DE1564352A1 - Verfahren zur Metallisierung von Halbleiterbauelementen - Google Patents
Verfahren zur Metallisierung von HalbleiterbauelementenInfo
- Publication number
- DE1564352A1 DE1564352A1 DE19661564352 DE1564352A DE1564352A1 DE 1564352 A1 DE1564352 A1 DE 1564352A1 DE 19661564352 DE19661564352 DE 19661564352 DE 1564352 A DE1564352 A DE 1564352A DE 1564352 A1 DE1564352 A1 DE 1564352A1
- Authority
- DE
- Germany
- Prior art keywords
- gold
- aluminum
- film
- ooo
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
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- H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
- H01L2224/486—Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US50251865A | 1965-10-22 | 1965-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1564352A1 true DE1564352A1 (de) | 1970-04-02 |
Family
ID=23998195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19661564352 Pending DE1564352A1 (de) | 1965-10-22 | 1966-09-17 | Verfahren zur Metallisierung von Halbleiterbauelementen |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE1564352A1 (enExample) |
| NL (1) | NL6614963A (enExample) |
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1966
- 1966-09-17 DE DE19661564352 patent/DE1564352A1/de active Pending
- 1966-10-21 NL NL6614963A patent/NL6614963A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| NL6614963A (enExample) | 1967-04-24 |
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