DE1640928B2 - COPPER-LAMINATED BASE MATERIAL FOR PRINTED CIRCUITS AND PROCESS FOR ITS MANUFACTURING - Google Patents

Description

Epoxy resin-impregnated fiberglass fabric under pressure and heat between press plates was processed on a commercially available polishing machine using a grinding paste with a polishing brush described above at a speed of about 500 m per minute with repeated Qssillieren, the temperature of the copper foil between 50 and 80 ° C was held. The surface roughness of such a material was 1.0 to 1.3 μm after processing.
The drawing shows diagrams which show the surface roughness of a copper-clad base material produced according to the invention.

5 gives a schematic representation of the determination of the Rauhtlefenproffls again;

F1 g. 1 shows the roughness profile of one in the example ι described copper-clad Batotorlwji

Fig. 2 shows a profile that is perpendicular to the recording direction according to Fig. 1 on the same sample

XÄHÄ

have been taken up by test specimens like them

Shape of a plate. The copper foil 2 is laminated in a manner known per se onto the base material 1 made of hard tissue. The surface roughness of the copper foil does not exceed 1.5 μνα.

1 sheet of drawings

Claims (2)

according to de Vries in that the roughness profile is determined by means of a sapphire needle from the path of the contact points of a scanning circle with given 1. Copper-clad base material for a narrow probe radius of the needle (10 μm) from an overprinted circuit, which receives marked 5 flöchenproßl. The distance between the shows that the surface roughness of the upper and lower boundary lines, which describe the (maximum roughness depth of the Cu surface) 1.5 ^ m resulting roughness profile, is considered not to exceed. maximum surface roughness viewed. 2. A method for producing a copper- The needle movements are converted in an electro-laminated base material for printed circuit io mechanical transducer system into electrical frames with a surface roughness not via voltages that are proportional to the wand movement 1.5 ^ m according to claim 1 by means of polishing. Devices for determining the surface roughness of a brush provided with polishing pastes are known.
Polishing machines, characterized in that the production of the copper surface according to the invention with a base material clad with long-fiber 15 can advantageously take place in further training natural fibers, in particular over 50 mm in length, by using the polishing brush provided at temperatures with polishing pastes provided see 50 to 80 ° C is polished. Polishing brushes on known polishing machines the copper surface is coated with long-fiber »0 natural fibers, especially over 50 mm in length. seen polishing brush at a temperature between 50 to 80 ° C is polished.
It has been found that the application The present invention relates to a manure of polishing brushes made of long-fiber natural copper clad Base material for printed scarf fibers are constructed, in combination with prayers in themselves and a method for its production. known grinding pastes at higher temperatures a well-known It is well known that copper-clad base material can be produced with a special surface quality Plant television receivers in particular have taken longer to produce radio and fibrous natural fibers used as well as devices for electronic fibers of subtropical and tropical agave species. In this application area, plays next to the 30 lasts. Such plant fibers are known, for example, as the Mexican structure of the base material, the copper foil fiber. An essential effect for the herringbone crucial role. The quality of the copper treatment of the tempered surface is achieved by top layer is among other things of its purity that with polishing brushes in a temperature range Dependent on thickness and elasticity. Polishing between 50 and 80 ° C is also required. Polishing at Raumdert, that it is free of pores and inclusions at a temperature of 35 leads to excessive abrasion. at Foreign particles, e.g. B. Dust and resin inclusions, application of temperatures around 25 to 50 ° C should be. Furthermore, a relatively large surface roughened copper is allowed on the surface of the not be any substances that are obtained from the manufacturing process and have a low polishing effect, Treatment process of the copper-clad base material, on the other hand, surprisingly becomes a good one or the manufacturing process of the copper foil 40 polishing effect and the desired surface roughness and which achieves the printability, etchability by the fact that in a peraturinter- and affect the solderability of the copper. The range between 50 to 8O ⁰ C on ^ h known filling of these demands presupposes a surface polishing machine is polished. Temperatures over treatment of the copper-clad base material before 80 ° C have proven to be disadvantageous, since here an influence on the base material is preceded by its use for the production of a printed 45. can follow and with a smear effect on the Process for processing the copper surface surface must be expected. The applications include chemical processes, e.g. B. The use of polishing brushes with synthetic fibers has proven to be an etching of the surface, as well as being a mechanical disadvantage; Polishing brushes with short bristles Surface treatments using brushes and suspensions are also disadvantageous,
abrasives in water or the like
Systems as well as various emery and polishing techniques. All these post-processing methods, exemplary embodiments:
regardless of nature, require a roughening of the Surface of the copper-clad base material, the 55 1. A in a known manner made of a copper foil generally from the original surface and epoxy-impregnated paper underneath structure of the copper surface deviates. Pressure and heat produced between press plates The object of the invention is to provide a substantial displaced laminate is on a commercial improvement of a copper-clad base material using a conventional polishing machine visibly of the printability, etchability and solderable grinding paste and by means of a description above as well as certain electrical properties for a polishing brush with a speed of the manufacture of printed circuit boards, for example. 500 m per minute under repeated are sufficient. It is solved when, according to the invention, an oscillation at a surface temperature of the copper-clad base material is used, wel- copper surface processed by about 70 ° C. the ches is characterized in that it is a top- 65 determination of the surface roughness of a surface roughness (max. surface roughness) that resulted from such material after processing 1.5 µτα. does not exceed. 0.8 to 1.5 μια. The surface roughness is in a known manner 2. A in a known manner made of copper foil and with