdes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefunken Patentverwertungs GmbH
Original Assignee
Telefunken Patentverwertungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefunken Patentverwertungs GmbH filed Critical Telefunken Patentverwertungs GmbH
Publication of DE1690255A1 publication Critical patent/DE1690255A1/en
Publication of DE1690255B2 publication Critical patent/DE1690255B2/en
Application granted granted Critical
Publication of DE1690255C3 publication Critical patent/DE1690255C3/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)

Description

TBLEIUNKEIi icQnoccTBLEIUNKEIi icQnocc

Patentverwertungsgesellschaft I D U U Z ο DPatent collecting society I D U U Z ο D

m, b. H.
Ulm (Donau.) , Elisabethenstr, 3m, b. H.
Ulm (Danube), Elisabethenstr, 3

Ulm (Donau), 8,März 1967 FE/PT-Ka/Eg - U 15/67Ulm (Danube), March 8, 1967 FE / PT-Ka / Eg - U 15/67

"Auf einem Trägerplättchen aufgebrachte Schaltung mit in Dickfilmtechnik hergestellten Ifeitungsbahnen""Circuit applied to a carrier plate with a circuit produced using thick film technology Ifeitungsbahnen "

Die Erfindung betrifft eine auf einem Tragerplättchen aufgebrachte Schaltung mit in Dickfilmtechnik hergestellten Leitungsbahnen und gegebenenfalls passiven Schaltelementen und mit in die Schaltung eingefügten, durch Klebung mechanisch befestigten Festkörperschaltkreisen, deren Anschlüsse mit den Leitungsbahnen elektrisch verbunden werden.The invention relates to an applied to a carrier plate Circuit with conductor tracks produced in thick film technology and, if necessary, passive switching elements and with mechanically inserted into the circuit by gluing attached solid-state circuits, the connections of which are electrically connected to the conductor tracks.

Bei dieser Technik dienen die in Dickfilmtechnik aufgebrachten Leitungsbahnen also im wesentlichen der Zusammenschaltung der Festkörperschaltkreise» also von Schaltkreisen, bei denen von einem Halbleitergrundkörper ausgegangen wird und bei denen die verschiedenen Schaltelemente auf diesem Halbleiterkörper z, B. durch Diffusion erzeugt werden. Derartige Schaltkreise können bekanntlich sehr klein aufgebaut werden. In this technology, the conductive paths applied using thick-film technology essentially serve to interconnect the solid-state circuits, that is, circuits in which a semiconductor base body is assumed and in which the various switching elements on this semiconductor body are produced, for example, by diffusion. It is known that such circuits can be constructed very small .

109820/1671109820/1671

- 2 - U 15/67- 2 - U 15/67

Wie bereits oben erwähnt, werden diese Festkörperschaltkreise mit Hilfe eines Klebstoffes, z. B, einem Harz, mechanisch auf dem Trägerplättchen der Gesamtschaltung aufgebracht· Es hat sich nun gezeigt, daß der zur Festlegung der Festkörperschaltkreise benutzte Klebstoff auch die umliegenden Leitungszüge benetzt. Hierdurch wird die Herstellung von elektrischen Verbindungen zwischen den auf den Trägerplättchen aufgedruckten Leitungszügen und den drahtförmigen Anschlüssen der Festkörper-« schaltkreise unmöglich gemacht.As mentioned above, these are solid state circuits with the help of an adhesive, e.g. B, a resin, mechanically applied to the carrier plate of the overall circuit · Es It has now been shown that the adhesive used to define the solid-state circuits also wets the surrounding cable runs. This will make the manufacture of electrical Connections between the printed on the carrier plate Lines and the wire-shaped connections of the solid-state circuits made impossible.

Die der Erfindung zugrundeliegende Aufgabe besteht darin, an dem Trägerplattchen Maßnahmen zu treffen, die das Benetzen der Leitungsbahnen zumindest dort verhindern, wo elektrische Verbindungen hergestellt werden sollen.The object on which the invention is based is to take measures on the carrier plate that facilitate wetting prevent the conductor paths at least where electrical connections are to be made.

Zur Lösung dieser Aufgabe wird zwischen den einzelnen Klebestellen und den benachbart liegenden Verbindungsstellen zwi-" sehen den Leitungsbahnen und den Anschlußdrähtchen der Festkörperschaltkreise ein den Klebstoff zurückhaltender kleiner Wall aus aufdruck- und einbrennbarem Isoliermaterial angebracht. To solve this problem, between the individual adhesive points and the adjacent connection points between "see the conductor tracks and the connecting wires of the solid-state circuits a small wall of printable and burn-in insulating material that retains the adhesive is attached.

