DE1667402A1 - Boards protected against fungal and insect attack, in particular chipboard, and urea-formaldehyde and / or melamine resin-bonded boards made of other lignocellulosic materials - Google Patents

Description

OWL DR. BERG Q1FU-IM & STAPF

PATENTAM WALTE! 6674tt2

0 MUNICH Z. HIUBI-ESTRASSE ZO

Dr. BM Df, Barg DJpMn ₉ . Stapf 8M <wt)> «n2, Hilbleslraße 20

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Our sign

IV / Gd 14 189

June 13, £ 196

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Inetytut Technologii Drewna, Poznan ^ ul · liniarska 1 / Poland.

Boards protected against fungal and insect fever, in particular chipboard and urea-formaldehyde and / or melfioaii-resin-gelatinized boards made of other lignocellulosic materials. ¹¹

SrfInder:

Dipl.Ing.Leonard Dziedzic,

Dip! · Ing »Stanislaw Spiawa Neyman,

Br «Edmung Urbanik.

"•" enstand aer Krfindung moldings such as panels' before * * * ttgaw # i8 · Get * epaiipl ** _t teae and iaomstoffornmldeliyd waae / Office &

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" ² " 166 74 G.

melamine resin-bonded moldings made from lignocellulose-containing Materials treated with a protective agent against fungal and Insect infestation have hardened

It is known that wood-based materials bound with urea linen, preferably chipboard, neither against wood-destroying ones Fungi still act as technical wood pests against insects residual stent are * The weight loss on test specimens of these types of panels as a result of the breakdown of the deciduous wood substance Mushrooms of the species Coniophora cerebella and ienzites trabea, exceeds the initial mass by about 45? ^ after three months. The further consequence is a complete destruction of the Plates.

The protection of lignocellulosic materials, preferably chipboard, against fungal and insect attack with the help of those known for tent. Fungi * and insecticides are associated with difficulties * Aqueous solutions of fungicides and insecticides cannot be used to protect finished wood chipboard and similar materials that are low in urea and / or melamine resin, since excessive moistening can destroy the treated wood materials and the protective effect can be veneursacheai to consider itself to be inadequate is · the application beksnrrlear 81ige £, Sawie axtämtm orgaaisc & e solvent containing Helaachutiitti-fctel is excluded. These connections certainly have disadvantages, as in the example

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unpleasant odor, as a result of which processors and consumers are annoyed. In addition, they cause discoloration of the products, make subsequent surface coating of the same more difficult and limit their field of application.

The protective treatment of wood chips with known agents and, for example, also encounters great difficulties in known processes before they are glued in the manufacture of panels. These difficulties are based in particular on the need to dry protectively treated Wood chips and this complicates the manufacturing process.

Penetrated into the wood particles or the resins used, in amounts effective against felt and insect infestation, admittedly, the known protective agents impair the setting process of the binder in the production of Chipboard · The condensation process of the binding agent takes place either too quickly or too slowly, what a reduction in the technical quality of the panels produced

The production of panel-shaped wood-based materials, preferably chipboard, which are the subject of the invention, does not require any changes in the usual production technology, despite the fact that the invented hardener, which at the same time has anti-fungal and insect-resistant properties, is used

109833/0492 - 4 -

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will. There is no need to add any customary hardening agents. This increases the technical quality of the manufactured Panels not only not adversely affected, but in contrast, their mechanical strength properties are improved. The chemical compound used according to the invention thus has, in addition to properties, a good one Catalyst in the condensation process of the resins used, also properties of an effective protective agent against Fungus and insect infestation «,

Carried out at the Institute for HoIetechnoIogy in Poznan Experiments have shown that chipboard, manufactured using urea ^ ormaldehyde resin, for example with the addition of the invented chemical compounds as hardeners, better physical and mechanical properties have compared to chipboard, which is glued with the same binder, but with the addition of to The hardener commonly used "

Chipboard made with the addition of the invented protective agent when hardeners were produced, the static values were 159 ^ higher Flexural strength and transverse tensile strength values that are around $ 20 higher. The water absorption capacity of these plates

was around 14 ^> and their swelling has been reduced by about $ 10 «

The protective treatment of the wood-based materials according to the invention, preferably chipboard is made with compounds whose