Günstigerweise verwendet man zur Herstellung des Walls das Material, das auch zur Herstellung anderer IsolierschichtenIt is a good idea to use that to make the wall Material that is also used to make other insulating layers

1 09820/ 1 67 11 09820/1 67 1

- 3 - U 15/67- 3 - U 15/67

auf dem Trägerplättchen verwendet wird. Es hat sich gezeigt, daß in einer Flüssigkeit, beispielsweise in einem öl, aufgeschlemmtes Glaspulver sich bei Anwendung der Dickfilmtechnik als Isoliermaterial sehr gut eignet, da dieses Material nach dem Siebdruckverfahren aufgebracht werden kann und danach eine gute Festigkeit durch das Einbrennen erhält. Weiterhin kann auch aufgeschlemmtes Aluminiumoxydpulver, Siliziumkarbidpulver und dergleichen zum Einsatz kommen. "is used on the carrier plate. It has shown, that in a liquid, for example in an oil, slurried Glass powder is very suitable as an insulating material when using thick film technology, as this material is after the screen printing process can be applied and then a good strength obtained from baking. Suspended aluminum oxide powder, silicon carbide powder can also be used and the like are used. "

Man kann die einzelnen Festkörperschaltkreise vollkommen mit einem Wall umschließen, Es wird in vielen Fällen jedoch genügen, einen Schutzwall an den Seiten der Festkörperschaltung vorzusehen, auf denen die benachbarten Verbindungsstellen liegen. The individual solid-state circuits can be completely enclosed with a wall, but in many cases it will be sufficient provide a protective wall on the sides of the solid-state circuit on which the adjacent connection points lie.

Ein Ausführungsbeiapiel einer erfindungsgemäß aufgebauten Schaltung ist in der Zeichnung dargestellt. Die Trägerplatte * der Schaltung trägt das Bezugszeichen 1. Auf dieser Platte, di© der Einfachheit halber nur teilweise bestückt dargestellt ist, sind Leitungszüge 3 im Siebdruckverfahren aufgebracht. Die am Rande liegenden Anschlüsse der Schaltung, die ebenfalls im Siebd3T3.ckverf ahren hergestellt wurden, tragen das Bezugszeichen 4.An exemplary embodiment of a circuit constructed according to the invention is shown in the drawing. The carrier plate * of the circuit bears the reference number 1. On this plate, which is shown only partially populated for the sake of simplicity, cable runs 3 are applied using the screen printing process. The connections of the circuit located on the edge, which were also produced in the sieving process, have the reference number 4.

Auf das Trägerplättchen sind Festkörperschaltkreise 2 aufgebracht.Solid-state circuits 2 are applied to the carrier plate.

Diese plättchonförmigen Festkörperschaltkreise 2 sind auf derThese plate-shaped solid-state circuits 2 are on the

1 09820/167 11 09820/167 1

ib9Ü255ib9Ü255

- 4 - U 15/67- 4 - U 15/67

Trägerplatte 1, wie "bereits oben erwähnt, aufgeklebt. Um zu verhindern, daß die in der Nähe der Festkörperschaltkreise 2 liegenden Anschlußpunkte zwischen den Leitungszügen 5 bzw, j£nschlüssen 4 und den Anschlußdrähten 6 der Festkörperschaltkreise 2 von dem Klebstoff benetzt werden, sind zwischen die Anschlußstellen und die Festkörperschaltkreise kleine, den Klebstoff zurückhaltende wallförmige Erhebungen 7 vorgesehen. Diese wallformigen Erhebungen sind in der Zeichnung schraffiert eingezeichnet. Sie werden in derselben Technik wie die Verbindungsleitungen 3 aufgedruckt und danach wird das aufgetragene Isoliermaterial eingebrannt, so daß ein fester Wall entsteht. Die Schaltung der Zeichnung enthält auch noch Widerstandsbeläge 5· Es soll hierdurch verdeutlicht werden, daß man dia erfindungsgemäße Ausbildung auch dort anwenden kann, wo neben den Leitungszügen auch Schaltelemente mit aufgedruckt werden, sich also nur ein Teil der Schaltelemente auf den Festkörperschalfckreisen 2 befindet* Wie bereits erwähnt, kann man die Wälle 7 aus dem gleichen Material herstellen, das auch als Isoliermaterial bei der Herstellung von Kreuzungen Verwendung findet. An der Stelle 8 sind zwei benachbarte Wälle 7 verbunden, wobei der Verbindungssteg die Isolierschicht für die Kreuzung an der Stelle 8 bildet.Carrier plate 1, as "already mentioned above, glued on. To prevent the connection points located in the vicinity of the solid-state circuits 2 between the lines 5 or connections 4 and the connecting wires 6 of the solid-state circuits 2 are wetted by the adhesive, are between the Connection points and the solid-state circuits are provided with small wall-shaped elevations 7 that retain the adhesive. These wall-shaped elevations are shown hatched in the drawing. They are made in the same technique as the interconnection lines 3 and then the applied insulating material is burned in, so that a solid wall is created. The circuit of the drawing also contains resistance coatings 5. This is intended to make clear that one dia according to the invention Training can also be used where, in addition to the cable runs, switching elements are also printed on so only a part of the switching elements on the solid-state circuit breakers 2 is * As already mentioned, the walls 7 can be made of the same material that is used as the insulating material in the production of crossings is used. At the point 8, two adjacent walls 7 are connected, wherein the connecting web forms the insulating layer for the intersection at point 8.