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The main component is ammonium fluorate or sodium fluorate, to which certain parts by weight of boric acid are added. Instead of boric acid, pentachlorophenol and hexachlorocyclohexane are added in certain parts by weight to the main component mentioned. Which of the mentioned secondary constituents is added to the main constituent depends on the climatic conditions in which the chipboard will be used. Chipboards, which are intended for use, for example, in temperate climates can be effectively protected against wood destroying biotic factors by addition to the urea formaldehyde and / or melamine resin of Ammoniumfluoborat or sodium fluoborate in amounts of Y / o to 1QF "of adhesive dry solids, depending on the Degree of danger. Chipboard, which is intended for use in the tropics and is therefore exposed to a particularly high risk of termites, requires an additional addition of active contact insecticides to the fungicidal fluoborate. In such cases the proportion of the total ingredients added to the adhesive is 15 / * of the binder dry substance «,

From incoming, in the Institute for Wood Technology in Poznan The tests carried out show that for the protective treatment of chipboard, which is intended for use in open-plan areas Climate are determined, a compound with the following chemical composition to the particularly useful whore:

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I. Preparation »

1. Ammonium fluorate or sodium fluorate 60 parts by weight

2. Boric Acid 15 "Potassium Dichromate 25 ^M

or a mixture containing 80 $ of this preparation I and 20 ^ Sodium fluoride content.

For the effective protection of chipboard, which are intended for use in tropical or subtropical climates " A modified agent with the following chemical composition is particularly suitable:

II. Preparation.

1. Ammonium fluorate 30 parts by weight

2. Pentachlorophenol 45 "

3. Hexachlorocyclohexane 25 "Can be used as aqueous solutions or suspensions in water these compounds are added to the binder directly from the chip gluing process. The choice of concentration of this aqueous solutions depends on how high the proportion of these protective agents must be in the finished panel to ensure their effectiveness against fungi and / or insects »

By adding one of these preparations to the urea-formaldehyde and / or melamine resin used, this is superfluous the use of common hardeners,

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Claims (3)

The test results also show that 2 kg to 5 kg of preparation I based on ammonium fluorate are sufficient for an effective protective treatment of 1 fm of chipboard against fungal and insect attack in a moderate climate. For an effective protective treatment of chipboard against fungal and insect attack, in particular against termite attacks, i.e. wood chipboard intended for use in the tropics, 2.5 kg to 10 kg of preparation II per 1 fm board must be added to the adhesive glued with 150 kg urea glue, composed of: urea-formaldehyde resin (with 5J> P weight concentration) 122.6 parts by weight. Hardener according to the invention (with 20 ^ weight concentration in the case of using preparation I or 25> weight concentration in the case of using preparation II) 10.0 P aräffin emulsio η (with 17 ^ weight concentration) 17.4 parts by weight further gluing of the panels without changing the usual technological parameters. Claims: 109833/0492 Claims: 1. Urea formaldehyde and / or melamine resin-bonded panels protected against wood-destroying fungi and insects shaped wood materials, preferably wood chipboard ,, thereby labeled products that are for use in temperate climates are determined ammonium fluorate or Sodium fluorate, boric acid and potassium dichromate or sodium dichromate, preferably in a weight ratio of 60:15:25, or products for use in tropical or subtropical climates are determined by ammonium fluorate or Sodium fluorate, pentachlorophenol and hexachlorocyclohexane, preferably in a weight ratio of 30:45:25. 2o wood-based materials according to claim 1, characterized in that that they contain 80 percent of the first additional mixture and around 20 percent of sodium fluoride, 3. A method for producing panels according to claim 1 or 2, characterized in that 2 to 5 kg of the first additional mixture are used to produce the molded wood-based bodies for effective protection against fungal and insect attack in a moderate climate or 2.5 kg to 10 kg of the second additional mixture for effective protection against fungal and insect attack in tropical and subtropical climates as a hardener for added to the condensation process «, 109833/0492