109820/ 167 1109820/167 1

Claims (2)

I69U255 - 5 - U 15/67 !PatentansprücheI69U255 - 5 - U 15/67! Patent claims 1. Auf einem Trägerplättchen aufgebrachte Schaltung mit in Dickfilmtechnik hergestellten Leitungsbahnen und gegebenenfalls passiven Schaltelementen und mit in die Schaltung eingefügten, durch Klebung mechanisch befestigten Festkörperschaltkreisen, deren Anschlüsse mit den Leitungsbahnen elektrisch verbunden werden, dadurch gekennzeichnet, daß zwischen den einzelnen Klebestellen und den benachbart liegenden Verbindungsstellen der Festkörperschaltkreise ein den Klebstoff zurückhaltender kleiner Wall aus aufdruck- und einbrennbarem Isoliermaterial angebracht ist,1. Circuit with in Conductor tracks made using thick film technology and, if necessary, passive switching elements and with inserted into the circuit, Solid-state circuits mechanically attached by gluing, their connections to the conductor tracks electrical are connected, characterized in that between the individual adhesive points and the adjacent connection points the solid-state circuit is a small wall of printable and baked-in material that retains the adhesive Insulation material is attached, 2. Schaltung nach Anspruch 1, gekennzeichnet durch die Verwendung von in Flüssigkeit aufgeschlemmtem Glaspulver als aufdruckbares Isoliermaterial.2. Circuit according to claim 1, characterized by the use of glass powder suspended in liquid as printable insulating material. 3* Schaltung nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß als aufdruckbares Isoliermaterial für den Wall das auch zur Herstellung von Isolierschichten verwendete Material benutzt wird« 3 * circuit according to claim 1 or 2, characterized in that the material also used for the production of insulating layers is used as the printable insulating material for the wall « 109820/1671109820/1671 L e e r s e i f eL e r s e i f e
DE1690255A 1967-03-14 1967-03-14 Circuit applied to a carrier plate with conductive paths manufactured using thick film technology Granted DE1690255B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DET0033434 1967-03-14

Publications (3)

Publication Number Publication Date
DE1690255A1 true DE1690255A1 (en) 1971-05-13
DE1690255B2 DE1690255B2 (en) 1975-01-09
DE1690255C3 DE1690255C3 (en) 1975-08-21

Family

ID=7557765

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1690255A Granted DE1690255B2 (en) 1967-03-14 1967-03-14 Circuit applied to a carrier plate with conductive paths manufactured using thick film technology

Country Status (2)

Country Link
DE (1) DE1690255B2 (en)
GB (1) GB1199231A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55156482U (en) * 1979-04-26 1980-11-11
US4761881A (en) * 1986-09-15 1988-08-09 International Business Machines Corporation Single step solder process
CA1278876C (en) * 1986-12-25 1991-01-08 Sho Masujima Adhesive mounted electronic circuit element
ATE554642T1 (en) 2009-09-22 2012-05-15 Micronas Gmbh INTEGRATION OF SMD COMPONENTS INTO AN IC HOUSING

Also Published As

Publication number Publication date
DE1690255B2 (en) 1975-01-09
GB1199231A (en) 1970-07-15
DE1690255C3 (en) 1975-08-21

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
E771 Valid patent as to the heymanns-index 1977, willingness to grant licences
EHJ Ceased/non-payment of the annual fee